Motorola MC10H124P, MC10H124FN, MC10H124L Datasheet

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SEMICONDUCTOR TECHNICAL DATA

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The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of digital
systems. The 10H part is a functional/pinout duplication of the standard
MECL 10K family part, with 100% improvement in propagation delay , and
no increase in power–supply current.

• Propagation Delay, 1.5 ns Typical

• Improved Noise Margin 150 mV (Over Operating Voltage and

Temperature Range)

• Voltage Compensated

• MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VCC = 5.0 V) V
Power Supply (VEE = –5.2 V) V
Input Voltage (VCC = 5.0 V) TTL V
Output Current — Continuous

— Surge
Operating T emperature Range T
Storage T emperature Range — Plastic

— Ceramic

EE
CC

I

I

out

A

T

stg

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Negative Power

Supply Drain
Current

Positive Power Supply

Drain Current

Reverse Current

Pin 6
Pin 7

Forward Current

Pin 6
Pin 7

Input Breakdown

Voltage
Input Clamp Voltage V
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.

I

CCH

I

CCL

V

(BR)in

I

E

I

R

I

F

OH

OL

IH

— 72 — 66 — 72 mA

— 16 — 16 — 18 mA
— 25 — 25 — 25 mA

——20050——20050—

——–12.8

–3.2——

5.5 — 5.5 — 5.5 — Vdc

— –1.5 — –1.5 — –1.5 Vdc

I

–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc

2.0 — 2.0 — 2.0 — Vdc
— 0.8 — 0.8 — 0.8 Vdc

IL

–8.0 to 0 Vdc
0 to +7.0 Vdc
0 to V

CC

50

100

0 to +75 °C

–55 to +150
–55 to +165

—

–12.8

–3.2——

Vdc

mA

°C

200

50

–12.8

–3.2

µA

mA



CERAMIC PACKAGE

PLASTIC PACKAGE

LOGIC DIAGRAM

5
6

7

10

11

GND = PIN 16

DIP

1
2
3
4
5
6
7
8

B

OUT

A

OUT

B

OUT

A

OUT

A

IN

COMMON

STROBE

B

IN

V

EE

VCC ( +5.0 VDC) = PIN 9

VEE ( –5.2 VDC) = PIN 8

PIN ASSIGNMENT

L SUFFIX

CASE 620–10

P SUFFIX

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

16
15
14
13
12
11
10

GND
C
D
D
C
D
C
V

9

4
2

3
1

12
15

13
14

OUT
OUT
OUT
OUT
IN
IN
CC

9/96

 Motorola, Inc. 1996

2–5

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

Tables on page 6–36 of the Motorola MECL Data

Book (DL122/D).

REV 6

MC10H124

ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

AC PARAMETERS

Propagation Delay t
Rise Time t
Fall Time t

0.55 2.25 0.55 2.4 0.85 2.95 ns

pd

0.5 1.5 0.5 1.6 0.5 1.7 ns

r

0.5 1.5 0.5 1.6 0.5 1.7 ns

f

APPLICATIONS INFORMATION

The MC10H124 has TTL–compatible inputs and
MECL complementary open–emitter outputs that allow
use as an inverting/non–inverting translator or as a
differential line driver. When the common strobe input is
at the low–logic level, it forces all true outputs to a MECL
low–logic state and all inverting outputs to a MECL
high–logic state.

An advantage of this device is that TTL–level
information can be transmitted differentially , via balanced
twisted pair lines, to MECL equipment, where the signal
can be received by the MC10H115 or MC10H116
differential line receivers. The power supply
requirements are ground, +5.0 volts, and –5.2 volts.

MOTOROLA MECL Data

2–6

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H124

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

0.007 (0.180) N

U

M

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–7 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H124

–T–

SEATING
PLANE

F

18

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

N

E

G

16 PLD

0.25 (0.010) T

M

S

A

–A–

916

B

F

C

S

–T–

H

G

D

16 PL

0.25 (0.010) T

K

M

A

CASE 620–10

ISSUE V

L

K

16 PLJ

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

SEATING
PLANE

J

M

M

0.25 (0.010) T

M

L

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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MOTOROLA MECL Data

2–8

*MC10H124/D*

◊

MC10H124/D

DL122 — Rev 6