MYDATA MY200SX User Manual

November 2013

MY200 Series P&P
Specification

™

MY200SX

MY200-SERIES P&P SPECIFICATION – MY200SX

FEEDER CAPACITY

FEEDER CAPACITY 8 MM TAPE

T3 T4 T5 T6

PLACEMENT SPEED AND ACCURACY

PLACEMENT SPEED AND ACCURACY – MY200SX 10/14

Rated Speed

IPC 9850 Chip Net Throughput

IPC 9850 Chip Tact Time

IPC 9850 Chip Repeatability 3s (X, Y, Theta)

IPC 9850 Chip Accuracy @ Cpk = 1.33 (X, Y, Theta)

IPC 9850 Fine Pitch Net Throughput

IPC 9850 Fine Pitch Tact Time

IPC 9850 Fine Pitch Repeatability 3s (X, Y, Theta)

IPC 9850 Fine Pitch Accuracy @ Cpk = 1.33 (X, Y, Theta)

The above specification achieved with a machine configuration including high precision mounthead (Midas),
high speed mounthead (HYDRA Z8), line scan vision system (LVS) and inline conveyor T3.
The IPC 9850 net throughput and accuracy numbers are obtained simultaneously, with the same machine settings.
The rated Speed value is obtained under conditions optimized for speed.

1) Depending on component and application.

2) According to IPC 9850. Net Throughput = (no of parts x 3600) / (board build time + board transfer time).

3) According to IPC 9850 0402C verification panel.

4) According to IPC 9850 QFP64/QFP100 verification panel.

5) According to IPC 9850 Cpk 1.33 = 4s + offset.

6) Small chip settings, recommended for 0201 (0.6 x 0.3 mm) and below.

(1)

(2,3)

(3)

(3)

24 000 CPH

20 000 CPH

0.163 s

30 µm, 1.8°
45 µm, 1.8°

(5)

50 µm, 2.6°
75 µm, 2.6°

(2,4)

(4)

(4)

(4,5)

3 200 CPH

0.958 s

21 µm, 0.05°

35 µm, 0.09°

SYSTEM FEATURES

SYSTEM FEATURES MY200SX

On-the-fly mount order optimization

Vision autoteach with snap-to-grid

Automatic illumination settings

(6)

(6)

Intelligent feeder concept – Agilis

On-the-fly feeder loading

Automatic feeder and component recognition

Dynamic feeder positions

Automatic board stretch compensation

Automatic conveyor width adjustment

Intelligent surface impact control

Tool collision avoidance

Multi-user, multi-tasking system software

Open software interfaces for factory integration

SQL database engine

Programmable light settings fiducial camera

MY200SX-10 112 96 - -

MY200SX-14 176 160 144 128

BOARD HANDLING

INLINE CONVEYOR

T3 T4 T5

Maximum Board Size 443 x 508 mm

(17.4” x 20”)

Maximum Board Size with ML adaptor

(2)

419 x 443 mm
(16.5” x 17.4”)

Minimum Board Size

(3)

70 x 50 mm
(2.7” x 2”)

Board Thickness Range 0.4 - 6.0 mm

(0.016” - 0.24”)

Board Edge Clearance Top and Bottom 3.2 mm (0.13”) 3.2 mm (0.13") 3.2 mm (0.13") 3.2 mm (0.13")

Top Side Clearance (max)

(4)

15 mm (0.59”) 15 mm (0.59") 15 mm (0.59") 15 mm (0.59")

Bottom Side Clearance (max) 32 mm (1.25”) 32 mm (1.25") 32 mm (1.25") 32 mm (1.25")

Maximum Board Weight 5 kg (11 lbs) 8 kg (17 lbs) 15 kg (33 lbs) 15 kg (33 lbs)

Board Transfer Height Conforms to SMEMA standard for board transfer height. Height adjustable from 880 to

975 mm (34.6” to 38.4”).

Operation Mode Inline, manual, inline odd-board, left-to-right / right-to-left

575 x 508 mm
(22.6" x 20")

554 x 443 mm
(21.8" x 17.4")

70 x 50 mm
(2.7" x 2")

0.4 - 6.0 mm
(0.016" - 0.24")

(1)

T6

736 x 609 mm
(29" x 24")

725 x 556 mm
(28" x 22")

70 x 50 mm
(2.7" x 2")

0.8 - 12.5 mm
(0.03" - 0.5")

(1)

914 x 609 mm
(36" x 24")

905 x 556 mm
(35.5" x 22")

70 x 50 mm
(2.7" x 2")

0.8 - 12.5 mm
(0.03" - 0.5")

COMPONENT RANGE

HIGH PRECISION MOUNTHEAD – MIDAS

Component Range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd-shape,

Component Specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005)

1) Customized larger component capabilty available: 76 x 66 x 15 mm (2.9” x 2.6” x 0.59”) or 151 x 26 x 15 mm (5.9” x 1.0” x 0.59”). Customized tall component capability 22 mm (0.86”) available.
Contact MYDATA sales for detailed customization information.

2) Depending on mounthead, mount tool, package, and production altitude.

HIGH SPEED MOUNTHEAD – HYDRA Z8

Component Range Chip (from 0201), SO28, SOT223, SOJ20, PLCC32, MELF, SOD, TSOP

Component Specification Min: 0.6 x 0.3 mm (0.02 x 0.01”) (0201)

ELECTRICAL VERIFIER (OPTIONAL)

Component Range Resistor, Capacitor, Unipolar Capacitor, Diode (forward voltage, reverse current),

Verification Time On-the-fly

surface-mount connectors, through-hole components, CSP, CCGA, DPAK,
Alcap, Tantalum.

Max: 56 x 56 x 15 mm (2.20” x 2.20” x 0.59”)
Max: component weight: 140 g

(2)

(1)

Max: 18.6 x 18.6 x 5.6 mm (0.73 x 0.73 x 0.22”) (PLCC44)

Zener diode (voltage drop), Transistor (current gain)

1) Available for MY200SX-14.

2) Optional. Suitable for irregular sized and odd shaped boards.

3) Recommended board train specification: 90 x 50 mm (3.5” x 2”) board size, 1.6 mm (0.06”) thickness.

4) Customized tall component capability 22 mm (0.86”)

VISION CAPABILITY

DUAL VISION SYSTEM (OPTIONAL)

componenT Type camera max acTive field of view min piTch min lead widTh

Leaded Components SVC

Bumped Components SVC

1) Standard vision camera in dual vision system (DVS).

2) High resolution camera in dual vision system (DVS).

LINESCAN VISION SYSTEM

componenT Type camera max acTive field of view min piTch min lead widTh

Leaded Components LVC

Bumped Components LVC

1) Line scan vision camera.

(1)

56 x 52 mm

(2)

HRC

(1)

56 x 52 mm

(2)

HRC

(1)

56 x 56 mm

(1)

56 x 56 mm

(2.20” x 2.04”)

15 x 15 mm
(0.59” x 0.59”)

(2.20” x 2.04”)

15 x 15 mm
(0.59” x 0.59”)

(2.2” x 2.2”)

(2.2” x 2.2”)

0.40 mm (16 mil) 0.20 mm (8 mil)

0.10 mm (4 mil) 0.05 mm (2 mil)

0.50 mm (20 mil) 0.25 mm (10 mil)

0.16 mm (6.3 mil) 0.08 mm (3.1 mil)

0.20 mm (8 mil) 0.10 mm (4 mil)

0.30 mm (12 mil) 0.15 mm (6 mil)