LINEAR TECHNOLOGY LT3011 Technical data

LT3011
50mA, 3V to 80V Low
Dropout Micropower Linear
Regulator with PWRGD
FEATURES
n
Wide Input Voltage Range: 3V to 80V
n
Low Quiescent Current: 46μA
n
Low Dropout Voltage: 300mV
n
Output Current: 50mA
n
PWRGD Flag with Programmable Delay
n
No Protection Diodes Needed
n
Adjustable Output from 1.24V to 60V
n
1μA Quiescent Current in Shutdown
n
Stable with 1μF Output Capacitor
n
Stable with Ceramic, Tantalum, and Aluminum
Capacitors
n
Reverse-Battery Protection
n
No Reverse Current Flow from Output to Input
n
Thermal Limiting
n
Thermally Enhanced 12-Lead MSOP and
10-Pin (3mm × 3mm) DFN Packages
APPLICATIONS
n
Low Current High Voltage Regulators
n
Regulator for Battery-Powered Systems
n
Telecom Applications
n
Automotive Applications
DESCRIPTION
The LT®3011 is a high voltage, micropower, low dropout linear regulator. The device is capable of supplying 50mA of output current with a dropout voltage of 300mV. Designed for use in battery-powered high voltage systems, the low quiescent current (46μA operating and 1μA in shutdown) is well controlled in dropout, making the LT3011 an ideal choice.
The LT3011 includes a PWRGD fl ag to indicate output regulation. The delay between regulated output level and fl ag indication is programmable with a single capacitor. The LT3011 also has the ability to operate with very small output capacitors; it is stable with only 1μF on the output. Small ceramic capacitors can be used without the addition of any series resistance (ESR) as is common with other regulators. Internal protection circuitry includes reverse­battery protection, current limiting, thermal limiting, and reverse current protection.
The LT3011 features an adjustable output with a 1.24V reference voltage. The device is available in the thermally enhanced 12-lead MSOP and the low profi le (0.75mm) 10-pin (3mm × 3mm) DFN package, both providing excel­lent thermal characteristics.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
5V Supply with Shutdown
IN
V
IN
3V TO 80V
V
SHDN
<0.3V >2.0V
1.6M
1μF
POWER GOOD
OUTPUT
OFF
ON
LT3011
SHDN
PWRGD
GND
C
OUT
ADJ
T
1000pF
750k
249k
1μF
V
OUT
5V 50mA
3011 TA01
350
300
250
200
150
100
DROPOUT VOLTAGE (mV)
50
0
0
Dropout Voltage
OUTPUT CURRENT (mA)
40
3011 TA02
3011f
1
LT3011
ABSOLUTE MAXIMUM RATINGS
IN Pin Voltage .........................................................±80V
OUT Pin Voltage ......................................................±60V
Input-to-Output Differential Voltage ........................±80V
ADJ Pin Voltage ........................................................±7V
SHDN Pin Voltage ...................................................±80V
Pin Voltage .................................................. 7V, –0.5V
C
T
PWRGD Pin Voltage ....................................... 80V, –0.5V
Output Short-Circuit Duration .......................... Indefi nite
PIN CONFIGURATION
TOP VIEW
10
OUT
1
ADJ
2
11
3
GND
4
NC
5
PWRG D
10-LEAD (3mm s 3mm) PLASTIC DFN
T
JMAX
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
DD PACKAGE
= 150°C, θJA = 43°C/W, θJC = 16°C/W
IN
NC
9
SHDN
8
7
NC
6
C
T
(Note 1)
Storage Temperature Range ................... –65°C to 150°C
Operating Junction Temperature (Notes 3, 10, 11)
LT3011E, LT3011I .............................. –40°C to 125°C
LT3011H ............................................ –40°C to 150°C
Lead Temperature (Soldering, 10 sec)
MSE Package Only ............................................ 300°C
TOP VIEW
1
NC
2
OUT
3
ADJ
GND
NC
PWRG D
T
= 150°C, θJA = 40°C/W, θJC = 16°C/W
JMAX
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
13
4 5 6
MSE PACKAGE
12-LEAD PLASTIC MSOP
NC
12
IN
11
NC
10
SHDN
9
NC
8
C
7
T
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT3011EDD#PBF LT3011EDD#TRPBF LDKQ
LT3011IDD#PBF LT3011IDD#TRPBF LDKQ
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
LT3011EMSE#PBF LT3011EMSE#TRPBF 3011 12-Lead Plastic MSOP –40°C to 125°C
LT3011HMSE#PBF LT3011HMSE#TRPBF 3011 12-Lead Plastic MSOP –40°C to 150°C
LT3011IMSE#PBF LT3011IMSE#TRPBF 3011 12-Lead Plastic MSOP –40°C to 125°C
LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT3011EDD LT3011EDD#TR LDKQ
LT3011IDD LT3011IDD#TR LDKQ
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
LT3011EMSE LT3011EMSE#TR 3011 12-Lead Plastic MSOP –40°C to 125°C
LT3011HMSE LT3011HMSE#TR 3011 12-Lead Plastic MSOP –40°C to 150°C
LT3011IMSE LT3011IMSE#TR 3011 12-Lead Plastic MSOP –40°C to 125°C
Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container. For more information on lead free part marking, go to:
For more information on tape and reel specifi cations, go to:
http://www.linear.com/leadfree/
http://www.linear.com/tapeandreel/
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
3011f
2
LT3011
ELECTRICAL CHARACTERISTICS
The l
denotes the specifi cations which apply over the –40°C to 125°C operating temperature range, otherwise specifi cations are TJ = 25°C.
(LT3011E, LT3011I)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage I
ADJ Pin Voltage (Notes 2, 3) V
Line Regulation (Note 2)
Load Regulation (Note 2)
Dropout Voltage V
= V
IN
OUT(NOMINAL)
(Notes 4, 5)
GND Pin Current V
= V
IN
OUT(NOMINAL)
(Notes 4, 6)
Output Voltage Noise C
= 50mA
LOAD
= 3V, I
IN
4V < V
< 80V, 1mA < I
IN
ΔV
= 3V to 80V, I
IN
VIN = 4V, ΔI V
= 4V, ΔI
IN
= 1mA
I
LOAD
I
= 1mA
LOAD
I
= 10mA
LOAD
I
= 10mA
LOAD
I
= 50mA
LOAD
I
= 50mA
LOAD
= 0mA
I
LOAD
I
= 1mA
LOAD
I
= 10mA
LOAD
I
= 50mA
LOAD
= 10μF, I
OUT
= 1mA
LOAD
LOAD
= 1mA to 50mA
LOAD
= 1mA to 50mA
LOAD
= 50mA, BW = 10Hz to 100kHz, V
LOAD
< 50mA
LOAD
= 1mA
= 1.24V 100 μV
OUT
l
l
l
l
l
l
l
l l l l
1.228
1.215
2.8 4 V
1.24
1.24
1.252
1.265
112 mV
61525mV
100 150
190
200 260
350
300 370
550
46 105 410
1.9
90 200 700
3.3
RMS
ADJ Pin Bias Current (Note 7 ) 30 100 nA
Shutdown Threshold V
SHDN Pin Current (Note 8) V
Quiescent Current in Shutdown V
= Off to On
OUT
V
= On to Off
OUT
SHDN
V
SHDN
= 6V, V
IN
= 0V = 6V
= 0V 1 5 μA
SHDN
PWRGD Trip Point % of Nominal Output Voltage, Output Rising
l l
0.3
1.3
1.1
0.5
0.1
l
85 90 94 %
2V
2
0.5
PWRGD Trip Point Hysteresis % of Nominal Output Voltage 1.1 %
PWRGD Output Low Voltage I
C
Pin Charging Current
T
C
Pin Voltage Differential V
T
Ripple Rejection V
Current Limit V
Input Reverse Leakage Current V
Reverse Output Current (Note 9) V
= 50μA
PWRGD
CT(PWRGD High)
= 7V (Avg), V
IN
= 7V, V
IN
V
= 4V, ΔV
IN
= –80V, V
IN
= 1.24V, VIN < 1.24V (Note 2) 8 15 μA
OUT
– V
CT(PWRGD Low)
RIPPLE
= 0V
OUT
= –0.1V (Note 2)
OUT
= 0V
OUT
= 0.5V
P-P
, f
RIPPLE
= 120Hz, I
= 50mA 65 85 dB
LOAD
l
l
140 250 mV
36 μA
1.67 V
140 mA
l
60
l
6mA
V V
mV
mV mV
mV mV
mV mV
μA μA μA
mA
V
μA μA
mA
ELECTRICAL CHARACTERISTICS
The l
denotes the specifi cations which apply over the –40°C to 150°C operating temperature range, otherwise specifi cations are TJ = 25°C.
(LT3011H)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage I
ADJ Pin Voltage (Notes 2, 3) V
Line Regulation (Note 2)
Load Regulation (Note 2)
= 50mA
LOAD
= 3V, I
IN
4V < V
IN
ΔV
= 3V to 80V, I
IN
V
= 4V, ΔI
IN
V
= 4V, ΔI
IN
= 1mA
LOAD
< 80V, 1mA < I
LOAD
= 1mA to 50mA
LOAD
= 1mA to 50mA
LOAD
< 50mA
LOAD
= 1mA
l
1.228
l
1.215
l
2.8 4 V
1.24
1.24
1.252
1.265
112 mV
61525mV
l
3011f
3
V V
mV
LT3011
ELECTRICAL CHARACTERISTICS
The l
denotes the specifi cations which apply over the –40°C to 150°C operating temperature range, otherwise specifi cations are at TJ = 25°C.
(LT3011H)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Dropout Voltage
= V
V
IN
OUT(NOMINAL)
(Notes 4, 5)
GND Pin Current V
= V
IN
OUT(NOMINAL)
(Notes 4, 6)
Output Voltage Noise C
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
I
LOAD
OUT
= 1mA = 1mA
= 10mA = 10mA
= 50mA = 50mA
= 0mA = 1mA = 10mA = 50mA
= 10μF, I
= 50mA, BW = 10Hz to 100kHz, V
LOAD
l
l
l
l l l l
= 1.24V 100 μV
OUT
100 150
220
200 260
380
300 370
575
46 105 410
1.9
125 225 750
3.5
mV mV
mV mV
mV mV
mA
RMS
ADJ Pin Bias Current (Note 7) 30 100 nA
Shutdown Threshold V
SHDN Pin Current (Note 8) V
Quiescent Current in Shutdown V
OUT
V
OUT
SHDN
V
SHDN
IN
= 6V, V
= Off to On = On to Off
= 0V = 6V
SHDN
= 0V 1 5 μA
PWRGD Trip Point % of Nominal Output Voltage, Output Rising
l l
0.3
1.3
1.1
0.5
0.1
l
85 90 95 %
2V
2
0.5
PWRGD Trip Point Hysteresis % of Nominal Output Voltage 1.1 %
PWRGD Output Low Voltage I
C
Pin Charging Current
T
C
Pin Voltage Differential V
T
Ripple Rejection V
Current Limit V
Input Reverse Leakage Current V
Reverse Output Current (Note 9) V
= 50μA
PWRGD
CT(PWRGD High)
= 7V (Avg), V
IN
= 7V, V
IN
V
= 4V, ΔV
IN
= –80V, V
IN
= 1.24V, VIN < 1.24V (Note 2) 8 15 μA
OUT
– V
CT(PWRGD Low)
RIPPLE
= 0V
OUT
= –0.1V (Note 2)
OUT
= 0V
OUT
= 0.5V
P-P
, f
RIPPLE
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: The LT3011 is tested and specifi ed for these conditions with the ADJ pin connected to the OUT pin.
Note 3: Operating conditions are limited by maximum junction temperature. The regulated output voltage specifi cation will not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, the output current range must be limited. When operating at maximum output current, the input voltage range must be limited.
Note 4: To satisfy requirements for minimum input voltage, the LT3011 is tested and specifi ed for these conditions with an external resistor divider (249k bottom, 409k top) for an output voltage of 3.3V. The external resistor divider will add a 5μA DC load on the output.
Note 5: Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specifi ed output current. In dropout, the output voltage will be equal to (V
Note 6: GND pin current is tested with V
IN
– V
DROPOUT
= V
IN
).
OUT(NOMINAL)
and a current
source load. This means the device is tested while operating close to its
= 120Hz, I
= 50mA 65 85 dB
LOAD
dropout region. This is the worst-case GND pin current. The GND pin current will decrease slightly at higher input voltages.
Note 7: ADJ pin bias current fl ows into the ADJ pin. Note 8: SHDN pin current fl ows out of the SHDN pin. Note 9: Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the rated output voltage. This current fl ows into the OUT pin and out the GND pin.
Note 10: The LT3011 regulators are tested and specifi ed under pulse load conditions such that TJ TA. The LT3011E regulators are 100% tested at T
= 25°C. Performance of the LT3011E over the full –40°C
A
to 125°C operating junction temperature range is assured by design, characterization and correlation with statistical process controls. The LT3011I regulators are guaranteed over the full –40°C to 125°C operating junction temperature range. The LT3011H is tested to the LT3011H Electrical Characteristics table at 150°C operating junction temperature. High junction temperatures degrade operating lifetimes. Operating lifetime is derated at junction temperatures greater than 125°C.
Note 11: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C (LT3011E/LT3011I) or 150°C (LT3011H) when overtemperature protection is active. Continuous operation above the specifi ed maximum operating junction temperature may impair device reliability.
l
l
140 250 mV
36 μA
1.67 V
l
60
l
140 mA
mA
6mA
3011f
μA μA μA
V
μA μA
4
LT3011
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = 25°C, unless otherwise noted.
Dropout Voltage Guaranteed Dropout Voltage Dropout Voltage
400
350
300
250
200
150
100
DROPOUT VOLTAGE (mV)
50
0
TJ 125oC
TJ 25oC
10 204030 50
0
OUTPUT CURRENT (mA)
3011 G01
600
500
400
300
200
DROPOUT VOLTAGE (mV)
100
0
= TEST POINTS
TJb 125oC
TJb 25oC
10 20 30 40
OUTPUT CURRENT (mA)
505015253545
3011 G02
400
350
300
250
200
150
100
DROPOUT VOLTAGE (mV)
50
0
–50
Quiescent Current ADJ Pin Voltage Quiescent Current
80
VIN = 6V
= ∞
R
L
70
= 0
I
L
60
50
40
30
20
QUIESCENT CURRENT (μA)
10
0
–25 0 50
–50
V
SHDN
V
SHDN
25
TEMPERATURE (°C)
= V
IN
= GND
75 100 125 150
3011 G04
1.250 IL = 1mA
1.248
1.246
1.244
1.242
1.240
1.238
1.236
ADJ PIN VOLTAGE (V)
1.234
1.232
1.230
–50
–25
25 50 10075 125
0
TEMPERATURE (°C)
150
3011 G05
80
TJ = 25°C R
70
L
60
50
40
30
20
QUIESCENT CURRENT (μA)
10
0
0
IL = 50mA
IL = 10mA
IL = 1mA
–25
=
19
25 50 10075 125
0
TEMPERATURE (°C)
150
3011 G03
d
V
= V
SHDN
IN
24
358610 INPUT VOLTAGE (V)
7
3011 G06
GND Pin Current GND Pin Current vs I
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
GND PIN CURRENT (mA)
0.4
0.2
0
0
TJ = 25°C *FOR V
RL = 1.24k, IL = 1mA*
2143679510
INPUT VOLTAGE (V)
= 1.24V
OUT
RL = 24.8Ω
= 50mA*
I
L
RL = 124Ω
= 10mA*
I
L
RL = 49.6Ω
= 25mA*
I
L
8
3011 G07
2.0 VIN = V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
GND PIN CURRENT (mA)
0.4
0.2
0
OUT(NOMINAL)
= 25°C
T
J
0
1052015 30 35 4525 50
OUTPUT CURRENT (mA)
+1V
OUT
SHDN Pin Threshold
1.6
1.4
1.2
1.0
0.8
0.6
0.4
SHDN PIN THRESHOLD (V)
0.2
0
–25 0 50
40
3011 G08
–50
25
TEMPERATURE (°C)
75 100 125 150
3011 G09
3011f
5
LT3011
TYPICAL PERFORMANCE CHARACTERISTICS
= 25°C, unless otherwise noted.
T
J
SHDN Pin Current SHDN Pin Current ADJ Pin Bias Current
0.28 TJ = 25°C
CURRENT FLOWS
0.24 OUT OF SHDN PIN
0.20
0.16
0.12
0.08
SHDN PIN CURRENT (μA)
0.04
0
12
0
1.5 2.5435
0.5 4.5
SHDN PIN VOLTAGE (V)
3.5
3011 G10
PWRGD Trip Point PWRGD Output Low Voltage C
95
94
93
92
91
–50
OUTPUT FALLING
–25
90
89
88
87
86
PWRGD TRIP POINT (% OF OUTPUT VOLTAGE)
85
OUTPUT
RISING
25 50 10075 125
0
TEMPERATURE (°C)
150
3011 G13
0.6 V
= 0V
SHDN
CURRENT FLOWS OUT OF SHDN PIN
0.5
0.4
0.3
0.2
SHDN PIN CURRENT (μA)
0.1
0
–50 0 50 75–25 25 100 150125
200
I
PWRGD
180
160
140
120
100
80
60
40
PWRGD OUTPUT LOW VOLTAGE (mV)
20
0
–50
–25
= 50μA
0
TEMPERATURE (°C)
25 50 10075 125
TEMPERATURE (°C)
3011 G11
3011 G14
150
120
100
80
60
40
ADJ PIN BIAS CURRENT (nA)
20
0
–50 0 50 75–25 25 100 150125
Charging Current
T
4.0 PWRGD TRIPPED HIGH
3.5
3.0
2.5
2.0
1.5
CHARGING CURRENT (μA)
1.0
T
C
0.5
0
–25 0 50
–50
TEMPERATURE (°C)
25
TEMPERATURE (°C)
75 100 125 150
3011 G12
3011 G15
CT Comparator Threshold Current Limit Current Limit
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
COMPARATOR THRESHOLD (V)
T
C
0.2
0
–50
–25
0
V
CT(HIGH)
V
CT(LOW)
25 50 10075 125
TEMPERATURE (°C)
150
3011 G16
180
V
= 0V
OUT
= 25°C
T
160
J
140
120
100
80
60
CURRENT LIMIT (mA)
40
20
0
24
07
358610
19
INPUT VOLTAGE (V)
3011 G17
200
180
160
140
120
100
CURRENT LIMIT (mA)
6
80
60
40
20
0
–50
VIN = 7V
= 0V
V
OUT
–25
25 50 10075 125
0
TEMPERATURE (°C)
150
3011 G18
3011f
LT3011
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = 25°C, unless otherwise noted.
Reverse Output Current Reverse Output Current Input Ripple Rejection
160
140
120
100
REVERSE OUTPUT CURRENT (μA)
ADJ PIN CLAMP
(SEE APPLICATIONS
INFORMATION)
80
60
40
20
0
24
07
358610
19
OUTPUT VOLTAGE (V)
TJ = 25°C
= 0V
V
IN
CURRENT FLOWS INTO OUTPUT PIN
= V
V
OUT
ADJ
3011 G19
80
VIN = 0V
= V
V
OUT
70
60
50
40
30
20
REVERSE OUTPUT CURRENT (μA)
10
0
–50
= 1.24V
ADJ
–25 0 50
25
TEMPERATURE (°C)
75 100 125 150
3011 G20
90
88
86
84
82
80
78
76
RIPPLE REJECTION (dB)
74
72
70
–50
Input Ripple Rejection Minimum Input Voltage Load Regulation
100
VIN = 7V + 50mV
90
= 50mA, V
I
L
80
70
60
50
40
30
RIPPLE REJECTION (dB)
20
10
0
10 100 100k 1M
RIPPLE
RMS
= 1.24V
OUT
1k 10k
FREQUENCY (Hz)
C
OUT
CERAMIC
C
= 1μF
OUT
CERAMIC
= 10μF
3011 G22
4.0 IL = 50mA
3.5
3.0
2.5
2.0
1.5
1.0
MINIMUM INPUT VOLTAGE (V)
0.5
0
–25 0 50
–50
25
TEMPERATURE (°C)
75 100 125 150
3011 G23
0
–2
–4
–6
–8
LOAD REGULATION (mV)
–10
–12
–50 0 50 75–25 25 100 150125
VIN = 7V + 0.5V
= 50mA
I
L
V
OUT
–25
ΔIL = 1mA TO 50mA V
OUT
P-P
= 1.24V
25 50 10075 125
0
TEMPERATURE (°C)
= 1.24V
TEMPERATURE (°C)
RIPPLE AT f = 120Hz
150
3011 G21
3011 G24
Output Noise Spectral Density Output Noise (10Hz to 100kHz) Transient Response
10
V
= 1.24V
OUT
= 1μF
C
OUT
= 50mA
I
L
1
0.1
DENSITY (μV/ Hz)
0.01
OUTPUT NOISE SPECTRAL
0.001 10
FREQUENCY (Hz)
1k 10k100 100k
3011 G25
V
OUT
100μV/DIV
V
= 1.24V
OUT
= 1μF
C
OUT
= 50mA
I
L
WORST-CASE NOISE
1ms/DIV
3011 G26
0.3
0.2
0.1
0
DEVIATION (V)
OUTPUT VOLTAGE
–0.1
–0.2
50
25
LOAD
0
CURRENT (mA)
200 400
0 700
100 900
VIN = 6V V C C ΔI
300 500
TIME (μs)
SET FOR 5V
OUT
= 1μF CERAMIC
IN
= 1μF CERAMIC
OUT
= 1mA TO 50mA
LOAD
600 1000
800
3011 G27
3011f
7
LT3011
PIN FUNCTIONS
OUT (Pin 1/Pin 2): Output. The output supplies power to the load. A minimum output capacitor of 1μF is required to prevent oscillations. Larger capacitors will be required for applications with large transient loads to limit peak voltage transients. See the Applications Information section for more information on output capacitance and reverse output characteristics.
ADJ (Pin 2/Pin 3): Adjust. This is the input to the error amplifi er. This pin is internally clamped to ±7V. It has a bias current of 30nA which fl ows into the pin (see the curve labeled ADJ Pin Bias Current vs Temperature in the Typical Performance Characteristics section). The ADJ pin voltage is 1.24V referenced to ground, and the output voltage range is 1.24V to 60V.
GND (Pins 3, 11/Pins 4, 13): Ground. The exposed back­side of the package (Pin 11/Pin 13) is an electrical connec­tion for GND. As such, to ensure optimum device opera­tion and thermal performance, the Exposed Pad must be connected directly to Pin 3/Pin 4 on the PC board.
NC (Pins 4, 7, 9/Pins 1, 5, 8, 10, 12): No Connection. These pins have no internal connection. Connecting NC pins to a copper area for heat dissipation provides a small improvement in thermal performance.
PWRGD (Pin 5/Pin 6): Power Good. The PWRGD fl ag is an open-collector fl ag to indicate that the output voltage has increased above 90% of the nominal output voltage. There is no internal pull-up on this pin; a pull-up resistor must be used. The PWRGD pin will change state from an open-collector pull-down to high impedance after both the output is above 90% of the nominal voltage and the capacitor on the C ferential. The maximum pull-down current of the PWRGD pin in the low state is 50μA.
pin has charged through a 1.67V dif-
T
(DFN/MSOP)
(Pin 6/Pin 7): Timing Capacitor. The CT pin allows the
C
T
use of a small capacitor to delay the timing between the point where the output crosses the PWRGD threshold and the PWRGD fl ag changes to a high impedance state. Cur­rent out of this pin during the charging phase is 3μA. The voltage difference between the PWRGD low and PWRGD high states is 1.67V (see the Applications Information section).
SHDN (Pin 8/Pin 9): Shutdown. The SHDN pin is used to put the LT3011 into a low power shutdown state. The output will be off when the SHDN pin is pulled low. The SHDN pin can be driven either by 5V logic or open-collector logic with a pull-up resistor. The pull-up resistor is only required to supply the pull-up current of the open-collec­tor gate, normally several microamperes. If unused, the SHDN pin must be tied to a logic high or V
IN (Pin 10/Pin 11): Input. Power is supplied to the device through the IN pin. A bypass capacitor is required on this pin if the device is more than six inches away from the main input fi lter capacitor. In general, the output imped­ance of a battery rises with frequency, so it is advisable to include a bypass capacitor in battery-powered circuits. A bypass capacitor in the range of 1μF to 10μF is suffi cient. The LT3011 is designed to withstand reverse voltages on the IN pin with respect to ground and the OUT pin. In the case of a reverse input voltage, which can occur if a battery is plugged in backwards, the LT3011 will act as if there is a diode in series with its input. There will be no reverse current fl ow into the LT3011 and no reverse volt­age will appear at the load. The device will protect both itself and the load.
Exposed Pad (Pin 11/Pin 13): Ground. The Exposed Pad must be soldered to the PCB.
IN
.
8
3011f
APPLICATIONS INFORMATION
LT3011
The LT3011 is a 50mA high voltage/low dropout regulator with micropower quiescent current and shutdown. The device is capable of supplying 50mA at a dropout voltage of 300mV. The low operating quiescent current (46μA) drops to 1μA in shutdown. In addition to low quiescent current, the LT3011 incorporates several protection features which make it ideal for use in battery-powered systems. The device is protected against both reverse input and reverse output voltages. In battery backup applications where the output can be held up by a backup battery when the input is pulled to ground, the LT3011 acts like it has a diode in series with its output and prevents reverse current fl ow.
Adjustable Operation
The LT3011 has an output voltage range of 1.24V to 60V. The output voltage is set by the ratio of two external resistors as shown in Figure 1. The device servos the output to maintain the voltage at the adjust pin at 1.24V referenced to ground. The current in R1 is then equal to 1.24V/R1 and the current in R2 is the current in R1 plus the ADJ pin bias current. The ADJ pin bias current, 30nA at 25°C, fl ows through R2 into the ADJ pin. The output voltage can be calculated using the formula in Figure 1. The value of R1 should be less than 250k to minimize errors in the output voltage caused by the ADJ pin bias current. Note that in shutdown the output is turned off and the divider current will be zero. The adjustable device is tested and specifi ed with the ADJ pin tied to the OUT pin and a 5μA DC load (unless otherwise specifi ed) for an output voltage of 1.24V. Speci-
fi cations for output voltages greater than 1.24V will be proportional to the ratio of the desired output voltage to
1.24V; (V
/1.24V). For example, load regulation for an
OUT
output current change of 1mA to 50mA is –6mV (typical) at V
= 1.24V. At V
OUT
12
V
124
V
.
658
mV mV
•– =
= 12V, load regulation is:
OUT
Output Capacitance and Transient Response
The LT3011 is designed to be stable with a wide range of output capacitors. The ESR of the output capacitor affects stability, most notably with small capacitors. A minimum output capacitor of 1μF with an ESR of 3Ω or less is recommended to prevent oscillations. The LT3011 is a micropower device and output transient response will be a function of output capacitance. Larger values of output capacitance decrease the peak deviations and provide improved transient response for larger load current changes. Bypass capacitors, used to decouple individual components powered by the LT3011, will increase the effective output capacitor value.
Extra consideration must be given to the use of ceramic capacitors. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior across temperature and applied voltage. The most common dielectrics used are specifi ed with EIA temperature char­acteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and Y5V dielectrics are good for providing high capacitances
ADJ
R2
+ (I
)(R2)1 +
ADJ
R1
= V
V
OUT
V
= 1.24V
ADJ
= 30nA AT 25oC
I
ADJ
OUTPUT RANGE = 1.24V TO 60V
IN
V
IN
Figure 1. Adjustable Operation
OUT
LT3011
ADJ
GND
V
+
R2
R1
OUT
3011 F01
3011f
9
LT3011
APPLICATIONS INFORMATION
in a small package, but they tend to have strong voltage and temperature coeffi cients, as shown in Figures 2 and 3. When used with a 5V regulator, a 16V 10μF Y5V capacitor can exhibit an effective value as low as 1μF to 2μF for the DC bias voltage applied and over the operating tempera­ture range. The X5R and X7R dielectrics result in more stable characteristics and are more suitable for use as the output capacitor. The X7R type has better stability across temperature, while the X5R is less expensive and is avail­able in higher values. Care still must be exercised when using X5R and X7R capacitors; the X5R and X7R codes only specify operating temperature range and maximum capacitance change over temperature. Capacitance change due to DC bias with X5R and X7R capacitors is better than Y5V and Z5U capacitors, but can still be signifi cant enough to drop capacitor values below appropriate levels. Capaci­tor DC bias characteristics tend to improve as component case size increases, but expected capacitance at operating voltage should be verifi ed.
Voltage and temperature coeffi cients are not the only sources of problems. Some ceramic capacitors have a piezoelectric response. A piezoelectric device generates voltage across its terminals due to mechanical stress, simi­lar to the way piezoelectric accelerometer or microphone works. For a ceramic capacitor, the stress can be induced by vibrations in the system or thermal transients.
PWRGD Flag and Timing Capacitor Delay
The PWRGD fl ag is used to indicate that the ADJ pin volt­age is within 10% of the regulated voltage. The PWRGD pin is an open-collector output, capable of sinking 50μA of current when the ADJ pin voltage is low. There is no internal pull-up on the PWRGD pin; an external pull-up resistor must be used. When the ADJ pin rises to within 10% of its fi nal reference value, a delay timer is started. At the end of this delay, programmed by the value of the capacitor on the C
pin, the PWRGD pin switches to a high
T
impedance and is pulled up to a logic level by an external pull-up resistor.
To calculate the capacitor value on the C
pin, use the
T
following formula:
It
C
TIME
=
CT DELAY
VV
CT HIGH CT L OW
() ()
Figure 4 shows a block diagram of the PWRGD circuit. At start-up, the timing capacitor is discharged and the PWRGD pin will be held low. As the output voltage increases and the ADJ pin crosses the 90% threshold, the JK fl ipfl op is reset, and the 3μA current source begins to charge the timing capacitor. Once the voltage on the CT pin reaches the V
CT(HIGH)
threshold (approximately 1.7V at 25°C), the capacitor voltage is clamped and the PWRGD pin is set to a high impedance state.
20
0
–20
–40
–60
CHANGE IN VALUE (%)
–80
–100
0
26
Figure 2. Ceramic Capacitor DC Bias Characteristics Figure 3. Ceramic Capacitor Temperature Characteristics
BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10MF
X5R
Y5V
4
8
DC BIAS VOLTAGE (V)
10
14
12
16
3011 F02
40
20
0
–20
–40
–60
CHANGE IN VALUE (%)
–80
BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10MF
–100
–50
–25 0
X5R
Y5V
50 100 125
25 75
TEMPERATURE (oC)
10
3011 F03
3011f
APPLICATIONS INFORMATION
LT3011
During normal operation, an internal glitch fi lter will ignore short transients (<15μs). Longer transients below the 90% threshold will reset the JK fl ip-fl op. This fl ip-fl op ensures that the capacitor on the C the way to the V
CT(LOW)
pin is quickly discharged all
T
threshold before restarting the time delay. This provides a consistent time delay after the ADJ pin is within 10% of the regulated voltage before the PWRGD pin switches to high impedance.
Thermal Considerations
The power handling capability of the device will be limited by the maximum rated junction temperature (125°C, LT3011E/ LT3011I or 150°C, LT3011H). The power dissipated by the device will be made up of two components:
1. Output current multiplied by the input/output voltage
differential: I
• (VIN – V
OUT
OUT
) and,
2. GND pin current multiplied by the input voltage:
• V
I
GND
IN
The GND pin current is found by examining the GND pin current curves in the Typical Performance Characteristics section. Power dissipation will be equal to the sum of the two components listed above.
The LT3011 series regulators have internal thermal limiting designed to protect the device during overload conditions. For continuous normal conditions, the maximum junction temperature rating of 125°C (LT3011E/ LT3011I) or 150°C (LT3011H) must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction to ambient. Additional heat sources mounted nearby must also be considered.
3μA
I
CT
ADJ
V
REF
• 90%
C
T
+
QJ
K
V
CT(HIGH)
– V (z1.1V)
PWRGD
BE
For surface mount devices, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat gener­ated by power devices.
The following table lists thermal resistance for several different board sizes and copper areas. All measurements were taken in still air on 3/32" FR-4 board with one ounce copper.
Table 1. MSOP Measured Thermal Resistance
COPPER AREA
BOARD AREA
2500 sq mm 2500 sq mm 2500 sq mm 52°C/W
1000 sq mm 2500 sq mm 2500 sq mm 54°C/W
225 sq mm 2500 sq mm 2500 sq mm 58°C/W
100 sq mm 2500 sq mm 2500 sq mm 64°C/W
Table 2. DFN Measured Thermal Resistance
COPPER AREA
BOARD AREA
2500 sq mm 2500 sq mm 2500 sq mm 52°C/W
1000 sq mm 2500 sq mm 2500 sq mm 54°C/W
225 sq mm 2500 sq mm 2500 sq mm 58°C/W
100 sq mm 2500 sq mm 2500 sq mm 64°C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE BACKSIDE
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE BACKSIDE
The thermal resistance junction-to-case (θJC), measured at the Exposed Pad on the back of the die, is 16°C/W. Continuous operation at large input/output voltage dif­ferentials and maximum load current is not practical due to thermal limitations. Transient operation at high input/ output differentials is possible. The approximate thermal time-constant for a 2500sq mm 3/32" FR-4 board, with maximum topside and backside area for one ounce cop­per, is three seconds. This time-constant will increase as more thermal mass is added (i.e., vias, larger board and other components).
+
V
CT(LOW)
z0.1V
Figure 4. PWRGD Circuit Block Diagram
3011 F04
For an application with transient high power peaks, average power dissipation can be used for junction temperature calculations as long as the pulse period is signifi cantly less than the thermal time constant of the device and board.
3011f
11
LT3011
APPLICATIONS INFORMATION
Calculating Junction Temperature
Example 1: Given an output voltage of 5V, an input volt­age range of 24V to 30V, an output current range of 0mA to 50mA, and a maximum ambient temperature of 50°C, what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
I
OUT(MAX)
• (V
IN(MAX)
– V
OUT
) + (I
GND
• V
IN(MAX)
)
Where:
at (I
= 50mA
= 30V
= 50mA, VIN = 30V) = 1mA
OUT
I
OUT(MAX)
V
IN(MAX)
I
GND
So:
P = 50mA • (30V – 5V) + (1mA • 30V) = 1.28W
The thermal resistance will be in the range of 52°C/W to 64°C/W depending on the copper area. So, the junction temperature rise above ambient will be approximately equal to:
1.28W • 58°C/W = 74°C
The maximum junction temperature will then be equal to the maximum junction temperature rise above ambient plus the maximum ambient temperature or:
T
= 50°C + 74°C = 124°C
JMAX
Operation at the different power levels is as follows:
76% operation at P1, 19% for P2, 4% for P3, and 1% for P4.
P
= 76%(0.23W) + 19%(2.20W) + 4%(0.35W)
EFF
+ 1%(3.42W) = 0.64W
With a thermal resistance in the range of 52°C/W to 64°C/W, this translates to a junction temperature rise above ambi­ent of 33°C to 41°C.
High Temperature Operation
Care must be taken when designing LT3011 applications to operate at high ambient temperatures. The LT3011 works at elevated temperatures but erratic operation can occur due to unforeseen variations in external components. Some tantalum capacitors are available for high temperature operation, but ESR is often several ohms; capacitor ESR above 3Ω is unsuitable for use with the LT3011. Ceramic capacitor manufacturers (Murata, AVX, TDK and Vishay Vitramon at this writing) now offer ceramic capacitors that are rated to 150°C using an X8R dielectric. Device instability will occur if the output capacitor value and ESR are outside design limits at elevated temperature and operating DC voltage bias (see information on capacitor characteristics under Output Capacitance and Transient Response). Check each passive component for absolute value and voltage ratings over the operating temperature range.
Example 2: Given an output voltage of 5V, an input voltage of 48V that rises to 72V for 5ms (max) out of every 100ms, and a 5mA load that steps to 50mA for 50ms out of every 250ms, what is the junction temperature rise above ambi­ent? Using a 500ms period (well under the time-constant of the board), power dissipation is as follow:
P1 (48V
, 5mA load) = 5mA • (48V – 5V)
IN
+ (200μA • 48V) = 0.23W
P2 (48V
, 50mA load) = 50mA • (48V – 5V)
IN
+ (1mA • 48V) = 2.20W
P3 (72V
, 5mA load) = 5mA (72V – 5V)
IN
+ (200μA • 72V) = 0.35W
P1 (72V
, 50mA load) = 50mA (72V – 5V)
IN
+ (1mA • 72V) = 3.42W
12
Leakage in capacitors, or from solder fl ux left after insuf­fi cient board cleaning, adversely affects the low quies­cent current operation. Consider junction temperature increase due to power dissipation in both the junction and nearby components to ensure maximum specifi ca­tions are not violated for the LT3011E/LT3011H/LT3011I or external components.
Protection Features
The LT3011 incorporates several protection features which make it ideal for use in battery-powered circuits. In ad­dition to the normal protection features associated with monolithic regulators, such as current limiting and thermal limiting, the device is protected against reverse-input voltages, and reverse voltages from output-to-input.
3011f
APPLICATIONS INFORMATION
LT3011
Current limit protection and thermal overload protection are intended to protect the device against current overload conditions at the output of the device. For normal opera­tion, the junction temperature should not exceed 125°C (LT3011E/LT3011I) or 150°C (LT3011H).
The input of the device will withstand reverse voltages of 80V. Current fl ow into the device will be limited to less than 6mA (typically less than 100μA) and no negative voltage will appear at the output. The device will protect both itself and the load. This provides protection against batteries which can be plugged in backwards.
The ADJ pin of the adjustable device can be pulled above or below ground by as much as 7V without damaging the device. If the input is left open-circuit or grounded, the ADJ pin will act like an open-circuit when pulled below ground, and like a large resistor (typically 100k) in series with a diode when pulled above ground. If the input is powered by a voltage source, pulling the ADJ pin below the reference voltage will cause the device to try and force the current limit out of the output. This will cause the output to go to an unregulated high voltage. Pulling the ADJ pin above the reference voltage will turn off all output current.
In situations where the ADJ pin is connected to a resistor divider that would pull the ADJ pin above its 7V clamp volt­age if the output is pulled high, the ADJ pin input current must be limited to less than 5mA. For example, a resistor
divider is used to provide a regulated 1.5V output from the
1.24V reference when the output is forced to 60V. The top resistor of the resistor divider must be chosen to limit the current into the ADJ pin to less than 5mA when the ADJ pin is at 7V. The 53V difference between the OUT and ADJ pin is divided by the 5mA maximum current into the ADJ pin yields a minimum top resistor value of 10.6k.
In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage, or is left open-circuit. Current fl ow back into the output will follow the curve shown in Figure 5. The rise in reverse output current above 7V occurs from the breakdown of the 7V clamp on the ADJ pin. With a resistor divider on the regula­tor output, this current will be reduced depending on the size of the resistor divider.
When the IN pin of the LT3011 is forced below the OUT pin or the OUT pin is pulled above the IN pin, input cur­rent will typically drop to less than 2μA. This can happen if the input of the LT3011 is connected to a discharged (low voltage) battery and the output is held up by either a backup battery or a second regulator circuit. The state of the SHDN pin will have no effect on the reverse output current when the output is pulled above the input.
160
140
120
100
80
60
40
REVERSE OUTPUT CURRENT (μA)
20
0
07
Figure 5. Reverse Output Current
ADJ PIN CLAMP
(SEE ABOVE)
TJ = 25°C
= 0V
V
IN
CURRENT FLOWS INTO OUTPUT PIN
= V
V
OUT
ADJ
24
358610
19
OUTPUT VOLTAGE (V)
3011 F05
3011f
13
LT3011
TYPICAL APPLICATIONS
5V Buck Converter with Low Current Keep Alive Backup
6
V
5.5V*
TO 60V
IN
C3
4.7MF 100V CERAMIC
BOOST
4
V
IN
LT1766
15
SHDN
14
SYNC
GND
BIAS
V
1, 8, 9, 16
SW
D2
D1N914
Buck Converter
C2
0.33MF
2
D1 10MQ060N
10
R1
15.4k
12
FB
C
11
C 1nF
R2
4.99k
C
L1
15MH
100MF 10V
SOLID
TANTALUM
V
OUT
5V 1A/250mA
C1
+
Effi ciency vs Load Current
100
EFFICIENCY (%)
90
80
70
60
= 5V
V
OUT
L = 68MH
VIN = 10V
VIN = 42V
OPERATING
CURRENT
HIGH
LOW
100k
V
(FUTURE 42V)
12V
OFF
10
8
5
SHDN
PWRGD
GND
LT3011
3, 11
1
OUTIN
2
ADJ
C
T
6
1000pF
*
FOR INPUT VOLTAGES BELOW 7.5V,
750k
SOME RESTRICTIONS MAY APPLY
INCREASE L1 TO 30MH FOR LOAD CURRENTS ABOVE 0.6A AND TO
249k
60MH ABOVE 1A.
LT3011 PIN NUMBERS ARE FOR THE DD PACKAGE.
3011 TA03
50
0.25
0
LOAD CURRENT (A)
0.50
0.75
1.00
1.25
3011 TA04
LT3011 Automotive Application
+
IN
ON
1MF
NO PROTECTION
DIODE NEEDED!
SHDN
LT3011
GND
OUTIN
ADJ
750k
249k
1MF
LOAD: CLOCK,
SECURITY SYSTEM
ETC
14
V
OFF
48V
ON
(72V TRANSIENT)
LT3011 Telecom Application
IN
1MF
SHDN
LT3011
GND
OUTIN
ADJ
750k
NO PROTECTION
DIODE NEEDED!
249k
1MF
LOAD:
SYSTEM MONITOR
ETC
3011 TA05
+
BACKUP BATTERY
3011f
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
R = 0.115
TYP
LT3011
0.38
± 0.10
106
3.50 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.25 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.38 ±0.05
(2 SIDES)
0.50 BSC
PACKAGE OUTLINE
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
2.845 p 0.102 (.112 p .004)
5.23
(.206)
MIN
0.42 p 0.038
(.0165 p .0015)
TYP
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
GAUGE PLANE
0.18
(.007)
1.651 p 0.102 (.065 p .004)
(.0256)
DETAIL “A”
DETAIL “A”
0.65
BSC
o – 6o TYP
0
TOP MARK
(SEE NOTE 6)
MSE Package
0.889
p 0.127
(.035 p .005)
3.20 – 3.45
(.126 – .136)
0.53 p 0.152
(.021 p .006)
6
DETAIL “B”
7
(.118 p .004)
1.65 ± 0.10
(2 SIDES)
0.00 – 0.05
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
NO MEASUREMENT PURPOSE
0.406 p 0.076 (.016 p .003)
REF
3.00 p 0.102
(NOTE 4)
0.86
(.034)
REF
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.12 REF
DETAIL “B”
FOR REFERENCE ONLY
3.00 ±0.10
p 0.102
2.845 (.112 p .004)
4.039 p 0.102 (.159 p .004)
(NOTE 3)
(4 SIDES)
0.75 ±0.05
PIN 1
0.200 REF
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
BOTTOM VIEW OF
EXPOSED PAD OPTION
1
12
12 11 10 9 8 7
4.90 p 0.152 (.193 p .006)
123456
1.10
(.043)
MAX
0.35 REF
15
0.25 ± 0.05
0.50 BSC
(DD) DFN 1103
SEATING
PLANE
0.22 –0.38
(.009 – .015)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
TYP
0.650
(.0256)
BSC
0.1016 p 0.0508 (.004 p .002)
MSOP (MSE12) 0608 REV B
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa­tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3011f
15
LT3011
TYPICAL APPLICATION
Constant Brightness for Indicator LED over Wide Input Voltage Range
–48V CAN VARY FROM –4V TO –80V
RETURN
OFF
–48V
ON
I
= 1.24V/R
LED
1MF
SET
IN
SHDN
LT 3 0 1 1
GND
OUT
ADJ
1MF
R
SET
3011 TA06
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LT1121/
150mA, Micropower, LDO V
LT1121HV LT1676 60V, 440mA (I
), 100kHz, High
OUT
: 4.2V to 30V/36V, V
IN
Reverse Battery Protection, SOT-223, S8 and Z Packages VIN: 7.4V to 60V, V
OUT(MIN)
Effi ciency Step-Down DC/DC Converter
LT1761 100mA, Low Noise Micropower, LDO V
LT1762 150mA, Low Noise Micropower, LDO V
LT1763 500mA, Low Noise Micropower, LDO V
LT1764/ LT1764A
3A, Low Noise, Fast Transient Response, LDO
: 1.8V to 20V, V
IN
Low Noise < 20μV
: 1.8V to 20V, V
IN
Low Noise < 20μV
: 1.8V to 20V, V
IN
Low Noise < 20μV
: 2.7V to 20V, V
V
IN
Low Noise < 40μV
OUT(MIN)
RMS
OUT(MIN)
RMS
OUT(MIN)
RMS
OUT(MIN)
RMS
DD and TO220-5 Packages
LT1766 60V, 1.2A (I
), 200kHz, High Effi ciency
OUT
VIN: 5.5V to 60V, V
OUT(MIN)
Step-Down DC/DC Converter
LT1776 40V, 550mA (I
), 200kHz, High
OUT
VIN: 7.4V to 40V, V
OUT(MIN)
Effi ciency Step-Down DC/DC Converter
LT1956 60V, 1.2A (I
), 500kHz, High Effi ciency
OUT
VIN: 5.5V to 60V, V
OUT(MIN)
Step-Down DC/DC Converter
LT1962 300mA, Low Noise Micropower, LDO V
LT1963/ LT1963A
1.5A, Low Noise, Fast Transient Response, LDO
: 1.8V to 20V, V
IN
Low Noise < 20μV
: 2.1V to 20V, V
V
IN
Low Noise < 40μV
OUT(MIN)
RMS
OUT(MIN)
RMS
DD, TO220-5, S0T-223 and S8 Packages
LT1965 1.1A, Low Noise, Low Dropout Linear
Regulator
310mV Dropout Voltage, Low Noise = 40μV V
: 1.2V to 19.5V, Stable with Ceramic Capacitors, TO-220, DDPak,
OUT
MSOP and 3mm × 3mm DFN Packages LT3009 20mA, 3μA IQ Micropower LDO 280mV Dropout Voltage, Low IQ = 3μA, VIN: 1.6V to 20V, ThinSOT and SC-70 Packages LT3010/
LT3010H LT3012/
LT3012H LT3013/
LT3013H
50mA, 3V to 80V, Low Noise Micropower LDO
250mA, 4V to 80V, Low Dropout Micropower Linear Regulator
250mA, 4V to 80V, Low Dropout Micropower Linear Regulator
LT3014/HV 20mA, 3V to 80V, Low Dropout
Micropower Linear Regulator
LT3080/ LT3080-1
1.1A, Parallelable, Low Noise, Low Dropout Linear Regulator
: 3V to 8V, V
V
IN
Low Noise < 100μV
VIN: 4V to 80V, V
OUT(MIN)
RMS
: 1.24V to 60V, VDO = 0.4V, IQ = 40μA, ISD <1μA,
OUT
TSSOP-16E and 4mm × 3mm DFN-12 Packages, H Grade = +140°C T
VIN: 4V to 80V, V
: 1.24V to 60V, VDO = 0.4V, IQ = 65μA, ISD <1μA,
OUT
TSSOP-16E and 4mm × 3mm DFN-12 Packages, H Grade = +140°C T
: 3V to 80V (100V for 2ms, HV Version), V
V
IN
I
= 7μA, ISD <1μA, ThinSOT and 3mm × 3mm DFN-8 Packages
Q
300mV Dropout Voltage (2-Supply Operation), Low Noise = 40μV
V
: 0V to 35.7V, Current-Based Reference with One Resistor V
OUT
Parallelable (No Op Amp Required), Stable with Ceramic Capacitors, TO-220, SOT-223,
MSOP and 3mm × 3mm DFN Packages; LT3080-1 Features an Integrated Ballast Resistor ThinSOT is a trademark of Linear Technology Corporation.
Linear Technology Corporation
16
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
= 3.75V, VDO = 0.42V, IQ = 30μA, ISD = 16μA,
OUT(MIN)
= 1.24V, IQ = 3.2mA, ISD = 2.5μA, S8 Package
= 1.22V, VDO = 0.3V, IQ = 20μA, ISD <1μA,
, Stable with 1μF Ceramic Capacitors, ThinSOTTM Package
= 1.22V, VDO = 0.3V, IQ = 25μA, ISD <1μA,
, MS8 Package
= 1.22V, VDO = 0.3V, IQ = 30μA, ISD <1μA,
, S8 Package
= 1.21V, VDO = 0.34V, IQ = 1mA, ISD <1μA,
, “A” Version Stable with Ceramic Capacitors,
= 1.2V, IQ = 2.5mA, ISD = 25μA, TSSOP-16/E Package
= 1.24V, IQ = 3.2mA, ISD = 30μA, N8 and S8 Packages
= 1.2V, IQ = 2.5mA, ISD = 25μA, TSSOP-16/E Package
= 1.22V, VDO = 0.27V, IQ = 30μA, ISD <1μA,
, MS8 Package
= 1.21V, VDO = 0.34V, IQ = 1mA, ISD <1μA,
, “A” Version Stable with Ceramic Capacitors,
, VIN: 1.8V to 20V,
RMS
= 1.275V, VDO = 0.3V, IQ = 30μA, ISD = 1μA,
, MS8E Package, H Grade = +140°C T
: 1.22V to 60V, VDO = 0.35V,
OUT
JMAX
JMAX
, PWRGD Flag
JMAX
, VIN: 1.2V to 36V,
RMS
Set; Directly
OUT
LT 0808 • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2008
3011f
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