MOTOROLA MC33560DTB, MC33560DTBR2, MC33560DW, MC33560DWR2 Datasheet

MC33560

Power Management and Interface IC for Smartcard Readers and Couplers

The MC33560 is an interface IC for smartcard reader/writer applications. It enables the management of any type of smart or memory card through a simple and flexible microcontroller interface. Moreover, several couplers can be coupled in parallel, thanks to the chip select input pin (pin #5). The MC33560 is particularly suited to low power and portable applications because of its power saving features and the minimum of external parts required. Battery life is extended by the wide operating range and the low quiescent current in stand by mode. A highly sophisticated protection system guarantees timely and controlled shutdown upon error conditions.

• 100% Compatible with ISO 7816–3 Standard

• Wide Battery Supply Voltage Range: 1.8V < V

• Programmable V

Supply for 3V or 5V Card Operation

CC

• Power Management for Very Low Quiescent Current in Stand By

Mode (30µA max)

• Microprocessor Wake–up Signal Generated Upon Card Insertion

• Self Contained DC/DC Converter to Generate V

of Passive Components

• Controlled Power Up/Down Sequence for High Signal Integrity on

the Card I/O and Signal Lines

• Programmable Card Clock Generator

• Chip Select Capability for Parallel Coupler Operation

• High ESD Protection on Card Pins (4kV, Human Body Model)

• Fault Monitoring V

BATlow

, V

CClow

and I

CClim

• All Card Outputs Current Limited and Short Circuit Protected

• T ested Operating Temperature Range: –25°C to +85°C

Figure 1. Simplified Functional Block Diagram

VBAT

ILIM

PGND

PWRON

INT

RDYMOD

CS

L1

POWER

MANAGER

AND

PROGRAMMING

DC/DC

CONVERTER

< 6.6V

BAT

using a Minimum

CC

CARD

DETECTOR

DELAY

CRDDET CRDCON

24

DTB SUFFIX

http://onsemi.com

1

TSSOP–24

CASE 948H

24

PIN CONNECTIONS

124

PGND

PWRON

RDYMOD

INVOUT

ASYCLKIN

SYNCLK

CRDGND

2

INT

3 4

CS

5

RESET

6 7

IO CRDCON

8

9 10 11

CRDIO CRDRST

12

(Top View)

23 22 21 20 19 18 17 16 15 14 13

SO–24L DW SUFFIX CASE 751E

1

ILIM VBAT L1 C4 C8 CRDC8

CRDDET CRDC4 CRDCLK

CRDVCC

SYNCLK

ASYCLKIN

INVOUT

IO

RESET

C4 C8

 Semiconductor Components Industries, LLC, 1999

October, 1999 – Rev. 0

CLOCK

GENERATOR

VBAT

LEVEL

TRANSLATOR

ORDERING INFORMATION

CRDVCC CRDIO

CRDRST CRDC4

CRDC8 CRDCLK CRDGND

1 Publication Order Number:

Device Package Shipping

MC33560DW MC33560DWR2 MC33560DTB MC33560DTBR2

SO–24WB 30 Units/Rail

SO–24WB 1000 Tape & Reel TSSOP–24 62 Units/Rail TSSOP–24 2500 Tape & Reel

MC33560/D

MC33560

MAXIMUM RATINGS (Note 1)

Rating

Battery Supply Voltage V Battery Supply Current I Power Supply Voltage V Power Supply Current I Digital Input Pins

(2, 4, 5, 6, 7, 9, 10, 17, 18, 20, 21)

Digital Output Pins (3, 4, 8) V

Card Interface Pins (11, 13, 14, 15, 16, 19) V

Coil Driver Pin (22), ILIM (pin 24) Power Ground (pin 1)

ESD Capability: (Note 2) Standard Pins (2, 3, 4, 5, 6, 7, 8, 9, 10, 17, 18,

20, 21, 22, 23, 24)

Card Interface Pins (11, 13, 14, 15, 16, 19) SO–24WB Package:

Power Dissipation @ TA = 85 °C Thermal Resistance Junction to Air

TSSOP–24 Package:

Power Dissipation @ TA = 85 °C

Thermal Resistance Junction to Air Operating Ambient Temperature Range T Operating Junction Temperature Range T Max. Junction Temperature (Note 3) T Storage Temperature Range T

Note 1: Maximum electrical ratings are those values beyond which damage to the device may. TA = 25°C Note 2: Human body model, R = 1500W, C = 100pF Note 3: Maximum thermal rating beyond which damage to the device may occur This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, input and output voltages should be constrained to the ranges indicated in the recommended operating conditions.

Symbol Value Unit

BAT

CC

V

I

OUT

I

OUT

Card

I

Card

V

ESD

P

R

θJAs

P

R

θJAt

Jmax

CC

IN

I

L

Ds

Dt

A

stg

– 0.5 to VBAT + 0.5 but < 7

– 0.5 to VCC + 0.5

J

7 V

± 200 mA

6 V

± 150 mA

± 5

±10

± 25

± 200 ± 100

2

4

285 140

220 180

– 40 to + 85 °C

– 40 to + 125 °C

150 °C

– 65 to + 150 °C

V

mA

V

mA

V

mA mA

kV

mW

°C/W

mW

°C/W

ELECTRICAL CHARACTERISTICS These specifications are written in the same style as common for standard

integrated circuits. The convention considers current flowing into the pin (sink current) as positive and current flowing out of the pin (source current) as negative. (Conditions: V 85°C, L1 =47µH, R

BATTERY POWER SUPPLY SECTION

Supply Voltage Range

normal operating range extended operating range (Note 4) MC33560 Stand By Quiescent Current

PWRON = GND, CRDCON = GND, ASYCLKIN = GND, V

all other logic inputs and outputs open

DC Operating Current

–ICC = 10mA ; VCC =5V ,V V

undervoltage detection:

BAT

Upper Threshold

Lower Threshold

Hysteresis

Note 4: See figures 2 and 3.

=0W, CRDVCC capacitor=10µF, unless otherwise noted.)

LIM

Characteristic

= 6V

BAT

= 4V, VCC = 5V nom, PWRON = V

BAT

= 6V,

BAT

, operating mode, –ICC = 10mA, –25°C ≤ TA ≤

BAT

Symbol Min Typ Max Unit

V

BAT

I

oBAT

I

BATop

2.2

1.8

6.0

6.6 30

12.5 mA

1.6

1.4

0.2

http://onsemi.com

2

V

m

s

V

MC33560

VCC = 5V NOMINAL POWER SUPPLY SECTION

Characteristic

Output Voltage 2.2V v V

Card VCC Undervoltage Detection:

Upper Threshold Lower Threshold Switching Hysteresis

Peak Output Current VCC = 4V, internally limited

Current limit time–out VCC = 4V t Start–up Current VCC = 2V; 0°C to +85°C

Low Side Switch Saturation Voltage IL = 50mA, pin 22 V Rectifier on Saturation Voltage IL = 50mA, pin 22 to pin 13 V Converter Switching Frequency TA = 25 °C f Shut Down Current

(Card access deactivated)

VCC = 3V NOMINAL POWER SUPPLY SECTION (V

Characteristic

Output Voltage 2.2V v V

Card VCC Undervoltage Detection:

Upper Threshold Lower Threshold Switching Hysteresis

Start–up Current Shut Down Current

(Card access deactivated)

APPLICATION INTERFACE DC SECTION (V

Characteristic

Input High Threshold Voltage

(increasing)

Input Low Threshold Voltage

(decreasing)

Switching Hysteresis pins 2, 4, 5, 6, 10, 17 V Threshold Voltage pin 9

Pull–down resistance VIN = V Pull–up resistance VIN = 0.5V, pin 3, 4, 5 R Output High Voltage IOH = –2.5µA, pin 3, pin 4 for CS = H

Output Low Voltage IOL = 1.0 mA, pins 7, 20, 21

Input Leakage Current VIN = 2.5V, CS = H, pins 9, 17, 18,

1mA v –ICC v 10mA

2.5V v V 1mA v –ICC v 50mA

(RDYMOD output) (see table 4)

VCC = 2V PWRON = GND, VCC = 2V

pins 2, 4, 5, 6, 10, 17 V

pins 2, 5, 6, 10 pin 17 pin 4

pin18

IOH = –50µA, pins 7, 20,21 IOH = –0.2mA, pin 8 pin 4 ( in output mode)

IOL = 0.2mA, pins 3, 4, 8

20, 21

Test Conditions Symbol

v 6V

1mA v –ICC v 25mA

3.0V v V 1mA v –ICC v 60mA

(RDYMOD output) (see table 4)

(RDYMOD = L)

PWRON = GND, VCC = 2V I

BAT

v 6V

BAT

–40°C to 0°C

= 2.5V, –ICC = 5mA)

BAT

Test Conditions Symbol

v 6V

BAT

v 6V

BAT

= 5V)

BAT

Test Conditions Symbol

–1V, pin 2, 6, 7, 10 R

BAT

Guaranteed Limits

Min Typ Max

V

CC

V

T5H

V

T5L

V

HYS5

–I

CClim

d

–I

CCst

sat22

Fsat22

sw

SD

V

CC

V

T3H

V

T3L

V

HYS3

–I

CCst

I

SD

IH

V

IL

HYST V

TH

down

up

V

OH

V

OL

+/–Ileak 2.0

4.75

4.60

4.2

120

80 mA

80 50

80 mA

Min Typ Max

2.75

2.60

2.4 80

50 50

Min Typ Max

0.55*V

BAT

0.3*V

BAT

0.2*V

BAT

0.3*V

BAT

0.06*V

BAT

0.5*V

BAT

0.4*V

BAT

120 240 500 120 240 500

V

–1 V

BAT

5.0

VCC–0.14 V

4.5

180

160 ms

100 160 mV 400 520 mV 120 kHz

Guaranteed Limits

3.0

VCC–0.1

2.7

110

Guaranteed Limits

0.65*V

0.45*V

0.40*V

0.5*V

0.3*V

0.6*V

5.25

5.40

3.25

3.40

0.4 V

BAT

BAT BAT

BAT BAT BAT

BAT

Unit

V

mV

mA

Unit

V

V V

mV

mA

Unit

V

V V

k

W

k

W

m

A

http://onsemi.com

3

MC33560

CARD INTERFACE DC SECTION (V

Characteristic

Output High Voltage IOH = –20µA, pin 11, 16, 19

Output Low Voltage IOL = 1mA, pins 11, 16, 19

I/O Pull–up resistance, operating

mode, CS

Card pins security voltage (Card access deactivated)

Note 5: the transistors T1 on lines IO, C4 and C8 (see figure 24) have a max Rdson of 250W.

DIGITAL DYNAMIC SECTION (V

Input Clock Frequency pin 9, duty cycle = 50% f Card Clock Frequency pin 15 f Card Clock Duty Cycle (Note 7) pin 15, 50% to 50% VCC ,

Card Clock Rise and Fall Time pin15, 10% ↔ 90% V I/O Data Transfer Frequency pin [7, 11], [21, 16], [20, 19] (Note 8) f I/O Duty Cycle pin [7, 11], [21, 16], [20, 19] (Note 8)

I/O Rise and Fall Time pin [7, 11], [21, 16], [20, 19] (Note 8)

I/O Transfer Time pin [7, 11], [21, 16], [20, 19] (Note 8)

Card Signal Sequence Interval pin 11, 14, 15, 16, 19,

Card Detection Filter Time: Card insertion Card extraction

Internal Reset Delay RES, VCC power up/down t Ready Delay Time pin 4 t PWRON low Pulse Width CS = L, pin 2 t

Note 6: Pin loading=30pF, except INVOUT=15pF Note 7: As the clock buffer is optimized for low power consumption and hence not symmetrical, clock signal duty cycle is guaranteed for divide by 2 and divide by 4 ratio. Note 8: In either direction

DIGITAL DYNAMIC SECTION (V

Data Setup Time

RDYMOD, PWRON, RESET, IO

Data Hold Time

RDYMOD, PWRON, RESET, IO

CS low Pulse Width pin 5 t

=L, PWRON =H

Characteristic Test Conditions Symbol Min Typ Max Unit

= 5V)

BAT

Test Conditions Symbol

Min Typ Max

V

IOL = 0.2mA, pins 14, 15

IOL = 0.2mA, pins 14, 15 VOL = 0.5V , pin 11, 16, 19 18

PWRON = GND, lin=10mA, pin 11,

14, 15, 16, 19

= 5V, normal operating mode, Note 6)

BAT

fio = 16MHz

CC

50% to 50% V

10% ↔ 90% V

50% to 50% VCC , L H, H L

VCC power up/down

= 5V, programming mode, Note 6)

BAT

pin 2, 4, 6, 7 t

CC

OH

V

OL

V

security

asyclk

crdclk

r

clk

t

rclk

r

t

rio

t

dseq

t

fltin

t

fltout

dres drdy

won

smod

hmod

wcs

VCC –0.9 V

45 55 %

, t

fclk io io

, t

fio

tr

45 55 %

50 50

2.0

1.0

2.0

Guaranteed Limits

1.0 MHz

0.2 1.0

20

Guaranteed Limits

Unit

0.4 V

2.0 V

20 MHz 20 MHz

10 ns

150 ns

100 ns

150 150

2.0

k

W

m

s

m

s

m

s

m

s

m

s

m

s

m

s

m

s

m

s

http://onsemi.com

4

MC33560

IBATop

(

A)

I

(

A)

IBATop

M

(

A)

Figure 2. Maximum Battery and Card Supply

Current vs. V

200 180 160 140 120

m

100

80 60 40 20

0

1.5

2.5 3.5 7.5

ICC MAX

(V

CC

=5V)

BAT

IBATop MAX

4.5 5.5 6.5

VBAT (V)

Mode Sync

SYNCLK=4MHz

L1=47µH

Rlim=0

Figure 4. Battery Current vs. Input Clock Frequency

(ICC=0, V

14

VBAT=4V

12

L1=47µH

Rlim=0

10

ICC=0

m

8 6 4 2 0

2.0 4.0 6.0 8.0 10

0

Frequency (MHz)

BAT

=4V)

Async

Sync

Async/2

Async/4

12 14 16

Figure 3. Maximum Battery and Card Supply

200 180 160 140 120 100

I (mA)

Current vs. V

IBATop MAX

80 60 40 20

0

1.5

2.5 3.5 7.5

(VCC=3V)

BAT

ICC MAX

4.5 5.5 6.5

VBAT (V)

Mode Sync

SYNCLK=4MHz

L1=47µH

Rlim=0

Figure 5. Battery Current vs. Input Clock Frequency

(I

14 12 10

8 6

IBATop (mA)

4 2 0

=0, V

CC

VBAT=2.5V

L1=47µH

Rlim=0

ICC=0

2.0 4.0 6.0 8.0 10

0

Frequency (MHz)

BAT

=2.5V)

Async

Sync

Async/2 Async/4

12 14 16

Figure 6. Maximum Battery Current vs. R

(VCC=5V, V

250

200

L1=100µH

m

150

ax

100

50

L1=22µH

0

L1=47µH

12

Rlim (ohms)

=4V)

BAT

Mode Sync

SYNCLK=4MHz

VBAT=4V

34

LIM

5

Figure 7. Maximum Battery Current vs. R

250

200

150

100

IBATop Max (mA)

50

L1=22µH

0

(VCC=3V, V

L1=100µH

L1=47µH

12

Rlim (ohms)

BAT

=2.5V)

LIM

Mode Sync

SYNCLK=4MHz

VBAT=2.5V

34

5

http://onsemi.com

5

MC33560

Figure 8. Maximum Card Supply Current

vs. R

120 120

L1=100µH

100

80

60

ICC Max (mA)

40

20

L1=22µH

0

12

(VCC =5V, V

LIM

L1=47µH

Rlim (ohms)

=4V)

BAT

Mode Sync

SYNCLK=4MHz

VBAT=4V

34

5

Figure 10. Low Side Switch Saturation Voltage

(I

=50mA) vs. Temperature

L

0.08

0.07

0.06

0.05

0.04

0.03

0.02

Low Side Switch Saturation Voltage (V)

0.01

0.00 –25

–5 15 9535 55 75

TA, Ambient Temperature (°C)

100

80

60

ICC Max (mA)

40

20

L1=22µH

0

0.35

0.30

0.25

0.20

0.15

0.10

Rectifier On Saturation Voltage (V)

0.05

0.00 –25

Figure 9. Maximum Card Supply Current

vs. R

L1=100µH

12

(VCC =3V, V

LIM

L1=47µH

Rlim (ohms)

=2.5V)

BAT

Mode Sync

SYNCLK=4MHz

VBAT=2.5V

34

Figure 11. Rectifier On Saturation Voltage

(I

=50mA) vs. Temperature

L

–5 15 9535 55 75

TA, Ambient Temperature (°C)

5

Figure 12. Card Detection (insertion) filter time

vs. T emperature

115 110 105

µ

100

95 90 85

tfltin, Filter Time ( s)

80 75

70

–5 15 9535 55 75–25 –5 15 9535 55 75–25

TA, Ambient Temperature (°C) TA, Ambient Temperature (°C)

115 110

105

µ

100

95 90 85

tfltout, Filter Time ( s)

80 75

70

http://onsemi.com

6

Figure 13. Card Detection (extraction) filter time

vs. T emperature

MC33560

Figure 14. Pull Down Resistance vs. T emperature

350 330

W

310 290 270 250 230 210

Pull Down Resistance (k )

190 170 150

–25

–5 15 7535 55

TA, Ambient Temperature (°C)

Figure 15. Transition from 5V to 3V Card Supply Figure 16. Transition from 3V to 5V Card Supply

95

Figure 17. Overcurrent Shutoff (t

=160ms)

d

http://onsemi.com

7

Figure 18. Undervoltage Shutoff (V

T5L

=4.6 V)

CS

PWRON

INT

RDYMOD

VBAT

240 k

VBAT

240 k

VBAT

240 k

VBATOK

MC33560

Figure 19. Functional Block Diagram

VBAT

VBATOK

CS

PWRON

CS

CARD

CRDVCC

POWER

MANAGEMENT

LOGIC AND

PROGRAMMING

FAUL T

S

Q

LOGIC

R

CRDCON CRDDET

DELAY

t

50 mS

PROGRAM

CARDENABLE

RESET

SYNCLK

ASYCLKIN

C4

C8

CARD PINS

SEQUENCER

SEQ2 SEQ3 SEQ4

SEQ1

VBAT

IO

240 k

SEQ1

CARDENABLE

VBATOK

VBAT

SEQ3

CARDENABLE

VBATOK

VBAT

SEQ3

CARDENABLE

VBATOK

DATA

LATCH

240 k

CARDENABLE

240 k

FAULT ON/OFF 3V/5V

VBAT

DC/DC CONVERTER

BIDIRECTIONAL

I/O

BIDIRECTIONAL

I/O

BIDIRECTIONAL

I/O

CLOCK

GENERATOR

AND

PROGRAMMING

VBAT

LEVEL

SHIFT

SEQ4

CRDVCC

VBAT

LEVEL

SHIFT

CRDVCC

ILIM L1 CRDVCC

CRDIO

CRDC4

CRDC8

CRDRST

CRDCLK

SEQ2

INVOUT

PROGRAM

http://onsemi.com

8