MOTOROLA MC10H124FNR2, MC10H124M, MC10H124MEL, MC10H124ML1, MC10H124ML2 Datasheet

...

SEMICONDUCTOR TECHNICAL DATA
2–5
REV 6
Motorola, Inc. 1996
9/96
!          !
Propagation Delay, 1.5 ns Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 5.0 V) V
EE
–8.0 to 0 Vdc
Power Supply (VEE = –5.2 V) V
CC
0 to +7.0 Vdc
Input Voltage (VCC = 5.0 V) TTL V
I
0 to V
CC
Vdc
Output Current — Continuous
— Surge
I
out
50
100
mA
Operating T emperature Range T
A
0 to +75 °C
Storage T emperature Range — Plastic
— Ceramic
T
stg
–55 to +150 –55 to +165
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Negative Power
Supply Drain Current
I
E
72 66 72 mA
Positive Power Supply
I
CCH
16 16 18 mA
pp y
Drain Current
I
CCL
25 25 25 mA
Reverse Current
Pin 6 Pin 7
I
R
——20050——20050—
200
50
µA
Forward Current
Pin 6 Pin 7
I
F
——–12.8
–3.2——
–12.8
–3.2——
–12.8
–3.2
mA
Input Breakdown
Voltage
V
(BR)in
5.5 5.5 5.5 Vdc
Input Clamp Voltage V
I
–1.5 –1.5 –1.5 Vdc
High Output Voltage V
OH
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
Low Output Voltage V
OL
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
High Input Voltage V
IH
2.0 2.0 2.0 Vdc
Low Input Voltage V
IL
0.8 0.8 0.8 Vdc
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.

LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
B
OUT
A
OUT
B
OUT
A
OUT
A
IN
COMMON
STROBE
B
IN
V
EE
GND C
OUT
D
OUT
D
OUT
C
OUT
D
IN
C
IN
V
CC
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
GND = PIN 16
VCC ( +5.0 VDC) = PIN 9
VEE ( –5.2 VDC) = PIN 8
11
13 14
10
12 15
7
3 1
6
5
4 2
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
MC10H124
MOTOROLA MECL Data
DL122 — Rev 6
2–6
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%, VCC = 5.0 V ± 5.0%)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
AC PARAMETERS
Propagation Delay t
pd
0.55 2.25 0.55 2.4 0.85 2.95 ns
Rise Time t
r
0.5 1.5 0.5 1.6 0.5 1.7 ns
Fall Time t
f
0.5 1.5 0.5 1.6 0.5 1.7 ns
APPLICATIONS INFORMATION
The MC10H124 has TTL–compatible inputs and MECL complementary open–emitter outputs that allow use as an inverting/non–inverting translator or as a differential line driver. When the common strobe input is at the low–logic level, it forces all true outputs to a MECL low–logic state and all inverting outputs to a MECL high–logic state.
An advantage of this device is that TTL–level information can be transmitted differentially , via balanced twisted pair lines, to MECL equipment, where the signal can be received by the MC10H115 or MC10H116 differential line receivers. The power supply requirements are ground, +5.0 volts, and –5.2 volts.
MC10H124
2–7 MOTOROLAMECL Data
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T–
SEATING PLANE
S
L–M
M
0.007 (0.180) N
S
T
S
L–M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50
Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
____
MC10H124
MOTOROLA MECL Data
DL122 — Rev 6
2–8
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
____
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
–A–
–B–
–T–
F
E
G
N
K
C
SEATING PLANE
16 PLD
S
A
M
0.25 (0.010) T
16 PLJ
S
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01
____
16 9
18
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
MFAX: RMF AX0@email.sps.mot.com – T OUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MC10H124/D
*MC10H124/D*
Loading...