SEMICONDUCTOR TECHNICAL DATA
The MC10H166 is a 5–Bit Magnitude Comparator and is a functional/
pinout duplication of the standard MECL 10K part with 100%
improvement in propagation delay and no increase in power–supply
current.
The MC10H166 is a high–speed expandable 5–bit comparator for
comparing the magnitude of two binary words. Two outputs are provided:
A<B and A>B. The A = B function can be obtained by wire–ORing these
outputs (a low level indicates A = B) or by wire–NORing the outputs (a
high level indicates A = B). A high level on the enable function forces both
outputs low.
• Propagation Delay, Data–to–Output, 2.0 ns Typical
• Power Dissipation 440 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current— Continuous
— Surge
Operating Temperature Range T
Storage Temperature Range— Plastic
— Ceramic
I
T
EE
I
out
A
stg
–8.0 to 0 Vdc
0 to V
EE
50
100
0 to +75 °C
–55 to +150
–55 to +165
Vdc
mA
°C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
Input Current High I
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V
inH
inL
OH
OL
— 117 — 106 — 117 mA
E
— 350 — 220 — 220 µA
0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
IH
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
AC PARAMETERS
Propagation Delay
Data–to–Output
Enable–to–Output
Rise Time t
Fall Time t
NOTES:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.
t
pd
1.1
3.5
1.1
3.7
0.6
1.7
0.7
0.6 1.5 0.6 1.6 0.6 1.7 ns
r
0.6 1.5 0.6 1.6 0.6 1.7 ns
f
1.7
1.2
0.7
4.1
1.8
ns
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
TRUTH TABLE
Inputs
E
H
L
L
L
A B A < B A > B
XXL
WORD A = WORD B
WORD A > WORD B
WORD A < WORD B
DIP
PIN ASSIGNMENT
V
CC1
A>B
A<B
B0
A0
A1
B1
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
1
2
3
4
5
6
7
8
Book (DL122/D).
16
15
14
13
12
11
10
9
Outputs
L
L
L
H
V
E
B2
A2
A3
B3
B4
A4
CC2
L
H
L
3/93
Motorola, Inc. 1996
2–266
REV 5
A4 9
B4 10
MC10H166
LOGIC DIAGRAM
A3 12
B3 11
A2 13
B2 14
A1 6
B1 7
A0 5
B0 4
15
E
FIGURE 1 — 9–BIT MAGNITUDE COMPARA-
A0 B0 A1 B1 A2 B2 A3 B3 A4 B4
TOR
A5 B5 A6 B6 A7 B7 A8 B8
2 A
>
B
<
B
3 A
V
= PIN 1
CC1
V
= PIN 16
CC2
VEE= PIN 8
A0 A1 A2 A3 A4
B0 B1 B2 B3 B4
MC10H166
>
BA
A
<
B
For longer word lengths, the MC10H166 can be serially
expanded or cascaded. Figure 1 shows two devices in a
serial expansion for a 9–bit word length. The A > B and
A < B outputs are fed to the A0 and B0 inputs respectively
DL122 — Rev 6
A0 A1 A2 A3 A4
B0 B1 B2 B3 B4
A
<
A
<
B
For 9–Bit Word
B
A = BA>B
A
>
B
of the next device. The connection for an A = B output is
also shown. The worst case delay time of serial
expansion is equal to the number of comparators times
the data–to–output delay .
2–267 MOTOROLAMECL Data
MC10H166
A24
A23
A22
A21
A20
B24
B23
B22
B21
B20
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
FIGURE 2 — 25–BIT MAGNITUDE
COMPARATOR
A
<
B
>
B
A
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
B19
B18
B17
B16
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
A
<
A
>
<
A
>
A
A < B
A
>
A
<
A
>
B
B
B4
A4
B
B
B
B
B
B3
<
B
A3
A
B2
A2
B1
A > B
A1
B0
A0
For shorter delay times than possible with serial expansion,
devices can be cascaded. Figure 2 shows a 25–bit cascaded
comparator whose worst case delay is two data–to–output delays.
The cascaded scheme can be extended to longer word lengths.
A = B
<
A
>
A
B
B
MOTOROLA MECL Data
2–268
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10H166
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
2–269 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
MC10H166
–T–
SEATING
PLANE
F
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
16 PLJ
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING
PLANE
J
M
M
0.25 (0.010) T
M
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L 0.300 BSC 7.62 BSC
M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
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INTERNET: http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MOTOROLA MECL Data
2–270
*MC10H166/D*
◊
MC10H166/D
DL122 — Rev 6
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