
SEMICONDUCTOR TECHNICAL DATA
The MC10H016 is a high–speed synchronous, presettable, cascadable
4–bit binary counter. It is useful for a large number of conversion, counting and
digital integration applications.
• Counting Frequency , 200 MHz Minimum
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
• Positive Edge Triggered
MAXIMUM RATINGS
Characteristic Symbol Rating Unit
Power Supply (VCC = 0) V
Input Voltage (VCC = 0) V
Output Current — Continuous
— Surge
Operating T emperature Range T
Storage T emperature Range — Plastic
— Ceramic
EE
I
I
out
A
T
stg
–8.0 to 0 Vdc
0 to V
EE
50
100
0 to +75 °C
–55 to +150
–55 to +165
Vdc
mA
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0° 25° 75°
Characteristic Symbol Min Max Min Max Min Max Unit
Power Supply Current I
Input Current High
All Except MR
Pin 12 MR
Input Current Low I
High Output Voltage V
Low Output Voltage V
High Input Voltage V
Low Input Voltage V
I
E
inH
inL
OH
OL
IH
— 126 — 115 — 126 mA
——450
1190——
0.5 — 0.5 — 0.3 — µA
–1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
–1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
–1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
–1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
IL
265
700——
265
700
AC PARAMETERS
Propagation Delay
Clock to Q
Clock to TC
MR to Q
Set–up Time
Pn to Clock
CE
or PE to Clock
Hold Time
Clock to P
Clock to CE
Counting Frequency f
Rise Time t
Fall Time t
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50–ohm resistor to –2.0 volts.
n
or PE
t
pd
t
set
t
hold
count
r
f
1.0
2.4
1.0
2.5
1.0
0.7
2.4
0.7
0.7
2.4
2.0
2.5——
1.0
0.5——
200 — 200 — 200 — MHz
0.5 2.0 0.5 2.1 0.5 2.2 ns
0.5 2.0 0.5 2.1 0.5 2.2 ns
2.5
0.7
2.5
2.0
2.5——
1.0
0.5——
0.7
0.7
2.0
2.5
1.0
0.5
2.7
2.6
2.6
—
—
—
—
µA
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
DIP
PIN ASSIGNMENT
V
CC1
Q1
Q0
TC
PE
CE
PO
V
EE
ns
ns
ns
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
CE PE MR CP Function
L
L
L
H
H
L
H
H
X
X
X
X
Z = Clock Pulse (Low to High);ZZ = Clock Pulse (High to Low)
1
2
3
4
5
6
7
16
15
14
13
12
11
10
8
Book (DL122/D).
TRUTH TABLE
Load Parallel (Pn to Qn)
Z
L
L
L
L
L
H
Load Parallel (Pn to Qn)
Z
Count
Z
Hold
Z
Masters Respond;
ZZ
Slaves Hold
Reset (Qn = LOW,
X
T
= HIGH)
C
V
CC2
Q2
Q3
CP
MR
P3
P2
P1
9
9/96
Motorola, Inc. 1996
2–1
Features include assertion inputs and outputs on each
of the four master/slave counting flip–flops. Terminal
count is generated internally in a manner that allows
synchronous loading at nearly the speed of the basic
counter.
REV 6

MC10H016
TC
Q
FO
MASTER SLAVE
MSB
MR
Tc
P0–P3
C
PECE
Q0–Q3
1/2 10H1091/2 10H1091/2 10H109
MR
MR
Tc
P0–P3
C
Tc
5
P0–P3
C
Q
Q
Q
Q
PECE
Q0–Q3
PECE
Q0–Q3
Q
Q
4–Bit Binary Counter Logic Diagram
MASTER SLAVE
P1 P2 P3
Q
Q
CE
MR
PE
Q0 Q1 Q2 Q3
Q
MASTER SLAVE
P0
CP
PECE
Q0–Q3
propagation delays as many gate functions are achieved internally without incurring a full gate delay.
Note that this diagram is provided for understanding of logic operation only. It should not be used for evaluation of
PECE
1/2 10H109
Q0–Q3
LSB
MR
MR
÷N Counter 1 to 16
Tc
MC10H016 Cascaded for 5 Stage Presettable Counter
Max freq. is only OR gate delay below max when counting alone.
P0–P3
C
Tc
P0–P3
C
CLOCK
MOTOROLA MECL Data
2–2
DL122 — Rev 6

OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
MC10H016
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
0.007 (0.180) N
U
M
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
DL122 — Rev 6
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
2–3 MOTOROLAMECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
MILLIMETERSINCHES

MC10H016
–T–
SEATING
PLANE
F
18
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
N
E
G
16 PLD
0.25 (0.010) T
M
S
A
–A–
916
B
F
C
S
–T–
H
G
D
16 PL
0.25 (0.010) T
K
M
A
CASE 620–10
ISSUE V
L
K
16 PLJ
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
SEATING
PLANE
J
M
M
0.25 (0.010) T
M
L
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L 0.300 BSC 7.62 BSC
M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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MOTOROLA MECL Data
2–4
*MC10H016/D*
◊
MC10H016/D
DL122 — Rev 6