Microsemi Corporation MXP1126-C Datasheet
2830 S. Fairview St.
Santa Ana, CA 92704
PH: 714.979.8220
FAX: 714.557.5989
Photo Transistor Chip
Features
•Light Activated Photo Transistor Chip
•Planar NPN
•Aluminum Wire bondable
•Backside Metallization - Gold
•Die Attach methods: Eutectic or Epoxy
Electrical Characteristics @ 25oC
MXP1126-C
LOBMYSLOBMYS
LOBMYSLOBMYSCITSIRETCARAHCCITSIRETCARAHC
LOBMYS
VB
OEC
VB
OBE
VB
OBC
DItnerruCrotcelloCV
h
EF
ateBV
CITSIRETCARAHCCITSIRETCARAHCSNOITIDNOCSNOITIDNOC
CITSIRETCARAHC
egatloVrettimE-rotcelloCI
egatloVesaB-rettimEI
egatloVesaB-rotcelloCI
001=µA005stloV
C
001=µA02stloV
E
001=µA005stloV
C
EC
EC
stloV01=03spmAn
I,stloV5=
Am1=52
C
SNOITIDNOCSNOITIDNOCNIMNIM
SNOITIDNOC
NIMNIMPYTPYT
NIM
PYTPYTXAMXAM
PYT
XAMXAMSTINUSTINU
XAM
STINUSTINU
STINU
Data Sheet # MSC1341.PDF
Updated:October 1998
Opto
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