Motorola MC54HCT74AJ, MC145012P, MC145012DW, MC74HCT74AN, MC74HCT74AD Datasheet

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SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
         
High–Performance Silicon–Gate CMOS
The MC74HCT74A is identical in pinout to the LS74. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs.
This device consists of two D flip–flops with individual Set, Reset, and Clock inputs. Information at a D–input is transferred to the corresponding Q output on the next positive going edge of the clock input. Both Q and Q outputs are available from each flip–flop. The Set and Reset inputs are asynchronous.
Output Drive Capability: 10 LSTTL Loads
TTL NMOS Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0 µA
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 136 FETs or 34 Equivalent Gates
LOGIC DIAGRAM
RESET 1
DATA 1
CLOCK 1
SET 1
RESET 2
DATA 2
CLOCK 2
SET 2
1
2
3
4 13
12
11
10
5
6
9
8
Q1
Q1
Q2
Q2
PIN 14 = VCC PIN 7 = GND
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Design Criteria
Value
Units
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Internal Gate Count*
34
ea.
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Internal Gate Propagation Delay
1.5
ns
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Internal Gate Power Dissipation
5.0
µW
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Speed Power Product
.0075
pJ
* Equivalent to a two–input NAND gate.
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FUNCTION TABLE
PIN ASSIGNMENT
Inputs Outputs
Set Reset Clock Data Q Q
L H X X H L
H L X X L H
L L X X H* H* H H H H L H H L L H H H L X No Change H H H X No Change H H X No Change
*Both outputs will remain high as long as
Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously.
SET 1
CLOCK 1
DATA 1
RESET 1
11
12
13
14
8
9
105
4
3
2
1
7
6
SET 2
CLOCK 2
DATA 2
RESET 2
V
CC
Q2
Q2
GND
Q1
Q1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ORDERING INFORMATION
MC54HCTXXAJ MC74HCTXXAN MC74HCTXXAD
Ceramic Plastic SOIC
1
14
1
14
MC74HCT74A
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
V
in
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
V
out
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
I
in
DC Input Current, per Pin
± 20
mA
I
out
DC Output Current, per Pin
± 25
mA
I
CC
DC Supply Current, VCC and GND Pins
± 50
mA
P
D
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
750 500
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
260
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: –10mW/_C from 65_ to 125_C
SOIC Package: –7mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
DC Supply Voltage (Referenced to GND)
4.5
5.5
V
Vin, V
out
DC Input Voltage, Output Voltage (Referenced to GND)
0
V
CC
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time (Figure 1)
0
500
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC V
– 55 to
25_C
v
85_C
v
125_C
Unit
V
IH
Minimum High–Level Input Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
4.5
5.5
2.0
2.0
2.0
2.0
2.0
2.0
V
V
IL
Maximum Low–Level Input Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
4.5
5.5
0.8
0.8
0.8
0.8
0.8
0.8
V
Vin = VIH or V
IL
|I
out
| v 20 µA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
Vin = VIH or V
IL
|I
out
| v 4.0 mA
4.5
3.98
3.84
3.7
Vin = VIH or V
IL
|I
out
| v 20 µA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
Vin = VIH or V
IL
|I
out
| v 4.0 mA
4.5
0.26
0.33
0.4
I
in
Maximum Input Leakage Current
Vin = VCC or GND
5.5
± 0.1
± 1.0
± 1.0
µA
I
CC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND I
out
= 0 µA
5.5
2.0
20
80
µA
I
CC
–55_C
25_C to 125_C
Current
Vin = VCC or GND, Other Inputs l
out
= 0 µA
2.9
2.4
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
V
OH
V
OL
Minimum High–Level Output Voltage
Maximum Low–Level Output Voltage
V
V
Additional Quiescent Supply
Vin = 2.4 V, Any One Input
5.5
mA
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