Mitsubishi Electric Corporation Semiconductor Group BCR30AM Datasheet

MITSUBISHI SEMICONDUCTOR TRIAC
BCR30AM
MEDIUM POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
BCR30AM
T (RMS) ......................................................................30A
•I
•V
DRM ..............................................................400V/600V
FGT !, IRGT !, IRGT # ...........................................50mA
•I
OUTLINE DRAWING
15.9 MAX
4
TYPE NAME
VOLTAGE CLASS
2±0.3
1.0±0.2
24
1
3
5.45
1 2 3 4
231
5.45
4
T T GATE T
φ3.2±0.2
1
TERMINAL
2
TERMINAL
TERMINAL
2
TERMINAL
TO-3P
Dimensions
4.5±0.3
5.0
20.0±0.5
2
4
19.5 MIN
0.6±0.2
Measurement point of
case temperature
in mm
1.5±0.2
2.8±0.3
APPLICATION
Contactless AC switches, light dimmer, on/off and speed control of small induction motors, on/off control of copier lamps, microwave ovens
MAXIMUM RATINGS
Symbol
DRM
V VDSM
Symbol
I
T (RMS)
ITSM
2
t
I
PGM PG (AV) VGM IGM Tj Tstg
1. Gate open.
Parameter
Repetitive peak off-state voltage Non-repetitive peak off-state voltage
Parameter RMS on-state current Surge on-state current
2
I
t
for fusing
Peak gate power dissipation Average gate power dissipation Peak gate voltage Peak gate current Junction temperature Storage temperature Weight
1
8
1
Commercial frequency, sine full wave 360° conduction, T 60Hz sinewave 1 full cycle, peak value, non-repetitive
Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
Typical value
400 500
Voltage class
600 720
Conditions
c=75°C
12
Ratings
30
300
378
5
0.5 10
2 –40 ~ +125 –40 ~ +125
4.8
Unit
V V
Unit
A A
A
W W
V A
°C °C
g
2
s
Feb.1999
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
SUPPLY VOLTAGE TIME
TIME
TIME
MAIN CURRENT
MAIN VOLTAGE
(di/dt)c
V
D
(dv/dt)c
ELECTRICAL CHARACTERISTICS
Symbol
DRM
I VTM VFGT ! VRGT ! VRGT # IFGT ! IRGT ! IRGT # VGD Rth (j-c)
(dv/dt)c
2.Measurement using the gate trigger characteristics measurement circuit.3.The critical-rate of rise of the off-state commutating voltage is shown in the table below.4.The contact thermal resistance R
Repetitive peak off-state current On-state voltage
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage Thermal resistance
Critical-rate of rise of off-state commutating voltage
Parameter
2
2
th (b-f) in case of greasing is 0.3°C/W.
!
@
#
!
@
#
j=125°C, VDRM applied
T T
c=25°C, ITM=45A, Instantaneous measurement
T
j=25°C, VD=6V, RL=6, RG=330
j=25°C, VD=6V, RL=6, RG=330
T
j=125°C, VD=1/2VDRM
T Junction to case
Test conditions
4
MITSUBISHI SEMICONDUCTOR TRIAC
BCR30AM
MEDIUM POWER USE
Min.
— — — — — — — —
0.2 —
3
Limits
Typ.
— — — — — — — — — —
Max.
3.0
1.6
2.5
2.5
2.5
1.2
Unit
mA
V V V V
50
mA
50
mA
50
mA
V
°C/W
V/µs
Voltage
class
8
12
V
DRM
(V)
400
600
(dv/dt) c
Symbol
R
L
R
L
PERFORMANCE CURVES
MAXIMUM ON-STATE CHARACTERISTICS
3
10
7 5
3 2
2
10
7 5
3 2
1
10
7 5
ON-STATE CURRENT (A)
3 2
0
10
Min.
20
20
Unit
V/µs
TC = 25°C
Test conditions
1. Junction temperature T
j=125°C
2. Rate of decay of on-state commutat­ing current (di/dt)
c=–16A/ms
3. Peak off-state voltage V
D=400V
RATED SURGE ON-STATE CURRENT
500
400
300
200
100
SURGE ON-STATE CURRENT (A)
4.42.40.80.4 1.2 1.6 2.0 2.8 3.2 3.6 4.0
0
10023 5710
Commutating voltage and current waveforms
44
(inductive load)
1
23 5710
2
ON-STATE VOLTAGE (V)
CONDUCTION TIME
(CYCLES AT 60Hz)
Feb.1999
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