LG T320 Service Manual

Service Manual Model : LG-T320

Internal Use Only

Service Manual

LG-T320

Date: August, 2010 / Issue 1.0

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.3 Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 Supporting Standard .................................................................... 9

2.2 Main Parts : Solution ....................................................................10

2.3 H/W features ...................................................................................10

2.4 HW Spec. .........................................................................................12

3. BB CIRCUIT TECHNICAL BRIEF .........................................17

3.1 Functional Block Diagram .........................................................17

3.2 Baseband Processor Introduction .........................................18

3.3 Power management IC ..............................................................33

3.4 Charging control ...........................................................................37

3.5 ower ON/OFF .................................................................................39

3.6 SIM Interface ...................................................................................40

3.7 T - Flash connector .......................................................................41

5. TROUBLE SHOOTING .......................................................68

5.1 Trouble shooting test setup .....................................................68

5.2 Power on Trouble ..........................................................................69

5.3 Charging trouble ..........................................................................72

5.4 LCD display trouble .....................................................................74

5.5 Camera Trouble .............................................................................76

5.6 Receiver & Speaker trouble ......................................................78

5.7 Microphone trouble ....................................................................80

5.8 Vibrator trouble .............................................................................81

5.9 SIM & uSD trouble ........................................................................83

5.10 Touch trouble...............................................................................86

5.11 LCD LED trouble .........................................................................87

5.12 Bluetooth trouble ......................................................................88

6. DOWNLOAD ......................................................................91

7. BLOCK DIAGRAM ........................................................... 104

8. CIRCUIT DIAGRAM ........................................................ 105

3.8 Memory ............................................................................................42

3.9 LCD Display .....................................................................................43

3.10 LCD back-light illumination ...................................................44

3.11 Battery voltage monitor ..........................................................45

3.12 Audio ...............................................................................................46

3.13 FM radio & Bluetooth (BCM20780B0KUBG) ....................48

3.14 5PIN Interface connector ........................................................52

4. RF CIRCUIT TECHNICAL BRIEF .........................................53

4.1 General Description .....................................................................53

4.2 GSM Part ...........................................................................................56

4.3 WCDMA Part ...................................................................................60

4.4 GSM Power Ampliﬁer Module .................................................63

4.5 WCDMA Band1/8 Power Ampliﬁer Module .......................64

4.6 WCDMA Band1/8 Low Noise Ampliﬁer ...............................65

4.7 WCDMA Band1 Duplexer ..........................................................66

4.8 WCDMA Band8 Duplexer ..........................................................67

9. BGA Pin Map .................................................................. 111

10. PCB LAYOUT ................................................................. 115

11. RF CALIBRATION ......................................................... 117

11.1 Test Equipment Setup ........................................................... 117

11.2 Calibration Step ....................................................................... 117

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW ......................................................................123

12.2 Replacement Parts..................................................................125

121.3 Accessory .................................................................................

......... 123

147

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LGE Internal Use Only

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Only for training and service purposes

1. INTRODUCTION

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INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features

of the T320.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services. System

users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not

warrant that this product is immune from the above case but will prevent unauthorized use of common

carrier telecommunication service of facilities accessed through or connected to it. LGE will not be

responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing

harm or interruption in service to the telephone network, it should disconnect telephone service until repair

can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the T320 or compatibility with the net work, the

telephone company is required to give advanced written notice to the user, allowing the user to take

appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the T320 must be performed only by the LGE or its authorized agent. The user

may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that

unauthorized alternations or repair may affect the regulatory status of the system and may void any

remaining warranty.

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

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E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information such as

the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

T320 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also

grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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Only for training and service purposes

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1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

୛ APC Automatic Power Control

୛ BB Baseband

୛ BER Bit Error Ratio

୛ CC-CV Constant Current – Constant Voltage

୛ CLA Cigar Lighter Adapter

୛ DAC Digital to Analog Converter

୛ DCS Digital Communication System

୛ dBm dB relative to 1 milli-watt

୛ DSP Digital Signal Processing

୛ EEPROM Electrical Erasable Programmable Read-Only Memory

୛ EGPRS Enhanced General Packet Radio Service

୛ EL Electroluminescence

୛ ESD Electrostatic Discharge

୛ FPCB Flexible Printed Circuit Board

୛ GMSK Gaussian Minimum Shift Keying

୛ GPIB General Purpose Interface Bus

୛ GPRS General Packet Radio Service

୛ GSM Global System for Mobile Communications

୛ IPUI International Portable User Identity

୛ IF Intermediate Frequency

୛ LCD Liquid Crystal Display

୛ LDO Low Drop Output

୛ LED Light Emitting Diode

୛ LGE LG Electronics

୛ OPLL Offset Phase Locked Loop

୛ PAM Power Amplifier Module

୛ PCB Printed Circuit Board

୛ PGA Programmable Gain Amplifier

୛ PLL Phase Locked Loop

୛ PSTN Public Switched Telephone Network

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

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୛ RF Radio Frequency

୛ RLR Receiving Loudness Rating

୛ RMS Root Mean Square

୛ RTC Real Time Clock

୛ SAW Surface Acoustic Wave

୛ SIM Subscriber Identity Module

୛ SLR Sending Loudness Rating

୛ SRAM Static Random Access Memory

୛ STMR Side Tone Masking Rating

୛ TA Travel Adapter

୛ TDD Time Division Duplex

୛ TDMA Time Division Multiple Access

୛ UART Universal Asynchronous Receiver/Transmitter

୛ VCO Voltage Controlled Oscillator

୛ VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

୛ WAP Wireless Application Protocol

୛ 8PSK 8 Phase Shift Keying

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Only for training and service purposes

2. PERFORMANCE

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2. PERFORMANCE

2.1 Supporting Standard

Item Feature Comment

Supporting Standard WCDMA 900 / WCDMA 2100/HSDPA

GSM850/EGSM/DCS/PCS1 with seamless

handover

Phase 2+(include AMR)

SIM Toolkit : Class 3

Frequency Range GSM850 TX : 824 - 849MHz

GSM850 RX : 869 - 894MHz

EGSM TX : 880 - 915 MHz

EGSM RX : 925 - 960 MHz

DCS TX : 1710 - 1785 MHz

DCS RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz

PCS RX : 1930 - 1990 MHz

WCDMA900 TX : 880 - 915 MHz

WCDMA900 RX : 925 - 960 MHz

WCDMA2100 TX : 1920 - 1980 MHz

WCDMA2100 RX : 2110 - 2170 MHz

HSDPA TX : 880 - 915 MHz

1920 - 1980 MHz

HSDPA RX : 925 - 960 MHz

2110 - 2170 MHz

WLAN 802.11g : 2400 – 2483.5 MHz

Application Standard WAP 2.0, JAVA 2.1

2. PERFORMANCE

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2. PERFORMANCE

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2.2 Main Parts : Solution

Item Part name Comment

Digital Baseband PMB8878 (Infineon)

Analog Baseband PMB8878 (Infineon)

RF chip TQ7M5005H (TriQuent))

2.3 H/W features

Item Feature Comment

Form Factor Color LCD – Bar Type

1)Capacity Standard : Li-Ion, 900mAh

Battery

2) Packaging Type : Soft Pack

Size 102.4 x 56.4 x 11.9mm

Weight 91g With Battery

GSM More than 204 hours @paging period 5 Stand-

by time

WCDMA More than 204hours @DRX=7

GSM More than 154min. @ Power Level 5 Talk

time

WCDMA More than 154min. @Tx=12dBm

Charging time Less than 3hours @power OFF/900mAh

Rx sensitivity EGSM900 : -105 dBm

DCS1800 : -105 dBm PCS1900 : -105 dBm

WCDMA2100 : -106.7 dBm GSM/ GPRS

EGSM900 : 32 dBm

DCS1800 : 30 dBm

PCS1900 : 29.5 dBm

Class4 (EGSM900) Class1(DCS) Class1(PCS)

TX output

power

EDGE EGSM900 : 27 dBm

DCS1800 : 26 dBm

PCS1900 : 26 dBm

E2 (EGSM900) E2 (DCS) E2 (PCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

Display Main LCD(3”, 240 x 400)/TFT

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Only for training and service purposes

2. PERFORMANCE

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Item Feature Comment

Built-in Camera AF 5 Mega pixel

ANT Main : Internal Fixed Type

System connector 5 Pin

Ear Phone Jack Φ3.5 4 Pole, Stereo

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Bluetooth V2.1 with A2DP

Voice Recording Yes

Speaker Phone

mode Support

Yes

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable No

T-Flash Yes Not Equipped

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LGE Internal Use Only

2. PERFORMANCE

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2.4 HW Spec.

2.4.1 GSM Transmitter/Receiver spec.

Item Specification

Frequency

GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz

EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz

DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Phase Error

Rms : 5°

Peak : 20 °

Frequency Error

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission

Disturbance)

GSM/DCS : < -28dBm

T

ransmitter Output power and Burst

Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing <3.69us

Spectrum due to modulation out to

less than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out to

larger than 1800kHz offset to the

edge of the transmit band

GSM : 1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection – Speech

channels

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

AM Suppression

-SM : -31dBm - DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

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Only for training and service purposes

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2.4.2 WCDMA Transmitter spec.

Item Specification

Transmit Frequency WCDMA900 : 880 – 915MHz

WCDMA2100 : 1920 MHz ~ 1980 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage

Power Ratio (ACLR)

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

Spurious Emissions

|f-fc| > 12.5 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

< -15 dB at Pout t -20 dBm

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

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2.4.3 WCDMA Receiver spec.

Item Specification

Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz

WCDMA2100 : 2110 ~2170 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity (ACS) ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84 MHz

& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control In Uplink Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

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Only for training and service purposes

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2.4.4 HSDPA Transmitter Spec..

Sub

-

T

est 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

Maximum Output

Power

3GPP Not Complete Error Vector Magnitude

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz

> 43 dB @ ±10 MHz

Adjacent

Channel Leakage

Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Spectrum Emission

Mask

G

HS-DPCCH

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz Transmit Frequency

Specification Item

+/- 2.35 End of CQI4

+/- 0.60 Middle of CQI3

+/- 0.61 Start of CQI2

+/- 2.36 Start of Ack/Nack1

5

Transmitter

power step

tolerance

[dB]

Power

step

size, P

[dB]

Power step slot

boundary

Power

step

Sub-

test in

table

C.10.1.

1 MHz -49dBc 8.5 ~ 12.5 MHz

1 MHz -35-10×(୞f-7.5)dBc 7.5 ~ 8.5 MHz

1 MHz -35-1×(୞f-3.5)dBc 3.5 ~ 7.5 MHz

30 kHz -35-15×(୞f-2.5)dBc 2.5 ~ 3.5 MHz

Measurement

Bandwidth

Minimum requirement

Frequency offset from

carrier ୞

f

2. PERFORMANCE

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LGE Internal Use Only

2. PERFORMANCE

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2.4.5 HSDPA Receiver Spec..

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

Maximum Input Level

(BLER or R), 16QAM Only

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

Receive Frequency

SpecificationItem

- 16 -

Only for training and service purposes

3. BB CIRCUIT TECHNICAL BRIEF

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3. BB Circuit Technical brief

3.1 Functional Block Diagram

[Figure 3.1-1] Functional Block Diagram

Filter

BT

BC6888

T-Flash

RF

EDGE

GSM850/900/1800/1900

26M

UART1

I2S

32K

26M

SDIO

MMC I/F

NAND

DATA(00:15)

16bit MM_AD[0]~[15}

EDGE

PAM

FEM

Transceiver

PMB6952

NAND DAT

A

DIF I/F

DATA(00:15)

SDRAM

1Gbit

Flash

2Gbit

Duplex

UMTS

PAM

WCDMA

SDRAM_ DATA

EBU_ ADDR

ADDR

2.8Inch LCD WQVGA 240x320

2V11_RTC

UMTS 900/2100

MP-EH

PMB8878

VOL, Lock Key, three Kry

MIC1

oztpj

VBACKUP

2.0HS

Audio

Sub system

MAX9877

I2C

USIM

I2C1

USIM I/F

Audio Out

yj}

V

ibrator



|ziV |hy{

yz}Vzwr

ZU\Ȱ lG

I2C1

~

UART

USB

USB_SELECT

I2C2

t|pj

tG|ziG



USB_SELECT

UART TX/RX

{h

SB_BUS

I2C2

1V8.

USIM I/F

8bit CIF(0) (7)

PMIC

PMB6821

1.2FS

32K

Touch

Charge Pump

RT9396

6CH, 4LDO

CAMERA 5MP

jGpj

OzP

i

O`WWhSGsTP

V

U

I2C1

2V62

2V8

3. BB CIRCUIT TECHNICAL BRIEF

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LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

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3.2 Baseband Processor Introduction

[Figure 3.2-1] Top level block diagram of S-GOLD®3H(PMB8878)

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Only for training and service purposes

3. BB CIRCUIT TECHNICAL BRIEF

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3.2.1 General description

S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal

baseband IC combined with a 3G coprocessor IC, providing all analog and digital functionality for a dual

mode mobile phone in a single chip.

Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm CMOS

technology to meet the ever increasing demands of the market for feature rich and high performance

terminals at low costs.

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.

3.2.2 Block Description

z Processing core

- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the

Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate Motion Estimation

algorithms with based video encoding schemes..

- TEAKLite DSP core

z ARM9-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory (I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z TEAKLite®-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

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LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

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z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.

z Controller Bus system

- The processor cores and their peripherals are connected by powerful buses.

- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and

external memories and with the peripheral buses.

- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

- A controller FPI bus for connecting the low performance controller peripherals such as keypad etc. called

hereafter fPI2 bus.

- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with 8channels offloads

the controller from data transfers.

- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called AHB_PER1 and

AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer AHB ‘backbone’ by

asynchronous, burst capable AHB2AHB bridges which are shared between accessing masters.

- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and AHB_PER2 by its

second master interface.

z TEAKLite® Bus System

- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals. Also the

data bus is connected into the controller system via shared RAMs to the FPI3 bus.

- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD®3H. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with four additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

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Only for training and service purposes

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- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

· GMSK Modulator: gauss-filter with B*T=0.3

· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- f8 and f9 Cipher unit

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low-power mode and enhanced CPU modes(idle and sleep modes)

- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly coupled

to the display interface. The resulting building block consisting of 2D engine and Display interface is called

Display Content Controller (DCC)

- Security crypto box supporting

· AES, DES, 3 DES

· Hash function

· RSA acceleration

· Secret Root Key (e-fuse) and Key Management

· True Random Number Generator

- Sample Rate Converter (SRC) for audio up-sampling

- Comprehensive static and dynamic Power Management

· Various frequency options during operation mode

· 32 kHz clock in standby mode

· Sleep control in standby mode

· RAMs and ROMs in power save mode during standby mode

· Additional leakage current reduction in standby mode possible by switching off for the TEAKLitre®

subsystem.

- Extensive debug support for the controller and the DSP system

· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow trace) for ARM

· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®

· Multi-core debug support

· 4 Monitor pins for important internal signals and most pad signals

· Cerberus debugging unit

- 2 General Purpose Timers with 3 32-bit timers

- Serial number

3. BB CIRCUIT TECHNICAL BRIEF

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LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

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- A real time clock with alarm functions

- 2 capture/compare units with 16 channels. One channel active during sleep mode.

- An ITU-R BT.656 compatible Camera Interface

z 3G Coprocessor Subsystem

- ARM7 TRMI-S

· 240 kByte Instruction RAM

· 64 kByte Data RAM

· 8 kByte Boot ROM

- 20kByte Communication RAM

- HW accelerators for

· Transmit Path

· Inner and Outer Receiver for Release5 incl. HSDPA

G

3.2.3 RF Interface(T_OUT)

S-Gold® 3H uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 NA -

T_OUT2 ANT_SEL1

T_OUT3 HOOK_DETECT

T_OUT4 _CHG_EOC

T_OUT5

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2

T_OUT8 ANT_SEL3

T_OUT9 TOUCH_INT

T_OUT10 F_MODE

T_IN0 LCD_BL_CTRL

T_IN1 CHG_EN

- 22 -

Only for training and service purposes

3. BB CIRCUIT TECHNICAL BRIEF

G

3.2.4 ADC channel

ADC block is composed of 11 external ADC channel. This block operates charging process and other related

process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 NC

M3 NC

M4 NC

M5 N.C

M6 N.C

M7 HW revision reserved pin

M8 VBAT (divide resistor) Battery supply voltage measure

M9 N.C

M10 N.C

- 23 -

LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

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3.2.5 GPIO map

Over a hundred allowable resources, T320 is using as follows except dedicated to SIM and Memory. T320

GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in

below table

[Table 3.2.5-1] S-Gold®3H GPIO pin Map

Port Function Net Name Description

*Keypad

KP_IN0 KEYIN0 

KP_IN1 KEYIN1 

KP_IN2 KEYIN2 

KP_IN3 TOUCH_RST 

KP_IN4 NA( GPIO not available) 

KP_IN5 WLAN_HOST_WAKEUP 

KP_IN6 WLAN__RESET_N 

KP_OUT0 KEYOUT0 

KP_OUT1 KEYOUT1 

KP_OUT2 VT_CAM_PWR 

KP_OUT3 NA( GPIO not available) 

*USIF1: Universal Serial IF

*USB

 

USIF1_RXD_MRST UART_RX 

USIF1_TXD_MTSR UART_TX 

USIF1_RTS_N USB_DAT_VP 

USIF1_CTS_N USB_SE0_VM 

*USIF2: Universal Serial IF

 

USIF2_RXD_MRST NA( GPIO not available) 

USIF2_TXD_MTSR RPWRON 

USIF2_RTS_N BT_UART_RTS 

USIF2_CTS_N BT_UART_CTS 

*USIF3: Universal Serial IF

 

USIF3_RXD_MRST UART_BT_RX 

- 24 -

Only for training and service purposes

G

USIF3_TXD_MTSR UART_BT_TX 

USIF3_SCLK NA( GPIO not available) 

*MMCI2: Intrachip

 

MMCI2_CMD MMC_CMD 

MMCI2_DAT[0] MMC_D[0] 

MMCI2_CLK MMC_CLK 

*CIF: Camera Interface

 

CIF_D0 CAM_DATA0 

CIF_D1 CAM_DATA1 

CIF_D2 CAM_DATA2 

CIF_D3 CAM_DATA3 

CIF_D4 CAM_DATA4 

CIF_D5 CAM_DATA5 

CIF_D6 CAM_DATA6 

CIF_D7 CAM_DATA7 

CIF_PCLK CAM_PCLK 

CIF_HSYNC CAM_HSYNC 

CIF_VSYNC CAM_VSYNC 

CLKOUT2 CAM_MCLK 

CIF_PD CAM_STANDBY 

CIF_RESET CAM_RESET 

*Display_Interface

 

DIF_D0 LCD_DATA00 

DIF_D1 LCD_DATA01 

DIF_D2 LCD_DATA02 

DIF_D3 LCD_DATA03 

DIF_D4 LCD_DATA04 

DIF_D5 LCD_DATA05 

DIF_D6 LCD_DATA06 

DIF_D7 LCD_DATA07 

DIF_D8 LCD_ID 

DIF_CS1 NLCD_MAIN_CS 

DIF_CS2 MMC_DETECT 

3. BB CIRCUIT TECHNICAL BRIEF

- 25 -

LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

G

DIF_CD LCD_RS 

DIF_WR NLCD_WR 

DIF_RD NA( GPIO not available) 

DIF_HD BT_HOST_WAKEUP 

DIF_VD LCD_VSYNC 

DIF_RESET1 LCD_RESET 

DIF_RESET2 A_RESET 

*I2C1

 

I2C1_SCL I2C1_SCL 

I2C1_SDA I2C1_SDA 

PM_INT PM_INT 

*I2C2

 

I2C2_SCL I2C2_SCL 

I2C2_SDA I2C2_SDA 

*Chip Card (USIM1)

 

CC_IO SIM_IO 

CC_CLK SIM_CLK 

CC_RST SIM_RST 

*FIrDA:

Fast IrDA

 

IrDA_TX USB_OEN 

IrDA_RX MUIC_INT 

*SWIF

 

SWIF_TXRX NA(GPIO NOT available) 

*MMCI1:

Card Connector

 

MMCI1_CMD WLAN_CMD 

MMCI1_DAT[0] WLAN_SDIO[0] 

MMCI1_CLK WLAN_CLK 

*MMCI1:

SD-Extension

 

MMCI1_DAT[1] WLAN_SDIO[1] 

MMCI1_DAT[2] WLAN_SDIO[2] 

MMCI1_DAT[3] WLAN_SDIO[3] 

- 26 -

Only for training and service purposes

3. BB CIRCUIT TECHNICAL BRIEF

G

*I2S1

 

I2S1_CLK0 BT_PCM_CLK 

I2S1_CLK1 NA(GPIO NOT available) 

I2S1_RX BT_PCM_RX 

I2S1_TX BT_PCM_TX 

I2S1_WA0 BT_PCM_SYNC 

*I2S2

 

I2S2_CLK0 I2S2_CLK 

I2S2_CLK1 BT_RESET_N 

I2S2_RX I2S2_SDO 

I2S2_TX BT_WAKEUP 

I2S2_WA0 I2S2_WS 

I2S2_WA1 NA( GPIO NOT available) 

*Voiceband: Analog Interface

 

EPN1 EPN 

 EPN 

EPP1 EPP 

 EPP 

EPPA1 HSL 

 HSL 

EPREF NA( NOT available) 

 NA( NOT available) 

EPPA2 HSR 

 HSR 

MICN1 MAIN_MIC_N 

MICP1 MAIN_MIC_P 

MICN2 HS_MIC_N 

MICP2 HS_MIC_P 

AUXN1 NA( NOT available) 

AUXP1 NA( NOT available) 

AUXN2 NA( NOT available) 

AUXP2 NA( NOT available) 

AUXGND GND(bypass cap, 0.2u) 

- 27 -

LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

G

VMICP VMIC_P 

VMICN VMIC_GND 

*I/Q-Signale: Analog Interface,

Baseband

 

PAOUT1-1 NA( NOT available) 

PAOUT1-2 PA_LEVEL 

BB_I 2G_IP 

BB_IX 2G_IN 

BB_Q 2G_QP 

BB_QX 2G_QN 

*Measurement

 

M_0 BAT_ID 

M_1 RF_TEMP 

M_2 NA( NOT available) 

M_3 NA( NOT available) 

M_4 NA( NOT available) 

M_5 NA( NOT available) 

M_6 NA( NOT available) 

M_7 HW revision reserved pin 

M_8 VBAT (divide resistor) 

M_9 NA( NOT available) 

M_10 NA( NOT available) 

*Bandgap reference: Analog

Interface

 

VREFP VREFN 

IREF GND (22K, 2%) 

*JTAG

 

TDO TDO 

TDI TDI 

TMS TMS 

TCK TCK 

TRST_n TRSTN 

RTCK RTCK 

*Debug

 

- 28 -

Only for training and service purposes

G

TRIG_IN TRIG_IN , 2V62_VIO, 1K PU 

MON1 2V62_VIO, 1K PU 

MON2 GND, 10K PD 

TRACESYNC TRACESYNC 

TRACECLK TRACECLK 

PIPESTAT[2] PIPESTAT2 

PIPESTAT[1] PIPESTAT1 

PIPESTAT[0] PIPESTAT0 

TRACEPKT[0] TRACEPKT0 

TRACEPKT[1] TRACEPKT1 

TRACEPKT[2] TRACEPKT2 

TRACEPKT[3] TRACEPKT3 

TRACEPKT[4] TRACEPKT4 

TRACEPKT[5] TRACEPKT5 

TRACEPKT[6] TRACEPKT6 

TRACEPKT[7] TRACEPKT7 

*External Bus Interface (EBU)

 

MEM_WAIT_n _WAIT 

MEM_ADV_n BA1 

MEM_RD_n _RD 

MEM_AD[0] DATA[0] 

MEM_AD[1] DATA[1] 

MEM_AD[2] DATA[2] 

MEM_AD[3] DATA[3] 

MEM_AD[4] DATA[4] 

MEM_AD[5] DATA[5] 

MEM_AD[6] DATA[6] 

MEM_AD[7] DATA[7] 

MEM_AD[8] DATA[8] 

MEM_AD[9] DATA[9] 

MEM_AD[10] DATA[10] 

MEM_AD[11] DATA[11] 

MEM_AD[12] DATA[12] 

3. BB CIRCUIT TECHNICAL BRIEF

- 29 -

LGE Internal Use Only

3. BB CIRCUIT TECHNICAL BRIEF

G

MEM_AD[13] DATA[13] 

MEM_AD[14] DATA[14] 

MEM_AD[15] DATA[15] 

MEM_CS0_n _NAND_CS 

MEM_CS1_n _RAM_CS 

MEM_CS2_n NA(NOT available) 

MEM_CS3_n _CS3 

MEM_WR_n _WR 

MEM_A[16] ADD[16] 

MEM_A[17] ADD[17] 

MEM_A[18] ADD[18] 

MEM_A[19] ADD[19] 

MEM_A[20] ADD[20] 

MEM_A[21] ADD[21] 

MEM_A[22] ADD[22] 

MEM_A[23] ADD[23] 

MEM_A[24] ADD[24] 

MEM_A[25] ADD[25] 

MEM_A[26] ADD[26] 

MEM_CSA0_n ADD[27] 

MEM_CSA1_n ADD[28] 

MEM_CSA2_n ADD[29] 

MEM_CSA3_n BA0 

MEM_BFCLKO1 BFCLKO 

MEM_BFCLKO2 SDCLKI 

MEM_SDCLKO SDCLKO 

MEM_BC0_n _BC0 

MEM_BC1_n _BC1 

MEM_BC2_n LDQS 

MEM_BC3_n UDQS 

MEM_A[0] ADD[0] 

MEM_A[1] ADD[1] 

MEM_A[2] ADD[2] 

- 30 -

Only for training and service purposes

G

MEM_A[3] ADD[3] 

MEM_A[4] ADD[4] 

MEM_A[5] ADD[5] 

MEM_A[6] ADD[6] 

MEM_A[7] ADD[7] 

MEM_A[8] ADD[8] 

MEM_A[9] ADD[9] 

MEM_A[10] ADD[10] 

MEM_A[11] ADD[11] 

MEM_A[12] ADD[12] 

MEM_A[13] ADD[13] 

MEM_A[14] ADD[14] 

MEM_A[15] ADD[15] 

MEM_RAS_n _RAS 

MEM_CAS_n _CAS 

MEM_CKE CKE 

*FCDP: Flash Controller DMA

Port

 

FCDP_RBn FCDP 

*Flash Write Protection

 

FWP _WP 

*GSM TDMA Timer: GSM Control

 

T_OUT0 TXON_PA 

T_OUT1 NA(GPIO NOT available) 

T_OUT2 ANT_SEL1 

T_OUT3 HOOK_DETECT 

T_OUT4 _EOC 

T_OUT5 WLAN_REG_ON 

T_OUT6 PA_MODE 

T_OUT7 ANT_SEL2 

T_OUT8 ANT_SEL3 

T_OUT9 TOUCH_INT 

T_OUT10 F_MODE 

3. BB CIRCUIT TECHNICAL BRIEF

- 31 -

LGE Internal Use Only

LG T320 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual