MOTOROLA MCM4464 Technical data

MCM4464 SERIES
1
MOTOROLA FAST SRAM
1MB R4000 Secondary Cache Fast Static RAM Module Set
Four MCM4464 modules comprise a full 1 MB of secondary cache for the R4000 processor. Each module contains nine MCM6709J fast static RAMs for a cache data size of 64K x 36. The tag portion, dependent on word line size, contains either two MCM6709J or one MCM6706J fast static RAMs. All input sig­nals, except A0 and WE
are buffered using 74FBT2827 drivers with series 25
resistors.
The MCM6709J and MCM6706J are fabricated using high–performance sili­con–gate BiCMOS technology. Static design eliminates the need for internal clocks or timing strobes.
All 1MB R4000 supported secondary cache options are available.
Single 5 V ± 10% Power Supply
All Inputs and Outputs are TTL Compatible
Three State Outputs
Fast Module Access Time: 12/15/17 ns
Zero Wait–State Operation
Unified or Split Seconday Cache Modules are Available (See Ordering
Information for Details)
Word Line Sizes of 4, 8, 16, and 32 are Available (See Ordering
Information for Details)
The Pin Compatible MCM44256 Series is also Available to Support a Full
4MB R4000 Secondary Cache.
Decoupling Capacitors are Used for Each Fast Static RAM and Buffer,
Along with Bulk Capacitance for Maximum Noise Immunity
High Quality Multi–Layer FR4 PWB with Separate Power and Ground
Planes
Write Enable. . . . . . . . . . . . . . . . . . . . . . .
DCS
Data Enable. . . . . . . . . . . . . . . . . . . . . .
TCS
Tag Enable. . . . . . . . . . . . . . . . . . . . . . .
OE
Output Enable. . . . . . . . . . . . . . . . . . . . .
DQ0 – DQ35 Data Input / Output. . . . . . . . .
TDQ0 – TDQ7 TAG Data Input / Output. . . V
CC
+ 5 V Power Supply. . . . . . . . . . . . . . . .
V
SS
Ground. . . . . . . . . . . . . . . . . . . . . . . . . .
For proper operation of the device, VSS must be connected to ground.
Order this document
by MCM4464/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
PIN ASSIGNMENT
80 LEAD SIMM — TOP VIEW
MCM4464 Series
VCC2
DQ5 V
SS
DQ8 DQ10 DQ12 DQ14 DQ15 DQ17
DQ19 DQ21
V
SS
DQ23 DQ25 DQ27
V
SS
DQ0 DQ2
DQ4 DQ6
DQ9 DQ11
DQ13 V
SS DQ16 DQ18
DQ20 DQ22 V
CC
DQ28
DQ7
19 21
23 25 27 29
1 3 5 7
9 11 13 15
17
20 22
24 26 28
30 32
4 6
8 10 12 14 16 18
31
DQ3
33 35 37
34 36 38
40
39
DQ31
V
SS
DQ26
DQ24
DQ34 42
A0 A2 A4 A6
V
CC OE
A8
A10
V
SS A13 A15
NC TDQ0 TDQ1
DQ33 DQ35 WE
A1 A3
V
SS
DCS A7
A9 A11 A12 A14 NC TCS
TDQ4
A5
59 61 63 65 67 69
41 43 45
47 49 51
53 55
57
60 62 64
66* 68*
70 72
44 46 48
50 52
54 56 58
71
V
SS
73 75 77
74 76 78 80
79 V
CC
TDQ6
TDQ2
V
SS
DQ29 DQ30 DQ32
DQ1
TDQ3 TDQ5 TDQ7
V
SS
NOTE: Pin assignment is for unified cache. For
split cache option, Pin 68 becomes Address MSB (A15) and Pin 66 is NC.
REV 1 8/94
Motorola, Inc. 1994
查询MCM4464供应商
A0 – A15 Address Inputs. . . . . . . . . . . . . . . .
WE
PIN NAMES
MCM4464 SERIES 2
MOTOROLA FAST SRAM
BLOCK DIAGRAM
A0 DQ0 – DQ3 W
MCM6709J E G A1 A2 A3 – A15
A3 – A15
A0
DQ0 – DQ35
TCS DCS
OE
A1 A2
WE
TDQ0 – TDQ7
74FBT2827
DRIVER
4 WORD
LINE SIZE
64K x 36 CACHE
TAG OPTIONS:
36
8
MCM6709J
MCM6706J
MCM6706J
MCM6706J
W G DQ0 – DQ7
A0 A1 A2 – A14 E
64K x 8
TAG
8 WORD
LINE SIZE
32K x 8
TAG
(A0 NOT USED)
16 WORD LINE SIZE
16K x 8
TAG
(A0, A1 NOT USED)
32 WORD LINE SIZE
8K x 8
TAG
(A0, A1, A2 NOT USED)
W G DQ0 – DQ7
A0 A1 A2 – A14 E
W G DQ0 – DQ7
A0 A1 A2 – A14 E
W G DQ0 – DQ7
A0 A1
A3 – A15 E
A2
MCM4464 SERIES
3
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to V
SS
= 0 V)
Rating
Symbol Value Unit
Power Supply Voltage V
CC
– 0.5 to 7.0 V
Voltage Relative to V
SS
Vin, V
out
– 0.5 to VCC + 0.5 V
Output Current (per I/O) I
out
± 30 mA
Power Dissipation P
D
10 W
Temperature Under Bias T
bias
– 10 to + 85 °C
Operating Temperature T
A
0 to + 70 °C
Storage Temperature T
stg
– 25 to +125 °C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V ± 10%, TA = 0 to + 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
(Voltages referenced to VSS = 0 V)
Parameter
Symbol Min Typ Max Unit
Supply Voltage (Operating Voltage Range) V
CC
4.5 5.0 5.5 V
Input High Voltage
(DQ0 – 35, TDQ0 – 7, WE
, A0)
(A1 – A15, OE
, DCS, TCS)
V
IH
2.2
2.0
— —
VCC + 0.3 V* VCC + 0.3 V*
V
Input Low Voltage V
IL
– 0.5**
0.8 V
*VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2 V ac (pulse width 20 ns)
**VIL (min) = – 3.0 V ac (pulse width 20 ns)
DC CHARACTERISTICS
Parameter Symbol Min Typ Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VCC) I
lkg(I)
± 10 µA
Output Leakage Current (G, xCS = VIH, V
out
= 0 to VCC) Ilkg(O) ± 10 µA
AC Supply Current (G, xCS = VIL, I
out
= 0 mA) I
CCA
1850 mA
Output Low Voltage (IOL = + 8 mA) V
OL
0.4 V
OUtput High Voltage (IOH = – 4.0 mA) V
OH
2.4 V
Note: Good decoupling of the local power supply should always be used.
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
A
= 25°C, Periodically Sampled Rather Than 100% Tested)
Parameter
Symbol Typ Max Unit
Input Capacitance (A0, WE)
(A1 – A15, OE
, DCS, TCS)
C
in
C
in
 
110
10
pF pF
Input/Output Capacitance C
out
10 pF
on this module contain circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to these high–imped­ance circuits.
These BiCMOS memory circuits have been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. The module is in a test socket or mounted on a printed circuit board and transverse air flow of at leat 500 linear feet per minute is maintained.
This devices
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