MYDATA MY200DX User Manual

November 2013

MY200 Series P&P
Specification

™

MY200DX

MY200-SERIES P&P SPECIFICATION – MY200DX

FEEDER CAPACITYPLACEMENT SPEED AND ACCURACY SYSTEM FEATURES

PLACEMENT SPEED AND ACCURACY – MY200DX 10/14

Rated Speed

IPC 9850 Chip Net Throughput

IPC 9850 Chip Tact Time

IPC 9850 Chip Repeatability 3s (X, Y, Theta)

IPC 9850 Chip Accuracy @ Cpk = 1.33 (X, Y, Theta)

IPC 9850 Fine Pitch Net Throughput

IPC 9850 Fine Pitch Tact Time

IPC 9850 Fine Pitch Repeatability 3s (X, Y, Theta)

IPC 9850 Fine Pitch Accuracy @ Cpk = 1.33 (X, Y, Theta)

The above specification achieved with a machine configuration including high precision mounthead (Midas),
high speed mounthead (HYDRA Z8), line scan vision system (LVS) and inline conveyor T4.
The IPC 9850 net throughput and accuracy numbers are obtained simultaneously, with the same machine settings.
The rated Speed value is obtained under conditions optimized for speed.

1) Depending on component and application.

2) According to IPC 9850. Net Throughput = (no of parts x 3600) / (board build time + board transfer time).

3) According to IPC 9850 0402C verification panel.

4) According to IPC 9850 QFP64/QFP100 verification panel.

5) According to IPC 9850 Cpk 1.33 = 4s + offset.

6) Small chip settings, recommended for 0201 (0.6 x 0.3 mm) and below.

(1)

(2,3)

(3)

(3)

40 000 CPH

32 000 CPH

0.103 s

30 µm, 1.8°
45 µm, 1.8°

(5)

50 µm, 2.6°
75 µm, 2.6°

(2,4)

(4)

(4)

(4,5)

4 400 CPH

0.720 s

21 µm, 0.05°

35 µm, 0.09°

COMPONENT RANGE

HIGH PRECISION MOUNTHEAD – MIDAS

SYSTEM FEATURES MY200DX

On-the-fly mount order optimization

Vision autoteach with snap-to-grid

Automatic illumination settings

(6)

(6)

Intelligent feeder concept – Agilis

Automatic feeder and component recognition

On-the-fly feeder loading

Dynamic feeder positions

Automatic board stretch compensation

Automatic conveyor width adjustment

Intelligent surface impact control

Tool collision avoidance

Multi-user, multi-tasking system software

Open software interfaces for factory integration

SQL database engine

Programmable light settings fiducial camera

FEEDER CAPACITY 8 MM TAPE

t4 t5 t6

MY200DX-10 96 - -

MY200DX-14 160 144 128

BOARD HANDLING

INLINE CONVEYOR

t4 t5

(1)

t6

Maximum Board Size 575 x 508 mm (22.6" x 20") 736 x 609 mm (29" x 24") 914 x 609 mm (36" x 24")

Maximum Board Size with ML adaptor

Minimum Board Size

(3)

(2)

554 x 443 mm (21.8" x 17.4") 725 x 556 mm (28" x 22") 905 x 556 mm (35.5" x 22")

70 x 50 mm (2.7" x 2") 70 x 50 mm (2.7" x 2") 70 x 50 mm (2.7" x 2")

Board Thickness Range 0.4 - 6.0 mm (0.016" - 0.24") 0.8 - 12.5 mm (0.03" - 0.5") 0.8 - 12.5 mm (0.03" - 0.5")

Board Edge Clearance Top and Bottom 3.2 mm (0.13") 3.2 mm (0.13") 3.2 mm (0.13")

Top Side Clearance (max)

(4)

15 mm (0.59") 15 mm (0.59") 15 mm (0.59")

Bottom Side Clearance (max) 32 mm (1.25") 32 mm (1.25") 32 mm (1.25")

Maximum Board Weight 8 kg (17 lbs) 15 kg (33 lbs)

(5)

15 kg (33 lbs)

(1)

(5)

Board Transfer Height Conforms to SMEMA standard for board transfer height.

Height adjustable from 880 to 975 mm (34.6” to 38.4”).

Operation Mode Inline, manual, inline odd-board, left-to-right / right-to-left

1) Available for MY200DX-14.

2) Optional. Suitable for irregular sized and odd shaped boards.

3) Recommended board train specification: 90 x 50 mm (3.5” x 2”) board size, 1.6 mm (0.06”) thickness.

4) Customized tall component capability 22 mm (0.86”).

Component Range Chip (from 01005), SOIC, PLCC, TSOP, QFP, BGA, flip chip, odd-shape,

surface-mount connectors, through-hole components, CSP, CCGA, DPAK,
Alcap, Tantalum.

Component Specification Min: 0.4 x 0.2 mm (0.016” x 0.008”) (01005)

Max: 56 x 56 x 15 mm (2.20” x 2.20” x 0.59”)
Max: component weight: 140 g

1) Customized larger component capabilty available: 76 x 66 x 15 mm (2.9” x 2.6” x 0.59”) or 151 x 26 x 15 mm (5.9” x 1.0” x 0.59”). Customized tall component capability 22 mm (0.86”) available.
Contact MYDATA sales for detailed customization information.

2) Depending on mounthead, mount tool, package, and production altitude.

(2)

(1)

HIGH SPEED MOUNTHEAD – HYDRA Z8

Component Range Chip (from 0201), SO28, SOT223, SOJ20, PLCC32, MELF, SOD, TSOP

Component Specification Min: 0.6 x 0.3 mm (0.02 x 0.01”) (0201)

Max: 18.6 x 18.6 x 5.6 mm (0.73 x 0.73 x 0.22”) (PLCC44)

ELECTRICAL VERIFIER (OPTIONAL)

Component Range Resistor, Capacitor, Unipolar Capacitor, Diode (forward voltage, reverse current),

Verification Time On-the-fly

Zener diode (voltage drop), Transistor (current gain)

VISION CAPABILITY

DUAL VISION SYSTEM (OPTIONAL)

component type camera max active field of view min pitch min lead width

Leaded Components SVC

Bumped Components SVC

1) Standard vision camera in dual vision system (DVS).

2) High resolution camera in dual vision system (DVS).

LINESCAN VISION SYSTEM

component type camera max active field of view min pitch min lead width

Leaded Components LVC

Bumped Components LVC

1) Line scan vision camera.

(1)

56 x 52 mm

(2)

HRC

(1)

56 x 52 mm

(2)

HRC

(1)

56 x 56 mm

(1)

56 x 56 mm

(2.20” x 2.04”)

15 x 15 mm
(0.59” x 0.59”)

(2.20” x 2.04”)

15 x 15 mm
(0.59” x 0.59”)

(2.2” x 2.2”)

(2.2” x 2.2”)

0.40 mm (16 mil) 0.20 mm (8 mil)

0.10 mm (4 mil) 0.05 mm (2 mil)

0.50 mm (20 mil) 0.25 mm (10 mil)

0.16 mm (6.3 mil) 0.08 mm (3.1 mil)

0.20 mm (8 mil) 0.10 mm (4 mil)

0.30 mm (12 mil) 0.15 mm (6 mil)