MRF5035
2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS — continued (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
ON CHARACTERISTICS
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 25 mAdc)
V
GS(th)
1.25 2.3 3.5 Vdc
Drain–Source On–Voltage
(VGS = 10 Vdc, ID = 3 Adc)
V
DS(on)
— — 0.422 Vdc
Forward Transconductance
(VDS = 10 Vdc, ID = 3 Adc )
g
fs
3.2 — — S
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
iss
— 88 — pF
Output Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
oss
— 197 — pF
Reverse Transfer Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
rss
18 24 29 pF
FUNCTIONAL TESTS (In Motorola Test Fixture)
Common–Source Amplifier Power Gain
(VDD = 12.5 Vdc, P
out
= 35 W, f = 512 MHz
IDQ = 400 mA) f = 175 MHz
G
ps
6.5
—
7.5
12
—
—
dB
Drain Efficiency
(VDD = 12.5 Vdc, P
out
= 35 W, f = 512 MHz
IDQ = 400 mA) f = 175 MHz
η
50
—
55
55
—
—
%
Load Mismatch
(VDD = 15.5 Vdc, 2 dB Overdrive, f = 512 MHz,
Load VSWR = 20:1, All Phase Angles at Frequency of Test)
ψ
No Degradation in Output Power
Components List
B1, B2 Short Ferrite Bead, Fair Rite Products
C1, C14 10 µF, 50 V, Electrolytic
C2 1500 pF, Chip Capacitor
C3 140 pF, Chip Capacitor
C4, C11 0–10pF, Trimmer Capacitor
C5 30 pF, Chip Capacitor
C6, C7 43 pF, Chip Capacitor
C8, C9 36 pF, Chip Capacitor
C10 3.6 pF, Chip Capacitor
C12, C15, C16 120 pF, Chip Capacitor
C13 0.1 µF, Chip Capacitor
L1 5 Turns, 18 AWG, 0.116″ ID
L2 8 Turns, 20 AWG, 0.125″ ID
N1, N2 Type N Flange Mount
R1 1 kΩ, 1/4 W, Carbon
R2 1 MΩ, 1/4 W, Carbon
R3 100 Ω, 1/4 W, Carbon
R4 110 Ω, 1/4 W, Carbon
Z1, Z9 Transmission Line*
Z2 Transmission Line*
Z3 Transmission Line*
Z4 Transmission Line*
Z7 Transmission Line*
Z8 Transmission Line*
Board Glass Teflon 0.060″
*See Photomaster for Dimensions
Figure 1. 512 MHz Narrowband Test Circuit Electrical Schematic
C15
B2
Z4
RF Input
N1
V
GG
R1
C4
Z3Z1 Z2
RF Output
N2
Z9C16Z8Z7
V
DD
C14
C12
C13
C3
L1
L2
C11
C10
DUT
C5
R2
C1
C2
B1
Socket
R3
C6 C9
C7 C8
R4
+ +