National Semiconductor DS90C363 Technical data

查询DS90C363供应商

DS90C363/DS90CF364
+3.3V Programmable LVDS Transmitter 18-Bit Flat Panel
Display (FPD) Link—65 MHz, +3.3V LVDS Receiver
18-Bit Flat Panel Display (FPD) Link—65 MHz

September 1999

DS90C363/DS90CF364 +3.3V Programmable LVDS 18-Bit-Color Flat Panel Display (FPD)

Link— 65 MHz

General Description

The DS90C363 transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams. A phase-locked transmit clock is transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. The DS90CF364 receiver converts the
LVDS data streams back into 21 bits of CMOS/TTL data. At
a transmit clock frequency of 65 MHz, 18 bits of RGB data
and 3 bits of LCD timing and control data (FPLINE,
FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per
LVDSdata channel. Using a 65 MHz clock, the data through­puts is 170 Mbytes/sec. The Transmitter is offered with pro­grammable edge data strobes for convenient interface with a
variety of graphics controllers. The Transmitter can be pro­grammed for Rising edge strobe or Falling edge strobe
through a dedicated pin. A Rising edge Transmitter will inter­operate with a Falling edge Receiver (DS90CF364) without
any translation logic.

This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.

Block Diagrams

Application

Features

n 20 to 65 MHz shift clock support
n Programmable Transmitter (DS90C363) strobe select

(Rising or Falling edge strobe)

n Single 3.3V supply
n Chipset (Tx + Rx) power consumption
n Power-down mode (
n Single pixel per clock XGA (1024x768) ready
n Supports VGA, SVGA, XGA and higher addressability.
n Up to 170 Megabyte/sec bandwidth
n Up to 1.3 Gbps throughput
n Narrow bus reduces cable size and cost
n 290 mV swing LVDS devices for low EMI
n PLL requires no external components
n Low profile 48-lead TSSOP package
n Falling edge data strobe Receiver
n Compatible with TIA/EIA-644 LVDS standard
n ESD rating
n Operating Temperature: −40˚C to +85˚C

>

7kV

<

0.5 mW total)

<

250 mW (typ)

DS012886-14

TRI-STATE®is a registered trademark of National Semiconductor Corporation.

© 1999 National Semiconductor Corporation DS012886 www.national.com

Block Diagrams (Continued)

DS90C363

DS012886-1

Order Number DS90C363MTD

See NS Package Number MTD48

DS90CF364

Order Number DS90CF364MTD

See NS Package Number MTD48

www.national.com 2

DS012886-24

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Supply Voltage (V
CMOS/TTL Input Voltage −0.3V to (V
CMOS/TTL Output Voltage −0.3V to (V
LVDS Receiver Input Voltage −0.3V to (V
LVDS Driver Output Voltage −0.3V to (V
LVDS Output Short Circuit

Duration Continuous
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature

(Soldering, 4 sec) +260˚C

Maximum Package Power Dissipation Capacity 25˚C

MTD48 (TSSOP) Package:

) −0.3V to +4V

CC

CC
CC
CC
CC

+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)

DS90C363 1.98 W
DS90CF364 1.89 W

Package Derating:

DS90C363 16 mW/˚C above +25˚C
DS90CF364 15 mW/˚C above +25˚C

ESD Rating

(HBM, 1.5 kΩ, 100 pF)

>

Recommended Operating
Conditions

Supply Voltage (V

) 3.0 3.3 3.6 V

CC

Operating Free Air

Temperature (T

) −40 +25 +85 ˚C

A

Receiver Input Range 0 2.4 V
Supply Noise Voltage (V

Min Nom Max Units

) 100 mV

CC

7kV

PP

Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units

CMOS/TTL DC SPECIFICATIONS

V

IH

V

IL

V

OH

V

OL

V

CL

I

IN

I

OS

LVDS DC SPECIFICATIONS

V

OD

∆V

V

OS

∆V

I

OS

I

OZ

V

TH

V

TL

I

IN

TRANSMITTER SUPPLY CURRENT

ICCTW Transmitter Supply Current, Worst

ICCTG Transmitter Supply Current, 16

High Level Input Voltage 2.0 V
Low Level Input Voltage GND 0.8 V
High Level Output Voltage IOH= −0.4 mA 2.7 3.3 V
Low Level Output Voltage IOL= 2 mA 0.06 0.3 V
Input Clamp Voltage ICL= −18 mA −0.79 −1.5 V
Input Current VIN=VCC, GND, 2.5V or 0.4V
Output Short Circuit Current V

= 0V −60 −120 mA

OUT

±

5.1±10 µA

Differential Output Voltage RL= 100Ω 250 345 450 mV
Change in VODbetween 35 mV

OD

complimentary output states
Offset Voltage (Note 4) 1.125 1.25 1.375 V
Change in VOSbetween 35 mV

OS

complimentary output states
Output Short Circuit Current V
Output TRI-STATE®Current PWR DWN = 0V,

= 0V, RL= 100Ω −3.5 −5 mA

OUT

V

OUT

=0VorV

CC

±

1

Differential Input High Threshold VCM= +1.2V +100 mV
Differential Input Low Threshold −100 mV
Input Current VIN= +2.4V, VCC= 3.6V

V

= 0V, VCC= 3.6V

IN

Case

Grayscale

R

= 100Ω,

L

= 5 pF, Worst

C

L

Case Pattern

1, 3 )

(Figures

,TA= −40˚C to

+85˚C
R

= 100Ω,

L

= 5 pF, 16

C

L

Grayscale Pattern

(Figures 2, 3 )

,TA=

−40˚C to +85˚C

f = 32.5 MHz 31 45 mA

f = 37.5 MHz 32 50 mA
f = 65 MHz 42 55 mA
f = 32.5 MHz 23 35 mA

f = 37.5 MHz 28 40 mA
f = 65 MHz 31 45 mA

CC

±

10 µA

±

10 µA

±

10 µA

V

www.national.com3

Electrical Characteristics (Continued)

Over recommended operating supply and temperature ranges unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Units

TRANSMITTER SUPPLY CURRENT

ICCTZ Transmitter Supply Current PWR DWN = Low

Power Down Driver Outputs in TRI-STATE

®

under

Power Down Mode

RECEIVER SUPPLY CURRENT

ICCRW Receiver Supply Current, Worst

Case

ICCRG Receiver Supply Current, 16

Grayscale

C

= 8 pF, Worst

L

Case Pattern

1,4)

(Figures

,TA= −40˚C to

+85˚C
C

= 8 pF, 16

L

Grayscale Pattern

(Figures 2, 4 )

,TA=

−40˚C to +85˚C

f = 32.5 MHz 49 65 mA

f = 37.5 MHz 53 70 mA
f = 65 MHz 78 105 mA
f = 32.5 MHz 28 45 mA

f = 37.5 MHz 30 47 mA
f = 65 MHz 43 60 mA

ICCRZ Receiver Supply Current PWR DWN = Low

Power Down Receiver Outputs Stay Low during

Power Down Mode

Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.

Note 2: Typical values are given for V
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci-

fied (except V
Note 4: V

and ∆VOD).

OD

previously referred as VCM.

OS

= 3.3V and TA= +25C.

CC

10 55 µA

10 55 µA

www.national.com 4

Transmitter Switching Characteristics

Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified

Symbol Parameter Min Typ Max Units

LLHT LVDS Low-to-High Transition Time
LHLT LVDS High-to-Low Transition Time
TCIT TxCLK IN Transition Time
TCCS TxOUT Channel-to-Channel Skew
TPPos0 Transmitter Output Pulse Position for Bit 0

(Figure 3 )
(Figure 3 )

(Figure 5 )

(Figure 6 )

f = 65 MHz −0.4 0 0.3 ns

(Figure 17 )

TPPos1 Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11.0 11.3 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns
TCIP TxCLK IN Period
TCIH TxCLK IN High Time
TCIL TxCLK IN Low Time
TSTC TxIN Setup to TxCLK IN
THTC TxIN Hold to TxCLK IN
TCCD TxCLK IN to TxCLK OUT Delay 25˚C, V
TPLLS Transmitter Phase Lock Loop Set
TPDD Transmitter Power Down Delay

(Figure 7)

(Figure 7)

(Figure 7)

(Figure 7 )

(Figure 7 )

(Figure 15 )

= 3.3V

CC

(Figure 11 )

15 T 50 ns

0.35T 0.5T 0.65T ns

0.35T 0.5T 0.65T ns

f = 65 MHz 2.5 ns

0ns

(Figure 9 )

3.0 3.7 5.5 ns

0.75 1.5 ns

0.75 1.5 ns
5ns

250 ps

10 ms

100 ns

www.national.com5

Receiver Switching Characteristics

Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified

Symbol Parameter Min Typ Max Units

CLHT CMOS/TTL Low-to-High Transition Time
CHLT CMOS/TTL High-to-Low Transition Time
RSPos0 Receiver Input Strobe Position for Bit 0

(Figure 4 )
(Figure 4 )

(Figure 18 )

f = 65 MHz 0.7 1.1 1.4 ns

2.2 5.0 ns

2.2 5.0 ns

RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (Note 5)
RCOP RxCLK OUT Period
RCOH RxCLK OUT High Time
RCOL RxCLK OUT Low Time
RSRC RxOUT Setup to RxCLK OUT
RHRC RxOUT Hold to RxCLK OUT
RCCD RxCLK IN to RxCLK OUT Delay 25˚C, V
RPLLS Receiver Phase Lock Loop Set
RPDD Receiver Power Down Delay

Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min
and max) and the receiver input setup and hold time (internal data sampling window - RSPos). This margin allows for LVDS interconnect skew, inter-symbol inter­ference (both dependent on type/length of cable), and clock jitter (less than 250 ps).

(Figure 8)

(Figure 8 )

(Figure 8)

(Figure 19 )

(Figure 8 )

(Figure 8 )

(Figure 12 )

(Figure 16 )

CC

= 3.3V

f = 65 MHz 400 ps

15 T 50 ns
f = 65 MHz 7.3 8.6 ns
f = 65 MHz 3.45 4.9 ns
f = 65 MHz 2.5 6.9 ns
f = 65 MHz 2.5 5.7 ns

(Figure 10 )

5.0 7.1 9.0 ns
10 ms

1µs

AC Timing Diagrams

FIGURE 1. “Worst Case” Test Pattern

www.national.com 6

DS012886-2

AC Timing Diagrams (Continued)

DS012886-3

FIGURE 2. “16 Grayscale” Test Pattern (Notes 6, 7, 8, 9)

Note 6: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 7: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed

to produce groups of 16 vertical stripes across the display.

Note 8:

Figures 1, 2

Note 9: Recommended pin to signal mapping. Customer may choose to define differently.

show a falling edge data strobe (TxCLK IN/RxCLK OUT).

DS012886-15

FIGURE 3. DS90C363 (Transmitter) LVDS Output Load and Transition Times

FIGURE 4. DS90CF364 (Receiver) CMOS/TTL Output Load and Transition Times

DS012886-16

FIGURE 5. DS90C363 (Transmitter) Input Clock Transition Time

DS012886-4

www.national.com7

AC Timing Diagrams (Continued)

Measurements at Vdiff=0V
TCCS measured between earliest and latest LVDS edges
TxCLK Differential Low→High Edge

FIGURE 6. DS90C363 (Transmitter) Channel-to-Channel Skew

FIGURE 7. DS90C363 (Transmitter) Setup/Hold and High/Low Times

FIGURE 8. DS90CF364 (Receiver) Setup/Hold and High/Low Times

DS012886-17

DS012886-18

DS012886-5

FIGURE 9. DS90C363 (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)

www.national.com 8

DS012886-19

AC Timing Diagrams (Continued)

FIGURE 10. DS90CF364 (Receiver) Clock In to Clock Out Delay

FIGURE 11. DS90C363 (Transmitter) Phase Lock Loop Set Time

DS012886-6

DS012886-20

FIGURE 12. DS90CF364 (Receiver) Phase Lock Loop Set Time

DS012886-7

www.national.com9

AC Timing Diagrams (Continued)

FIGURE 13. Seven Bits of LVDS in One Clock Cycle

FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs

DS012886-9

DS012886-10

FIGURE 15. Transmitter Power Down Delay

FIGURE 16. Receiver Power Down Delay

www.national.com 10

DS012886-21

DS012886-8

AC Timing Diagrams (Continued)

FIGURE 17. Transmitter LVDS Output Pulse Position Measurement

DS012886-22

www.national.com11

AC Timing Diagrams (Continued)

FIGURE 18. Receiver LVDS Input Strobe Position

www.national.com 12

DS012886-25

AC Timing Diagrams (Continued)

C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
Tppos—Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 10) + ISI (Inter-symbol interference) (Note 11)
Cable Skew — typically 10 ps–40 ps per foot, media dependent

Note 10: Cycle-to-cycle jitter is less than 250 ps at 65 MHz.
Note 11: ISI is dependent on interconnect length; may be zero.

DS012886-11

FIGURE 19. Receiver LVDS Input Skew Margin

DS90C363 Pin Description—FPD Link Transmitter

Pin Name I/O No. Description

TxIN I 21 TTL level input. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines — FPLINE,

TxOUT+ O 3 Positive LVDS differentiaI data output.
TxOUT− O 3 Negative LVDS differential data output.
FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
R_FB I 1 Programmable strobe select.
RTxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT− O 1 Negative LVDS differential clock output.
PWR DWN

V

CC

I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at

I 3 Power supply pins for TTL inputs.
GND I 4 Ground pins for TTL inputs.
PLL V

CC

I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS V

CC

I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.

FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).

power down.

www.national.com13

DS90CF364 Pin Description—FPD Link Receiver

Pin Name I/O No. Description

RxIN+ I 3 Positive LVDS differentiaI data inputs.
RxIN− I 3 Negative LVDS differential data inputs.
RxOUT O 21 TTL level data outputs. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines — FPLINE,

FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT.
PWR DWN
V

CC

I 1 TTL level input. When asserted (low input) the receiver outputs are low.

I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V

CC

I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V

CC

I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.

Applications Information

The DS90C363 and DS90CF364 are backward compatible
with the existing 5V FPD Link transmitter/receiver pair
(DS90CF563 and DS90CF564). To upgrade from a 5V to a

3.3V system the following must be addressed:

1. Change 5V power supply to 3.3V. Provide this supply to
the V

, LVDS VCCand PLL VCCof both the transmitter

CC

and receiver devices. This change may enable the re­moval of a 5V supply from the system, and power may
be supplied from an existing 3V power source.

2. The DS90C363 (transmitter) incorporates a rise/fall
strobe select pin. This select function is on pin 14, for­merly a V
rise/fall strobe select pin is connected to V
configured with a rising edge strobe. In a system cur­rently using a 5V rising edge strobe transmitter
(DS90CR563), no layout changes are required to ac­commodate the new rise/fall select pin on the 3.3V
transmitter. The V
the device will be configured with a rising edge strobe.

When converting from a 5V falling edge transmitter
(DS90CF563) to the 3V transmitter a minimal board
layout change is necessary. The 3.3V transmitter will

not be configured with a falling edge strobe if V
mains connected to the select pin. To guarantee the

3.3V transmitter functions with a falling edge strobe pin
14 should be connected to ground OR left unconnected.
When not connected (left open) and internal pull-down
resistor ties pin 14 to ground, thus configuring the trans­mitter with a falling edge strobe.

3. The DS90C363 transmitter input and control inputs ac­cept 3.3V TTL/CMOS levels. They are not 5V tolerant.

connection on the 5V products. When the

CC

signal may remain at pin 14, and

CC

, the part is

CC

re-

CC

www.national.com 14

Pin Diagram

DS90C363

DS90CF364

DS012886-23

TABLE 1. Programmable Transmitter

Pin Condition Strobe Status

R_FB R_FB = V

CC

Rising edge strobe

R_FB R_FB = GND Falling edge strobe

DS012886-13

www.national.com15

Physical Dimensions inches (millimeters) unless otherwise noted

Link— 65 MHz

DS90C363/DS90CF364 +3.3V Programmable LVDS 18-Bit-Color Flat Panel Display (FPD)

48-Lead Molded Thin Shrink Small Outline Package, JEDEC

Dimensions show in millimeters

Order Number DS90C363MTD and DS90CF364MTD

NS Package Number MTD48

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the

2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.

labeling, can be reasonably expected to result in a
significant injury to the user.

National Semiconductor
Corporation

Americas
Tel: [phone]
Fax: [phone]
Email: [e-mail]

www.national.com

National Semiconductor
Europe

Fax: [phone]

Email: [e-mail]
Deutsch Tel: [phone]
English Tel: [phone]
Français Tel: [phone]
Italiano Tel: [phone]

National Semiconductor
Asia Pacific Customer
Response Group

Tel: [phone]
Fax: [phone]
Email: [e-mail]

National Semiconductor
Japan Ltd.

Tel: [phone]
Fax: [phone]

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.