MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR20A, BCR20B, BCR20C, BCR20E
MEDIUM POWER USE
A, B, C : NON-INSULATED TYPE, E : INSULATED TYPE, GLASS PASSIVATION TYPE
BCR20A, BCR20B, BCR20C, BCR20E
•IT (RMS) ......................................................................20A
•V
DRM ..............................................................400V/500V
FGT !, IRGT !, IRGT # ...........................................30mA
•I
OUTLINE DRAWING
φ2.0 MIN
3
1
3
1
2
3
2
T
T
GATE
1
TERMINAL
2
TERMINAL
TERMINAL
17.5 MAX
BCR20A
φ8.7 MAX
φ11 MAX
1
Dimensions
3 MAX
9 MAX
2
in mm
24 MAX
APPLICATION
Contactless AC switches, light dimmer,
on/off control of traffic signals, on/off control of copier lamps, microwave ovens,
solid state relay
MAXIMUM RATINGS
Symbol
DRM
V
VDSM
Symbol
T (RMS)
I
ITSM
2
t
I
PGM
PG (AV)
VGM
IGM
Tj
Tstg
✽1. Gate open.
Parameter
Repetitive peak off-state voltage
Non-repetitive peak off-state voltage
Parameter
RMS on-state current
Surge on-state current
2
t
for fusing
I
Peak gate power dissipation
Average gate power dissipation
Peak gate voltage
Peak gate current
Junction temperature
Storage temperature
✽1
8
✽1
Commercial frequency, sine full
wave, 360° conduction
60Hz sinewave 1 full cycle, peak value, non-repetitive
Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
400
600
Voltage class
Conditions Unit
BCR20A, B, C
BCR20E
T
c=98°C
T
b=64°C
12
500
700
Ratings
20
220
203
5.0
0.5
10
2.0
–20 ~ +125
–20 ~ +125
Unit
V
V
A
A
2
A
s
W
W
V
A
°C
°C
Feb.1999
BCR20A, BCR20B, BCR20C, BCR20E
SUPPLY
VOLTAGE TIME
TIME
TIME
MAIN CURRENT
MAIN
VOLTAGE
(di/dt)c
V
D
(dv/dt)c
A, B, C : NON-INSULATED TYPE, E : INSULATED TYPE, GLASS PASSIVATION TYPE
MAXIMUM RATINGS (continue)
Symbol
V
iso
—
Weight (Typical value)
—
Soldering temperature
—
Mounting torque
Isolated voltage
Parameter
BCR20A
BCR20B
BCR20C
BCR20E
BCR20A only, 10 sec.
BCR20C only
BCR20E only, T
a=25°C, AC 1 minute, T2 terminal to base
ELECTRICAL CHARACTERISTICS
Symbol
DRM
I
VTM
VFGT !
VRGT !
VRGT #
IFGT !
IRGT !
IRGT #
VGD
Rth (j-c)
Rth (j-b)
(dv/dt)c
✽2.Measurement using the gate trigger characteristics measurement circuit.
✽3.The critical-rate of rise of the off-state commutating voltage is shown in the table below.
Repetitive peak off-state current
On-state voltage
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Thermal resistance
Critical-rate of rise of off-state
commutating voltage
Parameter
✽2
✽2
j=125°C, VDRM applied
T
c=25°C, Tb=25°C (BCR20E only), ITM=30A, Instantaneous
T
measurement
!
@
T
j=25°C, VD=6V, RL=6Ω, RG=330Ω
#
!
@
j=25°C, VD=6V, RL=6Ω, RG=330Ω
T
#
T
j=125°C, VD=1/2VDRM
Junction to case (BCR20A, BCR20B, BCR20C)
Junction to base (BCR20E)
Conditions
Test conditions
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
MEDIUM POWER USE
Unit
g
°C
kg·cm
N·m
V
Unit
mA
V
V
V
V
30
mA
30
mA
30
mA
—
—
V
°C/W
°C/W
V/µs
Min.
—
—
—
—
—
—
—
—
0.2
—
—
✽3
Ratings
Limits
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
3.5
9.0
9.0
11
230
30
2.94
1500
Max.
3.0
1.5
1.5
1.5
1.5
1.1
2.4
Voltage
class
8
10
V
400
600
DRM
(V)
Symbol
R
L
R
L
(dv/dt) c
Min.
—
10
—
10
T
j=125°C
ing current
(di/dt)
c=–10A/ms
V
D=400V
Test conditions
Unit
1. Junction temperature
2. Rate of decay of on-state commutat-
V/µs
3. Peak off-state voltage
Commutating voltage and current waveforms
(inductive load)
Feb.1999