Motorola MC54HC4066J, MC74HC4066N, MC74HC4066DT Datasheet


SEMICONDUCTOR TECHNICAL DATA
1
REV 6
Motorola, Inc. 1995
10/95
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High–Performance Silicon–Gate CMOS
The MC54/74HC4066 utilizes silicon–gate CMOS technology to achieve fast propagation delays, low ON resistances, and low OFF–channel leakage current. This bilateral switch/multiplexer/demultiplexer controls analog and digital voltages that may vary across the full power–supply range (from V
CC
to GND).
The HC4066 is identical in pinout to the metal–gate CMOS MC14016 and MC14066. Each device has four independent switches. The device has been designed so that the ON resistances (RON) are much more linear over input voltage than RON of metal–gate CMOS analog switches.
This device is identical in both function and pinout to the HC4016. The ON/OFF control inputs are compatible with standard CMOS outputs; with pullup r esistors, they are compatible w ith LSTTL o utputs. For analog switches with voltage–level translators, see the HC4316.
Fast Switching and Propagation Speeds
High ON/OFF Output Voltage Ratio
Low Crosstalk Between Switches
Diode Protection on All Inputs/Outputs
Wide Power–Supply Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
Analog Input Voltage Range (VCC – GND) = 2.0 to 12.0 Volts
Improved Linearity and Lower ON Resistance over Input Voltage than
the MC14016 or MC14066 or HC4016
Low Noise
Chip Complexity: 44 FETs or 11 Equivalent Gates
LOGIC DIAGRAM
X
A
Y
A
1 2
A ON/OFF CONTROL
13
X
B
Y
B
4 3
B ON/OFF CONTROL
5
X
C
Y
C
8 9
C ON/OFF CONTROL
6
X
D
Y
D
11 10
D ON/OFF CONTROL
12
ANALOG OUTPUTS/INPUTS
ANALOG INPUTS/OUTPUTS = XA, XB, XC, X
D
PIN 14 = V
CC
PIN 7 = GND

FUNCTION TABLE
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
Y
D
X
D
D ON/OFF CONTROL
A ON/OFF CONTROL
V
CC
X
C
Y
C
X
B
Y
B
Y
A
X
A
GND
C ON/OFF CONTROL
B ON/OFF CONTROL
On/Off Control State of
Input Analog Switch
L Off H On
D SUFFIX
SOIC PACKAGE
CASE 751A–03
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
ORDERING INFORMATION
MC54HCXXXXJ MC74HCXXXXN MC74HCXXXXD MC74HCXXXXDT
Ceramic Plastic SOIC TSSOP
1
14
1
14
1
14
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
1
14
MC54/74HC4066
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
CC
Positive DC Supply Voltage (Referenced to GND)
– 0.5 to + 14.0
V
V
IS
Analog Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
V
in
Digital Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
I
DC Current Into or Out of Any Pin
± 25
mA
P
D
Power Dissipation in Still Air,Plastic or Ceramic DIP†
SOIC Package†
TSSOP Package†
750 500 450
mW
T
stg
Storage Temperature
– 65 to + 150
_
C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
(Ceramic DIP)
260 300
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V
CC
Positive DC Supply Voltage (Referenced to GND)
2.0
12.0
V
V
IS
Analog Input Voltage (Referenced to GND)
GND
V
CC
V
V
in
Digital Input Voltage (Referenced to GND)
GND
V
CC
V
VIO*
Static or Dynamic Voltage Across Switch
1.2
V
T
A
Operating Temperature, All Package Types
– 55
+ 125
_
C
tr, t
f
Input Rise and Fall Time, ON/OFF Control Inputs (Figure 10) VCC = 2.0 V
VCC = 4.5 V VCC = 9.0 V
VCC = 12.0 V
0 0 0 0
1000
500 400 250
ns
*For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may
be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC V
– 55 to
25_C
v
85_Cv 125_C
Unit
V
IH
Minimum High–Level Voltage ON/OFF Control Inputs
Ron = Per Spec
2.0
4.5
9.0
12.0
1.5
3.15
6.3
8.4
1.5
3.15
6.3
8.4
1.5
3.15
6.3
8.4
V
V
IL
Maximum Low–Level Voltage ON/OFF Control Inputs
Ron = Per Spec
2.0
4.5
9.0
12.0
0.3
0.9
1.8
2.4
0.3
0.9
1.8
2.4
0.3
0.9
1.8
2.4
V
I
in
Maximum Input Leakage Current ON/OFF Control Inputs
Vin = VCC or GND
12.0
± 0.1
± 1.0
± 1.0
µA
I
CC
Maximum Quiescent Supply Current (per Package)
Vin = VCC or GND VIO = 0 V
6.0
12.0
2 8
20 80
40
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance cir­cuit. For proper operation, Vin and V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus.
MC54/74HC4066
High–Speed CMOS Logic Data DL129 — Rev 6
3 MOTOROLA
DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
V
CC V
– 55 to
25_C
v
85_Cv 125_C
Unit
R
on
Maximum “ON” Resistance
Vin = V
IH
VIS = VCC to GND IS v 2.0 mA (Figures 1, 2)
2.0†
4.5
9.0
12.0
170
85 85
— 215 106 106
— 255 130 130
Vin = V
IH
VIS = VCC or GND (Endpoints) IS v 2.0 mA (Figures 1, 2)
2.0
4.5
9.0
12.0
— 85 63 63
106
78 78
— 130
95
95
R
on
Maximum Difference in “ON” Resistance Between Any Two Channels in the Same Package
Vin = V
IH
VIS = 1/2 (VCC – GND) IS v 2.0 mA
2.0
4.5
9.0
12.0
— 30 20 20
— 35 25 25
40
30
30
I
off
Maximum Off–Channel Leakage Current, Any One Channel
Vin = V
IL
VIO = VCC or GND Switch Off (Figure 3)
12.0
0.1
0.5
1.0
µA
I
on
Maximum On–Channel Leakage Current, Any One Channel
Vin = V
IH
VIS = VCC or GND (Figure 4)
12.0
0.1
0.5
1.0
µA
†At supply voltage (VCC – GND) approaching 2 V the analog switch–on resistance becomes extremely non–linear. Therefore, for low–voltage
operation, it is recommended that these devices only be used to control digital signals.
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, ON/OFF Control Inputs: tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
V
CC V
– 55 to
25_C
v
85_Cv 125_C
Unit
t
PLH
,
t
PHL
Maximum Propagation Delay, Analog Input to Analog Output
(Figures 8 and 9)
2.0
4.5
9.0
12.0
50 10 10 10
65 13 13 13
75
15
15
15
ns
t
PLZ
,
t
PHZ
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 11)
2.0
4.5
9.0
12.0
150
30 30 30
190
38 30 30
225
45
30
30
ns
t
PZL
,
t
PZH
Maximum Propagation Delay, ON/OFF Control to Analog Output
(Figures 10 and 1 1)
2.0
4.5
9.0
12.0
125
25 25 25
160
32 32 32
185
37
37
37
ns
C
Maximum Capacitance ON/OFF Control Input
10
10
10
pF
Control Input = GND
Analog I/O
Feedthrough
— —
35
1.0
35
1.0
35
1.0
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Switch) (Figure 13)*
15
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
MC54/74HC4066
MOTOROLA High–Speed CMOS Logic Data
DL129 — Rev 6
4
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
Parameter
Test Conditions
V
CC
V
Limit*
25_C
54/74HC
Unit
BW
Maximum On–Channel Bandwidth or Minimum Frequency Response
(Figure 5)
fin = 1 MHz Sine Wave Adjust fin Voltage to Obtain 0 dBm at V
OS
Increase fin Frequency Until dB Meter Reads – 3 dB
RL = 50 , CL = 10 pF
4.5
9.0
12.0
150 160 160
MHz
Off–Channel Feedthrough Isolation
(Figure 6)
fin Sine Wave Adjust fin Voltage to Obtain 0 dBm at V
IS
fin = 10 kHz, RL = 600 , CL = 50 pF
4.5
9.0
12.0
– 50 – 50 – 50
dB
fin = 1.0 MHz, RL = 50 , CL = 10 pF
4.5
9.0
12.0
– 40 – 40 – 40
Feedthrough Noise, Control to Switch
(Figure 7)
Vin v 1 MHz Square Wave (tr = tf = 6 ns) Adjust RL at Setup so that IS = 0 A
RL = 600 , CL = 50 pF
4.5
9.0
12.0
60
130 200
mV
PP
RL = 10 k, CL = 10 pF
4.5
9.0
12.0
30 65
100
Crosstalk Between Any Two Switches
(Figure 12)
fin Sine Wave Adjust fin Voltage to Obtain 0 dBm at V
IS
fin = 10 kHz, RL = 600 , CL = 50 pF
4.5
9.0
12.0
– 70 – 70 – 70
dB
fin = 1.0 MHz, RL = 50 , CL = 10 pF
4.5
9.0
12.0
– 80 – 80 – 80
THD
Total Harmonic Distortion
(Figure 14)
fin = 1 kHz, RL = 10 k, CL = 50 pF THD = THD
Measured
– THD
Source
VIS = 4.0 VPP sine wave VIS = 8.0 VPP sine wave
VIS = 11.0 VPP sine wave
4.5
9.0
12.0
0.10
0.06
0.04
%
*Guaranteed limits not tested. Determined by design and verified by qualification.
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