Mitsubishi M68762SL Datasheet

MITSUBISHI RF POWER MODULE
14+/-1
22.5+/-0.5
21.5+/-0.5
1.5+0.8/-0
21+/-0.5
4+/-0.3
10+/-0.5
7.5+0.8/-0
2.3+/-0.3
3.1+/-0.4
(9.8)
M68762SL
Silicon Bipolar Power Amplifier, 350-400MHz 30W FM Mobile
OUTLINE DRAWING
3+/-0.3
7.25+/-0.8
1 2 3 4 5 6
12+/-1
16.5+/-1
33.0+/-1
phi 0.45
43.5+/-1
55.5+/-1
Dimensions in mm
66+/-0.5
60+/-0.5
51.5+/-0.5
2-R2+/-0.5
+/-0.2
BLOCK DIAGRAM
1
PIN:
Pin : RF INPUT
1
: 1st. DC SUPPLY
2
Vcc1
: 2nd. DC SUPPLY
3
Vcc2
: 3rd. DC SUPPLY
4
Vcc3
5
Po
6
GND : FIN
42 3
5 6
H3
MAXIMUM RATINGS (Tc=25deg C UNLESS OTHERWISE NOTED)
SYMBOL PARAMETER CONDITIONS RATINGS UNIT Vcc SUPPLY VOLTAGE ZG=ZL=50 ohms 17 V Icc TOTAL CURRENT ZG=ZL=50 ohms 10 A Pin INPUT POWER Vcc1<12.5V, ZG=ZL=50 ohms 600 mW Po OUTPUT POWER Vcc1<12.5V, ZG=ZL=50 ohms 40 W Tc(OP) OPERATION CASE TEMPERATURE ZG=ZL=50 ohms -30 to +110 deg. C Tstg STORAGE TEMPERATURE -40 to +110 deg. C Note:Above parameters are guaranteed independently.
ELECTRICAL CHARACTERISTICS (Tc=25deg.C UNLESS OTHERWISE NOTED)
SYMBOL PARAMETER TEST CONDITIONS LIMITS UNIT
MIN MAX
f FREQUENCY RANGE 350 400 MHz
Po OUTPUT POWER 30 W
Efficiency TOTAL EFFICIENCY VCC=12.5V, 40 %
2fo 2nd HARMONIC Pin=0.3W, -30 dBc 3fo 3rd HARMONIC ZG=ZL=50 ohms -30 dBc
VSWR in INPUT VSWR 3.5 -
- STABILITY (note 1)
ZG=50 ohms, V
CC1
(Vcc1<Vcc2=Vcc3)
=5-12.5V, Vcc2=Vcc3=10-16V
No parasitic
oscillation
-
Po<40W (Pin control), Load VSWR < 3.0:1(all phase)
VSWRT LOAD VSWR TOLERANCE VCC=15.2V,Po=30W(Pin control)
ZG=50 ohms, LOAD VSWR=20:1
No degradation
or destroy
-
NOTE: Above parameters, ratings, limits and conditions are subject to change. NOTE1: Stability is tested by sampling test (10pcs/LOT)
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
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