Some of contents are subject to change without notice.
DESCRIPTION
M2S56D20ATP is a 4-bank x 16,777,216-word x 4-bit,
M2S56D30ATP is a 4-bank x 8,388,608-word x 8-bit,
M2S56D40ATP is a 4-bank x 4,194,304-word x 16-bit,
double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are
referenced to the rising edge of CLK. Input data is registered on both edges of data strobe, and output
data and data strobe are referenced on both edges of CLK. The M2S56D20/30/40ATP achieves very
high speed data rate up to 133MHz, and are suitable for main memory in computer systems.
FEATURES
- Vdd=Vddq=2.5V+0.2V
- Double data rate architecture;
two data transfers per clock cycle
- Bidirectional, data strobe (DQS) is transmitted/received with data
- Differential clock inputs (CLK and /CLK)
- DLL aligns DQ and DQS transitions
with CLK transitions edges of DQS
- Commands entered on each positive CLK edge;
- data and data mask referenced to both edges of DQS
- 4 bank operation controlled by BA0, BA1 (Bank Address)
Clock: CLK and /CLK are differential clock inputs. All address and control
input signals are sampled on the crossing of the positive edge of CLK and
CLK, /CLKInput
CKEInput
/CSInputChip Select: When /CS is high, any command means No Operation.
/RAS, /CAS, /WEInputCombination of /RAS, /CAS, /WE defines basic commands.
A0-12Input
negative edge of /CLK. Output (read) data is referenced to the crossings of
CLK and /CLK (both directions of crossing).
Clock Enable: CKE controls internal clock. When CKE is low, internal clock
for the following cycle is ceased. CKE is also used to select auto / self refresh.
After self refresh mode is started, CKE becomes asynchronous input. Self refresh
is maintained as long as CKE is low.
A0-11 specify the Row / Column Address in conjunction with BA0,1. The
Row Address is specified by A0-12. The Column Address is specified by
A0-9,11(x4), A0-9(x8) and A0-8(x16). A10 is also used to indicate precharge
option. When A10 is high at a read / write command, an auto precharge is
performed. When A10 is high at a precharge command, all banks are
precharged.
BA0,1Input
DQ0-15(x16),
DQ0-7(x8),
DQ0-3(x4),
DQS
DM
Vdd, VssPower SupplyPower Supply for the memory array and peripheral circuitry.
VddQ, VssQPower SupplyVddQ and VssQ are supplied to the Output Buffers only.
VrefInputSSTL_2 reference voltage.
Input / Output
Input / Output
Input
Bank Address: BA0,1 specifies one of four banks to which a command is
applied. BA0,1 must be set with ACT, PRE, READ, WRITE commands.
Data Input/Output: Data bus
Data Strobe: Output with read data, input with write data. Edge-aligned
with read data, centered in write data. Used to capture write data.
For the x16, LDQS corresponds to the data on DQ0-DQ7; UDQS
correspond to the data on DQ8-DQ15
Input Data Mask: DM is an input mask signal for write data. Input data
is masked when DM is sampled HIGH along with that input data
during a WRITE access. DM is sampled on both edges of DQS.
Although DM pins are input only, the DM loading matches the DQ
and DQS loading. For the x16, LDM corresponds to the data on DQ0-DQ7;
UDM corresponds to the data on DQ8-DQ15.
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Jun. '01 Preliminary
BLOCK DIAGRAM
DLL
Memory
Array
Bank #0
Memory
Array
Bank #1
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
DQ0 - 15
I/O Buffer
Memory
Array
Bank #2
UDQS,LDQS
QS Buffer
Memory
Array
Bank #3
Mode Register
Address Buffer
A0-12
BA0,1
Type Designation Code
M 2 S 56 D 3 0 A TP –75A
Control Circuitry
Control Signal Buffer
Clock Buffer
/CS /RAS /CAS/WEUDM,
CLKCKE
/CLK
This rule is applied to only Synchronous DRAM family.
Speed Grade 10: 125MHz@CL=2.5,100MHz@CL=2.0
75: 133MHz@CL=2.5,100MHz@CL=2.0
75A: 133MHz@CL=2.5,133MHz@CL=2.0
Package Type TP: TSOP(II)
Process Generation
Function Reserved for Future Use
Organization 2n2: x4, 3: x8, 4: x16
DDR Synchronous DRAM
Density 56: 256M bits
Interface V:LVTTL, S:SSTL_3, _2
Memory Style (DRAM)
Mitsubishi Main Designation
LDM
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M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
BASIC FUNCTIONS
The M2S56D20/30/40ATP provides basic functions, bank (row) activate, burst read / write, bank
(row) precharge, and auto / self refresh. Each command is defined by control signals of /RAS,
/CAS and /WE at CLK rising edge. In addition to 3 signals, /CS ,CKE and A10 are used as chip
select, refresh option, and precharge option, respectively. To know the detailed definition of
commands, please see the command truth table.
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate (ACT) [/RAS =L, /CAS =/WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read (READ) [/RAS =H, /CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA. First output data appears after
/CAS latency. When A10 =H at this command, the bank is deactivated after the burst read (autoprecharge, READA)
Write (WRITE) [/RAS =H, /CAS =/WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written
is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write
(auto-precharge, WRITEA)
Precharge (PRE) [/RAS =L, /CAS =H, /WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read
/write operation. When A10 =H at this command, all banks are deactivated (precharge all, PREA ).
Auto-Refresh (REFA) [/RAS =/CAS =L, /WE =CKE =H]
REFA command starts auto-refresh cycle. Refresh address including bank address are generated
internally. After this command, the banks are precharged automatically.
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Jun. '01 Preliminary
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
COMMAND TRUTH TABLE
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Address Entry &
Bank Activate
Single Bank PrechargePREHHLLHLVLX
Precharge All Banks
Column Address Entry
& Write
Column Address Entry
& Write with
Auto-Precharge
Column Address Entry
& Read
Column Address Entry
& Read with
Auto-Precharge
ACTHHLLHHVVV
PREAHHLLHLHX
WRITEHHLHLLVLV
WRITEAHHLHLLVHV
READHHLHLHVLV
READAHHLHLHVHV
CKE
n-1
CKE
n
/CS/RAS/CAS/WEBA0,1
X
A10
/AP
A0-9,
11-12
note
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSX
Burst TerminateTERMHHLHHLXXX
Mode Register SetMRSHHLLLLLLV
H=High Level, L=Low Level, V=Valid, X=Don't Care, n=CLK cycle number
NOTE:
1. Applies only to read bursts with autoprecharge disabled; this command is undefined (and should not be used) for
read bursts with autoprecharge enabled, and for write bursts.
2. BA0-BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register;BA0=1 ,
BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the
op-code to be written to the selected Mode Register.
LHHXXXXXX
LHLHHHXXX
1
2
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Jun. '01 Preliminary
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
FUNCTION TRUTH TABLE
Current State/CS /RAS /CAS /WE AddressCommandActionNotes
IDLEHXXX XDESELNOP
LHHH XNOPNOP
LHHLBATERMILLEGAL2
LHLX BA, CA, A10READ / WRITEILLEGAL2
LLHHBA, RAACTBank Active, Latch RA
LLHLBA, A10PRE / PREANOP4
LLLHXREFAAuto-Refresh5
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHH XNOPNOP
LHHLBATERMNOP
LHLH BA, CA, A10READ / READA
LHLLBA, CA, A10WRITE / WRITEA
LLHHBA, RAACTBank Active / ILLEGAL2
LLHLBA, A10PRE / PREAPrecharge / Precharge All
LLLHXREFAILLEGAL
LLLL
READ(Auto-
Precharge
Disabled)
HXXX XDESELNOP (Continue Burst to END)
LHHH XNOPNOP (Continue Burst to END)
LHHLBATERMTerminate Burst
LHLH BA, CA, A10READ / READA
LHLLBA, CA, A10WRITE / WRITEAILLEGAL
LLHHBA, RAACTBank Active / ILLEGAL2
LLHLBA, A10PRE / PREATerminate Burst, Precharge
LLLHXREFAILLEGAL
LLLL
Op-Code, ModeAdd
Op-Code, ModeAdd
Op-Code, ModeAdd
MRSMode Register Set5
Begin Read, Latch CA, Determine
Auto-Precharge
Begin Write, Latch CA, Determine
Auto-Precharge
MRSILLEGAL
Terminate Burst, Latch CA, Begin
New Read, Determine AutoPrecharge
MRSILLEGAL
3
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MITSUBISHI LSIs
Jun. '01 Preliminary
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
FUNCTION TRUTH TABLE (continued)
Current State/CS /RAS /CAS /WE AddressCommandActionNotes
WRITE(Auto-
Precharge
Disabled)
READ with
Auto-Precharge
WRITE with
Auto-Precharge
HXXXXDESELNOP (Continue Burst to END)
LHHHXNOPNOP (Continue Burst to END)
LHHLBATERMILLEGAL
LHLH BA, CA, A10READ / READA
LHLLBA, CA, A10WRITE / WRITEA
LLHH BA, RAACTBank Active / ILLEGAL2
LHHHXNOPNOP (Continue Burst to END)
LHHLBATERMILLEGAL
LHLH BA, CA, A10READ / READAILLEGAL for Same Bank6
LHLLBA, CA, A10WRITE / WRITEAILLEGAL for Same Bank 6
LLHH BA, RAACTBank Active / ILLEGAL2
LLHLBA, A10PRE / PREAPrecharge / ILLEGAL2
LLLH XREFAILLEGAL
LLLL
HXXXXDESELNOP (Continue Burst to END)
LHHHXNOPNOP (Continue Burst to END)
LHHLBATERMILLEGAL
LHLH BA, CA, A10READ / READAILLEGAL for Same Bank 7
LHLLBA, CA, A10WRITE / WRITEAILLEGAL for Same Bank 7
LLHH BA, RAACTBank Active / ILLEGAL2
1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of
that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state. May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
6. Refer to Read with Auto-Precharge in page 24.
7. Refer to Write with Auto-Precharge in page 26.
ILLEGAL = Device operation and/or data-integrity are not guaranteed.
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DDR SDRAM (Rev.1.2)
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FUNCTION TRUTH TABLE for CKE
Current StateCKE n-1 CKE n/CS/RAS/CAS/WE AddressActionNotes
SELF-
REFRESHING
POWER
DOWN
ALL BANKS
IDLE
HXXXXXXINVALID1
LHHXXXXExit Self-Refresh (Idle after tRC)1
LHLHHHXExit Self-Refresh (Idle after tRC)1
LHLHHLXILLEGAL1
LHLHLXXILLEGAL1
LHLLXXXILLEGAL1
LLXXXXXNOP (Maintain Self-Refresh)1
HXXXXXXINVALID
LHXXXXXExit Power Down to Idle
LLXXXXXNOP (Maintain Self-Refresh)
HHXXXXXRefer to Function Truth Table2
HLLLLHXEnter Self-Refresh2
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
HLHXXXXEnter Power Down2
HLLHHHXEnter Power Down2
HLLHHLXILLEGAL2
HLLHLXXILLEGAL2
HLLLXXXILLEGAL2
LXXXXXXRefer to Current State =Power Down2
ANY STATE
other than listed
above
HHXXXXXRefer to Function Truth Table
HLXXXXXBegin CLK Suspend at Next Cycle3
LHXXXXXExit CLK Suspend at Next Cycle3
LLXXXXXMaintain CLK Suspend
ABBREVIATIONS:
H=High Level, L=Low Level, X=Don't Care
NOTES:
1. CKE Low to High transition will re-enable CLK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All Banks Idle State.
3. Must be legal command.
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DDR SDRAM (Rev.1.2)
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Jun. '01 Preliminary
SIMPLIFIED STATE DIAGRAM
POWER
APPLIED
POWER
ON
PREA
MODE
REGISTER
SET
PRE
CHARGE
ALL
MRS
MRS
Active
Power
Down
M2S56D20/ 30/ 40ATP
256M Double Data Rate Synchronous DRAM
SELF
REFRESH
REFS
REFSX
AUTO
REFRESH
POWER
DOWN
CKEL
IDLE
ACT
REFA
CKEL
CKEH
CKEH
ROW
ACTIVE
WRITEREAD
WRITE
WRITEA
WRITE
WRITEAREADA
WRITEA
PREPRE
READA
READ
READA
PRE
PRE
CHARGE
READ
READA
BURST
STOP
READ
TERM
MITSUBISHI ELECTRIC
Automatic Sequence
Command Sequence
12
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