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Datasheet TLE 6236 G
Smart Octal Low-Side Switch
Features Product Summary
• Short Circuit Protection
• Overtemperature Protection
• Overvoltage Protection
• 8 bit Serial Data Input and Diagnostic
Output (acc. SPI protocol)
• Direct Parallel Control of Four Channels for PWM Applications
Supply voltage V
Drain source clamping voltage V
On resistance R
Output current (all outp.ON equal) I
(individually) 500 mA
• General Fault Flag
• Daisy chainable with other SPI devices
• Very Low Leakage Current (≤ 1µA)
• Compatible with 3V Micro Controllers
• Electostatic Discharge (ESD) Protection
Application
• µC Compatible Power Switch for 12V and 24VApplications
• Switch for Automotive and Industrial System
• Solenoids, Relays, Resistive Loads, LEDs
• Robotic Controls
General description
Octal Low-Side Switch in Smart Power Technology (SPT) with a Serial
Peripheral Interface (SPI) and eight open drain DMOS output stages. The TLE 6236 G is protected by
embedded protection functions and designed for automotive and industrial applications. The output
stages are controlled via an SPI Interface. Additionally four channels can be controlled direct in parallel
for PWM applications. The open load detection (pull down sources) can be disabled via the OL/PRG
pin. Then the leakage current is reduced to 1µA (max.) to avoid e.g. the glowing of LEDs in off state.
Therefore the TLE 6236 G is particularly suitable for body control units, dash board illumination or engine management systems.
4.5 – 5.5 V
S
DS(AZ)max
ON
D(NOM)
P-DSO 28
Ordering Code:
Q67007-A9413-A705
60 V
1.7 Ω
200 mA
Block Diagram
OL/PRG
GND
IN1
IN2
IN3
IN4
SCLK
SI
CS
SO
as Ch. 1
as Ch. 1
as Ch. 1
Serial Interface
RESET FAULT
VS
LOGIC
8
8
SPI
1
4
Output Control
Buffer
GND
Protection
Functions
Output Stage
8
OL/PRG
V
BB
OUT1
OUT8
V2.1 Page 26.Aug. 2002
1
Datasheet TLE 6236 G
Detailed Block Diagram
IN1
GND
OL/PRG
≥1
FAULTRESET
VS
Channel 1
Open load/SCG
SCB/Overload
Output Stage
OUT1
IN2
IN3
IN4
SO
SI
SCLK
CS
SPI
Interface
16 bit
≥1
≥1
≥1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Channel 8
GND
OL/PRG
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
V2.1 Page 26.Aug. 2002
2
Pin Description
Pin Configuration (Top view)
Pin Symbol Function
1 GND Ground
2 NC not connected
3 OUT1 Power Output Channel 1
4 OUT2 Power Output Channel 2
5 IN1 Input Channel 1
6 IN2 Input Channel 2
7 VS Supply Voltage
8 OL/PRG Open load actice/inactive Program Pin
9 IN3 Input Channel 3
10 IN4 Input Channel 4
11 OUT3 Power Output Channel 3
12 OUT4 Power Output Channel 4
13 NC not connected
14 GND Ground
15 GND Ground
16 NC not connected
17 OUT5 Power Output Channel 5
18 OUT6 Power Output Channel 6
19
20
CS
FAULT
Chip Select
General Fault Flag
21 SO Serial Data Output
22 SCLK Serial Clock
23 SI Serial Data Input
24
RESET
Reset
25 OUT7 Power Output Channel 7
26 OUT8 Power Output Channel 8
27 NC not connected
28 GND Ground
Datasheet TLE 6236 G
GND 1• 28 GND
NC 2 27 NC
OUT1 3 26 OUT8
OUT2 4 25 OUT7
IN1 5 24
IN2 6 23 SI
VS 7 22 SCLK
OL/PRG
821SO
IN3 9 20
IN4 10 19
OUT3 11 18 OUT6
OUT4 12 17 OUT5
NC 13 16 NC
GND 14 15 GND
P-DSO 28
RESET
FAULT
CS
V2.1 Page 26.Aug. 2002
3
Datasheet TLE 6236 G
Maximum Ratings for Tj = – 40°C to 150°C
Parameter Symbol Values Unit
Supply Voltage V
Continuous Drain Source Voltage (OUT1...OUT8) V
Input Voltage, All Inputs and Data Lines V
Operating Temperature Range
Storage Temperature Range
Output Current per Channel (see el. characteristics) I
Output Current per Channel @ TA = 25°C
1
(All 8 Channels ON; Mounted on PCB )
)
Output Clamping Energy
I
= 0.25 A
D
Power Dissipation (mounted on PCB) @ TA = 25°C P
Electrostatic Discharge Voltage (Human Body Model)
S
DS
IN
T
j
T
stg
D(lim)
I
D
E
V
AS
tot
ESD
according to MIL STD 883D, method 3015.7 and EOS/ESD
assn. standard S5.1 - 1993
DIN Humidity Category, DIN 40 040 E
IEC Climatic Category, DIN IEC 68-1 40/150/56
Thermal Resistance
junction - pin
junction - ambient @ min. footprint
R
thJP
R
thJA
-0.3 ... +7 V
45 V
- 0.3 ... + 7 V
- 40 ... + 150
°C
- 55 ... + 150
I
D(lim) min
A
250 mA
10 mJ
2W
2000 V
25
K/W
80
1
)
Output current rating so long as maximum junction temperature is not exceeded. At T
rent has to be calculated using R
V2.1 Page 26.Aug. 2002
according mounting conditions.
thJA
4
= 125 °C the output cur-
A
Datasheet TLE 6236 G
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
VS = 4.5 to 5.5 V ; Tj = - 40 °C to + 150 °C ; Reset = H
(unless otherwise specified)
1. Power Supply
min typ max
Supply Voltage
Supply Current I
Supply Current (in Standby Mode, RESET = L)
1)
2. Power Outputs
ON Resistance VS = 5 V; ID = 500 mA TJ = 25°C
T
= 150°C
J
Output Clamping Voltage Output OFF V
Current Limit I
Output Leakage Current V
Reset
= L
2)
Turn-On Time ID = 0.25 A, resistive load t
Turn-Off Time ID = 0.25 A, resistive load t
3. Digital Inputs
Input Low Voltage V
Input High Voltage V
Input Voltage Hysteresis V
Input Pull Down Current (IN1 ... IN4) I
OL/PRG, Reset Pull Up Current I
Input Pull Down Current (SI, SCLK) I
Input Pull Up Current ( CS ) I
V
S
S
I
S(Stdby)
R
DS(ON)
DS(AZ)
D(lim)
I
D(lkg)
ON
OFF
INL
INH
INHys
IN(1..4)
IN(OL/PRG,Res)
IN(SI,SCLK)
IN(CS)
4.5 -- 5.5
V
-- 1.5 3 mA
-- 50 µA
--
--
1.7
3
--
Ω
4
45 -- 60 V
500 750 1000 mA
-- -- 1 µA
-- 6 10 µs
-- 6 10 µs
- 0.3 -- 1.0 V
2.0 -- -- V
100 200 -- mV
20 50 100 µA
20 50 100 µA
10 20 50 µA
10 20 50 µA
4. Digital Outputs (SO,
FAULT
SO High State Output Voltage I
SO Low State Output Voltage I
)
= 2 mA V
SOH
= 2 mA V
SOL
SO Output Tri-state Leakage Current CS=H, 0 ≤ VSO ≤ VSI
FAULT Output Low Voltage I
= 1.6 mA V
FAULT
5. Diagnostic Functions
Open Load Detection Voltage V
Output Pull Down Current I
Fault Delay Time t
Overload Threshold Current I
Overtemperature Shutdown Threshold
Hysteresis
1
Test conditions : No floating digital Inputs
2
Measured on wafer level
SOH
SOL
SOlkg
FAULTL
DS(OL)
PD(OL)
d(fault)
D(lim) 1...8
T
th(sd)
T
hys
VS –
-- -- V
0.5V
-- -- 0.4 V
-10 0 10 µA
-- -- 0.4 V
0.6*VS0.7*VS0.8*V
V
S
200 300 450 µA
50 100 200 µs
500 700 1000 mA
170
--
-10
200
--
°C
K
V2.1 Page 26.Aug. 2002
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