LG RD-JS31 User Manual

Website : http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.h

MODEL : RD-JS31

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An lsolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitary that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Due to high vacuum and large surface area of picture tube, extreme care should be used in handling the Picture Tube. Do not lift the Picture tube by it's Neck.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate high impedance HV meter.

Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate

23.5

!1.5KV: 14-19 inch, 26!1.5KV: 19-21 inch,

29.0

!1.5KV: 25-29 inch, 30.0 ! 1.5KV: 32 inch

If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on positioin, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each esposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits sepcified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the Picture Tube. For continued X-RAY RADIATION protection, the replacement tube must be the same type tube as specified in the Replacement Parts List.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heatsink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some fieldeffect

transistors and semicounductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficent to demage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a repalcement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the ieads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION:Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the bruching together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintan tip temperature within the range or 500cF to 600cF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thorohly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500cF to 600cF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuiboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500cF to 600cF)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

SERVICING PRECAUTIONS

c. Qulckly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess

or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in parapraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suctiontype solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit boare.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heatsink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heatsink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicula y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involoves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

tion may be reproduced, tran smitted, tra nscribed, stored in a retrieval syste m, or translated into a ny la nguage or computer la nguage, in a ny f orm or by a ny mea n s, electronic, mecha nical, magnetic, optical, chemical, ma nual or otherwise, without the prior written permission of LG.

Disclaimer

The information in this guide is subject to cha nge without notice. LG makes no representations or warrantie s, e ither expressed or i mplied, with respect to the contents here of a nd specifically disclai ms a ny warranties of merchantability or f itness f or a ny particular purpose. Any LG software described in this manual is sold or licensed “as is”. Should the programs prove defective following their purchase, the buyer (and not LG, itsdistributor , or its dealer) a ssumes the entire cost of all nece ssary servicing, repair , and any incidental or consequential damages resulting from any defect in the software.

LG is a registered trademark of LG Corporation. Intel is a registered trademark of Intel Corporation. Pentium and Pentium II/III are trad emarks of Intel Corporation. Other brand a nd product names are trademarks and/or registered trademarks of their respective holders.

Conventions

The following conventions are used in this ma nual

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Table of Contents

Chapter 1 System Introduction 1

T echnical Spe cification .......................................................................................................1

System Block Diagra m .......................................................................................................3

Optics Conceptual Drawing................................................................................................4

Cha pter 2 Firmware Update 5

Setup T ool / Equi pment.......................................................................................................5

Upgrading Procedure .........................................................................................................6

Chapter 3 M achine Dissassembly and Repla ce ment 7

General Information ............................................................................................................8

Disa ssemble La mp Module................................................................................................9

Disa ssemble IO Cover ......................................................................................................10

Disa ssemble T op Cover and Front Fa n............................................................................1 1

Disa ssemble Main Board..................................... ..............................................................12

Disa ssemble Middle Cover...............................................................................................13

Disa ssemble Balla st Module..............................................................................................14

Dissa ssemble Optical Engine ..........................................................................................15

Disa ssemble Power Outlet Set..........................................................................................16

Disa ssemble Power Board................................................................................................17

Disa ssemble Foot Screw Assembly................................................................................. 18

Exploded Overview...........................................................................................................19

Chapter 4 Trouble shooting 20

Video Signal troubleshooting............................................................................................21

Operation FunctionTroubleshooting..................................................................................24

Power SourceTroubleshooting..........................................................................................25

Function T est a nd Align ment...............................................................................................26

Equipment Needed...................................................................................................26

T est Condition............................................................................................................26

Display Modes a nd Patterns ............................................................................................27

Compatible Modes ...................................................................................................27

Function T e st Display Pattern...................................................................................28

Table of Contents

Cha pter 5 Connector Inf ormation 30

Introduction...........................................................................................................................30

Main Board......................................................................................................................... 30

Power Board .....................................................................................................................37

Balla st Board ......................................................................................................................39

Cha pter 6 Re pla ce ment Parts List 40

RPL......................................................................................................................................40

Chapter 7 LED indicator f or RD-JS31.....................................................................................45

System Introduction

Technical Specification

Item Description

Display Type Single Panel 0.55" DLP Projector

Lamp Type P-VIP 200W

Brightness 1500 ANSI Lumen

Contrast Ratio 1200 : 1(Full on/off)

Resolution(Pixels) 800 x 600( 480,000 dot x 1)

Uniformity 85 %

Chapter

Optical Compensation Light Tunnel

Focal Length 20.2 ~ 24.2 mm

Screen Size 100"@3.67m

Throw Distance 1.2 ~ 10 Meter

Projection Type

Compatibility

Keystone Correction Vertical: +/-15 (In Wild mode +/-10)

Audio System 2W x 1

Front, Rear, Ceiling

"Horizontal frequency (31~79KHz" )

"Vertical frequency ( 50~85Hz" )

Pixel Rate 108 MHz

Aspect Ratio 16:9 , 4:3

Video Input PAL , NTSC , SECAM

Input Source Computer , HDTV , S-Video , Video

Analog RGB (Input Signal) D-Sub Connector

1 Chapter 1

Item Description

Operation Humidity 35~85%

3:2 Pull Down

Progressive Scan

Blank

Other Key Feature

Auto Source Detection

Auto Tracking/Sync.

Plastic Body

Sound Noise <30dBA (In ECO mode)

Power Requirement 100~240v, 50~60Hz

Dimension(W x D x H) 274 x 210 x 104 mm

Weight 2.2 KG (<4.5 lb)

Remote Mouse Multifunctional

OSD Language

Power Consumption 250 W

Operation Temperature +5 ~ +35C

Certification

English, French, German, Swedish, Russian, Italian, Spanish, Simplified Chinese, Korean, Portuguese,

UL/ cUL, GS, CB, MIC, CE , FCC Class B , SABS, PSB, GOST, C-Tick, CCC,

Chapter 1 2

System Block Diagram

3 Chapter 1

Optics-Conceptual Dra wing

Lens Assembly (3680V00116H)

Mirror

Aspherical Lens-C2

DMD (0.55 inch)

DMD PCB

Heatsink

Light Tunnel

Aspherical

Lamp Housing

Color WheelLens-C1

Osram Lamp (6912B22006E)

FAN (5900V03002K)

Thermal PCB (6871VSN257R)

Chapter 1 4

Firmware Upgrade

This cha pter provides the equi pment needed, setup and upgrading procedure for Firmware upgrade.

Setup Tool / Equipment

1. Computer

2. USB Cable (see right picture)

3. Power Coard

Upgrading Procedure

Chapter 2

1. Connect Downloa d Cable to proje ctor

2. Open burning progra m (DLP Composer Lite)

5 Cha pter 2

3. After turn on AC switch, pre ss the buttons a ccording to below sequence s Menu -> Auto -> Menu -> Source -> Menu -> OK

4. Click the Start Download button a nd then start to burning of program .

5. Completion of Burning than re move Power Cord a nd Burning Cord .

Chapter 2 6

Cha pter

Machine Disassembly and Replacement

This section provides disassembly procedures for RD-JS31 DLP P rojector. Before you begin any of these procedures, be sure to turn off the power, computer system, and other attached devices; then disconnect the pow er cable from the electronically outlet. Moreover, when you disassemble the projector, be sure to put the screws in a safe place and separate them according to grouping.

Tool Needed

Long Nose Nipper

Hex Sleeves 5mm

Screw Bit (+) : 107 Screw Bit (+) : 101 Screw Bit (+) : 102

Item PHOTO

7 Ch apter 3

General Information

Befor e You Begin

Before proceeding with the disassembly procedure, make sure that you do the following:

1. Turn off the power to the system and all peripherals.

2. Unplug the AC adapter and all power and signal cables from the system.

3. Wear Anti-static wrist strap.

Chapter 3 8

Disassemble Lamp Module

Note:Unplug all the cord before disassembling the P rojector.

1. Loosen two screws of Lamp Cover

2. Remove Lamp Cover

3. Loosen two screws of Lamp Module .

4. Grasp the lamp handle and pull out Lamp Module

01635-B77*2

3580V00094K

P2034-454

P6184-0002 3110V00321H

9 Ch apter 3

Disassemble IO Cover

1. Remove 3 screws of IO cover.

2. Separate all parts individually

3720V00206E

1. Remove the 2 screws on middle cover

2. Remove the 2 screws on botton cover

01635-367*2

01635-D21*2

Chapter 3 10

Disassemble Top Cover

1. Dispatch the top cover

2. Remove the FFC cable and main board mylar

3110V00320N

P6134-7000-00

P6144-0002

02591-0014-00

Disassemble Front Fan

1. Then life up the fan set directly .

5900V03002L

P6145-0002

11 Ch apter 3

Disassemble Main Board

1. Remove the 4 screws of main board .

2. Unplug all wires on the board (Main Board P IN location of connectors pls refer to Chapter 5 )

3. Remove the Main Board.

01635-366*4

6871VMN657M

Chapter 3 12

Disassemble Middle Cover

1. Unscrew two screws of the Middle cover.

2. Unplug all wires

3. Remove the Middle cover module

3110V00321J

01635-367*2

13 Ch apter 3

Disassemble Ballast Module

1. Unplug all wires on Ballast Module (Ballast Board PIN location of connectors pls refer to Chapter 5 )

2. Unscrew 6 screws on Ballast Module.

3. Remove the Ballast Module.

6316000005E

Chapter 3 14

Disassemble Optical Engine

1. Unplug the wire inside.

2.. Unscrew four screws on Optical Engine.

3. Then remove the Engine Module.

4. Be careful don’t let the Engine go down due to the heavy machine.

3680V00075G P1684-0003

01635-A01 *4

15 Ch apter 3

+ 52 hidden pages