M A COM MA4M3150, MA4M3100, MA4M3050, MA4M3030, MA4M3020 Datasheet

MA4M Series

MNS Microwave

Chip Capacitors

Features

Case Style

∙Excellent Repeatability (Wafer-to-Wafer and Lot-to-Lot)

∙Small Size

∙Low Loss, High Q

∙Available with Round or Square Bonding Pads

Description
M/A-COM’s MA4M series of MNS (metal-nitride-silicon) sili-
con chip capacitors is designed specifically for high reliability and
repeatable performance in microwave circuit applications. These
capacitors are made using a low pressure chemical vapor deposi-
tion (LPCVD) that results in dense, uniform nitride layers. These
capacitors exhibit higher capacitance per unit area (resulting in
smaller chip size) than similar MOS, MIS and ceramic capacitors.
Evaporated gold contacts are used to provide an easily bondable
metal pad on the capacitor chip. M/A-COM MNS capacitors have
shown no measurable capacitance change when subjected to the
rated standoff voltage of 150ºC.		350
The MA4M series of chip capacitors is an excellent choice for use
in hybrid microwave circuits up through Ku-band, where low
loss, high reliability, small size and temperature stability are
prime concerns.
These chip capacitors are suited for applications requiring DC
blocks, coupling capacitors, bypass capacitors, capacitive loads
and tuning elements in oscillators, multipliers and filters.

Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors

Characteristics Compared	MNS	Ceramic
Operating Temperature Range	-55 to +200°C	-55 to +125°C
Temperature Coefficient	180 PPM	1000 PPM
Insertion Loss of a 20 pF Capacitor in a 50 Ω line at 15 GHz	0.1 dB	0.2 dB
Chip Size
200 pF, 100V	40 x 40 mils	70 x 70 mils
20 pF, 100V	22 x 22 mils	50 x 50 mils

V3.00

M/A-COM Division of AMP Incorporated ■ North America: Tel. [phone], Fax [phone] ■ Asia/Pacific: Tel.[phone], Fax [phone] ■ Europe: Tel. [phone], Fax[phone]

www.macom.com	AMP and Connecting at a Higher Level are trademarks.
	Specifications subject to change without notice.

MNS Microwave Chip Capacitors	MA4M Series

Specifications

Chip Capacitors with Round Bonding Pads

		Maximum		Nominal
		Standoff		Top
	Capactance	Voltage		Contact
Model	(pF) 1,2,3,4	Rating2,5	Chip	Diameter
Number	± 10 %	(Volts)	Style	(mils)
MA4M2002	2	200	132	3.5
MA4M2005	5	200	132	6.0
MA4M1010	10	100	132	6.0
MA4M1020	20	100	132	9.0
MA4M2020	20	200	132	11.5
MA4M1030	30	100	132	11.0
MA4M1050	50	100	132	14.0
MA4M1080	80	100	199	18.0
MA4M1100	100	100	199	20.0
MA4M2100	100	200	200	26.0
MA4M1200	200	100	200	28.0
MA4M1250	250	100	200	32.0
MA4M1300	300	100	201	35.0
MA4M2300	300	200	263	45.0
MA4M1600	600	100	263	48.0

Chip Capacitors with Square Bonding Pads

			Maximum
			Standoff
	Capactance		Voltage
Model	(pF)	1,2,3,4	Rating2,5	Chip
			(Volts)
Number	± 10 %			Style
MA4M3010	10		200	350
MA4M3020	20		200	351
MA4M3030	30		200	352
MA4M3050	50		200	354
MA4M3100	100		50	358
MA4M3150	150		50	359

Notes:

15% capacitance tolerance is available on request.

2Other capacitance and standoff voltage values are available on request.

3Capacitance is measured at 1 MHz.

4Temperature coefficient of capacitance is nominally 180 PPM/°C.

5Device failure may occur if standoff voltage ratio is exceeded.

Maximum Ratings

Applied Voltage	Specified standoff voltage
Operating Temperature	-55°C to +200°C
Storage Temperature	-55°C to +200°C

TYPICAL CAPACITANCE CHANGE FOR MNS and CERAMIC CAPACITOR vs TEMPERATURE

(200 pF CAPACITOR)

+10

%

+8 CAPACITANCE CHANGE

+6

+4

TEMPERATURE qC

-75	-25	0		25		50	125				150		200
		-4
										M/A-COM MA4M1200
										CAPACITOR
		-6
		-8
		-10
										CERAMIC
										CAPACITOR

V3.00

M/A-COM Division of AMP Incorporated ■ North America: Tel. [phone], Fax [phone] ■ Asia/Pacific: Tel.[phone], Fax [phone] ■ Europe: Tel. [phone], Fax[phone]

www.macom.com	AMP and Connecting at a Higher Level are trademarks.
	Specifications subject to change without notice.