Motorola MC10H016FN, MC10H016FNR2, MC10H016L, MC10H016P Datasheet


SEMICONDUCTOR TECHNICAL DATA
  
The MC10H016 is a high–speed synchronous, presettable, cascadable 4–bit binary counter. It is useful for a large number of conversion, counting and digital integration applications.
Counting Frequency , 200 MHz Minimum
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
Positive Edge Triggered
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V Input Voltage (VCC = 0) V Output Current — Continuous
— Surge Operating T emperature Range T Storage T emperature Range — Plastic
— Ceramic
EE
I
I
out
A
T
stg
–8.0 to 0 Vdc 0 to V
EE
50
100
0 to +75 °C
–55 to +150 –55 to +165
Vdc
mA
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I Input Current High
All Except MR
Pin 12 MR Input Current Low I High Output Voltage V Low Output Voltage V High Input Voltage V Low Input Voltage V
I
E
inH
inL
OH OL
IH
126 115 126 mA
——450
1190——
0.5 0.5 0.3 µA –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
265 700——
265 700
AC PARAMETERS
Propagation Delay
Clock to Q Clock to TC MR to Q
Set–up Time
Pn to Clock CE
or PE to Clock
Hold Time
Clock to P
Clock to CE Counting Frequency f Rise Time t Fall Time t
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
n
or PE
t
pd
t
set
t
hold
count
r f
1.0
2.4
1.0
2.5
1.0
0.7
2.4
0.7
0.7
2.4
2.0
2.5——
1.0
0.5——
200 200 200 MHz
0.5 2.0 0.5 2.1 0.5 2.2 ns
0.5 2.0 0.5 2.1 0.5 2.2 ns
2.5
0.7
2.5
2.0
2.5——
1.0
0.5——
0.7
0.7
2.0
2.5
1.0
0.5
2.7
2.6
2.6
— —
— —
µA

L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
DIP
PIN ASSIGNMENT
V
CC1
Q1 Q0 TC PE CE
PO
V
EE
ns
ns
ns
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
CE PE MR CP Function
L
L
L
H
H
L
H
H
X
X
X
X
Z = Clock Pulse (Low to High);ZZ = Clock Pulse (High to Low)
1 2 3 4 5 6 7
16 15 14 13 12 11 10
8
Book (DL122/D).
TRUTH TABLE
Load Parallel (Pn to Qn)
Z
L L L L L
H
Load Parallel (Pn to Qn)
Z
Count
Z
Hold
Z
Masters Respond;
ZZ
Slaves Hold Reset (Qn = LOW,
X
T
= HIGH)
C
V
CC2
Q2 Q3 CP MR P3 P2 P1
9
9/96
Motorola, Inc. 1996
2–1
Features include assertion inputs and outputs on each of the four master/slave counting flip–flops. Terminal count is generated internally in a manner that allows synchronous loading at nearly the speed of the basic counter.
REV 6
MC10H016
TC
Q
FO
MASTER SLAVE
MSB
MR
Tc
P0–P3
C
PECE
Q0–Q3
1/2 10H1091/2 10H1091/2 10H109
MR
MR
Tc
P0–P3
C
Tc
5
P0–P3
C
Q
Q
Q
Q
PECE
Q0–Q3
PECE
Q0–Q3
Q
Q
4–Bit Binary Counter Logic Diagram
MASTER SLAVE
P1 P2 P3
Q
Q
CE
MR
PE
Q0 Q1 Q2 Q3
Q
MASTER SLAVE
P0
CP
PECE
Q0–Q3
propagation delays as many gate functions are achieved internally without incurring a full gate delay.
Note that this diagram is provided for understanding of logic operation only. It should not be used for evaluation of
PECE
1/2 10H109
Q0–Q3
LSB
MR
MR
÷N Counter 1 to 16
Tc
MC10H016 Cascaded for 5 Stage Presettable Counter
Max freq. is only OR gate delay below max when counting alone.
P0–P3
C
Tc
P0–P3
C
CLOCK
MOTOROLA MECL Data
2–2
DL122 — Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10H016
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
2–3 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES
MC10H016
–T–
SEATING PLANE
F
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
16 PLJ
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING PLANE
J
M
M
0.25 (0.010) T
M
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MOTOROLA MECL Data
2–4
*MC10H016/D*
MC10H016/D
DL122 — Rev 6
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