SEMICONDUCTOR TECHNICAL DATA
The RF Line
The MRF6409 is designed for GSM base stations applications. It incorporates high value emitter ballast resistors, gold metallizations and offers a high
degree of reliability and ruggedness.
• To be used in Class AB
• Specified 26 Volts, 960 MHz Characteristics
Output Power — 20 Watts CW
Gain — 1 1 dB Typ
Efficiency — 60% Typ
Order this document
by MRF6409/D
20 W, 960 MHz
RF POWER TRANSISTOR
NPN SILICON
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage V
Collector–Emitter Voltage V
Emitter–Base Voltage V
Collector–Current — Continuous I
Total Device Dissipation @ TC = 25°C
Derate above 25°C
Storage Temperature Range T
Operating Junction Temperature T
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case (1) R
ELECTRICAL CHARACTERISTICS (T
Characteristic
= 25°C unless otherwise noted)
C
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown V oltage
(IC = 20 mAdc, IB = 0)
Emitter–Base Breakdown Voltage
(IB = 5.0 mAdc, IC =0)
Collector–Emitter Breakdown Voltage
(IC = 20 mAdc, VBE = 0)
Collector–Cutoff Current
(VCE = 30 Vdc, VBE = 0)
(1) Thermal resistance is determined under specified RF operating condition.
V
(BR)CEO
V
(BR)EBO
V
(BR)CES
I
CES
CASE 319–07, STYLE 2
CEO
CES
EBO
C
P
D
stg
J
θJC
24 30 — Vdc
4.0 5.0 — Vdc
55 60 — Vdc
— — 6.0 mA
24 Vdc
55 Vdc
4.0 Vdc
5.0 Adc
45
0.26
–65 to +150 °C
200 °C
3.8 °C/W
Watts
W/°C
Motorola, Inc. 1997
MRF6409MOTOROLA RF DEVICE DATA
1
ELECTRICAL CHARACTERISTICS — continued (T
Characteristic
ON CHARACTERISTICS
DC Current Gain
(ICE = 1.0 Adc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 26 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS
Common–Emitter Amplifier Power Gain
(VCC = 26 Vdc, P
Collector Efficiency
(VCC = 26 Vdc, P
Load Mismatch
(VCC = 26 Vdc, P
Load VSWR = 3:1, All Phase Angles at Frequency of Test)
C8
= 20 W (CW), ICQ = 50 mA, f = 960 MHz)
out
= 20 W (CW), ICQ = 50 mA, f = 960 MHz)
out
= 15 W (CW), ICQ = 50 mA, f = 960 MHz,
out
R2
= 25°C unless otherwise noted)
C
Symbol Min Typ Max Unit
h
FE
C
ob
G
pe
η 50 60 — %
Ψ
T1
20 35 80 —
— 18 — pF
10 11 — dB
No Degradation in Output Power
+
5.0 V
–
RF INPUT
C7
C6
R1
B1
C1
B1, B2 Ferrite Bead
C1 3.3 pF, Chip Capacitor, High Q
C2, C3 4.7 pF, Chip Capacitor, High Q
C4 2.2 pF, Chip Capacitor, High Q
C5 82 pF, Chip Capacitor, High Q
C6, C9 330 pF, Chip Capacitor, High Q
C7, C10 0.1 µF, Chip Capacitor
C8 22 µF, 16 V, Tantalum Capacitor
D2
D1
R3
P1
D.U.T.
C11 4.7 µF, 50 V, Tantalum Capacitor
D1, D2 Diode BAS16 Type or Equivalent
P1 1.0 kΩ, Trimmer
R1 3.3 Ω, Chip Resistor
R2 68 Ω, Chip Resistor
R3 2.2 kΩ, Resistor
T1 NPN Transistor
Board Glass Teflon, εr = 2.55, H = 1/50 inch
Figure 1. T est Circuit Electrical Schematic
C9
C3
C2 C4
B2
C5
C10
C11
RF OUTPUT
+
26 V
–
MRF6409
2
MOTOROLA RF DEVICE DATA