Mitsubishi Electric QE82LG User Manual
Mitsubishi Programmable Controller
Insulation Monitoring Module
User
QE82LG
’
s Manual (Details)
IB63564F
Caution
- Installation on excluding the control board
CAUTION
● SAFETY PRECAUTIONS ●
(Read these precautions before using this product.)
This manual contains important instructions for MELSEC-Q series QE82LG.
Before using this product, please read this manual and the relevant manuals carefully and pay full
attention to safety to handle the product cor rectly .
The precautions given in this manual are concerned with this product only. For the safety precautions of
the programmable controller system, refer to the user’s manual of the CPU module used.
In this manual, the safety precautions are classified into two levels: "DANGER" and "CAUTION".
DANGER
Under some circumstances, failure to observe the precautions given under “ CAUTION” may lead to
serious consequences．
Observe the precautions of both levels because they are important for personal and system safety.
Keep this manual in an accessible place for future reference whenever needed, and make sure it is
delivered to the end user.
Indicates that incorrect handling may cause hazardous conditions,
resulting in death or severe injury.
Indicates that incorrect handling may cause hazardous conditions,
resulting in medium or slight personal injury or physical damage.
[Precautions for Operating Environment and Conditions]
• Do not use this product in the places listed below. Failure to follow the instruction may cause
malfunctions or decrease of product-life.
- Places the Ambient temperature exceeds the range 0 - 55ºC.
- Places the Relative humidity exceeds t he range 5 - 95% or condensation is observ ed.
- Altitude exceeds 2000 m.
- Places exposed to rain or water drop.
- Dust, corrosive gas, saline and oil smoke exist.
- Vibration and impact exceed the specifications.
A - 1
[Design Precautions]
Doing so may cause a malfunction to the sequencer system.
Caution
This module can not be used as an Electric Leakage Relay.
Caution
Doing so can cause a malfunction or failure of the module.
Danger
• Do not write data into “System Area” in the buffer memory of the intelligent function module.
Also, do not output (turn ON) the “use prohibited” signal in the output signal sent from the
sequencer CPU to the intelligent function module.
• Do not install the input signal wire together with the main circuit lines or power cables. Keep a
distance of 300 mm or more between them. (Except for the terminal input part) Failure to do so
may result in malfunction due to noise.
•
[Installation Precautions]
• Any person who is involved in the installation and the wiring of this Sequencer should be fully
competent to do the work.
• Use the programmable controller in an environment that meets the general specifications in the
User’s manual of the CPU module used.
Failure to do so may result in electric shock, fire, malfunction, or damage to or deterioration of the
product.
• To mount the module, while pressing the module-mounting lever located in the lower part of the
module, fully insert the module fixing projection(s) into the hole(s) in the base unit and press the
module until it snaps into place.
Incorrect mounting may cause a malfunction, failure or a fall of the module.
When using the Sequencer in an environment of frequent vibrations, fix the module with a screw.
• Tighten the screws within the specified torque range.
Fixing-Module screw (arranged by user): M3 x 12mm
Tightening torque of the fixing-module screws 0.36 - 0.48 N•m
When the screw tightening is loose, it causes a fall, short-circuit, and a malfunction.
Over-tightening can damage the screws and the module, and it may cause a fall, short-circuit, or a
malfunction.
• Shut off the external power supply for the system in all phases before mounting or removing the
module. Failure to do so may result in damage to the product.
• Do not touch directly any conductive parts and electronic parts of the module.
A - 2
[Wiring Precautions]
Danger
If all phases are not turned off, it may cause an electric shock or product damages.
Caution
• FG terminal must be grounded according to the D-type ground (Type 3) dedicated for sequencer.
CZ-77S , CZ-112S
ZTA600A , ZTA1200A , ZTA2000A
frequency withstand voltage test.
• For installation and wiring works, make sure that the power source is shut off for all outside phases.
Failure to do so may result in electric shock or malfunction.
• When using this product, make sure to use it in combination with Mitsubishi’s zero-phase current
transformer (ZCT). Please not to exceed the ratings of this product for input of zero phase
transformer. For further details, please refer to zero phase transformer manual to maintain the
functionality and the accuracy of this product .
Split-type ZCT
CZ-22S , CZ-30S , CZ-55S
Through-type ZCT
• This module and the zero-phase current tr ansformer are used for less than 600V circuit only. They
are not used with exceeding 600V circuit.
• Do not open the secondary side of the zero-phase current transformer.
• Take care not entering any foreign objects such as chips and wire pieces into the module. It may
cause a fire, failure or a malfunction.
• In order to prevent the module from incoming foreign objects such as wire pieces during wiring
work, a foreign-object preventive label is placed on the module. While a wiring work is performed,
keep the label on the module. Before operating the system, peel off the label for heat release. If the
foreign-object preventive label is not peeled and the system is in use, residual heat inside the
module may reduce the product life.
• The wires to be connected to the module shall be put in a duct or fixed together by clamp. If not, the
loosing and unstable wire or careless stretching results in poor contact of electric wires. That may
cause a breakage of the module or wire or a malfunction.
• Use appropriate size of electric wires. If inappropriate size of electric wire is used, it may cause a
fire due to generated heat. For appropriate size of electric wires, refer to 7.5. 2 How to connect
wires.
• In case using stranded wire, take measures so that the filament should not vary by using a bar
terminal or by processing the point twisted. Use the bar terminal appropriated for the size of electric
wires. If using inappropriate bar terminals, a wire breakage or a contact failure may cause a device
malfunction, failure, a burnout or a fire.
• After wiring, confirm whether there is a wiring forgetting or a faulty wiring. They may cause a
device malfunction, a fire, or an electric shock.
• When removing the wires connected to the module, do not pull wires as holding on their electric
wire portions. Push the buttons on the terminal, and then remov e the w ire.
• If the wires connected to the module are strongly pulled off, it may cause a malfunction or a
breakage to the module or the wire. (Tensile load: 22N or less)
• Ensure the wiring to the module properly, checking the rated voltage and current of the product and
the terminal pin assignment. If the input voltage exceed the rated voltage or the wiring is improper,
it may cause a fire or a breakage.
• Do not exceed the specified voltage when doing an insulation resistance test and a commercial
ZT15B, ZT30B , ZT40B , ZT60B , ZT80B , ZT100B ,
A - 3
• Use the product within the ratings specified in this manual. When using it outside the ratings, it not
• Do not touch the live terminal. It may cause a malfunction.
of the connectors. (Check these items under the power failure condition.)
- Places exposed to rain or water drop.
Caution
• Dispose of the product as an industrial waste.
[Start-up Precautions]
Caution
only causes a malfunction or failure but also there is a fear of igniting and damaging by a fire.
• Before operating the product, check that active bare wire and so on does not exist around the
product. If any bare wire exists, stop the operat ion immediately, and take an appropriate action
such as isolation protection.
• Do not disassemble or modify the module. It may cause failure, a malfunction, an injury or a fire.
• Attaching and detaching the module must be performed after the power source is shut off for all
outside phases. If not all phases are shut off, it may cause failure or a malfunction of the module.
[Maintenance Precautions]
Caution
• Cleaning and additional tightening of module-fixing screws must be performed after the input power
source is shut off for all outside phases. If not all phases are shut off, it may cause failure or a
malfunction of the module.
• Use a soft dry cloth to clean off dirt of the module surface.
• Do not let a chemical cloth remain on the surface for an extended period nor wipe the surface with
thinner or benzene.
Check for the following items for using this product properly for long time.
<Daily maintenance>
(1) N o damage on this product (2) No abnormality with LED indicators (3) No abnormal noise,
smell or heat.
<Periodical maintenance> (Once every 6 months to 1 year)
(4) Confirm there is loosing in installation, wire connection to terminal blocks, and the connection
[Storage Precautions]
Caution
• To store this product, turn off the power and remove wires, and put it in a plastic bag.
For long-time storage, avoid the following places. Failure to follow the instruction may cause a
failure and reduced life of the product.
- Places the Ambient temperature exceeds the range -25 to +75ºC.
- Places the Relative humidity exceeds t he range 5 - 95% or condensation is observ ed.
- Dust, corrosive gas, saline and oil smoke exist, and vibration and frequent physical impact
occur.
[Disposal Precautions]
A - 4
Printed date
* Manual number
Revision history
9.3
Section 1.1, Section 3.1, Section 4.2, Section 6.1, Section 6.3
7.2,
Back cover
described in this manual.
Revision history
Jan, 2011 IB-63564 First edition
Correction
SAFETY PRECAUTIONS, Section 4.2, Section 8.1, Section 8.3
Sep, 2011 IB-63564-A
Addition
SAFETY PRECAUTIONS, Section 2.1, Section 3.2, Section 7.4, Section
* Manual number is provided at t he bottom of the cov er page.
Aug. 2012 IB-63564-B
Jul. 2013 IB-63564-C
Nov. 2013 IB-63564-D
Jan. 2016 IB63564E
Jul, 2017 IB63564F
Correction
Section 2.3, Section 7.6, Section 9.1
Correction
Section 2.3, Section 7.6, Section 7.7, Section 8.2, Section 9.3
Addition
Correction
Section 4.1, Section 4.2.5, Section 6.1, Section 6.2.2, Section 6.2.3,
Section 6.3.1, Section 6.3.2, Section 6.3.4, Section 6.3.5, Section 6.4.1,
Section 7.6.2, Section 7.6.4, Section 8.2, Section 9.1
Addition
Section 6.1, Section 6.4.3, Appendix 3
Correction
Cover, Back cover
Correction
Compliance with the EMC and Low Voltage Directives,
Section 2.1, Section 3.2, Section 6.2, Section 6.3, Section 6.4, Section
Section 7.5, Section 7.6, Section 8, Section 9.2, Appendix 2, Appendix 3,
This manual does not guarantee to protect or does not give a permission to any industrial property and any related rights.
Also, our company shall not be held any responsible for any issues related to industrial properties due to product usage
2011 MITSUBISHI ELECTRIC CORPORATION
A - 5
Table of Content
SAFETY PRECAUTIONS ·········································································································· A-1
Revision history ······················································································································· A-5
Table of content ······················································································································ A-6
Compliance with the EMC and Low Voltage Directives····································································· A-8
Names, abbreviations, terminology ···························································································· A-9
Product configuration ················································································································ A-9
Chapter 1: Overview 1-1
1.1 Features ··························································································································· 1-1
Chapter 2: System Configuration 2-1 - 2-4
2.1 Applicable system ··············································································································· 2-1
2.2 Precautions for system configuration ······················································································· 2-3
2.3 How to check the function version, serial number, and module version ··········································· 2-3
Chapter 3: Specifications 3-1 - 3-2
3.1 General specifications·········································································································· 3-1
3.2 Electrical and mechanical specifications ·················································································· 3-2
Chapter 4: Functions 4-1 - 4-11
4.1 List of functions ·················································································································· 4-1
4.2 Functions in detail ·············································································································· 4-2
Chapter 5: I/O signal to CPU module 5-1 - 5-7
5.1 List of I/O signals ················································································································ 5-1
5.2 Details of I/O signals ············································································································ 5-2
Chapter 6: Buffer memory 6-1 - 6-13
6.1 Buffer memory assignment ··································································································· 6-1
6.2 Configurable sections (Un\G0 to Un\G1100, Un\G2000 to Un\G2100) ··········································· 6-4
6.3 Measurable sections (Un\G1100 to Un\G1999, Un\G2100 to Un\G2999) ······································· 6-6
6.4 Common sections (Un\G3000 to Un\G4999) ··········································································· 6-12
Chapter 7: Setting and procedure for operation 7-1 - 7-24
7.1 Precautions for handling ····································································································· 7-1
7.2 Procedure for operation ······································································································ 7-2
7.3 Name and function of each part ····························································································· 7-3
7.4 Attaching and removing the module ························································································ 7-5
7.5 Connecting wires, wiring ······································································································· 7-7
7.6 Setting from GX Works2 ···································································································· 7-14
7.7 Setting from GX Developer ································································································· 7-20
A - 6
Chapter 8: Programming 8-1 - 8-8
8.1 Programming procedure ····································································································· 8-1
8.2 System configuration and usage conditions for sample program ·················································· 8-2
8.3 Sample programming ········································································································· 8-4
Chapter 9: Troubleshooting 9-1 - 9-8
9.1 List of error codes ·············································································································· 9-1
9.2 Troubleshooting ················································································································· 9-4
9.3 Q&A ································································································································· 9-7
Appendix Appendix 1 - 7
Appendix 1: External dimensions ······················································································ Appendix-1
Appendix 2: Optional devices ··························································································· Appendix-2
Appendix 3: Addition or change of functions ······································································· Appendix-7
Index Index 1
A - 7
CZ-22S , CZ-30S , CZ-55S
CZ-77S , CZ-112S
ZT15B, ZT30B , ZT40B , ZT60B ,
ZTA600A , ZTA1200A , ZTA2000A
CE marking cable (twisted pair cable )
AWG22 – AWG18 (0.3 – 0.8 mm2)
Max. cable length
50m
Compliance with the EMC and Low Voltage Directives
(1) For programmable controller system
To configure a system meeting the requirements of the EMC and Low Voltage Directives when
incorporating the Mitsubishi program mable controller (EMC and Low Voltage Direc tives compliant)
into other machinery or equipment, refer to QCPU User's Manual (Hardware Des ign, Maintenance
and Inspection).
The CE mark , indicating compliance with the EMC and Low Voltage Directives, is printed on the
rating plate of the programmable controller.
(2) For the product
For the compliance of this pr oduct with the EMC and Low Voltage Directives, refer to Section 7.5
Wiring.
(3) CE marking conformity combination module
This module conforms to CE marking standard in a condition to make combination use with following
zero-phase current transformer (ZCT) and cable.
Split-type ZCT
Through-type ZCT
cable
ZT80B , ZT100B ,
Single wire:
AWG24 – AWG18 (φ0.5 - 1.0mm)
Stranded wire:
A - 8
terminology
Io1
Abbreviation for CH1 leak current.
Ior1
Abbreviation for CH1 leak current for resistance.
Io2
Abbreviation for CH2 leak current.
Ior2
Abbreviation for CH2 leak current for resistance.
Collective term for Io1 1-step alarm, Io1 2-step alarm, Ior1 1-step
alarm, and Ior1 2-step alarm.
Collective term for Io2 1-step alarm, Io2 2-step alarm, Ior2 1-step
alarm, and Ior2 2-step alarm.
Collective term for Io1 max. value and its date/time of occurrence, and
Ior1 max. value and its date/time of occurrence.
Collective term for Io2 max. value and its date/time of occurrence, and
Ior2 max. value and its date/time of occurrence.
Collective term for the year of max. value occurrence, month and day
and second and day of the week of max. value occurrence.
Collective term for Io1 1-step alarm occurrence count, Io1 2-step
2-step alarm occurrence count.
Collective term for Io21 1-step alarm occurrence count, Io2 2-step
2-step alarm occurrence count.
ZCT
Abbreviation for zero-phase current transformer
Model name
Product name
Quantity
QE82LG
Insulation monitoring Module
1
Names, abbreviations, terminology
In this manual, the following names, abbreviations, and terminology are used to explain the insulation
monitoring module, unless otherwise specified.
Names, abbreviations,
CH1 Alarm
CH2 Alarm
CH1 max. value
CH2 max. value
Descriptions of names, abbreviations, terminology
Date/time of occurrence
CH1 Alarm occurrence count
CH2 Alarm occurrence count
Product configuration
The following describes the product configuration.
of max. value occurrence, hour and minute of max. value occurrence,
alarm occurrence count, Ior1 1-step alarm occurrence count, and Ior1
alarm occurrence count, Ior2 1-step alarm occurrence count, and Ior2
A - 9
Note
A - 10
1 Overview
QE82LG
Chapter 1: Overview
1.1 Features
This manual explains specifications, handling methods, and programming of
Insulation Monitoring Module QE82LG (hereinafter, abbreviated as QE82LG)
supporting MELSEC-Q series.
(1) This enables to measure leak current for safety actions.
By monitoring leak current (Io), risk for electric shock can be detected.
(2) This enables constant monitoring of insulation for equipment.
By monitoring leak curr ent f or res ista nce ( Ior) , det eri orati on of equi pment insulation
can be tracked.
(3) This enables 2-level alarm monitoring during monitoring for each measuring
element.
For each leak current (Io) and leak current for resistance (Ior), 2-level alarm
monitoring can be performed without a sequence.
(4) This enables to measure two circuits, using one device.
At the power source with the same-phase wire system, a single device can
measure two circuits.
(5) This enables to measure sensitive.
By changing setting to high sensitivity mode, this enables to measure from
0.01mA.
1 - 1
QE82LG
2 System Configuration
Attachable CPU Module
Attachable
Remarks
CPU Type
CPU Model
Q00JCPU
16
Q00CPU
Q01CPU
Q02CPU
Q02HCPU
Q06HCPU
Q12HCPU
Q25HCPU
Q02PHCPU
Q06PHCPU
Q12PHCPU
Q25PHCPU
Q12PRHCPU
Q25PRHCPU
Q00UJCPU
16
Q00UCPU
Q01UCPU
Q02UCPU
36
Q03UDCPU
Q04UDHCPU
Q06UDHCPU
Q10UDHCPU
Q13UDHCPU
Q20UDHCPU
Q26UDHCPU
Q03UDECPU
Q04UDEHCPU
Q06UDEHCPU
Q10UDEHCPU
Q13UDEHCPU
Q20UDEHCPU
Q26UDEHCPU
Q50UDEHCPU
Q100UDEHCPU
Chapter 2: System Configur ati on
2.1 Applicable system
The following describes applicable systems.
(1) Applicable module and the quantity of attachable pieces
(a)When mounted with CPU module
CPU module to which QE82LG can be attached and the number of attachable
pieces are shown below.
Depending on the combination of the attached module and the number of
attached pieces, lack of power capacity may occur.
When attaching the module, please consider the power capacity.
If the power capacity is insufficien t, reconsid er the com bination of m odules to b e
attached.
Since the number of attachable modu les are limited by the power module which
used, please refer to the notes on the 2.2 precautions for system configuration.
Programmable
controller
CPU
Basic model
QCPU
High performance
model QCPU
Process CPU
Redundant CPU
Universal model
QCPU
quantity.
24
64
64
53
24
64
2 - 1
QE82LG
2 System Configuration
Attachable CPU Module
Attachable
Remarks
CPU Type
CPU Model
Q03UDVCPU
Q04UDVCPU
Q06UDVCPU
Q13UDVCPU
Q26UDVCPU
Q04UDPVCPU
Q06UDPVCPU
Q13UDPVCPU
Q26UDPVCPU
Q06CCPU-V
Q06CCPU-V-B
Q12DCCPU-V
Q24DHCCPU-LS
Q24DHCCPU-V
Q26DHCCPU-LS
Applicable Network Module
Remarks
QJ72LP25-25
QJ72LP25G
QJ72BR15
quantity.
Programmable
controller
CPU
C Controller module
(b) When mounted with MELSECNET/H remote I/O station
The table belo w shows the network modu les applicable to the QE 82LG and the
number of network modules to be mounted.
Depending on the combination with other modules or the number of mounted
modules, power supply capacity may be insufficient.
Pay attention to the power supp ly capacity before mounting modules, and if the
power supply capacity is insufficient, change the combination of the modules.
High-Speed
Universal model
QCPU
64
64
Number of modules
64
(c) The base unit can be mounted
QE82LG can be installed to any I/O slot of main base unit and extension base unit.
*1 In case of redundant CPU, can be mounted to the extension base unit only.
Mounted to the main base unit is not allowed.
*2 Limited within the range of I/O points for the CPU module.
(2) For multiple CPU system
The function version of the firs t released CT input m odule is C, and the C T input
module supports multiple CPU systems.
When using the CT input module in a multiple CPU system, refer to the following.
*QCPU User’s Manual (Mul tiple CPU system)
2 - 2
QE82LG
2 System Configuration
Product name
Model name
Remarks
iQ Platform compatible programmable
controller engineering software
MELSEC sequencer programming software.
“n” in the model name is 4 or larger.
19H101
710G1234
Module version
Serial No.
(3) Applicable software package
QE82LG supported software packages are as follows:
2.2 Precautions for system configuration
(a) Software package for sequencer
GX Works2 SWnDNC-GXW2
GX Developer SWnD5C-GPPW
(1) When attaching it to an expansion base without a power module
If QE82LG is att ached t o an expans ion b ase wit hout a po wer m odule, refer to the
user’s manual of the sequencer CPU to be used in order to select the power
module and expansion cable.
2.3 How to check the function version, serial number, and module version
(1) How to check the serial number and module version
It can be checked with the serial number label (placed on the right side of
QE82LG).
2 - 3
QE82LG
2 System Configuration
The serial number displayed on the Product Information List dialog box of GX
Developer may differ from that on the rating plate and
The function information of the product is updated when a new function is
added.
Serial number
(2) How to check the function version and serial number
(a) Checking on the front of the module.
The serial numbe r an d fu n ction ver sio n on t he r a tin g pl at e i s show n on th e fro nt
(at the bottom) of the module.
Function version
(b) Checking on the System monitor dialog box (Product Information List)
To display the system monitor, select [Diagnostics]
click the Product Information List button of GX Developer.
[System monitor] and
→
Point
on the front of the module.
The serial num ber on the rat ing plate and f ront part of th e module indic ates
・
the management information of the product.
The serial number displa yed o n t he Product Infor mation List dia lo g b ox of G X
・
Developer in di cat e s the fu nct i on information of the product.
2 - 4
QE82LG
3 Specifications
Item
Specifications
Phase-wire system
single-phase 2-wire / single-phase 3-wire / three-phase 3-wire
Ratings
Voltage
single-phase
3-wire
110 V , 220 V AC
single-phase
3-wire
110V AC (1 - 2 line, 2 - 3 line) 220 V (1 - 3 line)
Leak current circuit
1 A AC
value of ZCT.)
Frequency
50-60 Hz
Measuring range
Low sensitivity mode : 0-1000mA
High sensitivity mode : 0.00-100.00mA
Resolution
Low sensitivity mode : 1mA
High sensitivity mode : 0.01mA
Allowable tolerance of module
Low sensitivity mode : Leak current
: ±2.5mA
Measurable circuit count
2 circuits*
3
Data update cycle
Leak current : 2 seconds or less
Leak current for resistance : 10 seconds or less
Backup for electric blackout
Nonvolatile memory is used.
Alarm occurrence
count)
I/O occupation
16 points (I/O assignment: intelligence 16 points)
Chapter 3: Specifications
3.1 General specifications
circuit
*1,*
(excluding ZCT)
2
2-wire,
three-phase
(Zero-phase current transformer (ZCT) is used. It indicat es the primar y current
: ±2.5% (10 – 100% range of Ratings)
: ±2.5mA (0 – 10% range of Ratings)
: Leak current for resistance
: ±2.5% (10 – 100% range of Rating s)
: ±2.5mA (0 – 10% range of Ratings)
High sensitivity mode : Leak current
: ±2.5mA
: Leak current for resistance
* 1:110 V, 220V di r e ct con ne ct io n is possible. Abov e 440 V vol t ag e t ran sformer outside (VT) is required.
* 2:In case of m easuring le akage curren t for resis tance, it is possible on single-phase 2-wire, sin gle-phase
3-wire, three-phase 3-wire delta circuit.
* 3:The measurement of two circuits is possible at one module in the same system in the same trans.
(Items: Settings, Max. value and date/time of occurrence,
3 - 1
QE82LG
3 Specifications
Item
Specifications
VA
circuit
Each phase 0.1 VA (at 110 V AC), Each phase 0.2 VA (at 220 V AC)
(5 V DC)
0.17 A
Operating temperature
0 – 55°C (Ave rag e daily temperature 35°C or below)
Operating humidity
5 – 95% RH (No condensation)
Storage temperature
-25° – +75°C
Storage humidity
5 – 95% RH (No condensation)
Operating altitude
2000m or below
Installation area
Inside a cont rol panel
Operating environment
No corrosive gas
Conforms to JIS
Constant
acceleration
Half
amplitude
Sweep
time
10 times
vibration
-
1.75 mm
8.4 – 150 Hz
4.9 m/s2
-
Impact resistance
Conforms to JIS B 3502, IEC 61131-2 (147 m/s2, XYZ each direction 3 times)
Over voltage category *1
II
or less
Pollution degree *2
2 or less
Equipment category
Class I
wire)
(Z+, Z terminal)
Single wire
AWG24 – AWG18 (φ0.5 - 1.0mm)
Stranded wire*4
AWG22 – AWG18 (0.3 – 0.8 mm2)
terminal
Single wire
AWG24 – AWG18 (φ0.5 - 1.0mm)
Stranded wire
*4
AWG22 – AWG18 (0.3 – 0.8 mm2)
Tightening torque
Module-fixing screws (M3 screw)
*5
0.36 – 0.48 N･m
Between voltage/leak current input terminals – FG terminal
2210 V AC
5 sec
Between voltage/leak current input terminals – sequencer
power source and GND terminal
2210 V AC
5 sec
Insulation resistance
5 MΩ or more (500 V DC) at locations above
External dimensions
27.4 mm (W) x 98 mm (H) x 90 mm (D), excluding protruding portions
Mass
0.1 kg
Product life expectancy
10 years (used under the average daily temperature 35°C or less)
3.2 Electrical and mechanical specifications
Consumption
Internal current consumption
Vibration resistance
Applicable
wire
(Usable
electric
Voltage
ZCT Input
terminal
Voltage input
B 3502,
IEC 61131-2
*3
Intermittent
vibration
Continuous
Frequency
5 – 8.4 Hz
8.4 – 150 Hz
5 – 8.4 Hz
- 3.5 mm
2
9.8 m/s
-
XYZ
each
direction
-
Commercial frequency
withstand voltage
*1. This indicates the assumed area of electric distribution to which the device is connected, the area
ranging from public distribution to factory machinery. The category II applies to the device
power-supplied from fixed facility. The surge voltage of this product is 2500 V up to the rated voltage of
300 V.
*2. The index indicates the level of conductive substance at the device’s operating environment.
Contamination level 2 m eans only non-conductive sub stance. H owever, occ asional c ondensat ion ma y
lead to temporary conduction.
*3. At the c onnec ti on b etwe en ZCT sec ondary terminal an d th is m odu le termina l (Z +, Z), e ach wire has to
be twisted for usage.
*4. If stranded wire is used, a bar terminal must be used.
Recommended bar terminal: TGV TC-1.25-11T (Made by Nichifu)
*5. The m odule can be fix ed eas ily to t he bas e uni t, using the hook on top of the m odul e. Howe ver, if it is
used under a vibrating environment, we strongly recommend that the module be fixed with screws.
3 - 2
4 Functions
Reference
section
and Ior2, and stores
and can measure an
leak current. *1
7.7.2
ddition, you can set 2 steps of alarm values for each
can be used in such way to
the value
to be over the monitoring value
signal is turned
on.
Alarm occurrence
For each alarm monitored element, it counts the
frequency of the alarms, which will be stored in the
Alarm occurrence
Even if the power source reset occurs, the count of
alarm occurrence is retained.
switch enables
into the buffer
existence of voltage and current
Chapter 4: Functions
4.1 List of functions
Functions of QE82LG are provided in Table 4.1-1.
Table 4.1-1 List of functions
QE82LG
No.
1 Measurement
2 Hold max. values
3 Alarm monitoring
Function
It enable measures Io1, Ior1, Io2,
the records into a buffer memory as needed.
It changes a low sensitivity mode (0-1000mA) and high
sensitivity mode (0.00-100.00mA)
For Io1, Ior1, Io2, and Ior2, each maximum va lues and
date of occurrence are stored in the buffer memory as
needed.
Even if the power source reset occurs, maximum values
and date of occurrence are retained.
It can monitor the upper limit for Io1，Ior1，Io2, and Ior2.
In a
monitored element, and they
release cautious alarm and real alarm. When
exceeds and continues
for alarm delay time, a specified input
Descriptions
Section
4.2.1
Section
7.6.2
Section
4.2.2
Section
4.2.3
4
5 Test
count
*1: High sensitivity mode can be used QE82LG whose serial number (upper six digits,
shown on the front (at the bottom) of the module) is 150612 or later.
buffer memory as needed.
It can count up to 9999 times of Alarm occurrence count.
If the count exceeds 9999 times,
count remains 9999 times.
The intelligent function module
pseudo-storage of the specified value
memory, even with non(sensor) input.
Using this module, you can create a sequence, etc.
4 - 1
Section
4.2.4
Section
4.2.5
4 Functions
Measured items
Details
Measured items
Mode
Resolution
Measuring range
Low sensitivity
mode
Two
places
Measured items Behavior of this module
or over 66.5 Hz), it becomes 0 mA.
4.2 Functions in detail
4.2.1 Measuring functions
(1) Measured items
Measured items and measured ranges are described as follows:
QE82LG
CH1 leak current
CH1 leak current for
resistance
CH2 leak current
CH2 leak current for
resistance
(2) Resolution of measured data
Resolution of measured data is described as follows:
- Leak current, leak current for resistance
Present value (Un\G1100)
Max. value (Un\G1101)
Date/time of occurrence (Un\G1102 to Un\G1105)
Present value (Un\G1150)
Max. value (Un\G1151)
Date/time of occurrence (Un\G1152 to Un\G1155)
Present value (Un\G2100)
Max. value (Un\G2101)
Date/time of occurrence (Un\G2102 to Un\G2105)
Present value (Un\G2150)
Max. value (Un\G2151)
Date/time of occurrence (Un\G2152 to Un\G2155)
Io1
Ior1
Io2
Ior2
(3) Restrictions for measuring data
- Measurem ent cannot be performed immediatel y after the power loading to the sequencer
system (while Module ready (Xn0) is under the OFF condition).
After checking that Module ready (Xn0) is ON, obtain measuring data.
- Measurement cannot be p er f ormed immediately after operating conditions are s et up to this
module. After checking that Operating conditio n sett ing com pletion f lag (Xn9) bec om es O N,
obtain measuring data.
- Behaviors during operation are as follows:
Io1
Ior1
Io2
Ior2
High sensitivity
mode
When the input cur rent is less tha n 1 mA in low sensi tivity m ode
or 0.01mA in high sensitivity mode, it becomes 0 mA.
When the input current is less than 80 V, it becomes 0 mA.
In the case of abnorm al frequency (when it is less than 44.5 Hz
Integer 1 mA 0-1000mA
decimal
0.01ｍA
0.00-100.00mA
4 - 2
4 Functions
CH1最大値クリア要求(YnA)
CH1最大値クリア完了フラグ(XnA)
ON
OFF
OFF
ON
OFF
OFF
CH1 max. value clear completion flag (XnA)
4.2.2 Max. values hold function
It memorizes the m ax. value for each m easured element, and re tains it until the max. value is
cleared.
(1) Max. value memory
1) It memorizes the max. value for the following measured element.
- CH1 leak current
- CH1 leak current for resistance
- CH2 leak current
- CH2 leak current for resistance
2) It mem orizes the date and time of oc cur r ence (year/month/day/hour/minute/second/day of
the week) together with the max. value.
3) The max. value and the date and time of occurrence ar e s tored in t he n on vo lat ile memory,
so that these max. values can be retained even at a power source reset.
(2) How to clear the max. value
1) You can use the I/O signal to clear the max. value.
2) The max. value immediately after clearing will be the present value and the date of
occurrence will be the present date and time.
3) The follow ing data can be cleared up on CH1 max. valu e clear request (YnA). Ho wever,
the following data cannot be cleared individually.
- Io1 max. value (Un\G1101)
- Io1 date and time of occurrence (Un\G1102 to Un\G1105)
- Ior1 max. value (Un\G1151)
- Ior1 date and time of occurrence (Un\G1152 to Un\G1105)
4) The following d ata can be cleared upon CH2 m ax. value clear re quest (YnC). H owever,
the following data cannot be cleared individually.
- Io2 max. value (Un\G2101)
- Io2 date and time and time of occurrence (Un\G2102 to Un\G2105)
- Ior2 max. value (Un\G2151)
- Ior2 date and time of occurrence (Un\G2152 to Un\G2105)
5) The following des cribes how to clear CH 1 max. value. (C H2 max. value follows t he sam e
procedure using CH2 max. value clear request (YnC).)
(i) Check that CH1 max. value clear request (YnA) is OFF.
(ii) Set CH1 max. value clear request (YnA) to ON.
Max. values and dates and times of occurrence of CH1 leak current and CH1 leak
current for resistance are cleared, and then CH1 max. value clear completion flag
(XnA) is turned ON.
(iii) Check that CH1 m ax. value clear completi on fla g (XnA) is ON, and then set CH1 m ax.
value clear request (YnA) to OFF.
QE82LG
CH1 max. value clear request (YnA)
Figure 4.2.2-1 Procedure for clearing max. value
4 - 3
4 Functions
Setting item
Setting range
Description
Alarm is released when the present
and the
size.
whether or not the
occurrence condition should be
alarm value after the alarm is released.
Alarm is released when the present
situation continues for alarm delay time.
ON
OFF
OFF
ON
OFF
OFF
動作条件設定完了フラグ
(Xn9
)
動作条件設定要求(
Yn9)
4.2.3 Alarm monitoring function
For monitoring each m easured item, you can set max. 2 points of upper limit alarm to perform
monitoring. During th e alarm monitoring, the module can m onitor the input signal to check for
the occurrence.
(1) Setting the alarm monitoring
1) Setting items and setting range for the alarm monitoring are described below.
Alarm value Low sensitivity mode
QE82LG
The value is for monitoring the target
1 to 1000 (mA)
measured element.
High sensirivity mode
0.01-100.00 (mA)
0: No monitoring
value exceeds alarm value
situation continues for alarm delay time.
Also, in the case of 2-step monitoring,
the 1-step and secondary alarm values
can be configured regardless of their
Alarm reset method 0: Self-retention
1: Auto reset
You can set
alarmretained if the value goes back to the
Alarm delay time 0 to 300 (seconds)
value exceeds the alarm value and the
2) Setting procedures are as follows:
(i) Check that Operating condition setting request (Yn9) is OFF.
(ii) Set ala rm value, a larm reset m ethod, and alarm delay tim e. For the address of buffer
memory corresponding to each measured element, refer to Chapter 6.
(iii) Set Operating condition setting request (Yn9) to ON. Operation starts at each set
value, and then Operating condition setting completion flag (Xn9) is turned OFF.
(iv) Check that O perating cond ition setting c ompletion f lag (Xn9) becom es OFF, and then
set Operating condition setting request (Yn9) to OFF.
Operating condition setting request (Yn9)
Operating condition setting completion flag (Xn9)
Figure 4.2.3-1 Time chart of alarm monitoring setting
3) Each item of the alarm m onitoring is stored in the nonvolatile m emory, so that se t values
can be retained even at a power source reset.
4 - 4
4 Functions
CH1漏洩電流一段警報
発生フラグ(Xn1)
OFF
ON
警報マスク時間
ON
OFF
OFF
CH1警報リセット
要求(Yn1)
OFF
警報状態
警報未発生 警報発生 警報リセット自己保持
警報監視値
警報マスク時間
警報
発生
警報未
発生
Io1 primary alarm flag (Xn1)
Alarm
Alarm
occurrence
Self-retention
Alarm
occurrence
Alarm reset
Alarm
non
Alarm
occurrence
Alarm mas k time
Alarm mas k time
Alarm mas k time
(2) Alarm flag (Xn1 to Xn8) and behavior of ALM1 LED and ALM2 LED
1) There are 4 statuses of alarm for each alarm monitoring element.
(a) Alarm non-occurrence status
(b) Alarm occurrence status
(c) Self-retention status (O n l y w hen the alarm reset method is set to “self-retention”)
(d) Alarm reset status
* In order to st ate the al arm , alar m monitoring must be les s tha n th e v al ue o nce during
Alarm value
Request of CH1 alarm reset (Yn1)
Alarm status
2) Relationship between the alarm status and Alarm flag (Xn1 to Xn8)
(a) Alarm non-occurrence status
(b) Alarm occurrence status
(c) Self-retention status
(d) Alarm reset status
QE82LG
The present value is under alarm value or the prese nt value exceeds alarm value but
the situation continues for less than alarm delay time.
The present value exceeds alarm value and the situation exceeds alarm delay time.
The present value has changed from the alarm oc currence status to be under alarm
value.
Alarm reset request (Yn1, Yn5) is released under the alarm occurrence status, and the
present value is sti ll over alarm value.
the alarm reset state.
non-occurrence
-occurrence
Figure 4.2.3-2 Example of alarm status (alarm reset method = “self-retention”)
Under the alarm non-occurrence status, Alarm flag (Xn1 to Xn8) is OFF.
Under the alarm occurrence status, Alarm flag (Xn1 to Xn8) is ON.
Under the self-retention status, Alarm flag (Xn1 to Xn8) is ON.
Under the alarm reset status, Alarm flag (Xn1 to Xn8) is OFF.
4 - 5
4 Functions
QE82LG
3) Behaviors of ALM1 LED and ALM2 LED
(a) The indication of ALM1 LED changes according to status of CH1 Alarm.
Io1 primary alarm flag (Xn1)
Io1 secondary alarm flag (Xn2)
Ior1 primary alarm flag (Xn3)
Ior1 secondary alarm flag (Xn4)
(b) The indication of ALM2 LED changes according to status of CH2 Alarm.
Io2 primary alarm flag (Xn5)
Io2 secondary alarm flag (Xn6)
Ior2 primary alarm flag (Xn7)
Ior2 secondary alarm flag (Xn8)
(c) ALM1 LED and ALM2 LED disp lay the following 3 indications according to the alarm
status of the alarm occurrence flag.
- Flashing
Of the alarm occurrence f lags, one or m ore flags are in the alarm occurrenc e status
or in the alarm reset status (regardless of the status of the remaining alarm
occurrence flags).
- ON
Of the alarm occurrence f lags, one or m ore flags are in the self-retention status and
the remaining flags of alarm occurrence are in the alarm non-occurrence status.
- OFF
Flags of alarm occurrence are all in the alarm non-occurrence status.
4 - 6
4 Functions
CH1漏洩電流一段警報
発生フラグ(Xn1)
OFF
ON
警報マスク時間
OFF
警報マスク時間
ALM1 LED
消灯 点滅
消灯
(a)
(b)
(c)
警報監視値
CH
1漏洩電流一段警報
発生フラグ(Xn1)
OFF
ON
警報マスク時間
ON
OFF
OFF
CH1警報リセット要求(Yn1)
OFF
ALM1 LED
消灯
点滅
消灯点灯
(a)
(b)
(c) (d)
警報監視値
Io1 primary alarm flag (Xn1)
OFF
Alarm mas k tim
Alarm mas k time
Flashing
OFF
Alarm mas k time
OFF
Flashing
ON
OFF
QE82LG
(3) Behavior of alarms
1) When the alarm reset m ethod is in the “aut o reset” s etting (Ex ample of Io1 primar y alarm
monitoring):
(a) If the present value Io1 exceeds alarm value and the situation continues for alarm
delay time, Io1 primary alarm flag (Xn1) will be turned ON. At th e same time, ALM1
LED flashes.
(b) If the present value goes below the upper limit, Io1 primar y alarm flag ( Xn1) will be
turned OFF. At this time, ALM1 LED is turned off.
(c) Even if the present value Io1 exceeds alarm value, if the value goes under alarm value
within alarm delay time, Io1 primary alarm flag (Xn1) will remain OFF.
Alarm value
e
Figure 4.2.3-3 Time chart of the secondary alarm (alarm reset method = “auto-reset”)
2) When alarm reset method is set to “self-retention” (Example of Io1 primary alarm
monitoring)
(a) If the present value Io1 exceeds alarm value and the situation continues for alarm
delay time, Io1 primary alarm flag (Xn1) will be turned ON. At th e same time, ALM1
LED flashes.
(b) If the present value Io1 goes below the upper limit, Io1 primary alarm flag (Xn1)
remains ON (self-retention). During the self-retention, ALM1 LED is turned on.
(c) By turning CH1 alarm res et request (Yn1) to ON, Io1 prim ary alarm flag (Xn1) will be
turned OFF. At this time, ALM1 LED is turned off.
(d) Check that Io1 pr im ary al arm flag (Xn1) becomes OFF, an d then s et CH1 alarm reset
request (Yn1) to OFF.
Alarm value
Io1 primary alarm flag (Xn1)
CH1 alarm reset request (Yn1)
Figure 4.2.3-4 Time chart of the secondary alarm (alarm reset method = “self-retention”)
4 - 7
4 Functions
QE82LG
3) An example of Io1 primary alarm monitoring is indicated in 1) and 2) above. Other alarm
monitoring will be in accordance with the same behavior.
For the setting items for the buffer m emory that corres ponds to the alarm monitoring and
the I/O signals, refer to Chapters 5 and 6.
(3) How to reset Alarm flag
1) If Alarm flag is ON during the a larm occurrence or the self -retention (in the cas e of the
alarm reset method = “self -retention”), Alarm flag c an be reset (turned OFF) us ing Alarm
reset request.
2) CH1 alarm clear request (Yn1) wi ll clear the followin g data. However, the f ollowing data
cannot be cleared individually.
- Io1 primary alarm flag (Xn1)
- Io1 secondary alarm flag (Xn2)
- Ior1 primary alarm flag (Xn3)
- Ior1 secondary alarm flag (Xn4)
3) The following data can be cleared upon CH2 alarm reset request (Yn5). However, the
following data cannot be cleared individually.
- Io2 primary alarm flag (Xn5)
- Io2 secondary alarm flag (Xn6)
- Ior2 primary alarm flag (Xn7)
- Ior2 secondary alarm flag (Xn8)
4 - 8
4 Functions
Io1一段警報発生フラグ
(Xn1)
OFF
ON
警報マスク
時間
ON
OFF
OFF
CH1警報リセット要求
(Yn1)
OFF
ALM1 LED
消灯
点滅 消灯
(b)
(c) (d)
(a)
点滅
(e)
警報マスク
時間
ON
警報監視値
Alarm
mask time
Alarm
mask time
OFF
Flashing
OFF
Flashing
QE82LG
4) How to reset Alarm flag during alarm occurrence (Example of Io1 primary alarm
monitoring)
(a) If the present value Io1 exceeds alarm value, Io1 primary alarm flag (Xn1) will be
turned ON. At the same time, ALM1 LED flashes.
(b) By turning CH1 alarm reset request (Yn1) to ON, Io1 prim ary alarm flag (Xn1) will be
turned OFF. At this time, ALM1 LED will remain flashing (because ALM1 LED is
synchronized with the alarm status, it will not turn off).
(c) Check that Io1 prim ar y alarm f lag (Xn1) becom es O FF, and then set CH1 al arm reset
request (Yn1) to OFF.
(d) If the present value Io1 goes under alarm value, ALM1 LED will be turned off.
(e) After that, if the present value Io1 exceeds alarm value, Io1 primar y alarm flag (Xn1)
will be turned ON again. At the same time, ALM1 LED flashes.
Alarm value
lo1 primary alarm flag (Xn1)
CH1 alarm reset request (Yn1)
5) How to reset Alarm flag during self-retention (in the case the alarm reset method =
“self-retention” only)
Refer to the procedure described in (2) 2).
Figure 4.2.3-5 Procedure for resetting Io1 primary alarm flag
(alarm reset method = “auto-reset”)
4 - 9
4 Functions
CH1警報発生回数クリア要求（YnB）
CH1警報発生回数クリア完了フラグ（XnB）
ON
OFF
OFF
ON
OFF
OFF
CH1 alarm occurrence count clear completion flag (XnB)
4.2.4 Alarm occurrence count function
It memorizes the c ount of alarm occurrence f or each alarm monitoring e lement, and retains it
until the count of alarm occurrence is performed.
(1) Memory of Alarm occurrence count
1) It memorizes each alarm occurrence count for the following element.
- Io1 primary alarm
- Io1 secondary alarm
- Ior1 primary alarm
- Ior1 secondary alarm
- Io2 primary alarm
- Io2 secondary alarm
- Ior2 primary alarm
- Ior2 secondary alarm
2) Alarm occ urrence count is stored in the nonvolatile memory, so that it can be retaine d
even at a power source reset.
QE82LG
(2) How to clear Alarm occurrence count
1) You can use I/O signal to clear the count of alarm occurrence.
2) The count of alarm occurrence immediately after the clear will be “0”.
3) The following d ata can b e cleared upon C H1 a larm occ urrenc e co un t clear re ques t (YnB).
However, the following data cannot be cleared individually.
- Io1 primary alarm occurrence count (Un\G1200)
- Io1 secondary alarm occurrence count (Un\G1201)
- Ior1 primary alarm occurrence count (Un\G1250)
- Ior1 secondary alarm occurrence count (Un\G1251)
4) The following dat a can be c leared upon CH2 alar m occur renc e cou nt c lear req ues t (YnD).
However, the following data cannot be cleared individually.
- Io2 primary alarm occurrence count (Un\G2200)
- Io2 secondary alarm occurrence count (Un\G2201)
- Ior2 primary alarm occurrence count (Un\G2250)
- Ior2 secondary alarm occurrence count (Un\G2251)
5) The following describes how to clear CH1 alarm occurrence count. (CH2 alarm
occurrence count follows the same procedure using CH2 alarm occurrence count clear
request (YnD).)
(i) Check that CH1 alarm occurrence count clear request (YnB) is OFF.
(ii) Set CH1 alarm occurrence count clear request (YnB) to ON.
CH1 alarm occurrence count is cleared, and then CH 1 alarm occurrence cou nt clear
completion flag (XnB) is turned ON.
(iii) Check that CH1 alarm occurrenc e count clear completion fla g (XnB) is ON, and then
set CH1 alarm occurrence count clear request (YnB) to OFF.
CH1 alarm occurrence count clear request (YnB)
Figure 4.2.3-6 Procedure for clearing Alarm occurrence count
4 - 10
4 Functions
4.2.5 Test function
This function is to output pseudo-fixed value to a buffer memory for debugging sequence
program. The value can be output to the buffer memory without input of voltage and current.
(1) How to use the test function
(2) Content of pseudo-output
QE82LG
1) Using the intelligent function switch sett ings, you can start the test mode to output the
fixed value.
2) For procedure for setting the intelligent function switch, refer to 7.5.2.
3) To finish the tes t mode, the set value is returned by th e intelli gent funct ion switch setting,
and after that, it starts a measuring m ode (low sensitivity mode or high sensitivity mode)
by resetting it.
(It resumes with the previous set value and accumulated electric energy as well as
periodic electric energy.)
For the value to be out put to the buff er memory, refer to Tables 6.1-1 to 6.1-3 in 6.1 Buffer
memory assignment.
(3) Percolations for using the test function
1) Because pseudo-f ixed value is output to the buff er memory, isolate the actual device to
avoid unexpected operation before running the sequence program.
4 - 11
5 I/O signal to CPU unit
module)
QE82LG)
Device # Signal name
Device # Signal name
Xn0
Module ready
Yn0
Use prohibited *1
Xn1
Io1 primary alarm flag
Yn1
CH1 alarm reset request
Xn2
Io1 secondary alarm flag
Yn2
Use prohibited *1
Xn3
Ior1 primary alarm flag
Yn3
Use prohibited *1
Xn4
Ior1 secondary alarm flag
Yn4
Use prohibited *1
Xn5
Io2 primary alarm flag
Yn5
CH2 alarm reset request
Xn6
Io2 secondary alarm flag
Yn6
Use prohibited *1
Xn7
Ior2 primary alarm flag
Yn7
Use prohibited *1
Xn8
Ior2 secondary alarm flag
Yn8
Use prohibited *1
flag
XnA
CH1 max. value clear completion flag
YnA
CH1 max. value clear request
completion flag
request
XnC
CH2 max. value clear completion flag
YnC
CH2 max. value clear request
completion flag
request
XnE
Use prohibited *1
YnE
Use prohibited *1
XnF
Error flag
YnF
Error clear request
Chapter 5: I/O signal to CPU module
5.1 List of I/O signals
I/O signals of QE82LG are listed in Table 5.1-1.
The “n” that is us ed i n this and later ch apters (for example: Xn0, Yn0, Un\G0, etc.) refers to th e num ber
that appears at the beginning of QE82LG.
Table 5.1-1 List of I/O signals
Input signal (signal direction from QE82LG to CPU
Output signal(signal direction from CPU module to
QE82LG
Xn9
XnB
XnD
Operating condition setting completion
CH1 alarm occurrence count clear
CH2 alarm occurrence count clear
Yn9 Operating condition setting request
YnB
YnD
CH1 alarm occurrence count clear
CH2 alarm occurrence count clear
Point
*1 These signals cannot be used by the user since they are for system use
only. If these are set to on or off b y the sequence prog ram , the perf orm ance
of the QE82LG cannot be g uaranteed.
5 - 1
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