Motorola MC68030 User Manual

MOTOROLA
m SEMICONDUCTOR
TECHNICAL DATA
ELECTRICAL SPECIFICATIONS
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MC68030
(~)MOTOROLA INC., 1990
MOTOROLA
Rev 1
m:
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Employer.
ELECTRICAL SPECIFICATIONS

MAXIMUM RATINGS

Rating Symbol Value
Supply Voltage* VC~ C -0.3 to +7.0 Input Voltage Vin - (~:5 to + 7.0 Operating Temperature Range
Minimum Ambient Temperature T A 0 40-MHz Maximum Ambient T A 70
Temperature
50-MHz Maximum Case T C 80
Temperature
Storage Temperature Range Tstg -55 to 150
*A continuous clock must be supplied to the MC68030 when it is powered
up.

THERMAL CHARACTERISTICS- PGA PACKAGE

Characteristic Symbol Value Rating
Thermal Resistance -- Ceramic °C/W
J~Jnction tO Ambient ejA 30* Junction to Case 0jC 15"
~Estimated
Unit
V
"V
°C
°C
This device contains protective cir- cuitry against damage due to high static voltages or electrical fields; however, it is advised that normal precautions be taken to avoid ap- plication of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to in appropriate logic voltage level (e.g., either GND or VCC).
MO,TOROLA
MC68030 ELECTRICAL SPECIFICATIONS

POWER CONSIDERATIONS

The average chip-junction temperature, T j, in °C can be obtained from:
Tj = T A + (PD ° 03A) (1
where:. ..
T A = Ambient Temperature, °C 0jA = Package Thermal Resistance,
Junction-to-Ambient, °C/W
PD = PINT+ PI/O
'PINT = IccxVcc, Watts-- Chip lnternaI Power
PI/O . - Power,Dissipationon Input and Output Pins
-- User Determined -.
For most applications PI/O<PINT and can be neglected. '
The foliowing is an approximate relationship between PD and Tj (if PI/O is
neglected):. .. .
...... . PD=.K+(Tj+273°C) , ,,.. . (2)
Solving equations (1)and (2) forKgives: ' ' " " ":
K = PD" (TA + 273°C) + eJA ° PD 2 (3) where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium) for a known T A. Using this value of K, the values (~f PD and Tj can be obtained by solving'equ"ations
(1) and (2) iteratively for any value of T A.
The total thermal resistance of a package (0jA)can be separated into two components, 0jC and 0CA, representing the barrier to heatflow from the
semiconductor junction to the package (case) surface (eJC) and from the case
to the outside ambient (0CA). These terms are related by the equation:
0jA=0jC+0CA (4)
ejC is device related and cannot be influenced by the user. However, 0CA is
user dependent and can be minimized by such thermal management tech- niques as heat sinks, ambient good thermal management on the part of the user can significantly reduce eCA so that 0jA approximately equals 0jC. Substitution of ejC for 0jA in
equation (1) will result in a lower semiconductor junction temperature.
Values for thermal resistance presented in this document, unless.estimated, were derived using the procedure described in Motorola Reliability Report
7843, "Thermal Resistance Measurement Method for MC68XX Microcom- ponent Devices," and are provided for design purposes only. Thermal meas- urements are complex and dependent on procedure and setup. User derived
values for thermal resistance may differ.
MC68030~ELECTRICAL;SP.ECIFICATIO NS
air
cooling, and thermal convection. Thus,
•MOTOROLA
AC ELECTRICAL SPECIFICATIONS DEFINITIONS
The AC specifications presented consist of output delays, input setup and
hold times, and signal skew times. All signals are specified relative to an appropriate edge of the MC68030 clock input and, possibly, relative to one or more other signals.
The measurement of the AC specifications is defined by the waveforms in
Figure 1. To test the parameters guaranteed by MQtorola, inputs must be
driven to the voltage levels •specified in~ Figure 1. Outputs of the MC68030 are specifiedwith minimum.and/or maximum limits, as appropriate, and are
measured as shown. Inputs to the MC68030 are specified with minimum and, as appropriate, maximum setup and hold times, and are measured asshown.
Finally, the measurements for signal-to-signal specifications are also shown.
Note that the testing levels used to verify conformance of the MC68030 to the AC specifications:does ~ not affect the guaranteed DC operation of the
device as specified in the DC electrical characteristics.
ME)'~OROEA MC68030!ELECTRICAL SPECIFICATIONS 3
' " ' CLK
"
" DRIVE
TO 2.4 V
D°TPUTS(2):L~ ' " VAL'O " '~2"0V 2.OV .'VA"0'
I 00TP,T° 0.aV~V_/_/-'I~_~V OUTPOTo+,
..... , ........ To 2:iv "TA--Y- 2.0 v VAL, O 28 v-&V77
;RIVE IN 0T 08V
T00,v t._c4._0_, t
. INPUTS(4) CLK "-~2E08; :NApL~DT :.::~ T02.4V
ALL
SIGNALS
(S)
NOTES:
- 1 - This out[)ut timing is applicable to all parameters specified relative to the rising edge of the clock 2"-This output'timing is applicable to all parameiers specified relative to" the fallingecIge ofthe cl()ck " 3 - This input timing is applicable to all parameters specified relative to the rising edge of the Clock
4 - This
input
5 - This timing is applicable to all parameters specified relative to the assertion/negation of another signal
LEGEND:
A - Maximum output delay specification B - Minimum output hold time C - Minimum input setup time specification D - Minimum input hold time specification E - Signal valid to signal valid specification (maximum or minimum) F - Signal valid to signal invalid specification (maximum or minimum)
timing is applicable to all
V
. --~-- 2.0 V
.~- 0.8 V
parameters specified
relative to the
falling
edge of the clock
.

Figure 1. Drive Levels and Test Points for AC Specifications

4 MC68030 ELECTRICAL-SPECIFICATIONS MOTOROLA
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