Motorola MRF5035 Datasheet

1
MRF5035MOTOROLA RF DEVICE DATA
The RF MOSFET Line
    
N–Channel Enhancement–Mode
Designed for broadband commercial and industrial applications at frequen­cies to 520 MHz. The high gain and broadband performance of this device makes it ideal for large–signal, common source amplifier applications in 12.5 volt mobile, and base station FM equipment.
Guaranteed Performance at 512 MHz, 12.5 Volt
Output Power — 35 Watts Power Gain — 6.5 dB Min Efficiency — 50% Min
Characterized with Series Equivalent Large–Signal Impedance Parameters
S–Parameter Characterization at High Bias Levels
Excellent Thermal Stability
All Gold Metal for Ultra Reliability
Capable of Handling 20:1 Load VSWR, @ 15.5 Volt, 512 MHz,
2 dB Overdrive
Circuit board photomaster available upon request by contacting
RF Tactical Marketing in Phoenix, AZ.
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain–Source Voltage V
DSS
36 Vdc
Drain–Gate Voltage (RGS = 1 MΩ) V
DGR
36 Vdc
Gate–Source Voltage V
GS
± 20 Vdc
Drain Current — Continuous I
D
15 Adc
Total Device Dissipation @ TC = 25°C
Derate above 25°C
P
D
97
0.56
Watts
W/°C
Storage Temperature Range T
stg
– 65 to +150 °C
Operating Junction Temperature T
J
200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
θJC
1.8 °C/W
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage (VGS = 0, ID = 20 mAdc) V
(BR)DSS
36 Vdc
Zero Gate Voltage Drain Current (VDS = 15 Vdc, VGS = 0) I
DSS
5 mAdc
Gate–Source Leakage Current (VGS = 20 Vdc, VDS = 0) I
GSS
5 µAdc
(continued)
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
Order this document
by MRF5035/D

SEMICONDUCTOR TECHNICAL DATA
35 W, 12.5 VOLTS, 512 MHz
N–CHANNEL BROADBAND
RF POWER FET
CASE 316–01, STYLE 3
Motorola, Inc. 1994
REV 6
MRF5035 2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS — continued (T
C
= 25°C unless otherwise noted.)
Characteristic
Symbol Min Typ Max Unit
ON CHARACTERISTICS
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 25 mAdc)
V
GS(th)
1.25 2.3 3.5 Vdc
Drain–Source On–Voltage
(VGS = 10 Vdc, ID = 3 Adc)
V
DS(on)
0.422 Vdc
Forward Transconductance
(VDS = 10 Vdc, ID = 3 Adc )
g
fs
3.2 S
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
iss
88 pF
Output Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
oss
197 pF
Reverse Transfer Capacitance
(VDS = 12.5 Vdc, VGS = 0, f = 1 MHz)
C
rss
18 24 29 pF
FUNCTIONAL TESTS (In Motorola Test Fixture)
Common–Source Amplifier Power Gain
(VDD = 12.5 Vdc, P
out
= 35 W, f = 512 MHz
IDQ = 400 mA) f = 175 MHz
G
ps
6.5 —
7.5 12
— —
dB
Drain Efficiency
(VDD = 12.5 Vdc, P
out
= 35 W, f = 512 MHz
IDQ = 400 mA) f = 175 MHz
η
50 —
55 55
— —
%
Load Mismatch
(VDD = 15.5 Vdc, 2 dB Overdrive, f = 512 MHz, Load VSWR = 20:1, All Phase Angles at Frequency of Test)
ψ
No Degradation in Output Power
Components List
B1, B2 Short Ferrite Bead, Fair Rite Products C1, C14 10 µF, 50 V, Electrolytic C2 1500 pF, Chip Capacitor C3 140 pF, Chip Capacitor C4, C11 0–10pF, Trimmer Capacitor C5 30 pF, Chip Capacitor C6, C7 43 pF, Chip Capacitor C8, C9 36 pF, Chip Capacitor C10 3.6 pF, Chip Capacitor C12, C15, C16 120 pF, Chip Capacitor C13 0.1 µF, Chip Capacitor L1 5 Turns, 18 AWG, 0.116 ID L2 8 Turns, 20 AWG, 0.125 ID
N1, N2 Type N Flange Mount R1 1 k, 1/4 W, Carbon R2 1 M, 1/4 W, Carbon R3 100 , 1/4 W, Carbon R4 110 Ω, 1/4 W, Carbon Z1, Z9 Transmission Line* Z2 Transmission Line* Z3 Transmission Line* Z4 Transmission Line* Z7 Transmission Line* Z8 Transmission Line* Board Glass Teflon 0.060
*See Photomaster for Dimensions
Figure 1. 512 MHz Narrowband Test Circuit Electrical Schematic
C15
B2
Z4
RF Input
N1
V
GG
R1
C4
Z3Z1 Z2
RF Output
N2
Z9C16Z8Z7
V
DD
C14
C12
C13
C3
L1
L2
C11
C10
DUT
C5
R2
C1
C2
B1
Socket
R3
C6 C9
C7 C8
R4
+ +
3
MRF5035MOTOROLA RF DEVICE DATA
TYPICAL CHARACTERISTICS
C
rss
C
iss
C
oss
VGS = 0 V f = 1 MHz
Typical Device Shown
Typical Device Shown
f = 400 MHz
VDD = 12.5 V Pin = 7 W
3 W
5 W
7 W
Pin = 10 W
3 W
5 W
7 W
Pin = 10 W
VDD = 12.5 V IDQ = 400 mA
520 MHz
470 MHzf = 400 MHz
P
out
, OUTPUT POWER (WATTS)
14
Figure 2. Output Power versus Input Power
50
Pin, INPUT POWER (WATTS)
10
0
4
20
40
30
Figure 3. Output Power versus Supply Voltage
55
0
8
VDD, SUPPLY VOLTAGE (VOLTS)
10
45
25
15
122 6 10 14
35
P
out
, OUTPUT POWER (WATTS)
Figure 4. Output Power versus Supply Voltage
VDD, SUPPLY VOLTAGE (VOLTS)
Figure 5. Output Power versus Gate Voltage
50
VGS, GATE–SOURCE VOLTAGE (VOLTS)
1 4
40
30
2 3
6 16
0
0
0
10
20
P
out
, OUTPUT POWER (WATTS)
P
out
, OUTPUT POWER (WATTS)
5
Figure 6. Drain Current versus Gate Voltage
6
VGS, GATE–SOURCE VOLTAGE (VOLTS)
1
0
2
2
4
Figure 7. Capacitance versus Voltage
0
5
VDS, DRAIN–SOURCE VOLTAGE (VOLTS)
10
350
250
151 3 4 20
400
0 250
C, CAPACITANCE (pF)
300
200
100
50
150
30
8 12
50
5
40
20
10
30
9 11 13 157
55
0
8 10
45
25
15
12 14
35
6 16
50
5
40
20
10
30
9 11 13 157
65
I
D
, DRAIN CURRENT (AMPS)
5
3
IDQ = 400 mA f = 400 MHz
IDQ = 400 mA f = 520 MHz
520 MHz
VDS = 10 V
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