Murata CMABZ User Manual

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Preliminary Specification Number : SP-ABZ-D

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LoRa Module Data Sheet

MP P/N: CMWX1ZZABZ

Sample P/N: CMWX1ZZABZ-TEMP

For LoRa

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Preliminary Specification Number : SP-ABZ-D

Revision

Code

Date

Description

Comments

June 8, 2016

Initial Draft

July 1, 2016

Updated height and package info

July 30,2016

Revised some formats and ΔRF_OPH_V test condition from 2.4-3.7V to 2.2-3.6V. Updated some electronic Characteristics. Added the recommended land pattern.

Aug 29,2016

Updated the RF performance, Electrical Characteristics and power up sequence.

Oct 11, 2016

Added FCC and IC statements.

2 / 19

Revision History

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Preliminary Specification Number : SP-ABZ-D

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TABLE OF CONTENTS

1. Features ······················································································································· 4

2. Part Number ················································································································· 4

3. Block Diagram ··············································································································· 4

4. Dimensions, Marking and Terminal Configurations ···························································· 5

5. Label Information ·········································································································· 8

6. Absolute Maximum Ratings ····························································································· 8

7. Operating Condition ······································································································· 8

8. Electrical Characteristics ································································································ 9

9. Power Sequences ··········································································································· 10

10. Recommend Land Pattern ····························································································· 11

11. Reference circuit ·········································································································· 12

12. Tape and Reel packing ·································································································· 13

13. Notice ························································································································ 16

14. Regulatory Statements ································································································· 18

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1. Features

Ordering Part Number

Description

CMWX1ZZABZ

MP P/N

CMWX1ZZABZ-TEMP

Engineering sample

Interfaces : I2C, UART, USB, SPI Main ICs : STM32L082, SX1276 Reference Clocks : Integrated 32MHz clock (TCXO with frequency error=±2 ppm)

Supported Frequencies : 868 MHz, 915 MHz Module Size : 12.5 mm x 11.6 mm x 1.76 mm (Max) Package : Metal Shield can RoHS : This module is compliant with the RoHS directive

2. Part Number

3. Block Diagram

Preliminary Specification Number : SP-ABZ-D

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and 32.768KHz clock (frequency error=±20 ppm)

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Preliminary Specification Number : SP-ABZ-D

Mark

Dimension

Mark

Dimension

Mark

Dimension

12.5±0.20

11.6±0.20

1.76 max

0.50±0.10

1.50±0.10

0.20±0.15

1.60±0.15

3.00±0.15

3.50±0.15

0.20±0.15

1.15±0.15

2.55±0.15

0.80±0.10

1.50±0.10

0.30±0.10

1.00±0.10

4. Dimensions, Marking and Terminal Configurations

Top View Bottom View

5 / 19

Side View

Table 1 Dimension (Unit: mm)

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Preliminary Specification Number : SP-ABZ-D

NO.

Terminal Name

Type

Connection to

IC terminal

Description

PA12/USB_DP

I/O

STM32L082_PA12

GPIO Mode:PA12 USB_DP

PA11/USB_DM

I/O

STM32L082_PA11

GPIO Mode:PA11 USB_DM

GND

Ground

VDD_USB

Power

Power supply for USB

VDD_MCU

Power

Power supply for MCU

VDD_RF

Power

Power supply for RF IC

GND

Ground

DBG_SX1276_DIO2

I/O

SX1276_DIO2

Debug pin for SX1276

DBG_SX1276_DIO3

I/O

SX1276_DIO3

Debug pin for SX1276

SX1276_DIO4

I/O

SX1276_DIO4

SX1276 DIO4

DBG_SX1276_DIO5

I/O

SX1276_DIO5

Debug pin for SX1276

DBG_SX1276_DIO1

I/O

SX1276_DIO1

Debug pin for SX1276

DBG_SX1276_DIO0

I/O

SX1276_DIO0

Debug pin for SX1276

PB15/SPI2_MOSI

I/O

STM32L082_PB15

GPIO Mode:PB15 SPI2_MOSI

PB14/SPI2_MISO

I/O

STM32L082_PB14

GPIO Mode:PB14 SPI2_ MISO

PB13/SPI2_SCK

I/O

STM32L082_PB13

GPIO Mode:PB13 SPI2_SCK

PB12/SPI2_NSS

GPIO Mode:PB12 SPI2_NSS

PA10/USART1_RX

I/O

STM32L082_PA10

GPIO Mode:PA10 USART1_RX

Terminal Configurations

6 / 19

< Top View >

Table 2 Terminal Configurations

I/O STM32L082_PB12

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Preliminary Specification Number : SP-ABZ-D

PA9/USART1_TX

I/O

STM32L082_PA9

GPIO Mode:PA9 USART1_TX

PA8/MCO

I/O

STM32L082_PA8

GPIO Mode:PA8 MCO

PA5/ADC5/DAC2

I/O

STM32L082_PA5

GPIO Mode:PA5 COMP2_INM ADC_IN5 DAC_OUT2

PA4/ADC4/DAC1

I/O

STM32L082_PA4

GPIO Mode:PA4 COMP2_INM ADC_IN4 DAC_OUT1

PA3/ADC3

GPIO Mode:PA3 COMP2_ INP ADC_IN3

PA2/ADC2

GPIO Mode:PA2 COMP2_OUT ADC_IN2

GND

Ground

ANT

Transmit / Receive Antenna

GND

Ground

DBG_CRF1

Debug pin

DBG_CRF3

Debug pin

DBG_CRF2

I/O

STM32L082_PC2

Debug pin

STSAFE_nRST

I - Reset for Security IC

VREF+

Power

Reference Voltage For ADC and DAC

PA0/WKUP1

I/O

STM32L082_PA0

GPIO Mode:PA0 COMP2_OUT ADC_IN2

MCU_nRST

STM32L082_PD5

NRST

PB8/I2C1_SCL

I/O

STM32L082_ PB8

GPIO Mode:PB8 I2C mode: SCL

PB9/I2C1_SDA

I/O

STM32L082_ PB9

GPIO Mode: PB9 I2C mode: SDA

PB2/LPTIM1_OUT

I/O

STM32L082_PB2

GPIO Mode:PB2 LPTIM1_OUT

PB7/LPTIM1_IN2

I/O

STM32L082_PB7

GPIO Mode:PB7 LPTIM1_IN2

PB6/LPTIM1_ETR

I/O

STM32L082_ PB6

GPIO Mode:PB6 LPTIM1_ETR

PB5/LPTIM1_IN1

I/O

STM32L082_ PB5

GPIO Mode:PB5 LPTIM1_IN1

PA13/SWDIO

I/O

STM32L082_PA13

GPIO Mode:PA13 SWDIO LPUART1_RX

PA14/SWCLK

GPIO Mode:PA14 SWCLK LPUART1_TX

BOOT0

STM32L082_PA5

Boot Option

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I/O STM32L082_PA3

I/O STM32L082_PA2

Ground -

A,I/O -

Ground -

I/O STM32L082_PA1

I/O STM32L082_PC1

I/O STM32L082_PA14

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Preliminary Specification Number : SP-ABZ-D

GND

Ground

PH1-OSC_OUT

I/O

STM32L082_PH1

GPIO Mode:PH1 High-speed external clock OSC output

PH0-OSC_IN

I/O

STM32L082_PH0

GPIO Mode:PH0 High-speed external clock OSC input

TCXO_OUT

O - Internal TCXO output

VDD _TCXO

Power

Power supply for the TCXO IC

49~57

GND

Ground

Parameters

Min

Typ

Max

Storage Temperature

-40

+90

Input RF Level

- - 10

dBm

Supply Voltage

VDD_USB

-0.3 - 3.9

VDD_MCU, VDD_RF, VDD_TCXO

-0.3 - 3.9

VREF+

-0.3

DD_MCU

+0.4

Parameters

Min

Typ

Max

Unit

Operating Temperature

-40

+85

degC

Supply Voltage

VDD_USB (USB peripheral used)

(1)

3.0 - 3.6

VDD_USB(USB peripheral not used)

(1)

DD_MCU_min

DD_MCU

DD_MCU_max

VDD_MCU,VDD_RF,VDD_TCXO

2.2

(3)

3.6

VREF+

(2)

1.8

VDD_MCU

Note: GPIO pins are to be left OPEN if not used.

5. Label Information

TBD

6. Absolute Maximum Ratings

Table 3 Maximum ratings

8 / 19

Unit

degC

7. Operating Condition

Table 4 Operating specification

(1) VDD_USB must respect the following conditions:

- When VDD_MCU is powered on (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.

- When VDD_MCU is powered down (VDD_MCU < VDD_MCU_min), VDD_USB should be always lower than VDD_MCU.

- In operating mode, VDD_USB could be lower or higher than VDD_MCU.

- If the USB is not used, VDD_USB must be tied to VDD_MCU to be able to use PA11 and PA12 as standard I/Os.

(2) VREF+ is used to ensure a better accuracy on low-voltage inputs and outputs of ADC and DAC. Detailed information is

on the STM32L082*** datasheet and user guider.

(3) When module is on +20dBm operation, the supply of the voltage should be set from 2.4V to 3.6V.

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Preliminary Specification Number : SP-ABZ-D

Symbol

Description

Conditions

Min.

Typ

Max

Unit

RFS_F_HF

LnaBoost is turned on

FDA = 5 kHz, BR = 4.8 kb/s

-117.5

dBm

IDDR

Supply current in Receive mode

LnaBoost Off, band 1

LnaBoost On, band 1

Symbol

Description

Conditions

Min.

Typ

Max

Unit

RF_OP

RF output power in 50 ohms on RFO pin ( High efficiency PA)

Max

Min -5

RF_OPH

RF output power in 50 ohms on PA_BOOST pin( Regulated PA)

Max

18.5

Min 2

ΔRF_ OPH_V

RF output power stability on PA_BOOST pin versus voltage supply.

+/-1

ΔRF_T

RF output power stability versus temperature on PA_BOOST pin.

+/-1.5

IDDT

Supply current in Transmit mode with impedance matching

128

RFOP = +17 dBm, on PA_BOOST

106

RFOP = +14 dBm, on RFO_HF pin

RFOP = + 7 dBm, on RFO_HF pin

Symbol

Description

Conditions

Min.

Typ

Max

Unit

IDDR_L

Supply current in receiver LoRa mode, LnaBoost off

Band 1, BW = 125 kHz

21.5

Band 1, BW = 250 kHz

22.2

Band 1, BW = 500 kHz

23.6

RFS_L125_HF

RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 125 kHz bandwidth

SF = 6

-117.5

dBm

SF = 7

-122.5

dBm

SF = 8

-125.5

dBm

SF = 9

-128.5

dBm

SF = 10

-131.0

dBm

SF = 11

-133.5

dBm

SF = 12

-135.5

dBm

RFS_L250_HF

RF sensitivity, Long-Range Mode, highest LNA gain, LnaBoost for Band1, using split Rx/Tx path 250 kHz bandwidth

SF = 6

-114.0

dBm

SF = 7

-119.0

dBm

SF = 8

-122.0

dBm

SF = 9

-125.0

dBm

SF = 10

-127.5

SF = 11

-130.0

dBm

SF = 12

-133.0

dBm

8. Electrical Characteristics

8.1 FSK/OOK Transceiver Specification

Conditions:

Supply voltage VDD=3.3 V, temperature = 25 °C, FXOSC = 32 MHz, FRF =868/915 MHz , 2-level FSK modulation without pre-filtering, FDA = 5 kHz, Bit Rate = 4.8 kb/s and terminated in a matched 50 Ohm impedance, shared Rx and Tx path matching, unless otherwise specified.

FSK/OOK Receiver Specification

FSK/OOK Transmitter Specification

9 / 19

Programmable with steps

Programmable with 1dB steps

VDD = 2.2 V to 3.6 V

From T = -40 °C to +85 °C

RFOP = +20 dBm, on PA_BOOST

8.2 LoRa Transceiver Specification

Conditions: The table below gives the electrical specifications for the transceiver operating with LoRaTM modulation. Following conditions apply unless otherwise specified: Supply voltage = 3.3 V, Temperature = 25° C, FXOSC = 32 MHz, Error Correction Code (EC) = 4/5, Packet Error Rate (PER)= 1%, CRC on payload enabled, Payload length = 10 bytes. With matched impedances

LoRa Receiver Specification

dBm

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Preliminary Specification Number : SP-ABZ-D

Symbol

Description

Conditions

Min.

Typ

Max

Unit

IDDT_L

Supply current in transmitter mode

RFOP setting = 14 dBm

RFOP setting = 10 dBm

IDDT_H_L

Supply current in transmitter mode

Using PA_BOOST pin RFOP setting = 20 dBm

128

LoRa Transmitter Specification

9. Power Sequences

9.1 Power Up Sequence

10 / 19

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Preliminary Specification Number : SP-ABZ-D

10. Recommend Land Pattern

11 / 19

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Preliminary Specification Number : SP-ABZ-D

11. Reference circuit

10uF

12 / 19

VDD_U SB

for VDD_TCXO connection

Option1: Connect VDD_TCXO to VDD

Option2: Connect VDD_TCXO to PA12

to make sure MCU can control TCXO on/off

VDD

10uF

LoRa m odule

DBG_SX1276_DI O0

PB15/SPI2_M OSI

PB14/SPI2_M ISO

PB13/SPI2_SC K

PB12/SPI2_N SS

PA10/USAR T1_R X

PA9/USAR T1_T X

PA8/MC O

PA5/ADC 5/D AC2

PA4/ADC 4/D AC1

PA3/ADC 3

PA2/ADC 2

STSAFE_nRST

0.1uF C2

VDD_TCXO

PA12/USB_D P1PA11/USB_D M2GND3VDD_U SB4VDD_MCU5VDD_R F6GND7DBG_SX1276_DIO28DBG_SX1276_DIO39SX1276_DIO410DBG_SX1276_DIO511DBG_SX1276_DIO1

VDD_T CXO TCXO_OUT

PH0-OSC_I N

PH1-OSC_OU T

BOOT0

PA14/SWC LK

PA13/SWD IO

PB5/LPTI M1_I N1

PB6/LPTI M1_ET R

PB7/LPTI M1_I N2

PB9/I2C 1_SDA

PB8/I2C 1_SCL

PB2/LPTI M1_OU T

PA0/WKU P1

MCU_nRST

VREF+

GND54GND55GND56GND

GND GND GND GND GND

GND

53 52 51 50 49

48 47 46 45 44 43 42 41 40 39 38 37

Optional

10K

1uF

0.1uF

DBG_CR F128DBG_CR F329DBG_CR F2

GND

ANT

C8 C9

SMA connector to

868MHz/915MHz Antenna

1uF

VREF+

VDD

1.8V and VDD for better accuracy

on low-voltage inputs and outputs

of ADC and DAC.

10K

VDD

C7 0.1uF

ADC and DAC are not active.

2. VREF+ can be connected to a

separate voltage which is between

Button

1 2

Notes for VREF+

1. VREF+ can be grounded when

11223344556

SWD connector

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Preliminary Specification Number : SP-ABZ-D

2.0±0.1

1.75±0.10

0.30±0.05

11.5±0.1

13±0.1

1.5+0.1/-0.0

24.0±0.3

feeding direction

4.0±0.1 *1

12.1±0.1

1.5+0.1/-0

2±0.15

W1 W2

R80

R135

120

φ330±2

φ 80±1

φ13±0.2

Label

Reel inside width W1: 25.5±1.0 Reel outside width W2: 29.5±1.0 Unit: mm

12. Tape and Reel packing

12.1 Dimension of Tape (Plastic tape)

12.2 Dimensions of Reel

13 / 19

24.0±0.1

(unit : mm)

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Preliminary Specification Number : SP-ABZ-D

40 to 200mm

(No components)

Components No components

Feeding direction

Leader tape

(Cover tape alone)

150mm min.

250mm min.

Tail tape

Feeding Hole

Chip

Feeding Direction

14 / 19

12.3 Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62μm in thickness

[4] Base tape : As specified in (1)

12.4 Leader and Tail tape

[3]

[1]

[2]

[3]

[4]

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Preliminary Specification Number : SP-ABZ-D

1.3 N max.

Label

Desiccant

Humidity Indicator

Anti-humidity Plastic Bag

15 / 19

- The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user.

- The cover tape and base tape are not adhered at no components area for 250mm min.

- Tear off strength against pulling of cover tape : 5N min.

- Packaging unit : 1000 pcs/ reel

- Material

 Base tape : Plastic  Reel : Plastic  Cover tape, cavity tape and reel are made the anti-static processing.

- Peeling of force: 1.3N max. in the direction of peeling as shown below.

165 to 180 ?

0.7 N max.

Cover tape

- Packaging (Humidity proof Packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator.

表示ラベル

　湿度インジケ－タ

Base tape

表示ラべル

乾燥剤

防湿梱包袋

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Preliminary Specification Number : SP-ABZ-D

16 / 19

13. Notice

13.1 Storage Conditions

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5 to 35 °C and humidity from 20 ~ 70 %RH.

(Packing materials, in particular, may be deformed at the temperature over 40 °C)

- The product left more than 6months after reception, it needs to be confirmed the solderbility before used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020)

- After the packing opened, the product shall be stored at <30 °C / <60 %RH and the product shall be used within 168 hours.

- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125 +5/-0 °C, 24 hours, 1 time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant.

13.2 Handling Conditions

Be careful in handling or transporting products because excessive stress or mechanical shock may break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solderability.

13.3 Standard PCB Design (Land Pattern and Dimensions)

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

13.4 Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products.

13.5 Soldering Conditions：

The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C .

Contact Murata before use if concerning other soldering conditions.

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Preliminary Specification Number : SP-ABZ-D

time(s)

220 °C

Within 60 s

Cooling down Slowly

180 °C 150 °C

240 ~ 250 °C Within 3 s

17 / 19

Reflow Soldering Standard Conditions (Example)

Pre-heatin

Within 120 s

Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

13.6 Cleaning :

Since this Product is Moisture Sensitive, any cleaning is not permitted.

13.7 Operational Environment Conditions :

Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use.

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring.

13.8 Input Power Capacity :

Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range.

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Preliminary Specification Number : SP-ABZ-D

18 / 19

14. Regulatory Statements

14.1 FCC Statements

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

Cet appareil est conforme à la section 15 des réglementations de la FCC. Le fonctionnement de

l’appareil est sujetaux deux conditions suivantes : (1) cet appareil ne doit pas provoquer d’interférences néfastes, et

(2) cet appareil doit tolérer les interférences reçues, y compris celles qui risquent de provoquer un fonctionnement indésirable.

Note: This product has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This product generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this product does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

—Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

This equipment should be installed and operated with a minimum distance 20cm between the radiator and your body

Cet équipement doit être installé et utilisé à une distance minimale de 20 cm entre le radiateur et votre corps

When the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module FCC ID: VPYCMABZ” or “Contains FCC ID: VPYCMABZ”.

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14.2 IC Statements

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

When the Industry Canada certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label

referring to the enclosed module. This exterior label can be use wording ”Contains transmitter module IC: 772C-CMABZ”or “Contains IC: 772C-CMABZ”.

14.3 eneral Statements

The module is limited to OEM installation ONLY The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or

install module.

Therefore, the final host product must be submitted to [Sychip] for confirmation that the installation of the module into the host is in compliance with the regulations of FCC and IC Canada. Specifically, if an antenna other than the model documented in the Filing is used, a Class 2 Permissive Change must be filed with the FCC. Changes or modifications

the equipment.

The Lora module is for use with external antennas ONLY. The antenna is Monopole Antenna and maximum gain is 1.04 dBi.

This module has been approved by FCC to operate with the antenna types with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

not expressly approved by the manufacture could void the user's authority to operate

install

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CAUTION

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment.

- Aerospace equipment

- Undersea equipment.

- Power plant control equipment

- Medical equipment.

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment.

- Disaster prevention / crime prevention equipment.

- Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, Reverse-Engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers.

Customer acknowledges that Murata will, if requested by you, conduct a failure analysis for defect or alleged defect of Products only at the level required for consumer grade Products, and thus such analysis may not always be available or be in accordance with your request (for example, in cases where the defect was caused by components in Products supplied to Murata from a third party).

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 90 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent

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on the content of specification sheet or approval sheet.

Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by

・the use of the engineering sample other than for evaluation purposes, particularly the installation or

integration in the product to be sold by you,

・deviation or lapse in function of engineering sample, ・improper use of engineering samples.

We disclaims any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.

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