Motorola MTP15N06VL Datasheet

1
Motorola TMOS Power MOSFET Transistor Device Data
  

   
N–Channel Enhancement–Mode Silicon Gate
New Features of TMOS V
On–resistance Area Product about One–half that of Standard
MOSFETs with New Low Voltage, Low R
DS(on)
Technology
Faster Switching than E–FET Predecessors
Features Common to TMOS V and TMOS E–FETS
Avalanche Energy Specified
I
DSS
and V
DS(on)
Specified at Elevated Temperature
Static Parameters are the Same for both TMOS V and TMOS E–FET
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain–to–Source Voltage V
DSS
60 Vdc
Drain–to–Gate Voltage (RGS = 1.0 M) V
DGR
60 Vdc
Gate–to–Source Voltage — Continuous
Gate–to–Source Voltage — Non–repetitive (tp 10 ms)
V
GS
V
GSM
± 15 ± 25
Vdc Vpk
Drain Current — Continuous
Drain Current — Continuous @ 100°C Drain Current — Single Pulse (tp 10 µs)
I
D
I
D
I
DM
15 12 53
Adc
Apk
Total Power Dissipation
Derate above 25°C
P
D
60
0.40
Watts
W/°C
Operating and Storage Temperature Range TJ, T
stg
–55 to 175 °C
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, Peak IL = 15 Apk, L = 1.0 mH, RG = 25 )
E
AS
113 mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
R
θJC
R
θJA
2.5
62.5
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds T
L
260 °C
Designer’s Data for “Worst Case” Conditions —The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET, Designer’s, and TMOS V are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
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
SEMICONDUCTOR TECHNICAL DATA
TM
D
S
G

TMOS POWER FET
15 AMPERES
60 VOLTS
R
DS(on)
= 0.085 OHM
CASE 221A–06, Style 5
TO–220AB
Motorola, Inc. 1996
MTP15N06VL
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage (Cpk 2.0) (3)
(VGS = 0 Vdc, ID = 0.25 mAdc) Temperature Coefficient (Positive)
V
(BR)DSS
60 —
— 68
— —
Vdc
mV/°C
Zero Gate Voltage Drain Current
(VDS = 60 Vdc, VGS = 0 Vdc) (VDS = 60 Vdc, VGS = 0 Vdc, TJ = 150°C)
I
DSS
— —
— —
10
100
µAdc
Gate–Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc) I
GSS
100 nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage (Cpk 2.0) (3)
(VDS = VGS, ID = 250 µAdc) Threshold Temperature Coefficient (Negative)
V
GS(th)
1.0 —
1.5
4.0
2.0 —
Vdc
mV/°C
Static Drain–to–Source On–Resistance (Cpk 2.0) (3)
(VGS = 5.0 Vdc, ID = 7.5 Adc)
R
DS(on)
0.075 0.085
Ohm
Drain–to–Source On–Voltage
(VGS = 5.0 Vdc, ID = 15 Adc) (VGS = 5.0 Vdc, ID = 7.5 Adc, TJ = 150°C)
V
DS(on)
— —
— —
1.5
1.3
Vdc
Forward Transconductance (VDS = 8.0 Vdc, ID = 7.5 Adc) g
FS
8.0 10 mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
570 800 pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
C
oss
180 250
Reverse Transfer Capacitance
f = 1.0 MHz)
C
rss
45 90
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
t
d(on)
11 20 ns
Rise Time
t
r
150 300
Turn–Off Delay Time
VGS = 5.0 Vdc,
RG = 9.1 )
t
d(off)
27 50
Fall Time
G
= 9.1 )
t
f
70 140
Q
T
32 40 nC
DS
= 48 Vdc, ID = 15 Adc,
Q
1
3.0
(VDS = 48 Vdc, ID = 15 Adc,
VGS = 5.0 Vdc)
Q
2
7.0
Q
3
11
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 15 Adc, VGS = 0 Vdc)
(IS = 15 Adc, VGS = 0 Vdc, TJ = 150°C)
V
SD
— —
0.96
0.85
1.6 —
Vdc
t
rr
63
S
= 15 Adc, VGS = 0 Vdc,
t
a
42
(IS = 15 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs)
t
b
21
Reverse Recovery Stored Charge Q
RR
0.140 µC
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die.) (Measured from the drain lead 0.25″ from package to center of die)
L
D
— —
3.5
4.5
— —
nH
Internal Source Inductance
(Measured from the source lead 0.25″ from package to source bond pad)
L
S
7.5
nH
(1) Pulse Test: Pulse Width 300 µs, Duty Cycle 2%. (2) Switching characteristics are independent of operating junction temperature. (3) Reflects typical values.
Cpk =
Max limit – Typ
3 x SIGMA
Gate Charge
Reverse Recovery Time
(VDD = 30 Vdc, ID = 15 Adc,
(V
(I
ns
MTP15N06VL
3
Motorola TMOS Power MOSFET Transistor Device Data
TYPICAL ELECTRICAL CHARACTERISTICS
0 2 4 6 8 10
0
10
20
30
35
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 1. On–Region Characteristics
I
D
, DRAIN CURRENT (AMPS)
92 3 4 8
0
10
20
30
35
I
D
, DRAIN CURRENT (AMPS)
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
Figure 2. Transfer Characteristics
0 10 20 305
0
0.02
0.04
0.06
0.12
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
ID, DRAIN CURRENT (AMPS)
Figure 3. On–Resistance versus Drain Current
and Temperature
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
0 10 20 30 40
0
5
10
100
Figure 5. On–Resistance Variation with
Temperature
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 6. Drain–To–Source Leakage
Current versus Voltage
I
DSS
, LEAKAGE (nA)
TJ = 125°C
100°C
TJ = 25
°C
VDS ≥ 5 V
TJ = –55
°C
25
°C
100
°C
TJ = 100
°C
25
°C
–55
°C
VGS = 0 V
VGS = 10V
VGS = 5 V
40
5
7 V
6 V
5 V
8 V
9 V
40
5
5 6 7
0.08
0.1
35
35
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
0 10 20 30 4035
0.04
0.08
ID, DRAIN CURRENT (AMPS)
10 V
TJ = 25
°C
VGS = 5 V
0.06
5
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE
(NORMALIZED)
–50
0.2
0.4
0.6
0.8
2.0
TJ, JUNCTION TEMPERATURE (
°
C)
–25 0 25 50 75 100 150
VGS = 5 V ID = 7.5 A
1
1.4
1.6
1.8
125
175
1 3 5 7 9
15
25
15
25
0.14
15 25
0.1
15 25
45
50
45
50
10
0.12
0.14
0.16
0.02 0
45 50
1.2
15 25 45
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