MYDATA MY200LX User Manual

November 2013

MY200 Series P&P
Specification

™

MY200LX

MY200-SERIES P&P SPECIFICATION – MY200LX

FEEDER CAPACITY

FEEDER CAPACITY 8 MM TAPE

t3 t4

PLACEMENT SPEED AND ACCURACY

PLACEMENT SPEED AND ACCURACY – MY200LX 10/14

Rated Speed

IPC 9850 Chip Net Throughput

IPC 9850 Chip Tact Time

IPC 9850 Chip Repeatability 3s (X, Y, Theta)

IPC 9850 Chip Accuracy @ Cpk = 1.33 (X, Y, Theta)

IPC 9850 Fine Pitch Net Throughput

IPC 9850 Fine Pitch Tact Time

IPC 9850 Fine Pitch Repeatability 3s (X, Y, Theta)

IPC 9850 Fine Pitch Accuracy @ Cpk = 1.33 (X, Y, Theta)

The above specification achieved with a machine configuration including high precision mounthead (Midas),
high speed mounthead (HYDRA Z8L), line scan vision system (LVS) and inline conveyor T3.
The IPC 9850 net throughput and accuracy numbers are obtained simultaneously, with the same machine settings.
The rated speed value is obtained under conditions optimized for speed.

1) Depending on component and application.

2) According to IPC 9850. Net Throughput = (no of parts x 3600) / (board build time + board transfer time).

3) According to IPC 9850 0402C verification panel.

4) According to IPC 9850 QFP64/QFP100 verification panel.

5) According to IPC 9850 Cpk 1.33 = 4s + offset.

6) chip repeatability with high precision head 36 µm, 1.5°

7) chip accuracy with high precision head, 63 µm, 2.2°

8) Fine pitch net throughput 2 250 CPH and tact time 1.423s with SVS/DVS.

(1)

(2,3)

(3)

(3,6)

(5,7)

(2,4,8)

(4)

(4)

(4,5)

16 000 CPH

13 800 CPH

0.250 s

45 µm, 1.8°

75 µm, 2.6°

3 200 CPH

0.958 s

21 µm, 0.05º

35 µm, 0.09º

SYSTEM FEATURES

SYSTEM FEATURES MY200LX

On-the-fly mount order optimization

Vision autoteach with snap-to-grid

Automatic illumination settings

Intelligent feeder concept – Agilis

Automatic feeder and component recognition

On-the-fly feeder loading

Dynamic feeder positions

Automatic board stretch compensation

Automatic conveyor width adjustment

Intelligent surface impact control

Tool collision avoidance

Multi-user, multi-tasking system software

Open software interfaces for factory integration

SQL database engine

Programmable light settings fiducial camera

MY200LX-10 112 96

MY200LX-14 176 160

BOARD HANDLING

INLINE CONVEYOR

t3 t4

Maximum Board Size 443 x 508 mm (17.4” x 20”) 575 x 508 mm (22.6” x 20”)

Maximum Board Size with ML adaptor

Minimum Board Size

(2)

Board Thickness Range 0.4 - 6.0 mm (0.016” - 0.24”) 0.4 - 6.0 mm (0.016” - 0.24”)

Board Edge Clearance Top and Bottom 3.2 mm (0.13”) 3.2 mm (0.13”)

Top Side Clearance (max) 15 mm (0.59”) 15 mm (0.59")

Bottom Side Clearance (max) 32 mm (1.25”) 32 mm (1.25")

Maximum Board Weight 5 kg (11 lbs) 8 kg (17 lbs)

Board Transfer Height Conforms to SMEMA standard for board transfer height.

Operation Mode Inline, manual, inline odd-board, left-to-right / right-to-left

1) Optional. Suitable for irregular sized and odd shaped boards.

2) Recommended board train specification: 90 x 50 mm (3.5” x 2”) board size, 1.6 mm (0.06”) thickness.

(1)

419 x 443 mm (16.5” x 17.4”) 554 x 443 mm (21.8” x 17.4”)

70 x 50 mm (2.7” x 2”) 70 x 50 mm (2.7” x 2”)

Height adjustable from 880 to 975 mm (34.6” to 38.4”).

COMPONENT RANGE

HIGH PRECISION MOUNTHEAD – MIDAS

Component Range

Chip (from 01005)
connectors, through-hole components, CSP, CCGA, DPAK, Alcap, Tantalum.

Component Specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005)

Max: 56 x 56 x 15 mm (2.20” x 2.20” x 0.59”)
Max: component weight: 140 g

1) Requires dual vision system (DVS) or line scan vision system (LVS). Standard vision system (SVS) chip from 0402.

2) Depending on mounthead, mount tool, package, and production altitude.

HIGH SPEED MOUNTHEAD – HYDRA Z8L (OPTIONAL)

Component Range Chip (from 0201) , SO8, SO14, SOT23, MELF.

Component Specification Min: 0.6 x 0.3 mm (0.02 x 0.01”) (0201)

Max: 8.70 x 8.70 x 5.60 mm (0.34” x 0.34” x 0.22”)

ELECTRICAL VERIFIER (OPTIONAL)

Component Range Resistor, Capacitor, Unipolar Capacitor, Diode (forward voltage, reverse current),

Verification Time On-the-fly

Zener diode (voltage drop), Transistor (current gain)

(1)

, SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd-shape, surface-mount

(2)

VISION CAPABILITY

STANDARD VISION SYSTEM, DUAL VISION SYSTEM (OPTIONAL)

component type camera max active field of view min pitch min lead width

HRC

HRC

(1)

56 x 52 mm

0.40 mm (16 mil) 0.20 mm (8 mil)

(2.20” x 2.04”)

(2)

15 x 15 mm

0.10 mm (4 mil) 0.05 mm (2 mil)

(0.59” x 0.59”)

(1)

56 x 52 mm

0.50 mm (20 mil) 0.25 mm (10 mil)

(2.20” x 2.04”)

(2)

15 x 15 mm

0.16 mm (6.3 mil) 0.08 mm (3.1 mil)

(0.59” x 0.59”)

(1)

56 x 56 mm

0.20 mm (8 mil) 0.10 mm (4 mil)

(2.2” x 2.2”)

(1)

56 x 56 mm

0.30 mm (12 mil) 0.15 mm (6 mil)

(2.2” x 2.2”)

Leaded Components SVC

Bumped Components SVC

1) Standard vision camera in standard/dual vision system (SVS/DVS).

2) High resolution camera in dual vision system (DVS).

LINESCAN VISION SYSTEM (OPTIONAL)

component type camera max active field of view min pitch min lead width

Leaded Components LVC

Bumped Components LVC

1) Line scan vision camera.