Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 2
1 Publication Order Number:
MC74HC390A/D
MC74HC390A
Dual 4-Stage Binary Ripple
Counter with
÷
2 and
÷
5
Sections
High–Performance Silicon–Gate CMOS
The MC74HC390A is identical in pinout to the LS390. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device consists of two independent 4–bit counters, each
composed of a divide–by–two and a divide–by–five section. The
divide–by–two and divide–by–five counters have separate clock
inputs, and can be cascaded to implement various combinations of ÷ 2
and/or ÷ 5 up to a ÷ 100 counter.
Flip–flops internal to the counters are triggered by high–to–low
transitions of the clock input. A separate, asynchronous reset is
provided for each 4–bit counter. State changes of the Q outputs do not
occur simultaneously because of internal ripple delays. Therefore,
decoded output signals are subject to decoding spikes and should not
be used as clocks or strobes except when gated with the Clock of the
HC390A.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No 7A
• Chip Complexity: 244 FETs or 61 Equivalent Gates
LOGIC DIAGRAM
Q
A
Q
B
Q
C
Q
D
1, 15
4, 12
2, 14
3, 13
5, 11
6, 10
7, 9
PIN 16 = V
CC
PIN 8 = GND
CLOCK A
RESET
CLOCK B
÷ 2
COUNTER
÷ 5
COUNTER
FUNCTION TABLE
Clock
A B Reset Action
X X H Reset
÷ 2 and ÷ 5
X L Increment
÷ 2
X L Increment
÷ 5
SO–16
D SUFFIX
CASE 751B
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TSSOP–16
DT SUFFIX
CASE 948F
1
16
PDIP–16
N SUFFIX
CASE 648
1
16
1
16
MARKING
DIAGRAMS
1
16
MC74HC390AN
AWLYYWW
1
16
HC390A
AWLYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
HC
390A
ALYW
1
16
Device Package Shipping
ORDERING INFORMATION
MC74HC390AN PDIP–16 2000 / Box
MC74HC390AD SOIC–16
48 / Rail
MC74HC390ADR2 SOIC–16 2500 / Reel
MC74HC390ADT TSSOP–16 96 / Rail
MC74HC390ADTR2 TSSOP–16
2500 / Reel
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
CLOCK B
b
Q
Ab
RESET b
CLOCK A
b
V
CC
Q
Db
Q
Cb
Q
Bb
CLOCK B
a
Q
Aa
RESET a
CLOCK A
a
GND
Q
Da
Q
Ca
Q
Ba
MC74HC390A
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DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
TSSOP Package†
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Maximum Input Leakage
Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tf = tf = 6 ns)
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
Maximum Propagation Delay, Clock A to QA
(Figures 1 and 3)
Maximum Propagation Delay, Clock A to QC
(QA connected to Clock B)
(Figures 1 and 3)
Maximum Propagation Delay, Clock B to QB
(Figures 1 and 3)
Maximum Propagation Delay, Clock B to QC
(Figures 1 and 3)
Maximum Propagation Delay, Clock B to QD
(Figures 1 and 3)
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
Maximum Input Capacitance
pF
1. For propagation delays with loads other than 50 pF , see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Counter)*
35
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).