Mitsubishi Electric Corporation Semiconductor Group BCR20E, BCR20C, BCR20B, BCR20A Datasheet

MITSUBISHI SEMICONDUCTOR TRIAC
BCR20A, BCR20B, BCR20C, BCR20E
MEDIUM POWER USE
A, B, C : NON-INSULATED TYPE, E : INSULATED TYPE, GLASS PASSIVATION TYPE
BCR20A, BCR20B, BCR20C, BCR20E
•IT (RMS) ......................................................................20A
•V
DRM ..............................................................400V/500V
FGT !, IRGT !, IRGT # ...........................................30mA
•I
OUTLINE DRAWING
φ2.0 MIN
3
1
3
1 2 3
2
T T GATE
1
TERMINAL
2
TERMINAL
TERMINAL
17.5 MAX
BCR20A
φ8.7 MAX
φ11 MAX
1
Dimensions
3 MAX
9 MAX
2
in mm
24 MAX
APPLICATION
Contactless AC switches, light dimmer, on/off control of traffic signals, on/off control of copier lamps, microwave ovens, solid state relay
MAXIMUM RATINGS
Symbol
DRM
V VDSM
Symbol
T (RMS)
I
ITSM
2
t
I
PGM PG (AV) VGM IGM Tj Tstg
1. Gate open.
Parameter
Repetitive peak off-state voltage Non-repetitive peak off-state voltage
Parameter
RMS on-state current
Surge on-state current
2
t
for fusing
I
Peak gate power dissipation Average gate power dissipation Peak gate voltage Peak gate current Junction temperature Storage temperature
1
8
1
Commercial frequency, sine full wave, 360° conduction
60Hz sinewave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
400 600
Voltage class
Conditions Unit
BCR20A, B, C BCR20E
T
c=98°C
T
b=64°C
12 500 700
Ratings
20
220
203
5.0
0.5 10
2.0
–20 ~ +125 –20 ~ +125
Unit
V V
A
A
2
A
s
W W
V A
°C °C
Feb.1999
BCR20A, BCR20B, BCR20C, BCR20E
SUPPLY VOLTAGE TIME
TIME
TIME
MAIN CURRENT
MAIN VOLTAGE
(di/dt)c
V
D
(dv/dt)c
A, B, C : NON-INSULATED TYPE, E : INSULATED TYPE, GLASS PASSIVATION TYPE
MAXIMUM RATINGS (continue)
Symbol
V
iso
Weight (Typical value)
Soldering temperature
Mounting torque
Isolated voltage
Parameter
BCR20A BCR20B BCR20C BCR20E BCR20A only, 10 sec.
BCR20C only
BCR20E only, T
a=25°C, AC 1 minute, T2 terminal to base
ELECTRICAL CHARACTERISTICS
Symbol
DRM
I
VTM
VFGT ! VRGT ! VRGT # IFGT ! IRGT ! IRGT # VGD Rth (j-c) Rth (j-b)
(dv/dt)c
2.Measurement using the gate trigger characteristics measurement circuit.3.The critical-rate of rise of the off-state commutating voltage is shown in the table below.
Repetitive peak off-state current
On-state voltage
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Thermal resistance
Critical-rate of rise of off-state commutating voltage
Parameter
2
2
j=125°C, VDRM applied
T
c=25°C, Tb=25°C (BCR20E only), ITM=30A, Instantaneous
T measurement
!
@
T
j=25°C, VD=6V, RL=6, RG=330
#
!
@
j=25°C, VD=6V, RL=6, RG=330
T
#
T
j=125°C, VD=1/2VDRM
Junction to case (BCR20A, BCR20B, BCR20C) Junction to base (BCR20E)
Conditions
Test conditions
MITSUBISHI SEMICONDUCTOR TRIAC
MEDIUM POWER USE
Unit
g
°C
kg·cm
N·m
V
Unit
mA
V
V V V
30
mA
30
mA
30
mA
V
°C/W °C/W
V/µs
Min.
— — — — — —
0.2 — —
3
Ratings
Limits
Typ.
— — — — — — — — —
3.5
9.0
9.0 11
230
30
2.94
1500
Max.
3.0
1.5
1.5
1.5
1.5
1.1
2.4
Voltage
class
8
10
V
400
600
DRM
(V)
Symbol
R
L
R
L
(dv/dt) c
Min.
10
10
T
j=125°C
ing current (di/dt)
c=–10A/ms
V
D=400V
Test conditions
Unit
1. Junction temperature
2. Rate of decay of on-state commutat-
V/µs
3. Peak off-state voltage
Commutating voltage and current waveforms
(inductive load)
Feb.1999
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