45
This is the PDF file of catalog No.O05E-5. No.O05E5.pdf 00.3.15
Notice of Chip Coil
4. Cleaning
The following conditions should be observed when cleaning
chip coils.
1Cleaning Temperature : 60D max. (40D max. for CFC
alternatives and alcohol cleaning agents)
2Ultrasonic
Output : 20W/
R max.
Duration : 5 minutes max.
Frequency : 28 to 40kHz
Care should be taken not to cause resonance of the PCB
and mounted products.
3Cleaning Agent
The following cleaning agents have been tested on
individual components. Evaluation in complete assembly
should be done prior to production.
a) CFC alternatives and alcohol cleaning agents
#Isopropyl alcohol (IPA)
#HCFC-225
b) Aqueous cleaning agents
#Surface active agent (Clean Thru 750H)
#High grade alcohol (Pine Alpha ST-100S)
#Hydrocarbon (Techno Cleaner 335)
#Alkaline saponifier (Aqua Cleaner 240-cleaner should be
diluted to 20% using deionized water.)
LQS series : Aqueous agents should not be used
because they may cause quality deterioration.
LQH series : Surface active agent and high grade alcohol
can be used.
4Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact Murata.
5. Resin Coating
When coating products with resin, the relatively high resin
curing stress may change inductance values.
For exterior coating, select resin carefully so that electrical
and mechanical performance of the product is not affected.
6. Caution for Use
This item is designed to have sufficient strength, but handle
with care not to make it chipped or broken due to its ceramic
structure.
¡LQW Series
# Sharp material, such as a pair of tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
# Do not give excessive mechanical shock to the products
mounted on the board to prevent the breaking of the core.
# In some mounting machines, when picking up
components support pin pushes up the components from
the bottom of base tape. In this case, please remove the
support pin. The support pin may damage the
components and break wire.
¡LQH/LQN Series
# Sharp material, such as a pair of tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
# Do not give excessive mechanical shock to the products
mounted on the board to prevent the breaking of the core.
¡LQP Series
# The pattern of the chip coil is covered with the protection
film. But the handling the chip coil shall be taken care so
that the chip coil would not be damaged with the pick-up
nozzle, the sharp substance and so on.
¡LQG
--N/--C/--
F Series
# There is possibility that the inductance value change due
to magnetism. Don't use a magnet or a pair of tweezers
with magnetism when chip coil are handled. (The tip of the
tweezers should be molded with resin or pottery.)
7. Handling
1Avoid applying excessive stress to products to prevent
damage.
2Do not touch winding with sharp objects such as tweezers
to prevent wire breakage.
3Do not apply excessive force to products mounted on
boards to prevent core breakage.
8. Operating Environment
Do not use products in corrosive gases atmosphere such as
chlorine gas, acid or sulfide gas.
9. Storage Requirements
1Storage Period
Products should be used within 12 months reckon from
the date of our out-going inspection.
Solderability should be verified if this period is exceeded.
(LQS33N/33C, LQP21A series should be used within 6
months.)
2Storage conditions
a) Store products in a warehouse in compliance with the
following conditions :
Temperature : Y10 to 40D
Humidity : 30 to 70%
(relative humidity)
Do not subject products to rapid changes in temperature
and humidity.
Do not store them in corrosive gases atmosphere such as
one containing sulfurous acid gas or alkaline gas.
This will prevent electrode oxidation which causes poor
solderability and possible corrosion of coils.
b) Do not store products in bulk packaging to prevent
collision among coils which causes core chipping and
wire breakage.
c) Store products on pallets to protect from humidity, dust,
etc.
d) Avoid heat shock, vibration, direct sunlight, etc.
10. Transportations
Do not apply excessive vibration or mechanical shock to
products.