Mitsubishi MH8S64AQFC-8, MH8S64AQFC-7L, MH8S64AQFC-6L, MH8S64AQFC-6 Datasheet

Preliminary Spec.
for easy interchange or addition of modules.
APPLICATION
4096 refresh cycle /64ms
(Component SDRAM)
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
The MH8S64AQFC is 8388608 - word by 64-bit Synchronous DRAM module. This consists of four industry standard 8Mx16 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high densities and large quantities of memory are required. This is a socket type - memory modules, suitable
FEATURES
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
Utilizes industry standard 8M x 16 Synchronous DRAMs TSOP and industry standard EEPROM in TSSOP
144-pin (72-pin dual in-line package)
single 3.3V±0.3V power supply Max. Clock frequency -6:133MHz,-7,8:100MHz
Fully synchronous operation referenced to clock rising edge
4 bank operation controlled by BA0,1(Bank Address) /CAS latency- 2/3(programmable) Burst length- 1/2/4/8/Full Page(programmable)
-6,-6L
-7,-7L
-8,-8L
PCB Outline
Frequency
133MHz 100MHz
CLK Access Time
5.4ns(CL=3)
6.0ns(CL=2)
6.0ns(CL=3)100MHz
Burst type- sequential / interleave(programmable) Column access - random Auto precharge / All bank precharge controlled by A10 Auto refresh and Self refresh
LVTTL Interface
main memory or graphic memory in computer systems
(Front) (Back)
1 2
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Preliminary Spec.
PIN CONFIGURATION
Number
Pin Name
Pin Name
Number
13579111315171924681012141618
Number
Pin Name
Pin Name
Number
73
74
7980818283848586878889
90
212293942324959625269798272899
1002930
101
102
3334105
3536107
3738109
3940111
1124142
113
1144344
115
1164546
117
118
4950121
5152123
1245354
125
1265556
127
1285758
129
130
6566137
6768139
1406970
141
1427172
143
144
Vss
DQ1
DQ3
Vcc
DQ4
DQ6
Vss
DQ33
DQ35
Vcc
DQ36
DQ38
CLK1
NCNCNCNCVcc
Vcc
DQ16
DQ48
DQ17
DQ49
DQ19
DQ51
Vss
DQ20
DQMB0
DQMB4
DQ21
DQ53
DQMB1
DQMB5
DQ22
DQ54
Vcc
Vcc
DQ23
DQ55
A0A3Vcc
Vcc
A2A5A8
Vss
Vss
DQ8
A9
DQ9
DQ41
A10
A11
DQ10
DQ42
Vcc
Vcc
DQ11
DQ43
DQMB2
DQMB6
Vcc
Vcc
DQMB3
DQ13
DQ24
DQ14
DQ46
DQ25
DQ57
DQ15
DQ47
DQ26
DQ58
Vss
Vss
DQ27
DQ59
NCNCVcc
Vcc
/RAS
DQ31
/WE
CKE1
Vss
Vss
/S0NCSDA
SCL
/S1NCVcc
Vcc
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
PIN
31
Front side
DQ0
DQ2
DQ5
DQ7
A1
PIN
20
32
Back side
DQ32
DQ34
DQ37
DQ39
Vss
A4
Vss
DQ40
PIN
Front side
NC
75
Vss
77 78
DQ18
91
103
Vss
A6
PIN
76
92
104 106 108 110
Back side
Vss
DQ50
Vss
DQ52
A7
BA0
Vss BA1
47
59 61 63
DQ12
NC
CLK0
Vcc
NC = No Connection
48
60 62 64
DQ44 DQ45
NC
CKE0
Vcc
/CAS
119
131 133 135
Vss
DQ28 DQ29 DQ30
120 122
132 134 136 138
DQMB7
Vss
DQ56
DQ60 DQ61 DQ62 DQ63
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Block Diagram
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
/S0
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
DQMB0
DQMB1
DQMB2
DQMB3
DQ0 DQ1 DQ2 DQ3
DQ4 DQ5 DQ6 DQ7
DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23
DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31
10
DQML
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
DQMU
I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15
DQML
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
DQMU
I/O 8 I/O 9 I/O 10 I/O 11 I/O 12
I/O 13 I/O 14
I/O 15
/CS
D0
/CS
D1
DQMB4
DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39
DQMB5
DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47
DQMB6
DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55
DQMB7
DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63
DQML
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
DQMU
I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15
DQML
I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
DQMU
I/O 8 I/O 9 I/O 10 I/O 11 I/O 12
I/O 13 I/O 14
I/O 15
/CS
D2
/CS
D3
BA0,BA1,A<11:0>
CLK0 CKE0 /RAS /CAS
/WE
Vcc Vss
D0 - D3 D0 - D3 D0 - D3
D0 - D3 D0 - D3
D0 - D3
D0 - D3
CLK1
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SCL
SERIAL PD
A0 A1 A2
SDA
22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Serial Presence Detect Table I
Voltage interface standard of this assembly
Non-PARITY
Minimum Clock Delay,Back to Back Random Column Addresses
non-buffered,non-registered
Precharge All,Auto precharge
SDRAM Access form Clock(2nd highest CAS latency)
SDRAM Access form Clock(3rd highest CAS latency)
-8,-8L
-8,-8L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
Byte Function described SPD enrty data SPD DATA(hex)
Defines # bytes written into serial memory at module mfgr 128
0 1 Total # bytes of SPD memory device 2 3 4 5 6 7 8
SDRAM Cycletime at Max.Supported CAS Latency (CL).
9
10
11 12 13 14 15 16 17 18
19 20 21 22 23
24
25 26
27
28
29
30
DIMM Configuration type (Non-parity,Parity,ECC)
SDRAM Cycle time(2nd highest CAS latency)
SDRAM Cycle time(3rd highest CAS latency)
Fundamental memory type SDRAM 04
# Row Addresses on this assembly A0-A11 0C
# Column Addresses on this assembly
# Module Banks on this assembly
Data Width of this assembly... x64 40
... Data Width continuation 0 00
Cycle time for CL=3
SDRAM Access from Clock
tAC for CL=3
Refresh Rate/Type self refresh(15.625uS) 80
SDRAM width,Primary DRAM
Error Checking SDRAM data width N/A 00
Burst Lengths Supported
# Banks on Each SDRAM device 4bank 04
CAS# Latency 2/3 06
CS# Latency 0 01
Write Latency 0 01
SDRAM Module Attributes
SDRAM Device Attributes:General
Cycle time for CL=2
tAC for CL=2
Precharge to Active Minimum
Row Active to Row Active Min.
RAS to CAS Delay Min
Active to Precharge Min
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-6,-6L,-7,-7L
-6,-6L,-7,-7L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
256 Bytes 08
A0-A8 09
1BANK 01
LVTTL 01
7.5ns 10ns
5.4ns 6ns
x16 10
1 01
1/2/4/8/Full page 8F
10ns 13ns D0
6ns 60 7ns 70
N/A 00 N/A 00
22.5ns 17 20ns 14 15ns 0F 20ns 14
22.5ns 17 20ns 14 45ns 2D
50ns 32
80
75 A0
54 60
00
00 0E
A0
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Serial Presence Detect Table II
4D4838533634415146432D37202020202020
-6,-6L,-7,7L
-8,8L
4D4838533634415146432D374C2020202020
4D4838533634415146432D38202020202020
4D4838533634415146432D384C2020202020
-6,-6L
-6,-6L
-6,-6L
-6,-6L
4D4838533634415146432D364C2020202020
4D4838533634415146432D36202020202020
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
31 Density of each bank on module 64MByte 10
Command and Address signal input setup time
32
Command and Address signal input hold time
33
34
Data signal input setup time
35
36-61
62 SPD Revision
63 Checksum for bytes 0-62
64-71 Manufactures Jedec ID code per JEP-108E MITSUBISHI 1CFFFFFFFFFFFFFF
72 Manufacturing location
73-90 Manufactures Part Number
91-92 Revision Code PCB revision rrrr 93-94 Manufacturing date year/week code yyww 95-98 Assembly Serial Number serial number ssssssss
99-125 Manufacture Specific Data option 00
126 Intetl specification frequency 127
128+ Unused storage locations open 00
Data signal input hold time
Superset Information (may be used in future) option 00
Intel specification CAS# Latency support
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
1.5ns 2ns
0.8ns 1ns
1.5ns 2ns
0.8ns 1ns
rev 1.2B
Check sum for -6,-6L AC Check sum for -7,-7L 0D Check sum for -8,-8L 4D
Miyoshi,Japan 01
Tajima,Japan 02
NC,USA 03
Germany 04
MH8S64AQFC-6 MH8S64AQFC-6L
MH8S64AQFC-7 MH8S64AQFC-7L
MH8S64AQFC-8 MH8S64AQFC-8L
100MHz 64
CL=2/3,AP,CK0,1
CL=3,AP,CK0,1
15 20
08 10
15 20
08 10
12
8F
8D
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Power Supply
SDA
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
PIN FUNCTION
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
CLK0
CKE0 Input
/S0
/RAS,/CAS,/WE Input Combination of /RAS,/CAS,/WE defines basic commands.
A0-11 Input
Input
Input
Master Clock:All other inputs are referenced to the rising edge of CK
Clock Enable:CKE controls internal clock.When CKE is low,internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE E becomes asynchronous input.Self refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means No Operation.
A0-11 specify the Row/Column Address in conjunction with BA0,1.The Row Address is specified by A0-11.The Column Address is specified by A0-8.A10 is also used to indicate precharge option.When A10 is high at a read / write command, an auto precharge is performed. When A10 is high at a precharge command, both banks are precharged.
BA0,1 Input
DQ0-63
DQMB0-7 Input
Vdd,Vss
SCL
Input/Output
Input
Output
Bank Address:BA0,1 is not simply BA.BA specifies the bank to which a command is applied.BA0,1 must be set with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge of CK
Din Mask/Output Disable:When DQMB is high in burst write.Din for the current cycle is masked.When DQMB is high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
Serial clock for serial PD
Serial data for serial PD
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Preliminary Spec.
The MH8S64AQFC provides basic functions,bank(row)activate,burst read / write,
To know the detailed definition of commands please see the command truth table.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
BASIC FUNCTIONS
bank(row)precharge,and auto / self refresh. Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge option,respectively.
CK
/S
Chip Select : L=select, H=deselect
/RAS
/CAS
/WE CKE A10
Command Command Command
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output data appears after /CAS latency. When A10 =H at this command,the bank is deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, both banks are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically.
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
COMMAND TRUTH TABLE
COMMAND
MNEMONIC
CKE
n-1
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
CKE
n
/S
/RAS
/CAS
/WE BA0,1 A10
A11
A0-9
Deselect DESEL H X H X X X X X X
No Operation NOP H X L H H H X X X
Row Adress Entry &
Bank Activate
Single Bank Precharge PRE H X L L H L V L X
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-Refresh REFA H H L L L H X X X
Self-Refresh Entry REFS H L L L L H X X X
Self-Refresh Exit REFSX L H H X X X X X X
Burst Terminate TERM
Mode Register Set
ACT H X L L H H V V V
PREA
WRITE
WRITEA H X L H L L V H V
READ H X L H L H V L V
READA H X L H L H V H V
MRS
H X L L H L X H X H X L H L L V L V
L H L H H H X X X H X L H H L X X X H X L L L L L L
X X
V
X X
V
V
V
V
X X X X X L
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
Current State /S /RAS /CAS /WE Address
IDLE H X X X X DESEL NOP
L H H H X NOP NOP L H H L L H L X L L H H L L H L L L L H X REFA
L L L L
ROW ACTIVE H X X X X DESEL NOP
L H H H X NOP NOP L H H L BA TBST NOP
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 L L H H BA,RA ACT Bank Active/ILLEGAL*2
L L H L BA,A10 PRE/PREA Precharge/Precharge All L L L H X REFA ILLEGAL
L L L L
READ H X X X X DESEL NOP(Continue Burst to END)
L H H H X NOP NOP(Continue Burst to END) L H H L
L H L H BA,CA,A10 READ/READA
L H L L BA,CA,A10 WRITE/WRITEA
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge L L L H X REFA ILLEGAL
L L L L
BA TBST ILLEGAL*2 BA,CA,A10
BA,RA BA,A10 PRE/PREA NOP*4
Op-Code, Mode-Add
Op-Code, Mode-Add
BA
Op-Code, Mode-Add
Command
READ/WRITE ILLEGAL*2
ACT Bank Active,Latch RA
Auto-Refresh*5
MRS Mode Register Set*5
Begin Read,Latch CA, Determine Auto-Precharge
WRITE/
WRITEA
MRS ILLEGAL
TBST Terminate Burst
MRS ILLEGAL
Begin Write,Latch CA, Determine Auto-Precharge
Terminate Burst,Latch CA, Begin New Read,Determine
Auto-Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
Action
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State /S /RAS /CAS /WE Address
WRITE H X X X X DESEL NOP(Continue Burst to END)
L H H H X NOP NOP(Continue Burst to END) L H H L BA TBST Terminate Burst
L H L H BA,CA,A10
L H L L BA,CA,A10
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA Terminate Burst,Precharge L L L H X REFA ILLEGAL
L L L L
READ with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L BA TBST ILLEGAL
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10
L L H H BA,RA ACT Bank Active/ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2
L L L H X REFA ILLEGAL L L L L
WRITE with H X X X X DESEL NOP(Continue Burst to END)
AUTO L H H H X NOP NOP(Continue Burst to END)
PRECHARGE L H H L
L H L H BA,CA,A10 READ/READA ILLEGAL L H L L BA,CA,A10 L L H H
L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
BA
BA,RA
Op-Code, Mode-Add
Command
Terminate Burst,Latch CA,
READ/READA
WRITE/
WRITEA
MRS ILLEGAL
WRITE/
WRITEA
MRS ILLEGAL
TBST ILLEGAL
WRITE/
WRITEA
ACT Bank Active/ILLEGAL*2
MRS ILLEGAL
Begin Read,Determine Auto­Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3
ILLEGAL
ILLEGAL
Action
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State /S /RAS /CAS /WE Address
PRE - H X X X X DESEL NOP(Idle after tRP)
CHARGING L H H H X NOP NOP(Idle after tRP)
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT ILLEGAL*2
L L H L BA,A10 PRE/PREA NOP*4(Idle after tRP) L L L H X REFA ILLEGAL
L L L L
ROW H X X X X DESEL NOP(Row Active after tRCD
ACTIVATING L H H H X NOP NOP(Row Active after tRCD
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2
L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code, Mode-Add
Op-Code, Mode-Add
Command
MRS ILLEGAL
MRS ILLEGAL
Action
WRITE RE- H X X X X DESEL NOP
COVERING L H H H X NOP NOP
L H H L BA TBST ILLEGAL*2 L H L X BA,CA,A10 READ/WRITE ILLEGAL*2 L L H H BA,RA ACT ILLEGAL*2 L L H L BA,A10 PRE/PREA ILLEGAL*2 L L L H X REFA ILLEGAL
L L L L
Op-Code,
Mode-Add
MRS ILLEGAL
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22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
1. All entries assume that CKE was High during the preceding clock cycle and the current
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE(continued)
Current State /S /RAS /CAS /WE Address Command Action
RE- H X X X X DESEL NOP(Idle after tRC)
FRESHING L H H H X NOP
L H H L BA TBST ILLEGAL L H L X BA,CA,A10 READ/WRITE ILLEGAL
L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
MODE H X X X X DESEL NOP(Idle after tRSC)
REGISTER L H H H X NOP NOP(Idle after tRSC)
SETTING L H H L BA TBST ILLEGAL
L H L X BA,CA,A10 READ/WRITE ILLEGAL L L H H BA,RA ACT ILLEGAL L L H L BA,A10 PRE/PREA ILLEGAL L L L H X REFA ILLEGAL
L L L L
Op-Code,
MRS ILLEGAL
Mode-Add
Op-Code,
MRS ILLEGAL
Mode-Add
NOP(Idle after tRC)
ABBREVIATIONS: H = Hige Level, L = Low Level, X = Don't Care BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
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Preliminary Spec.
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF - H X X X X X X
REFRESH*1 L H H X X X X
POWER H X X X X X X
DOWN L H X X X X X
ALL BANKS H H X X X X X
IDLE*2 H L L L L H X
CK
CK
n-1
L H L H H H X L H L H H L X L H L H L X X L H L L X X X L L X X X X X
L L X X X X X
H L H X X X X H L L H H H X H L L H H L X
H L L H L X X H L L L X X X
n
/RAS /CAS /WE Add
/S
Action
INVALID Exit Self-Refresh(Idle after tRC) Exit Self-Refresh(Idle after tRC)
ILLEGAL ILLEGAL ILLEGAL NOP(Maintain Self-Refresh)
INVALID Exit Power Down to Idle NOP(Maintain Self-Refresh) Refer to Function Truth Table Enter Self-Refresh Enter Power Down
Enter Power Down ILLEGAL ILLEGAL ILLEGAL
L X X X X X X
ANY STATE H H X X X X X
other than H L X X X X X
listed above L H X X X X X
L L X X X X X
Refer to Current State = Power Down Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3 Exit CK0 Suspend at Next Cycle*3 Maintain CK0 Suspend
ABBREVIATIONS: H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
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Preliminary Spec.
READA
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
SIMPLIFIED STATE DIAGRAM
MITSUBISHI LSIs
SELF
REFRESH
REFS
REFSX
WRITE
SUSPEND
MODE
REGISTER
SET
CLK
SUSPEND
CKEL
WRITE
CKEH
WRITEA READA
MRS
IDLE
ACT
CKEL
CKEH
ROW
ACTIVE
WRITE READ
WRITEA
WRITE
WRITEA
READA
READ
READA
REFA
CKEL
CKEH
READ
AUTO
REFRESH
POWER
DOWN
CKEL
CKEH
READ
SUSPEND
WRITEA
SUSPEND
POWER APPLIED
CKEL
CKEH
POWER
ON
WRITEA
PRE
PRE
PRE PRE
PRE
CHARGE
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CKEL
CKEH
READA
SUSPEND
Automatic Sequence Command Sequence
22.Sep.2000MIT-DS-0374-0.3 MITSUBISHI
Preliminary Spec.
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
SDRAM is ready for new command.
LENGTH
BURST
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock.Attempt to maintain CKE high,DQM0-7 high and NOP condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
register(MRS). The mode register stores these date until the next MRS command, which may be issued when both banks are in idle state. After tRSC from a MRS command, the
CK
/S /RAS /CAS /WE
BT= 0 BT= 1
1 2 4 8 R R R
FP
SEQUENTIAL INTERLEAVED
V
1 2 4 8 R R R R
LATENCY
MODE
00
CL 0 0 0 0 0 1 0 1 0 0 1 1
1 0 0 1 0 1 1 1 0 1 1 1
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0BA1BA0
0 0
/CAS LATENCY
WM
R R 2
3
R R R R
0 0
LTMODE BT BL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1
0
1
WRITE
MODE
BURST
0
1
SINGLE BIT
R:Reserved for Future Use FP: Full Page
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Preliminary Spec.
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
CK
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
Command
Address
DQ
Initial Address
A2 A1 A0
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0
CL= 3 BL= 4
BL
8
Read
Y
Q0 Q1 Q2 Q3
/CAS Latency Burst Length Burst Length
Burst Type
Column Addressing
Sequential Interleaved
0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 0 1 0 3 2 5 4 7 6 2 3 4 5 6 7 0 1 2 3 0 1 6 7 4 5 3 4 5 6 7 0 1 2 3 2 1 0 7 6 5 4 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3
Write
Y
D0 D1
D2
D3
1 0 1 1 1 0 1 1 1
- 0 0
- 0 1
- 1 0
- 1 1
- - 0
- - 1
5 6 7 0 1 2 3 4 5 4 7 6 1 0 3 2 6 7 0 1 2 3 4 5 6 7 4 5 2 3 0 1 7 0 1 2 0 1 2 3 1 2 3 0
4
2 3 0 1 3 0
0 1
2
1 0
3 4 5 6 3 2 1 0
1 2
7 6 5 4 0 1 2 3
1 0 3 2 2 3 0 1 3 2
0 1 1 0
1 0
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Preliminary Spec.
OPERATION DESCRIPTION
defined by the Burst Type. Minimum delay time of a READ command after an ACT command
command can be issued after (BL + tRP) from the previous READA. In any case, tRCD+BL >
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
BANK ACTIVATE
One of four banks is activated by an ACT command. An bank is selected by BA0-1. A row is selected by A0-11. Multiple banks can be active state concurrently by issuing multiple ACT commands. Minimum activation interval between one bank and another bank is tRRD.
PRECHARGE
An open bank is deactivated by a PRE command. A bank to be deactivated is designated by BA0-1. When multiple banks are active, a precharge all command (PREA, PRE + A10=H) deactivates all of open banks at the same time. BA0-1 are "Don't Care" in this case. Minimum delay time of an ACT command after a PRE command to the same bank is tRP.
Bank Activation and Precharge All (BL=4, CL=2)
CK
Command
A0-9,11
A10
BA0,1
DQ
ACT
Xa
Xa
00
tRRD
ACT
Xb
Xb
01
tRCD
READ
Yb
0
01
PRE
tRP
1
Qa0 Qa1 Qa2 Qa3
Precharge all
ACT
Xa
Xa
00
READ
A READ command can be issued to any active bank. The start address is specified by A0-8 (x16) . 1st output data is available after the /CAS Latency from the READ. The consecutive data length is defined by the Burst Length. The address sequence of the burst data is
to the same bank is tRCD. When A10 is high at a READ command, auto-precharge (READA) is performed. Any command (READ, WRITE, PRE, ACT, TBST) to the same bank is inhibited till the internal precharge is complete. The internal precharge starts at the BL after READA. The next ACT
tRASmin must be met.
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