Microsemi Corporation LX5204CPWP, LX5204CDP Datasheet
LIN DOC #:
5204
LX5204
9-LINE HOT SWA P, µPOWER SCSI TERMINATOR
THE INFINITE POWER OF INNOVATION
DESCRIPTION KEY FEATURES
The LX5204 is a nine-line active terminator
for the SCSI parallel bus. This SCSI standard
recommends active termination at both
ends of the SCSI bus. The LX5204 has the
added features of hot swappability, fully
complying with the SCSI hot swap specification.
During disconnect mode, the LX5204 requires a meager 60µA of supply current while
offering only 3.5pF of output capacitance.
To enter this low-power mode, the disconnect pin can be left open (floating) or driven
high, thereby disconnecting the terminating
resistors and placing the internal low dropout
regulator into low-power mode. In disconnect mode, each termination line presents
a high impedance to the SCSI bus with the
overall effect being to preserve high-signal
integrity and yield subsequent reliable, errorfree communications.
IMPORTANT: For the most current data, consult LinFinity's web site: http://www.linfinity.com.
During normal operation, the LX5204
consumes only 600µA of current, which is
the lowest enabled supply current of any
terminator available on the market today.
Linfinity's proprietary BiCMOS low dropout
regulator architecture enables this unique
and very efficient operating characteristic.
The LX5204 also offers a precisely
trimmed channel output current specified
to a 5% tolerance. The maximum value
of the output current is trimmed as closely
as possible to the SCSI standard maximum
specification to give the highest possible
noise margin for fast SCSI operation. And
the LX5204 sinks up to 150mA of current,
making it compatible with today's fast
active negation drivers.
The LX5204 is a superior, pin-for-pin
replacement for a variety of industry products such as the UC5603 and UC5613.
P RODUCTION DATA SHEET
■ 3.5pF OUTPUT CAPACITANCE DURING
DISCONNECT
■ HOT SWAP COMPATIBLE
■ 60µA SUPPLY CURRENT IN DISCON-
NECT MODE
■ 600µA SUPPLY CURRENT DURING
NORMAL OPERATION
■ 150mA SINK CURRENT FOR ACTIVE
NEGATION
■ LOGIC COMMAND DISCONNECTS ALL
TERMINATION LINES
■ CURRENT LIMIT AND THERMAL
PROTECTION
■ COMPATIBLE WITH SCSI 1, 2 AND 3
STANDARDS
■ CONSULT FACTORY FOR APPLICATION
TEST REPORT: 5204TR
PRODUCT HIGHLIGHT
RECEIVING WAVEFORM - 10MHZ DRIVING WAVEFORM - 10MHZ
Receiver
1 Meter, AWG 28
LX5204 LX5204
LX5268 LX5268
PACKAGE ORDER INFORMATION
TA (°C)
0 to 70 LX5204CPWP LX5204CDP
Note: All surface-mount packages are available in Tape & Reel.
Append the letter "T" to part number. (i.e. LX5204CDPT)
Plastic TSSOP
PWP
24-pin, Power
Driver
Plastic SOIC
DP
16-pin, Power
NOTE:
For An In-Depth
Discussion On Applying
SCSI, Request Linfinity
Application Note:
"Understanding The
Single-Ended SCSI Bus"
Copyright © 1997
Rev. 1.1 12/96
L INFINITY MICROELECTRONICS INC.
11861 WESTERN AVENUE, GARDEN GROVE, CA. 92841, 714-898-8121, FAX: 714-893-2570
1
LX5204
PRODUCT DATABOOK 1996/1997
9-LINE HOT SWA P, µPOWER SCSI TERMINATOR
RODUCTION DATA SHEET
P
ABSOLUTE MAXIMUM RATINGS (Note 1)
TermPwr Voltage ......................................................................................................... +7V
Signal Line Voltage ............................................................................................ 0V to +7V
Regulator Output Current ........................................................................................... 0.4A
Operating Junction Temperature
Plastic (PWP, DP Packages) ................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
THERMAL DATA
PWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθ
θ
θθ
JL
θθ
θ
θθ
JA
DP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Junction Temperature Calculation: TJ = TA + (P
numbers are guidelines for the thermal performance of the device/pc-board system.
The θ
JA
All of the above assume no ambient airflow.
θ
D
θθ
θθ
JL
x θ
θθ
θ
θθ
JA
).
JA
27°C/W
60°C/W
20°C/W
45°C/W
PACKAGE PIN OUTS
1 24
T7
223
T8
322
T9
421
520
619
718
817
916
10 15
11 14
T1
12 13
T2
PWP PACKAGE
T7
T8
T9
N.C.
{
GND
T1
T2
DP PACKAGE
Heatsink
DISCONNECT
Heatsink
DISCONNECT
N.C.
GND
N.C.
N.C.
N.C.
N.C.
(Top View)
1 16
215
314
413
512
611
710
89
(Top View)
T6
T5
REG OUT
N.C.
N.C.
N.C.
N.C.
N.C.
N.C.
V
T4
T3
T6
T5
REG OUT
N.C.
N.C.
V
TERM
T4
T3
TERM
Heatsink
Heatsink
POWER UP / POWER DOWN FUNCTION TABLE
Disconnect Outputs
L Enabled 600µA
H HI Z 60µA
Open HI Z 60µA
Quiescent
Current
2
Copyright © 1996
Rev. 1.1 12/96
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