Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
The MH8S64AQFC is 8388608 - word by 64-bit
Synchronous DRAM module. This consists of four
industry standard 8Mx16 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual
Inline package provides any application where
high densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable
FEATURES
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
Utilizes industry standard 8M x 16 Synchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
144-pin (72-pin dual in-line package)
single 3.3V±0.3V power supply
Max. Clock frequency -6:133MHz,-7,8:100MHz
Fully synchronous operation referenced to clock rising
edge
4 bank operation controlled by BA0,1(Bank Address)
/CAS latency- 2/3(programmable)
Burst length- 1/2/4/8/Full Page(programmable)
-6,-6L
-7,-7L
-8,-8L
PCB Outline
Frequency
133MHz
100MHz
CLK Access Time
5.4ns(CL=3)
6.0ns(CL=2)
6.0ns(CL=3)100MHz
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
LVTTL Interface
main memory or graphic memory in computer systems
(Front)
(Back)
1
2
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143
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
PIN CONFIGURATION
Number
Pin Name
Pin Name
Number
13579111315171924681012141618
Number
Pin Name
Pin Name
Number
73
74
7980818283848586878889
90
212293942324959625269798272899
1002930
101
102
3334105
3536107
3738109
3940111
1124142
113
1144344
115
1164546
117
118
4950121
5152123
1245354
125
1265556
127
1285758
129
130
6566137
6768139
1406970
141
1427172
143
144
Vss
DQ1
DQ3
Vcc
DQ4
DQ6
Vss
DQ33
DQ35
Vcc
DQ36
DQ38
CLK1
NCNCNCNCVcc
Vcc
DQ16
DQ48
DQ17
DQ49
DQ19
DQ51
Vss
DQ20
DQMB0
DQMB4
DQ21
DQ53
DQMB1
DQMB5
DQ22
DQ54
Vcc
Vcc
DQ23
DQ55
A0A3Vcc
Vcc
A2A5A8
Vss
Vss
DQ8
A9
DQ9
DQ41
A10
A11
DQ10
DQ42
Vcc
Vcc
DQ11
DQ43
DQMB2
DQMB6
Vcc
Vcc
DQMB3
DQ13
DQ24
DQ14
DQ46
DQ25
DQ57
DQ15
DQ47
DQ26
DQ58
Vss
Vss
DQ27
DQ59
NCNCVcc
Vcc
/RAS
DQ31
/WE
CKE1
Vss
Vss
/S0NCSDA
SCL
/S1NCVcc
Vcc
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
PIN
31
Front side
DQ0
DQ2
DQ5
DQ7
A1
PIN
20
32
Back side
DQ32
DQ34
DQ37
DQ39
Vss
A4
Vss
DQ40
PIN
Front side
NC
75
Vss
7778
DQ18
91
103
Vss
A6
PIN
76
92
104
106
108
110
Back side
Vss
DQ50
Vss
DQ52
A7
BA0
Vss
BA1
47
59
61
63
DQ12
NC
CLK0
Vcc
NC = No Connection
48
60
62
64
DQ44
DQ45
NC
CKE0
Vcc
/CAS
119
131
133
135
Vss
DQ28
DQ29
DQ30
120
122
132
134
136
138
DQMB7
Vss
DQ56
DQ60
DQ61
DQ62
DQ63
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
Block Diagram
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
Minimum Clock Delay,Back to Back Random Column Addresses
non-buffered,non-registered
Precharge All,Auto precharge
SDRAM Access form Clock(2nd highest CAS latency)
SDRAM Access form Clock(3rd highest CAS latency)
-8,-8L
-8,-8L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
-6,-6L
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
ByteFunction describedSPD enrty dataSPD DATA(hex)
Defines # bytes written into serial memory at module mfgr128
0
1Total # bytes of SPD memory device
2
3
4
5
6
7
8
SDRAM Cycletime at Max.Supported CAS Latency (CL).
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
DIMM Configuration type (Non-parity,Parity,ECC)
SDRAM Cycle time(2nd highest CAS latency)
SDRAM Cycle time(3rd highest CAS latency)
Fundamental memory typeSDRAM04
# Row Addresses on this assemblyA0-A110C
# Column Addresses on this assembly
# Module Banks on this assembly
Data Width of this assembly...x6440
... Data Width continuation000
Cycle time for CL=3
SDRAM Access from Clock
tAC for CL=3
Refresh Rate/Typeself refresh(15.625uS)80
SDRAM width,Primary DRAM
Error Checking SDRAM data widthN/A00
Burst Lengths Supported
# Banks on Each SDRAM device4bank04
CAS# Latency2/306
CS# Latency001
Write Latency001
SDRAM Module Attributes
SDRAM Device Attributes:General
Cycle time for CL=2
tAC for CL=2
Precharge to Active Minimum
Row Active to Row Active Min.
RAS to CAS Delay Min
Active to Precharge Min
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-6,-6L,-7,-7L
-6,-6L,-7,-7L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
256 Bytes08
A0-A809
1BANK01
LVTTL01
7.5ns
10ns
5.4ns
6ns
x1610
101
1/2/4/8/Full page8F
10ns
13nsD0
6ns60
7ns70
N/A00
N/A00
22.5ns17
20ns14
15ns0F
20ns14
22.5ns17
20ns14
45ns2D
50ns32
80
75
A0
54
60
00
00
0E
A0
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
Serial Presence Detect Table II
4D4838533634415146432D37202020202020
-6,-6L,-7,7L
-8,8L
4D4838533634415146432D374C2020202020
4D4838533634415146432D38202020202020
4D4838533634415146432D384C2020202020
-6,-6L
-6,-6L
-6,-6L
-6,-6L
4D4838533634415146432D364C2020202020
4D4838533634415146432D36202020202020
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
31Density of each bank on module64MByte10
Command and Address signal input setup time
32
Command and Address signal input hold time
33
34
Data signal input setup time
35
36-61
62SPD Revision
63Checksum for bytes 0-62
64-71Manufactures Jedec ID code per JEP-108EMITSUBISHI1CFFFFFFFFFFFFFF
72Manufacturing location
73-90Manufactures Part Number
91-92Revision CodePCB revisionrrrr
93-94Manufacturing dateyear/week codeyyww
95-98Assembly Serial Numberserial numberssssssss
99-125Manufacture Specific Dataoption00
126Intetl specification frequency
127
128+Unused storage locationsopen00
Data signal input hold time
Superset Information (may be used in future)option00
Intel specification CAS# Latency support
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
-7,-7L,-8,-8L
1.5ns
2ns
0.8ns
1ns
1.5ns
2ns
0.8ns
1ns
rev 1.2B
Check sum for -6,-6LAC
Check sum for -7,-7L0D
Check sum for -8,-8L4D
Miyoshi,Japan01
Tajima,Japan02
NC,USA03
Germany04
MH8S64AQFC-6
MH8S64AQFC-6L
MH8S64AQFC-7
MH8S64AQFC-7L
MH8S64AQFC-8
MH8S64AQFC-8L
100MHz64
CL=2/3,AP,CK0,1
CL=3,AP,CK0,1
15
20
08
10
15
20
08
10
12
8F
8D
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
Power Supply
SDA
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
PIN FUNCTION
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
CLK0
CKE0Input
/S0
/RAS,/CAS,/WEInputCombination of /RAS,/CAS,/WE defines basic commands.
A0-11Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
A0-11 specify the Row/Column Address in conjunction with
BA0,1.The Row Address is specified by A0-11.The Column
Address is specified by A0-8.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
BA0,1Input
DQ0-63
DQMB0-7Input
Vdd,Vss
SCL
Input/Output
Input
Output
Bank Address:BA0,1 is not simply BA.BA specifies the
bank to which a command is applied.BA0,1 must be set
with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge
of CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is
high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
Serial clock for serial PD
Serial data for serial PD
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Preliminary Spec.
The MH8S64AQFC provides basic functions,bank(row)activate,burst read / write,
To know the detailed definition of commands please see the command truth table.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
BASIC FUNCTIONS
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge.
In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
CK
/S
Chip Select : L=select, H=deselect
/RAS
/CAS
/WE
CKE
A10
Command
Command
Command
Refresh Option @refresh
command
Precharge Option @precharge or read/write
command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
COMMAND TRUTH TABLE
COMMAND
MNEMONIC
CKE
n-1
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
CKE
n
/S
/RAS
/CAS
/WE BA0,1A10
A11
A0-9
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHHXXXXXX
Burst TerminateTERM
Mode Register Set
ACTHXLLHHVVV
PREA
WRITE
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
MRS
HXLLHLXHX
HXLHLLVLV
LHLHHHXXX
HXLHHLXXX
HXLLLLLL
X
X
V
X
X
V
V
V
V
X
X
X
X
X
L
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
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22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
Current State/S/RAS /CAS/WEAddress
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHL
LHLX
LLHH
LLHL
LLLHXREFA
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTNOP
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
INVALID
Exit Power Down to Idle
NOP(Maintain Self-Refresh)
Refer to Function Truth Table
Enter Self-Refresh
Enter Power Down
Enter Power Down
ILLEGAL
ILLEGAL
ILLEGAL
LXXXXXX
ANY STATEHHXXXXX
other thanHLXXXXX
listed aboveLHXXXXX
LLXXXXX
Refer to Current State = Power Down
Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3
Exit CK0 Suspend at Next Cycle*3
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
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Preliminary Spec.
READA
Some contents are subject to change without notice.
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
SIMPLIFIED STATE DIAGRAM
MITSUBISHI LSIs
SELF
REFRESH
REFS
REFSX
WRITE
SUSPEND
MODE
REGISTER
SET
CLK
SUSPEND
CKEL
WRITE
CKEH
WRITEAREADA
MRS
IDLE
ACT
CKEL
CKEH
ROW
ACTIVE
WRITEREAD
WRITEA
WRITE
WRITEA
READA
READ
READA
REFA
CKEL
CKEH
READ
AUTO
REFRESH
POWER
DOWN
CKEL
CKEH
READ
SUSPEND
WRITEA
SUSPEND
POWER
APPLIED
CKEL
CKEH
POWER
ON
WRITEA
PRE
PRE
PREPRE
PRE
CHARGE
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CKEL
CKEH
READA
SUSPEND
Automatic Sequence
Command Sequence
22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
Preliminary Spec.
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
SDRAM is ready for new command.
LENGTH
BURST
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock.Attempt to maintain CKE high,DQM0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
register(MRS). The mode register stores these date until the next MRS command, which
may be issued when both banks are in idle state. After tRSC from a MRS command, the
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
LATENCY
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7 A6A5A4 A3A2A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
WRITE
MODE
BURST
0
1
SINGLE BIT
R:Reserved for Future Use
FP: Full Page
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Preliminary Spec.
Some contents are subject to change without notice.
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
defined by the Burst Type. Minimum delay time of a READ command after an ACT command
command can be issued after (BL + tRP) from the previous READA. In any case, tRCD+BL >
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH8S64AQFC -6,-6L,-7,-7L,-8,-8L
536,870,912-BIT (8,388,608 - WORD BY 64-BIT)SynchronousDRAM
BANK ACTIVATE
One of four banks is activated by an ACT command.
An bank is selected by BA0-1. A row is selected by A0-11.
Multiple banks can be active state concurrently by issuing multiple ACT commands.
Minimum activation interval between one bank and another bank is tRRD.
PRECHARGE
An open bank is deactivated by a PRE command.
A bank to be deactivated is designated by BA0-1.
When multiple banks are active, a precharge all command (PREA, PRE + A10=H)
deactivates all of open banks at the same time. BA0-1 are "Don't Care" in this case.
Minimum delay time of an ACT command after a PRE command to the same bank is tRP.
Bank Activation and Precharge All (BL=4, CL=2)
CK
Command
A0-9,11
A10
BA0,1
DQ
ACT
Xa
Xa
00
tRRD
ACT
Xb
Xb
01
tRCD
READ
Yb
0
01
PRE
tRP
1
Qa0Qa1Qa2Qa3
Precharge all
ACT
Xa
Xa
00
READ
A READ command can be issued to any active bank. The start address is specified by A0-8
(x16) . 1st output data is available after the /CAS Latency from the READ. The consecutive
data length is defined by the Burst Length. The address sequence of the burst data is
to the same bank is tRCD.
When A10 is high at a READ command, auto-precharge (READA) is performed. Any
command (READ, WRITE, PRE, ACT, TBST) to the same bank is inhibited till the internal
precharge is complete. The internal precharge starts at the BL after READA. The next ACT
tRASmin must be met.
22.Sep.2000MIT-DS-0374-0.3MITSUBISHI
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