Microsemi Corporation SG1626J, SG1626J-883B, SG1626J-DESC, SG1626L-883B, SG1626R Datasheet

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SG1626/SG2626/SG3626
DUAL HIGH SPEED DRIVER
DESCRIPTION
The SG1626, 2626, 3626 is a dual inverting monolithic high speed driver that is pin for pin compatible with the DS0026, TSC426 and ICL7667. This device utilizes high voltage Schottky logic to convert TTL signals to high speed outputs up to 18V. The totem pole outputs have 3A peak current capability, which en­ables them to drive 1000pF loads in typically less than 25ns. These speeds make it ideal for driving power MOSFETs and other large capacitive loads requiring high speed switching.
In addition to the standard packages, Silicon General offers the 16 pin S.O.I.C. (DW-package) for commercial and industrial applications, and the Hermetic TO-66 (R-package) for military use. These packages offer improved thermal performance for applications requiring high frequencies and/or high peak cur­rents.
EQUIVALENT CIRCUIT SCHEMATIC
••
Pin for pin compatible with DS0026, TSC426 and
••
ICL7667.
••
Totem pole outputs with 3.0A peak current capability.
••
••
Supply voltage to 22V.
••
••
Rise and fall times less than 25ns.
••
••
Propagation delays less than 20ns.
••
••
Inverting high-speed high-voltage Schottky logic.
••
••
Efficient operation at high frequency.
••
••
Available in:
••
8 Pin Plastic and Ceramic DIP 14 Pin Ceramic DIP 16 Pin Plastic S.O.I.C. 20 Pin LCC TO-99 TO-66
HIGH RELIABILITY FEATURES - SG1626
♦♦
Available to MIL-STD-883
♦♦ ♦♦
Radiation data available
♦♦ ♦♦
LMI level"S" processing available
♦♦
V
CC
6.5V V
REG
2.5K
INV. INPUT
3K
OUTPUT
GND
9/91 Rev 1.1 2/94 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
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SG1626/SG2626/SG3626
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage (VCC) ...........................................................
Logic Input Voltage ...............................................................
Source/Sink Output Current (Each Output)
Continuous ...................................................................
Pulse, 500ns ................................................................
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the specified terminal.
THERMAL DATA
J Package:
Thermal Resistance­Thermal Resistance-
Y Package:
Thermal Resistance­Thermal Resistance-
M Package:
Thermal Resistance­Thermal Resistance-
DW Package:
Thermal Resistance­Thermal Resistance-
T Package:
Thermal Resistance­Thermal Resistance-
Junction to Case, θ Junction to Ambient, θ
Junction to Case, θ Junction to Ambient, θ
Junction to Case, θ Junction to Ambient, θ
Junction to Case, θ Junction to Ambient, θ
Junction to Case, θ Junction to Ambient, θ
JC
JC
JC
JC
JC
.................. 30°C/W
.............. 80°C/W
JA
.................. 50°C/W
............ 130°C/W
JA
.................. 60°C/W
............. 95°C/W
JA
.................. 40°C/W
.............. 95°C/W
JA
.................. 25°C/W
........... 130°C/W
JA
22V
7V
±0.5A ±3.0A
Operating Junction Temperature
Hermetic (J, T, Y, R-Packages) ...................................
Plastic (M, DW, L-Packages) .......................................
Storage Temperature Range ............................
-65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ...................
R Package:
Thermal Resistance­Thermal Resistance-
L Package:
Thermal Resistance­Thermal Resistance-
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA). Note B. The above numbers for
Junction to Case, θ Junction to Ambient, θ
Junction to Case, θ Junction to Ambient, θ
................. 5.0°C/W
JC
............. 40°C/W
JA
.................. 35°C/W
JC
........... 120°C/W
JA
θJC are maximums for the limiting
thermal resistance of the package in a standard mount­ing configuration. The θ guidelines for the thermal performance of the device/pc-
numbers are meant to be
JA
board system. All of the above assume no ambient airflow.
150°C 150°C
300°C
RECOMMENDED OPERATING CONDITIONS (Note 2)
Supply Voltage (VCC) ..................................
Frequency Range ...............................................
4.5V to 20V (Note 3) DC to 1.5MHz
Peak Pulse Current ............................................................
Logic Input Voltage ................................................
Note 2. Range over which the device is functional. Note 3. AC performance has been optimized for V
-0.5 to 5.5V
= 8V to 20V.
CC
±3A
Operating Ambient Temperature Range (T
SG1626 .........................................................
)
J
SG2626 ...........................................................
SG3626 ..............................................................
-55°C to 125°C
-25°C to 85°C 0°C to 70°C
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55°C TA 125 °C, SG2626 with ­25°C ≤ T temperatures equal to the ambient temperature.)
Note 4. VCC = 10V to 20V.
85°C, SG3626 with 0°C ≤ TA 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
A
Static Characteristics
Logic 1 Input Voltage Logic 0 Input Voltage Input High Current Input High Current Input Low Current Input Clamp Voltage Output High Voltage
(Note 4)
Output Low Voltage (Note 4) Supply Current Outputs Low Supply Current Outputs High
VIN = 2.4V V
= 5.5V
IN
= 0V
V
IN
I
= -10mA
IN
= -200mA
I
OUT
I
= 200mA
OUT
V
= 2.4V (both inputs)
IN
= 0V (both inputs)
V
IN
Test ConditionsParameter
SG1626/2626/3626
Min. Typ. Max.
2.0
0.7
500
1.0
-4
-1.5
-3
V
CC
1.0
18
27
7.5
12
Units
V V
µA mA mA
V V
V mA mA
9/91 Rev 1.1 2/94 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
2 (714) 898-8121
∞ ∞
Garden Grove, CA 92841
∞ ∞
∞∞
FAX: (714) 893-2570
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ELECTRICAL CHARACTERISTICS (continued)
SG1626/SG2626/SG3626
SG1626/2626/3626
°°
TA= 25
°C
Test Conditions (Figure 1)Parameter
°°
TA=-55
SG1626
°°
°C to 125
°°
°°
°C
°°
Units
Min. Typ. Max.Min. Typ. Max.
Dynamic Characteristics (Note 6)
Propagation Delay High-Low
(TPHL)
Propagation Delay Low-High
(TPLH)
Rise Time (TTLH) Fall Time (TTHL) Supply Current (I
(both outputs)
Note 5. These parameters, specified at 1000pF, although guaranteed over recommended operating conditions, are not 100% tested in produc-
tion.
Note 6. V
= 15V.
CC
)
CC
CL = 1000pF (Note 5) CL = 2500pF
= 1000pF (Note 5)
C
L
CL = 2500pF
= 1000pF (Note 5)
C
L
CL = 2500pF C
= 1000pF (Note 5)
L
CL = 2500pF C
= 2500pF, Freq. = 200KHz
L
Duty Cycle = 50%
17 25 30 30 30
18 25 25 35 30 40 20 40
35
30 40 40 50 35 50 30 50
40
ns
ns
ns
ns
ns
ns
ns
ns
mA
AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS - FIGURE 1
CHARACTERISTIC CURVES
SG1626
FIGURE 2. TRANSITION TIMES VS. SUPPLY VOLTAGE
9/91 Rev 1.1 2/94 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
FIGURE 3. PROPAGATION DELAY VS. SUPPLY VOLTAGE
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FIGURE 4. TRANSITION TIMES VS. AMBIENT TEMPERATURE
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