MITSUBISHI AN-GEN-034-E User Manual
APPLICATION NOTE
App
Silicon RF Power Semiconductors
Document NO. AN-GEN-034-E
Date : 5
Rev. date : 22
Prepared : K.Nakamura
Confirmed : S.Kametani
(Taking charge of Silicon RF by
MIYOSHI Electronics)
SUBJECT: Recommended mounted & precaution for RD07&RD02 series with SLP package
SUMMARY:
This application note shows recommendation device mount method & precaution
for RD07&RD02 series.
1. Recommended P.C.B layout
th
Dec. 2003
th
.Jun. 2010
2. Recommended mount method
3. Pch vs. Ta at recommend device mounting
4. Junction thermal calculation
5. Recommended reflow soldering
6. Precaution
lication Note for Silicon RF Power Semiconductors
1/7
Recommended mounted & precaution for RD07&RD02 series with SLP package
App
0.8+/
05
8.0
AN-GEN-034-E
1. Recommended P.C.B layout (Power dissipation (Pd) capability is between
11~14W@Ta=25°C)
PACKAGE DIMENSIONS
6.0+/-0.15
0.2+/-0.05
4.6+/-0.05
3.3+/-0.05
1
-0.
(0.22)
4.9+/-0.15
1.0+/-0.05
INDEX
(0.25) (0.25)
2
2.0+/-0.05
3.5+/-0.05
3
(0.22)
RECOMMENDED P.C.B LAYOUT
0.9+/-0.1
Terminal
1.Drain
2.Source
3.Gate
0.2+/-0.05
4.7
0.8
Note
( ): center value
Unit: mm
2.0
3.4
0.8
0.5
0.4
60°
0.4
REGULAR TRIANGLE ARRANGEMENT
THROUGH HOLE
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Recommended mounted & precaution for RD07&RD02 series with SLP package
App
AN-GEN-034-E
2. Recommended mount method
In order to heat radiation, Mitsubishi recommends device mount like Fig.1. And this PCB has
regular triangle arrangement 13 through holes (Page2/7) at the underside of source area. And
the plating thickness of through hole is 0.05mm. Also, fix the PCB with screws
Fig.1
Drain
Source
Gate
fix with screws.
Reflow soldering
Printed Circuit board
heat sink
# Note: Mitsubishi Heat Sink size=40.0*90.0*10.0 Unit: mm
If you need to operate more high power, Mitsubishi recommends device
mount like Fig.2. (Please fix the source of device backside directly on heatsink by solder.)
Fig.2
Reflow soldering
fix with screws.
Printed Circuit board
heat sink
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