MITEL ACE9030IW, ACE9030FP2Q, ACE9030FP2N, ACE9030FP1Q, ACE9030FP1N Datasheet

...
ACE9030 is a combined radio interface circuit and twin
synthesiser, intended for use in a cellular telephone.
The radio interface section contains circuits to monitor and control levels such as transmit power in the telephone, circuits to demodulate the frequency modulated signal to audio, and a crystal oscillator with a frequency multiplier.
The Main synthesiser has normal and fractional-N modes both with optional speed-up to select the desired channel. The Auxiliary synthesiser is used for the transmit-receive offset and for modulation.
Both sections are controlled by a serial bus and have software selected power saving modes for battery economy. The circuit techniques used have been chosen to minimise external components and at the same time give very high performance.
Fig.1 Pin connections - top view
ORDERING INFORMATION
Industrial temperature range TQFP 64 lead 10 x 10 mm, 0·5 mm pitch
ACE9030M/IW/FP1N - shipped in trays and dry packed ACE9030M/IW/FP1Q - tape & reel and dry packed
TQFP 64 lead 7 x 7 mm, 0·4 mm pitch
ACE9030M/IW/FP2N - shipped in trays and dry packed ACE9030M/IW/FP2Q - tape & reel and dry packed
APPLICATIONS
AMPS and TACS Cellular Telephone
Two-way Radio Systems
RELATED PRODUCTS
ACE9030 is part of the following chipset:
ACE9020 Receiver and Transmitter Interface
ACE9040 Audio Processor
ACE9050 System Controller and Data Modem
VP64 FP64
FEATURES
Low Power Low Voltage (3·6 to 5·0 V) Operation
Serial Bus Controlled Power Down Modes
Simple Programming Format
Reference Crystal Oscillator
Frequency Multiplier for LO2 Signal
8·064 MHz Output for External Microcontroller
Main Synthesiser with Fractional-N Option
Auxiliary Synthesiser
Main Synthesiser Speed-up Options
FM Discriminator for 450 kHz or 455 kHz I.F. Signal
Radio System Control Interface
Part of the ACE Integrated Cellular Phone Chipset
TQFP 64 pin 0·4 mm and 0·5 mm pitch packages
Note: Pin 1 is identified by moulded spot and by coding orientation
DOUT5
DOUT6
DOUT7
FIAB
FIA
VDDSA
VSSSA
FIMB
FIM
VSSD
PDI
PDP
RSMA
DECOUP
RSC
VDDD
DOUT0 VDDX DOUT1 VDDA VSSA LO2 ADC1 ADC3A ADC3B ADC5 DOUT8 DAC2 DAC1 DOUT2 CIN1 CIN2
MODMP
MODMIN
TEST
PDA
VDDSUB
DOUT3 DOUT4 AMPP2 AMPN2
DAC3 AMPP1 AMPN1
AMP01 ADC2A ADC2B
ADC4
AMP02
RXCD
LATCHC
LATCHB
DATA
CL
AFCOUT
AUDIO
BP
AFCIN
IREF
VSSL
VDDL
CLK8
C8B
VDDSUB2
ACE9030
Fig. 2 ACE9030 Simplified Block Diagram
POLLING
ADC
BUS
INTERFACE
LOCK
DETECT
TWIN
SYNTHESISER
DIGITAL
OUTPUTS
CRYSTAL
MULTIPLIER
CRYSTAL
OSCILLATOR
8 MHz
PLL
TRIMMING
DACs
AFC
MIXER
AMP &
LIMITER
AUDIO
DEMOD.
+
+
L.F . AMPS
ACE9030
Radio Interface and Twin Synthesiser
Supersedes February 1997 edition, DS4288 - 1.4 DS4288 - 2.0 January 1998
2
ACE9030
Fig.3 ACE9030 Block diagram
+
+
+
+
MAIN SYNTHESISER
with FRACTIONAL-N
SERIAL BUS INPUT
REGISTERS (SYTHS)
SERIAL BUS I/O TO RADIO INTERFACE
BAND-GAP
REFERENCE
LOCK
DETECT
AUXILIARY
SYNTHESISER
REFERENCE
DIVIDER
FILTER
DEFINE
LEVELS
DATA & CONTROL
DEMOD
MIXER
TEST
SEL.
MULT x3, x5
VDDL VSSL
SWITCHES
ADC1
XO
INPUT SCANNER
8 Bit A to D Converter
DEMULTIPLEXER
REGISTERS
SELECTOR
VREF
RXCD VDDX
DOUT0 DOUT1 DOUT2 DOUT3
DOUT4 DOUT5
DOUT6
DOUT8
AUDIO
BP AFCOUT
DAC1
DAC2
VSSD
VDDD
MODMN
MODMP
PDI
PDP
RSMA
RSC
DAC3
DAC3
DAC2
DAC1
BIAS
GEN.
PDA
DOUT7
AMPO2
AMPO1
VSSL
VDDL
IREF
VSSA
VDDA
LEVEL SENSE
AMPP1
OSC8
PLL.
AMPN1
AMPP2
ADC2A
AMPN2
ADC1
ADC2B ADC3A
ADC4 ADC5
ADC3B
CRYSTAL
OSC.
AFCIN
C8B
CLK8
LO2
CIN2
CIN1
LATCHB
VDDSUB2
VDDSUB
DECOUP
VDDSA VSSSA
FIM
FIMB
CL
DATA
LATCHC
TEST
FIA
FIAB
ACE9030
3
PIN DESCRIPTIONS
The relevant supplies (VDD) and grounds (VSS) for each circuit function are listed. All VDD and VSS pins should be used.
Pin No. Name Description VDD VSS
1 AMPO2 LF amplifier 2 output. VDDA VSSA 2 RXCD Receive carrier detect (ADC1 comparator) output. VDDL VSSL 3 LATCHC Synthesiser programme enable input. VDDL VSSL 4 LATCHB Radio interface programme enable input. VDDL VSSL 5 DATA Serial data; programming input, results output. VDDL VSSL 6 CL Clock input for programming bus and for I.F. sampling. VDDL VSSL 7 AFCOUT Output from AFC amplifier after sampling. VDDL VSSL 8 AUDIO Output from f.m. discriminator after filtering. VDDA VSSA
9 BP Feedback input to audio bandpass filter. VDDA VSSA 10 AFCIN Input to AFC amplifier and f.m. discriminator. VDDL VSSL 11 IREF Bias current input for radio interface, connect setting resistor to ground. VSSA 12 VSSL Ground for radio interface logic. – 13 VDDL Power supply to radio interface logic. – 14 CLK8 Output clock at 8·064 MHz, locked to crystal. VDDL VSSL 15 C8B 8·064 MHz oscillator charge pump output and control voltage input. VDDA VSSA 16 VDDSUB2 Second connection for clean positive supply to bias substrate. VDDA VSSA 17 CIN2 Connection for crystal oscillator. VDDL VSSL 18 CIN1 Connection for crystal oscillator. VDDL VSSL 19 DOUT2 Digital control output 2. VDDL VSSL 20 DAC1 Analog control output 1. VDDA VSSA 21 DAC2 Analog control output 2. VDDA VSSA 22 DOUT8 Digital control output 8. VDDA VSSA 23 ADC5 Analog to digital converter input 5. VDDA VSSA 24 ADC3B Analog to digital converter input 3B. VDDA VSSA 25 ADC3A Analog to digital converter input 3A. VDDA VSSA 26 ADC1 Analog to digital converter input 1. VDDA VSSA 27 LO2 Output from crystal frequency multiplier. VDDA VSSA 28 VSSA Ground for radio interface analog parts. – 29 VDDA Power supply to radio interface analog parts. – 30 DOUT1 Digital control output 1. VDDX – 31 VDDX Power supply to DOUT1 and DOUT2 switches. – 32 DOUT0 Digital control output 0. VDDX – 33 VDDD Power supply to synthesisers, except input buffers and the bandgap. – 34 RSC Fractional-N compensation bias current, resistor to ground. VSSSA 35 DECOUP Bandgap reference decoupling capacitor connection. VDDSA VSSSA 36 RSMA Bias current for synthesiser charge pumps, resistor to ground. VSSSA 37 PDP Main synthesiser proportional charge pump output. VDDD VSSD 38 PDI Main synthesiser integral charge pump output. VDDD VSSD 39 VSSD Ground for synthesisers, except input buffers and the bandgap. – 40 FIM Main synthesiser positive input from prescaler. VDDSA VSSSA 41 FIMB Main synthesiser negative input from prescaler. VDDSA VSSSA 42 VSSSA Ground for FIM and FIA input buffers and the bandgap. – 43 VDDSA Power for FIM and FIA input buffers and the bandgap. – 44 FIA Auxiliary synthesiser positive input from VCO. VDDSA VSSSA 45 FIAB Auxiliary synthesiser negative input from VCO. VDDSA VSSSA 46 DOUT7 Digital control output 7. VDDD VSSD 47 DOUT6 Digital control output 6. VDDD VSSD 48 DOUT5 Digital control output 5. VDDD VSSD 49 MODMP Modulus control output to prescaler - positive sense. VDDD VSSD 50 MODMN Modulus control output to prescaler - negative sense. VDDD VSSD 51 TEST Test input and output for synthesisers. VDDD VSSD 52 PDA Auxiliary synthesiser charge pump output. VDDD VSSD 53 VDDSUB Clean positive supply to bias substrate. – 54 DOUT3 Digital control output 3. VDDL VSSL 55 DOUT4 Digital control output 4. VDDL VSSL 56 AMPP2 LF amplifier 2 positive input. VDDA VSSA 57 AMPN2 LF amplifier 2 negative input. VDDA VSSA 58 DAC3 Analog control output 3. VDDL VSSL 59 AMPP1 LF amplifier 1 positive input. VDDA VSSA 60 AMPN1 LF amplifier 1 negative input. VDDA VSSA 61 AMPO1 LF amplifier 1 output. VDDA VSSA 62 ADC2A Analog to digital converter input 2A. VDDA VSSA 63 ADC2B Analog to digital converter input 2B. VDDA VSSA 64 ADC4 Analog to digital converter input 4. VDDA VSSA
4
ACE9030
Fig.4 Typical VDD local decoupling networks without series resistors
Fig.5 Typical VDD local decoupling networks with series resistors
ABSOLUTE MAXIMUM RATINGS
Supply voltage from ground – 0·3 V to + 6·0 V (any V
DD
to any VSS) Supply voltage difference – 0·3 V to + 0·3 V (any V
DD
to any other VDD) Input voltage V
SS
– 0·3 V to VDD + 0·3 V (any input pin to its local VSS and VDD) Output voltage V
SS
– 0·3 V to VDD + 0·3 V (any output pin to its local V
SS
and VDD) Storage temperature – 55 °C to + 150 °C Operating temperature – 40 °C to + 85 °C
tions V
DDSUB
and V
DDSUB2
must be the most positive of all VDD’s at all times including during power on and off ramping. As the current taken through these V
DD
’s is significantly less than through the other VDD’s this requirement can be easily met by directly connecting all V
DD
pins to a common point on the circuit board but with the decoupling capacitors distributed to minimise cross-talk caused by common mode currents. If low value series resistors are to be included in the V
DD
connec­tions, with decoupling capacitors by the ACE9030 pins to further reduce interference, the V
DDSUB
and V
DDSUB2
pins should not have such a resistor in order to guarantee that their voltage is not slowed down at power-on. Power switches to DOUT0 and DOUT1 are supplied from V
DDX
and are specified
for a total current of up to 40 mA so any resistor in the V
DDX
connection must be very low, around 1, in order to avoid excessive voltage drop; it is recommended that this supply has no series resistor. These two methods are shown in circuit diagrams, figures 4 and 5. In both circuits the main V
DD
must
also have good decoupling.
These are not the operating conditions, but are the absolute limits which if exceeded even momentarily may cause permanent damage. To ensure sustained correct op­eration the device should be used within the limits given under Electrical Characteristics.
To avoid any possibility of latch-up the substrate connec-
Main VDD
VDDSUB VDDSUB2 VDDL VDDA VDDX VDDD VDDSA
VDDSUB VDDSUB2 VDDL VDDA VDDX VDDD VDDSA
Main VDD
No Resistor No Resistor
Very Small
ACE9030
5
Parameter Min. Typ. Max. Unit Conditions Power supply
Supply current, Radio Interface: Sleep mode 2.3 2·7 mA XO, OSC8 on Fully operating (excluding I
DDX
) 7 mA (see Note 1)
Supply current, Synthesisers: V
DD
=5V f
REF
= 10 MHz
Main and Auxiliary ON 5 mA f
MAIN
= 10 MHz
Main ON and Auxiliary in Standby 3.7 mA f
AUX
= 10 MHz Main in Standby and Auxiliary ON 3 mA (see Note 2) Main and Auxiliary in Standby, with Bandgap off 100 µA Supply current, Synthesisers: f
REF
= 15 MHz Main and Auxiliary ON 3 mA f
MAIN
= 16 MHz
Main ON and Auxiliary in Standby 2 mA f
AUX
= 90 MHz Main in Standby and Auxiliary ON 2 mA (see Note 2) Main and Auxiliary in Standby 100 µA
Input and output signals
Logic input HIGH (LATCHC, LATCHB, DATA, CL, and TEST) 0·7 x V
DD
VDD + 0·3 V Logic input LOW (LATCHC, LATCHB, DATA, CL, and TEST) – 0·3 + 0·8 V Input capacitance (signal pins) 10 pF Pin voltage Input leakage (signal pins) 1 µAVSS to V
DD
Logic output HIGH (RXCD, DATA, AFCOUT, VDD – 0·5 V TEST and DOUT2, 3 and 4) External load: Logic output LOW (RXCD, DATA, AFCOUT, 0·4 V 20 k & 30 pF TEST and DOUT2, 3 and 4) Output ON level, DOUT0 and DOUT1 V
DDX
– 0·2 V IOH = 20 mA. Output HIGH level, DOUT5, 6 and 7 2·3 2·9 V IOH = 80 µA Output LOW level, DOUT5, 6 and 7 0·3 V IOL = 0.2 µA Trimmed output level ON, DOUT8 3·35 3·55 V IOH = 135 to 400 µA. Level difference, DOUT8 ON – ADC reference – 5 + 15 mV Output level OFF, DOUT8 0.4 V MODMP, MODMN output HIGH VDD/2 + 0·35 VDD/2 + 1·0 V IOH = 10 µA MODMP, MODMN output LOW VDD/2 – 1·0 VDD/2 – 0·35 V IOL = – 10 µA Input Schmitt Hysteresis, pins CL, LATCHB, 0·3 V LATCHC, DATA. Analog circuits bias resistor on I
REF
68 k VDD @ 3·75 V
100 k V
DD
@ 4·85 V
ELECTRICAL CHARACTERISTICS
These characteristics apply over these ranges of conditions (unless otherwise stated):
T
AMB
= – 40 °C to + 85 °C, VDD = + 3·6 to + 5·0 V, GND ref. = V
SS
D.C. Characteristics
Notes
1. The sleep current is specified with the crystal oscillator (XO) and the OSC8 oscillator and PLL running as these are normally needed to provide the clock to the system controller.
2. The terms f
REF
, f
MAIN
, and f
AUX
refer to the frequencies of the Reference inputs (Crystal oscillator, pins CIN1 and CIN2), the Main synthesiser
inputs (pins FIM and FIMB) and the Auxiliary synthesiser inputs (pins FIA and FIAB) respectively.
6
ACE9030
Parameter Min. Typ. Max. Unit Conditions
Synthesiser charge pump current
Current setting resistor R
SMA
19 39 78 k Note 3
Current setting resistor R
SC
19 39 78 k Note 3
External capacitance on pin R
SMA
5 pF Ensures stable
External capacitance on pin R
SC
5 pF bias current.
Bias current I
RSMA
(nominally 1·25V / R
SMA
) 28·8 32 35·2 µAR
SMA
= 39 k
Bias current I
RSC
(nominally 1·25V / RSC) 28·8 32 35·2 µARSC = 39 k Iprop(0) scaling accuracy, pin PDP –10 +10 % @ 200 µA. Note 4 Iprop(1) scaling accuracy, pin PDP –10 +10 % @ 800 µA. Note 4 Iint scaling accuracy, pin PDI –10 +10 % @ 4 mA. Note 4 Icomp(0) scaling accuracy, pin PDP –10 +10 % @ ACC x 0·2 µA
Note 4
Icomp(1) scaling accuracy, pin PDP –10 +10 % @ ACC x 0·8 µA
Note 4
Icomp(2) scaling accuracy, pin PDI –10 +10 % @ ACC x 4 µA
Note 4 Iauxil scaling accuracy, pin PDA –5 +5 % @ 256 µA. Note 4 Auxiliary Charge Pump, –10 +10 % Note 5 Up or Down I
AUX
current variation Main Charge Pumps, –10 +10 % Note 6 Up or Down I
MAIN
or I
INTEGRAL
current variation Iprop(0) or Iprop(1) setting from PDP pin 1·0 mA Iint setting from PDI pin 5 mA Icomp(0) or Icomp(1) setting from PDP pin 12 µA Icomp(2) setting from PDI pin 180 µA Iauxil setting from PDA pin 512 µA
ELECTRICAL CHARACTERISTICS
These characteristics apply over these ranges of conditions (unless otherwise stated):
T
AMB
= – 40 °C to + 85 °C, VDD= + 3·6 to + 5·0 V, GND ref. = V
SS
D.C. Characteristics (continued)
Notes
3. The circuit is defined with resistors R
SMA
and RSC connected from pins RSMA and RSC to V
SSSA
but in most practical applications all VSS pins
will be connected to a ground plane so R
SMA
and RSC should then also be connected to this ground plane.
4. The charge pump currents are specified to this accuracy when the relevant output pin is at a potential of VDD/2 and with R
SMA
= 39 k, CN = 200, L= 1, K = 5, RSC = 19 kΩ. The nominal value is set by external resistors and by programming registers, as defined in Table 6. Tolerances in the internal Bandgap voltage and bias circuits are within the limits given for I
RSMA
and I
RSC
, the scaling accuracy of the multiplying DAC’s
is within these limits given for Iprop(0), Iprop(1), Iint, Icomp(0), Icomp(1), Icomp(2), and auxil.
5. The Auxiliary charge pump output voltage is referred to as V
PDA
and the output current I
AUX
is the Up or Down current measured when
V
PDA
= VDD/2. The conditions for the variation limits for the Up current are: either I
AUX
= 128 or 256 µA and 0 < V
PDA
< VDD – 0·5 V
or I
AUX
= 512 µA and 0 < V
PDA
< VDD – 0·65 V The conditions for the variation limits for the Down current are: either I
AUX
= 128 or 256 µA and 0·5 V < V
PDA
< V
DD
or I
AUX
= 512 µA and 0·65 V < V
PDA
< V
DD
6. The Main charge pump output voltage at pin PDP is referred to as V
PDP
and at pin PDI as V
PDI.
The output currents I
MAIN
and I
INTEGRAL
are the
up or down current Iprop(0), Iprop(1) or Iint measured when V
PDP
or V
DPI
= VDD/2.
The conditions for the variation limits for the Up current are :
I
MAIN
= 100 to 1000 µA or I
INTEGRAL
= 1 to 5 mA and 0 < V
PDP
< VDD – 0·45 V
The conditions for the variation limits for the Down current are:
I
MAIN
= 100 to 1000 µA or I
INTEGRAL
= 1 to 5 mA and 0·45 V < V
PDP
< V
DD
ACE9030
7
Parameter Min. Typ. Max. Unit Conditions CONTROL BUS
Clock rate CL input 1008 kHz Clock duty cycle CL input 40 50 60 % tDS, input data set-up time 80 ns See Fig. 7 tDH, input data hold time 80 ns See Fig. 7 t
CWL
, t
CWH
, CL input pulse width (to bus logic) 400 600 ns See Fig. 7 tCL, delay time, clock to latch 440 ns See Fig. 7 tLW, latch pulse high time 230 ns See Fig. 7 tLH, delay time, latch to clock 220 ns See Fig. 7 t
DSO
, output data set-up time 80 ns See Fig. 8
t
DHO
, output data hold time 80 ns See Fig. 8 tZS, DATA line available to ACE9030 80 1200 ns See Fig. 8 tZH, DATA line released by ACE9030 80 1200 ns See Fig. 8 t
CD
, delay from received message to 4 4 cycles See Figs. 8 and 10 transmitted response of CL Rise and Fall times, all digital inputs: 50 ns
DIGITAL OUTPUTS
DOUT0 and 1 On time to V
DD
– 0·2 V 100 µs 100 nF load and from DOUT0 and 1 Off time to > 1 M 100 µs LATCHB rising edge DOUT5, 6 and 7 rise and fall times 10 µs 30 pF load and to D.C. DOUT8 rise and fall time 10 µs specification noise
A to D CONVERTER
Lowest transition, 0000 0000 to 0000 0001 0·07 0·15 0·23 V Bandgap multiplier Highest transition, 1111 1110 to 1111 1111 3·35 3·45 3·55 V correctly trimmed ADC conversion time (20 cycles of CL) 20 µs CL = 1008 kHz Input scanning rate (CL ÷ 40) 25·2 kHz CL = 1008 kHz Integral Non-linearity – 1 + 1 LSB Differential Non-linearity – 0·8 + 0·8 LSB Power supply sensitivity 3 LSB/0.3V 0 to 10 kHz
CRYSTAL OSCILLATOR
Start-up time of crystal oscillator 5 ms Crystal effective series resistance (ESR) 25 Power dissipation in crystal 50 150 µW
D to A CONVERTERS
Full scale output level, DAC1, DAC2 & DAC3 3·35 3·45 3·55 V Bandgap multiplier Zero scale output level, DAC1 1·0 1·2 V trimmed to nominal Zero scale output level, DAC2 & DAC3 0·3 0·5 V reference voltage Integral Non-linearity – 1 + 1 LSB Differential Non-linearity – 0·5 + 0·5 LSB Output wideband and clock noise: 50 Hz to 1·1 MHz, flat integration 3 mV
rms
Power supply rejection ratio 30 dB 50 Hz to 25 kHz. Settling time to within 10% of end of step 6 µs DAC1 and DAC2 (DAC3 with external 15 k resistor) 10 pF load Output load capacitance, DAC1 and DAC2 100 nF Output load capacitance, DAC3 30 pF To guarantee stability Internal series resistor, DAC1 and DAC2 7 15 40 k DAC3 output current, sink or source 1·0 mA
ELECTRICAL CHARACTERISTICS
These characteristics apply over these ranges of conditions (unless otherwise stated):
T
AMB
= – 40 °C to + 85 °C, VDD= + 3·6 to + 5·0 V, GND ref. = V
SS
A.C. Characteristics
8
ACE9030
ELECTRICAL CHARACTERISTICS
These characteristics apply over these ranges of conditions (unless otherwise stated):
T
AMB
= – 40 °C to + 85 °C, all VDD= + 3·6 to + 5·0 V, GND ref. = V
SS
A.C. Characteristics (continued)
Note
7. AUDIO signal quality is measured with feedback components as shown in figure 18 and with 500 mV peak to peak input to AFCIN. Discriminator gain is set with D = 3 and M = 40 and VDD = 3·75 V and a crystal at 14·85 MHz. SINAD is defined as the ratio of wanted signal to all unwanted output, measured simultaneously with filters. The hum and noise figure is defined as the ratio of output power at AUDIO when AFCIN is unmodulated to the output power when AFCIN is driven as specified above.
Parameter Min. Typ. Max. Unit Conditions LOW FREQUENCY AMPLIFIERS (1 and 2)
Voltage Gain 1200 2800 Input Offset 10 20 mV Open loop input resistance 1 M Open loop output resistance 8 k Unity Gain bandwidth 2 MHz Input bias current, inverting input 200 nA Power supply rejection at 120 Hz, 10 kHz 40 50 dB Output voltage maximum V
DDA
– 0·2 V 10 k to 6ND
Output voltage maximum, as a comparator V
DDA
– 0·1 V 10 k to 6ND Output voltage minimum level 0·2 V 10 k to 6ND Output voltage minimum level 0·1 V 10 k to 6ND Common mode input range (LF1 1) V
SSA
2.5 V
Common mode input range (LF1 2) V
SSA
V
DDA
Output slew rate 0.15 0.25 V/µs Output load capacitance 30 pF
8 MHz OSCILLATOR and PLL
OSC8 centre frequency 8·064 MHz OSC8 VCO sensitivity 25
MHz/V
OSC8 charge pump output current 50 µA CLK8 output load, resistive: 15 25 100 k capacitive: 15 25 30 pF CLK8 output amplitude 0·8 1·0 2·4 V
pk-pk
CLK8 total output jitter 500 Hz 0 - 3 kHz Start-up time at power-on, to default settings 15 ms With a loop filter as
described in fig. 17 Lock time to within 125 ppm, after reprogramming set-ups 15 ms
AFCIN F.M. DISCRIMINATOR and AFC
AFCIN input signal level 0·05 2·5 V
pk-pk
AFCIN input impedance, resistive: 50 k capacitive: 10 pF Input frequency 400 500 kHz Input signal to integrated noise ratio 10 dB I.F. ± 15 kHz. Input Schmitt Hysteresis 8 mV AUDIO signal SINAD, psophometric, note 7 40 45 dB 1 kHz tone at 3 kHz AUDIO signal hum and noise, note 7 – 46 dB peak deviation on AUDIO output signal level, note 7 195 260 mV
rms
AFCIN input at I.F. AFCOUT load 30 pF AFCOUT duty cycle 37 63 % AFCOUT rise and fall times 75 ns
ACE9030
9
ELECTRICAL CHARACTERISTICS
These characteristics apply over these ranges of conditions (unless otherwise stated):
T
AMB
= – 40 °C to + 85 °C, all VDD= + 3·6 to + 5·0 V, GND ref. = V
SS
A.C. Characteristics (continued)
Note
8. To simplify single ended drive there is a resistor between FIA and FIAB and another between FIM and FIMB. In this mode the inputs should drive FIA or FIM with D.C. coupling and the other inputs FIAB and FIMB should be decoupled to ground by external capacitors.
Parameter Min. Typ. Max. Unit Conditions LO2 Multiplier
Amplitude 235 500 mV
rms
Circuit as in fig. 15, Reference frequency content of output -10.5 dBc 2nd, 4th harmonic content of output -13.5 dBc 5th harmonic of output -15 dBc 6th and higher harmonics in output -20 dBc
SYNTHESISERS Reference divider
Reference divider input frequency 5 30 MHz Drive level into CIN1 from external oscillator 400 mV
pk-pk
With crystal oscillator
powered down CIN1 input capacitance 10 pF CIN1 input resistance 10 k
Auxiliary synthesiser
FIA input frequency 10 135 MHz May be a sinewave Rise and fall times of inputs 10 ns Timing Skew between FIA and FIAB ± 2 ns See Fig. 6
or ± 10% signal Both maxima
period must be met
FIA, FIAB differential signal level with both 180 mV
pk-pk
Each input, 5 to 50 & sides driven 99 to 135 MHz
100 mV
pk-pk
Each input,
50 to 99 MHz FIA single input drive level with FIAB 360 mV
pk-pk
One input, 5 to 50 & decoupled to V
SS
99 to 135 MHz
200 mV
pk-pk
One input,
50 to 99 MHz FIA, FIAB common mode range VDD – 1·7 VDD – 0·7 V VDD = 3.6V FIA, FIAB common mode range 2.8 VDD – 0·85 V VDD = 5V FIA, FIAB input capacitance 10 pF FIA, FIAB differential input resistance 10 k Note 8 Auxiliary Synthesiser comparison frequency 2 MHz
Main Synthesiser
FIM input frequency 4 20 MHz Rise and fall times of inputs 50 ns FIM - FIMB Timing Skew ± 2 ns See Fig. 6
or ± 10% signal Both maxima
period must be met
FIM, FIMB differential signal level 100 mV
pk-pk
Each input, with both sides driven. 4 to 20 MHz FIM single input drive level 200 1000 mV
pk-pk
One input, with FIMB decoupled to V
SS
4 to 20 MHz FIM, FIMB common mode range VDD – 1·7 VDD – 0·7 V VDD =3.6V FIM, FIMB common mode range 2·8 VDD – 0·85 V VDD =5V FIM, FIMB input capacitance 10 pF FIM, FIMB differential input resistance 10 k Note 8 Delay FIM rising to MODMP/MODMN changing 30 ns Main Synthesiser comparison frequency 2 MHz
10
ACE9030
Fig. 6 Synthesiser Inputs
Fig. 7 Control Bus input timing
Fig. 8 Control Bus output timing
TIMING WAVEFORMS
SIGNAL PERIOD
PEAK to PEAK
AMPLITUDE
FIM or FIA
FIMB or FIAB
TIMING SKEW
DATA D2
D1 D0
CL
LATCHB or LATCHC
t
DS
t
DH
t
LW
t
CL
t
LH
t
CWL
t
CWH
t
DHO
t
ZH
t
CD
t
DSO
1
234
5
6
7
28 29
MSB
LSB
OUTPUT FROM ACE9030
t
ZS
DATA UNDEFINED
INTO ACE9030
DATA
D0
DATA OUTPUT DRIVE FROM ACE9030
CL
LATCHB
ACE9030
11
FUNCTIONAL DESCRIPTION - CONTROL BUS
The functions of the ACE9030 fall into two separate
groups, the Radio Interface and the Synthesisers.
The common control bus splits the input strings differ­ently for these two sections so this bus operation is described first as an introduction to the available features.
All functions are controlled by a serial bus; DATA is a bi­directional data line, to input all control data and to output the results of measurements in the Radio Interface section, CL is the clock, and LATCHB and LATCHC are the latch signals at the end of each control word for either the Radio Interface or the Synthesiser section respectively.
CL is a continuously running clock at typically 1·008 MHz, and all incoming and output data are latched on rising edges of this clock. The controller should clock data in and out on falling clock edges. For bus control purposes the frequency of
CL may be widely varied and this clock does not need to be continuous, however, the sampled I.F. signal AFCOUT, the Polling ADC, and the Lock Detect Filter also use CL as the sampling clock. In systems where any of these are required the clock CL is constrained to be 1·008 MHz and to be continuous.
To ensure clean initialisation the clock CL should give at least 8 cycles before the power-up command and similarly to set the control logic to known states there should be 8 cycles of CL after a power-down command.
During normal operation there should be at least 30 cycles of CL between latch pulses, 24 for the data bits (see figures 9,10 & 11) plus 6 extra. This minimum becomes 36 cycles if the extended synthesiser programming command (A2) is used.
Radio Interface Bus - Receive
Fig.9 Radio Interface receive bus timing
The received data is split into three bytes, where DATA1 normally contains a value to be loaded into a destination set by DATA2 and DATA3. When a command does not need to put any information into byte DATA1 a preamble xx1010xx is recommended to fill this byte. It is possible to set-up several features in one bus operation and to allow this the decoding only acts on single or selected bits; the others are given as “x” in the block descriptions. Two bits of DATA2 also set the type of command, with four options:
DATA2 DATA2 Type of Comment
bit 7 bit 6 Command
0 0 SLEEP No reply 0 1 NORMAL Send requested data 1 0 SET-UP No reply 1 1 TEST No reply
and the CLK8 output driver will be active, and are used to clock the microcontroller. To reduce the supply current to its mini­mum in Sleep the synthesisers must also be powered down, by a Word D message with DA and DM both set HIGH as described under Synthesiser Bus - Receive Only. During Sleep all set-up values are retained unless changed by a Set­up command. The exit from Sleep is by any Normal command.
Normal commands will end Sleep mode but are primarily used to change the operating mode of the cellular terminal or to request ADC data. The ACE9030 will output data onto the serial bus after a Normal command.
Set-up commands are used to adjust various operating parameters but can also initiate a logic restart if DATA3 bits 1 and 0 are both “1” so for routine changes of set-ups these bits should always be 00.
Test mode is included only for use during chip manufac­ture.
Sleep mode is selected to put the cellular terminal into a very low power state for when it is “Off” and neither waiting for, nor setting up a call. In Sleep only the crystal and 8·064 MHz oscillators, DAC1 and DAC2, the OSC8 phase locked loop,
The Sleep Command - DATA2 bits 7, 6 = 00
DATA1 DATA2 DATA3
xx1010xx 00xxxxxx xxxxxxxx
CL
DATA
LATCHB
DATA1 DATA2 DATA3
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
12
ACE9030
Summary of Normal Commands - DATA2 bits 7, 6 = 01
Normal commands are always a request for data; the ADC registers to be read are defined by Y1 and Y0 in DATA3. A normal
command will also end Sleep mode.
BIT EFFECT when at 0 EFFECT when at 1
DATA2:
7 With DATA2:6 defines command type ­6 - With DATA2:7 defines command type 5 Discriminator powered down Discriminator active. 4 - Load Lock threshold register from DATA1:7-1 3 DAC3 powered down DAC3 active 2 - Load DOUT7-0 from DATA1:7-0 1 - Load DAC3 from DATA1:7-0 0 Not used Not used
DATA3:
7 Not used Not used 6 LO2 multiplier powered down LO2 multiplier active 5 Set DOUT8 to OFF Set DOUT8 to ON, to output the ADC reference voltage 4 - Load ADC1 comparator from DATA1:7-0 3 - Load DAC1 from DATA1:7-0 2 - Load DAC2 from DATA1:7-0 1 Y1 Decode with DATA3:0 for Polling ADC register read 0 Y0 Decode with DATA3:1 for Polling ADC register read
BIT EFFECT when at 0 EFFECT when at 1
DATA2:
7 - With DATA2:6 defines command type 6 With DATA2:7 defines command type ­5 Not used Not used 4 - Set OSC8 VCO range from DATA1:5-0 3 - Set OSC8 VCO offset from DATA1:5-0 2 Select input A for ADC3 Select input B for ADC3 1 Select input A for ADC2 Select input B for ADC2 0 OSC8 off OSC8 on
DATA3:
7 Crystal oscillator off Crystal oscillator on 6 Bandgap off - use external reference Bandgap on 5 - Set discriminator divisors from DATA1:7,6
and lock detect period from DATA1:5
and OSC8 divisors from DATA1:2-0 4 - Set bandgap trim from DATA1:7-0 3 Not used Not used 2 Not used Not used 1 - Do a restart if both DATA3 bits 1 and 0 are at 1 0 - Do a restart if both DATA3 bits 1 and 0 are at 1
Summary of Set-up Commands - DATA2 bits 7, 6 = 10
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