3.Standard Land Pattern Dimensions--------------------------------------
4.Component List and Standard Deliverable----------------------------------------
5.Thermal Design of Heat Sink------------------------------------------------
6.Typical RF Characteristics---------------------------------------------------6-1.Frequency vs.-----------------------------------------------------------6-2.RF Power vs.------------------------------------------------------------6-3.Drain Quiescent Current vs.---------------------------------------6-4.DC Power Supply vs.-------------------------------------------------
- AN-VHF-049-
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Application Note for Silicon RF Power Semiconductors
2/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
1.Equivalent Circuitry
- AN-VHF-049-
Application Note for Silicon RF Power Semiconductors
3/16
2.PCB Layout
12n
12n
390 p
390 p
0.1u
0.1u
5.6K
5.6K
220p
220p
6.6n
6.6n
TOP VIEW (Layer 1)
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
- AN-VHF-049-
BOARD OUTLINE: 75.0*46.0(mm)
0ohm
0ohm
330 p
56p
56p
BOTTOM VIEW (Layer 4), Perspective through Top View
8004C
330 p
3.9p
3.9p
8.2p
15p
68p
68p
68p
68p
68p
68p
8002C
56p
22p8003C
3.9p
3.9p
3.9p
3.9p
130p
5.6oh m*2
130p
1.5n
1.5n
130p
5.6oh m*2
130p
47p
Application Note for Silicon RF Power Semiconductors
4/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
Internal Layer (Layer 2) , Perspective Through Top View
- AN-VHF-049-
BOARD OUTLINE: 75.0*46.0(mm)
Internal Layer (Layer 3) , Perspective Through Top View
Application Note for Silicon RF Power Semiconductors
5/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
3.Standard Land Pattern Dimensions
=
.
a
i
D
8.3
- AN-VHF-049-
6.52.813.54.93.5
9
.
4
3.3
3.8
3.2
1.2
18.0
19.7
23.425.4
4.1
UNIT:mm
Application Note for Silicon RF Power Semiconductors
6/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
Diameter: Wire=0.2mm Inside=1.4mm
T/N of coils=2
1
YC CORPORATION Co.,Ltd.
Diameter: Wire=0.8mm Inside=2.2mm
T/N of coils=2
1
YC CORPORATION Co.,Ltd.
Diameter: Wire=0.8mm Inside=2.2mm
T/N of coils=3
1
YC CORPORATION Co.,Ltd.
- AN-VHF-049-
4.Component List
-Component List
No.DescriptionP/NQtyManufacturer
TrMOSFETRD70HUF21 Mitsubishi Electric Corporation
C1300 pF3216200V GRM31M2C2D331JY21B1 MURATA MANUFACTURING CO.
C256 pF1608 Hi-Q 50V GQM1882C1H560JB011 MURATA MANUFACTURING CO.
C356 pF1608 Hi-Q 50V GQM1882C1H560JB011 MURATA MANUFACTURING CO.
C5220 pF160850V GRM1882C1H221JA011 MURATA MANUFACTURING CO.
C6220 pF160850V GRM1882C1H221JA011 MURATA MANUFACTURING CO.
C7 1500 pF160850V GRM1882C1H152JA011 MURATA MANUFACTURING CO.
C8 1500 pF160850V GRM1882C1H152JA011 MURATA MANUFACTURING CO.
C9130 pF2012100V GRM2162C2A131JA011 MURATA MANUFACTURING CO.
C 10130 pF2012100V GRM2162C2A131JA011 MURATA MANUFACTURING CO.
C 11130 pF2012100V GRM2162C2A131JA011 MURATA MANUFACTURING CO.
C 12130 pF2012100V GRM2162C2A131JA011 MURATA MANUFACTURING CO.
C 130.1 uF160816V GRM188B11C104KA011 MURATA MANUFACTURING CO.
C 140.1 uF160816V GRM188B11C104KA011 MURATA MANUFACTURING CO.
C 1547 pF2012 Hi-Q 50V GQM2192C1H470JB011 MURATA MANUFACTURING CO.
C 1668 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 1768 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 1868 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 1968 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 2068 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 2168 pF2012 Hi-Q 50V GQM2192C1H680JB011 MURATA MANUFACTURING CO.
C 2215 pF2012 Hi-Q 100V GQM2192C2A150JB011 MURATA MANUFACTURING CO.
C 238.2 pF2012 Hi-Q 100V GQM2192C2A8R2DB011 MURATA MANUFACTURING CO.
C 2556 pF2012 Hi-Q 50V GQM2192C1H560JB011 MURATA MANUFACTURING CO.
C 2622 pF2012 Hi-Q 50V GQM2192C1H220JB011 MURATA MANUFACTURING CO.
C 273.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 283.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 293.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 303.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 313.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 323.9 pF2012 Hi-Q 100V GQM2193C2A3R9CB011 MURATA MANUFACTURING CO.
C 33330 pF3216200V GRM31M2C2D331JY21B1 MURATA MANUFACTURING CO.
C 34390 pF3216200V GRM31M2C2D391JY21B1 MURATA MANUFACTURING CO.
C 35390 pF3216200V GRM31M2C2D391JY21B1 MURATA MANUFACTURING CO.
C 36220 uF35V EEUFC1V2211 Panasonic Corporation
L112 nH1608LQG18HH12N001 MURATA MANUFACTURING CO.
L212 nH1608LQG18HH12N001 MURATA MANUFACTURING CO.
L38 nH *
L48 nH * Diameter: Wire=0.2mm Inside=1.4mm T/N of coils=21 YC CORPORATION Co.,Ltd.
L58 nH *
L612 nH *
L717 nH * Diameter: Wire=0.8mm Inside=2.2mm T/N of coils=41 YC CORPORATION Co.,Ltd.
R15.6 ohm2012RPC10T5R6J1 TAIYOSHA ELECTRIC CO.
R25.6 ohm2012RPC10T5R6J1 TAIYOSHA ELECTRIC CO.
R35.6 ohm2012RPC10T5R6J1 TAIYOSHA ELECTRIC CO.
R45.6 ohm1608RPC10T5R6J1 TAIYOSHA ELECTRIC CO.
R5 5.6k ohm1608RPC05T562J1 TAIYOSHA ELECTRIC CO.
R6 5.6k ohm1608RPC05T562J1 TAIYOSHA ELECTRIC CO.
R70 ohm1608RPC05T0R01 TAIYOSHA ELECTRIC CO.
R80 ohm1608RPC05T0R01 TAIYOSHA ELECTRIC CO.
PbPCBMS3A01941 Homebuilt
RcSMAfemale connectorPAF-S00-0022 GIGALANE Corporation
Bc1 Bias connectorred colorTM-605R3 MSK Corporation
Bc2 Bias connectorblack colorTM-605B1 MSK Corporation
PeAluminum pedestal1 Homebuilt
PdThermal Silicon CompoundG746-Shin-Etsu Chemical Co.,Ltd
SbcSupport of bias connectors2 Homebuilt
Conductiong wire4 Homebuilt
ScrewM310 ScrewM2.64 ScrewM24 * Inductor of Rolling Coil measurement condition : f=100MHz
Application Note for Silicon RF Power Semiconductors
7/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
-Standard Deliverable
TYPE1Evaluation Board assembled with all the component including the option
TYPE2PCB (raw board)
5.Thermal Design of Heat Sink
- AN-VHF-049-
M3 Screw
M3 Screw
Pb
Tr
Junction point of MOSFET chip
Pd
R
Pe
th(ch-Pe bottom)=Rth(ch-case)+Rth(case-Pe bottom)
Thermally connect
Heat Sink
Tch
Also, operating Tj(“Tj
ThereforeT
T
Pe bottom-air
*: an instance assuming high temperature of standard ambient conditions is 60 deg. C.
=(Pout/Efficiency-Pout+Pin) x R
(delta)
”)=140 (deg. C.), in case of RD series that Tch
(op)
Pe bottom-air
=“Tj
(op)
as delta temperature between Pe bottom and ambient 60 deg. C.* is
” - Tch
(delta)
- Ta
(60deg.C.)
th(ch-Pe bottom)
=(65W/55%-65W+5.5) x 0.48=28.2 (deg. C.)
=140-28.2-60=51.8 (deg. C.)
(max)
(in this package)
=0.48 (deg. C./W)
=175 (deg. C.)
In terms of long-term reliability, “Tj
” has to be kept less than 140 deg. C. i.e. T
(op)
Pe bottom-air
has
to be less than 51.8 deg. C..
The thermal resistance of the heat sink to border it:
Rth
(Pe bottom-air)=TPe bottom-air
/(Pout/Efficiency-Pout+Pin)=51.8/(65W/55%-65W+5.5)=0.88 (deg. C./W)
Therefore
it is preferable that the thermal resistance of the heat sink is much smaller than 0.88 deg. C./W.
For assembly method including relevant precaution, refer to AN-GEN-070
Application Note for Silicon RF Power Semiconductors
8/16
RD70HUF2 single-stage amplifier with f=135-to-175MHz evaluation board
- AN-VHF-049-
6.Typical RF Characteristics
6-1.Frequency vs.
OUTPUT POWER, POWER GAIN, DRAIN EFFICIENCY, DRAIN CURRENT and INPUT RETURN LOSS