Motorola MTP10N10EL Datasheet
1
Motorola TMOS Power MOSFET Transistor Device Data
N–Channel Enhancement–Mode Silicon Gate
This advanced TMOS power FET is designed to withstand high
energy in the avalanche and commutation modes. This new energy
efficient design also offers a drain–to–source diode with a fast
recovery time. Designed for low voltage, high speed switching
applications in p ower supplies, converters and P WM motor
controls, these devices are particularly well suited for bridge circuits
where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected
voltage transients.
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• I
DSS
and V
DS(on)
Specified at Elevated Temperature
MAXIMUM RATINGS
(TC = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain–to–Source Voltage V
DSS
100 Vdc
Drain–to–Gate Voltage (RGS = 1.0 MΩ) V
DGR
100 Vdc
Gate–to–Source Voltage — Continuous
— Non–Repetitive (tp ≤ 10 ms)
V
GS
V
GSM
±15
±20
Vdc
Vpk
Drain Current — Continuous @ TC = 25°C
— Continuous @ TC = 100°C
— Single Pulse (tp ≤ 10 µs)
I
D
I
D
I
DM
10
6.0
35
Adc
Apk
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation @ TC = 25°C
(1)
P
D
40
0.32
1.75
Watts
W/°C
Watts
Operating and Storage Temperature Range TJ, T
stg
–55 to 150 °C
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, Peak IL = 10 Adc, L = 1.0 mH, RG = 25 Ω)
E
AS
50
mJ
Thermal Resistance — Junction to Case°
— Junction to Ambient
— Junction to Ambient
(1)
R
θJC
R
θJA
R
θJA
3.13
100
71.4
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds T
L
260 °C
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics—are given to facilitate “worst case” design.
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
Order this document
by MTP10N10EL/D
SEMICONDUCTOR TECHNICAL DATA
Motorola, Inc. 1996
TMOS POWER FET
10 AMPERES
100 VOLTS
R
DS(on)
= 0.22 OHMS
Motorola Preferred Device
D
S
G
CASE 221A–06, Style 5
TO–220AB
MTP10N10EL
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V
(BR)DSS
100
—
—
115
—
—
Vdc
mV/°C
Zero Gate Voltage Drain Current
(VDS = 100 Vdc, VGS = 0 Vdc)
°
(VDS = 100 Vdc, VGS = 0 Vdc, TJ = 125°C)
I
DSS
—
—
—
—
10
100
µAdc
Gate–Body Leakage Current (VGS = ±15 Vdc, VDS = 0 Vdc) I
GSS
— — 100 nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc)
Threshold Temperature Coefficient (Negative)µ
V
GS(th)
1.0
—
1.45
4.0
2.0
—
Vdc
mV/°C
Static Drain–to–Source On–Resistance (VGS = 5.0 Vdc, ID = 5.0 Adc) R
DS(on)
— 0.17 0.22 Ohm
Drain–to–Source On–Voltage
(VGS = 5.0 Vdc, ID = 10 Adc)°
(VGS = 5.0 Vdc, ID = 5.0 Adc, TJ = 125°C)
V
DS(on)
—
—
1.85
—
2.6
2.3
Vdc
Forward Transconductance (VDS = 8.0 Vdc, ID = 5.0 Adc)
g
FS
5.0 7.9 — mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
— 741 1040 pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
C
oss
— 175 250
Reverse Transfer Capacitance
f = 1.0 MHz)
C
rss
— 18.9 40
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
t
d(on)
— 11 20 ns
Rise Time
= 50 Vdc, I
= 10 Adc,
t
r
— 74 150
Turn–Off Delay Time
(VDD = 50 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc, Rg = 9.1 Ω)
t
d(off)
— 17 30
Fall Time t
f
— 38 80
Gate Charge
Q
T
— 9.3 15 nC
(See Figure 8)
= 80 Vdc, I
= 10 Adc,
Q
1
— 2.56
(VDS = 80 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc)
Q
2
— 4.4 —
Q
3
— 4.6 —
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 10 Adc, VGS = 0 Vdc)
(IS = 10 Adc, VGS = 0 Vdc, TJ = 125°C)
V
SD
—
—
0.98
0.898
1.6
—
Vdc
t
rr
— 124.7 —
= 10 Adc, V
= 0 Vdc,
t
a
— 86 —
(IS = 10 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/µs)
t
b
— 38.7 —
Reverse Recovery Stored Charge Q
RR
— 0.539 — µC
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25″ from package to center of die)
L
d
— 4.5 —
nH
Internal Source Inductance
(Measured from the source lead 0.25″ from package to source bond pad.)
L
s
— 7.5 —
(1) Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.
(2) Switching characteristics are independent of operating junction temperature.
Reverse Recovery Time
(V
(V
(I
ns
MTP10N10EL
3
Motorola TMOS Power MOSFET Transistor Device Data
TYPICAL ELECTRICAL CHARACTERISTICS
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
Figure 1. On–Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On–Resistance versus Drain Current
and Temperature
ID, DRAIN CURRENT (AMPS)
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
Figure 5. On–Resistance Variation with
Temperature
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 6. Drain–To–Source Leakage
Current versus Voltage
I
DSS
, LEAKAGE (nA)
TJ = 25°C
VGS = 5 V
10 V
VGS = 0 V
0 40 60
1
100
20 100
TJ = 125°C
0.25
0.2
10
5 10 2015
100°C
D
I , DRAIN CURRENT (AMPS)
10
5
0
0 2 531
VDS, DRAIN–TO–SOURCE VOLTAGE (VOLTS)
VGS = 10 V
7 V
3.5 V
4 V
5 V
TJ = 25°C
D
I , DRAIN CURRENT (AMPS)
5
0
1 2 3 4 5
VGS, GATE–TO–SOURCE VOLTAGE (VOLTS)
VDS ≥ 5 V
–55°C
TJ = 100°C
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE (OHMS)
0.35
0.25
0.15
0.05
0 5 10
ID, DRAIN CURRENT (AMPS)
VGS = 5 V
TJ = 25°C
100°C
–55°C
0.15
0.1
0
R
DS(on)
, DRAIN–TO–SOURCE RESISTANCE
(NORMALIZED)
TJ, JUNCTION TEMPERATURE (°C)
VGS = 5 V
ID = 5 A
–50 0 50 100 150125–25 25 75
2
1.5
1
0.5
0
4
15
20
4.5 V
25°C
15
20
15 20
3 V
2 V
10
80
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