LG MDT505 Diagram

MODEL: MDT505(MDS505V/W)SERVICE MANUAL
Internal Use Only
Website http://biz.lgservice.com
MINI HOME THEATER
SERVICE MANUAL
MODEL:
CAUTION
BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS” IN THIS MANUAL.
MDT505 (MDS505V/W)
CONTENTS
SECTION 1 ........ GENERAL
SECTION 2 ........ CABINET & MAIN CHASSIS
SECTION 3 ........ ELECTRICAL
SECTION 4 ........ REPLACEMENT PARTS LIST
1-1
SECTION 1. GENERAL
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
Storage in conductive bag
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
NEVER look directly at the laser beam, and don’t allow contact with fingers or other exposed skin.
5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton swab should be used, taking care not to distort lens.
Drop impact
Pressure
Magnet
How to hold the pick-up
Cotton swab
Conductive Sheet
6) Never attempt to disassemble the pick-up. Spring has excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
1-2
Pressure
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature or humidity is high, where strong magnet­ism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded. When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1 MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent stat­ic electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Armband
Resistor (1 MΩ)
Resistor (1 MΩ)
Conductive Sheet
1-3
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE LITERATURE.
1-4
SERVICE INFORMATION FOR EEPROM
POWER ON
DVD LOGO status
(N0 disc status)
Remote control
pause keyÖ1Ö4Ö7Ö2 in order
Press number 0~9, press character
A~F (1~6 for a while)
Use arrow key (▲/▼/◀/▶) to
move to appropriate position and
make changes
Press pause key once
DETECT NEW EEPROM (OPTION EDIT SCREEN)
NAME
OPT 1 OPT 2 OPT 3 OPT 4 OPT 5 OPT 6 OPT 7 OPT 8 OPT 9 OPT A
HEX
A5 06 85 B4 00 08 91 01 80 00
Change will be applied when power OFFÖON
1-5
HOW TO UPDATE AUDIO MICOM & DVD PROGRAMS
1. How to update AUDIO MICOM program.
[Update using CD]
1. Change the filename to download as “MDS715_(Version).HEX”. Only upper cases are permitted.
ex) MDS715 : “MDS715_0709081.HEX”
2. Copy the file to the root folder of a CD and burn it.
3. Insert the CD to the SET, and move to the DVD function.
Then the upgrade process will be started with the upgrade information.
4. If the upgrade process is complete, the set will be rebooted with “Complete” message.
[Update using USB]
1. Change the filename to download as “MDS715_(Version).HEX”. Only upper cases are permitted.
ex) MDS715 : “MDS715_0709081.HEX”
2. Copy the file to the root folder of USB storage.
3. After Home-menu is displayed on Screen of SET, Put the USB into the SET.
Then the upgrade process will be started with the upgrade information.
4. If the upgrade process is complete, the set will be rebooted with “Complete” message.
2. How to update DVD program.
[Update using CD]
1. Copy DVD program(ex: LG_MDS715LD1_Version.Rom) to Root folder of CD, and burn it.
ex) P:LG_MDS715LD1_0911180.Rom
2. Insert the CD to the SET, then after a while the CD tray will be opened with upgrade information on
the screen.
3. Remove the CD, and press “PLAY” key in remote controller.
4. Remove and reconnect the power cable when it changes to logo screen from upgrade information.
Then the upgrade process is completed.
[Update using USB]
1. Copy DVD program(ex: LG_MDS715LD1_Version.Rom) to Root folder of the formatted USB and burn it.
ex) P:\LG_MDS715LD1_0911180.Rom
2. After Home-menu is displayed on Screen of SET, Put the USB into the SET.
Then the upgrade process will be started with the upgrade information.
3. Remove the USB, press "PLAY" key of the remote controller.
4. Remove and reconnect the power cable when it changes to logo screen from upgrade information.
Then the upgrade process is completed.
1-6
SPECIFICATIONS
• GENERAL
Power supply 110~240 V, 50/60 Hz
Power consumption Refer to main label
Dimensions (W x H x D) 273 x 333 x 339 mm without foot
Net Weight (Approx.) 5.7 kg
Operating temperature 41 °F to 95 °F (5 °C to 35 °C)
Operating humidity 5 % to 90 %
Bus Power supply (USB) DC 5V 500mA
• INPUTS/ OUTPUTS
VIDEO OUT 1.0 V (p-p), 75 Ω, sync negative, RCA jack x 1
COMPONENT VIDEO OUT (Y) 1.0 V (p-p), 75 Ω, sync negative, RCA jack x 1,
(Pb)/(Pr) 0.7 V (p-p), 75 Ω, RCA jack x 2
ANALOG AUDIO IN 0.6 Vrms, 47 kΩ, RCA jack (L, R) x 1
PORT. IN 0.5 Vrms (3.5 mm stereo jack)
• TUNER
FM Tuning Range 87.5 to 108.0 MHz or 87.50 to 108.00 MHz
AM Tuning Range 522 to 1 620 kHz, 520 to 1 710 kHz or 522 to 1 710 kHz
• AMPLIFIER
Stereo mode 150 W + 150 W (4 Ω at 1 kHz)
Surround mode
Front 150 W + 150 W (4 Ω at 1 kHz)
Center 70 W (6 Ω at 1 kHz)
Surround 70 W + 70 W (6 Ω at 1 kHz)
Subwoofer 200 W (3 Ω at 60 Hz)
1-7
• SPEAKERS Front speaker (MDS505V)
rekaeps 2 yaW 2 epyT
4 ecnadepmI Ω
Rated Input Power 150 W
W 003 rewop tupnI .xaM
Net Dimensions(W x H x D) 240 x 387 x 336 mm
gk 5 thgieW teN
Passive Subwoofer (MDS505W)
rekaeps 1 yaW 1 epyT
3 ecnadepmI Ω
Rated Input Power 200 W
W 004 rewop tupnI .xaM
Net Dimensions(W x H x D) 261 x 331 x 409 mm
gk 5.6 thgieW teN
1-8
SECTION 2
CABINET & MAIN CHASSIS
CONTENTS
EXPLODED VIEWS..................................................................................................................................... 2-3
1. CABINET AND MAIN FRAME SECTION (MDT505) ................................................................................ 2-3
2. TAPE DECK MECHANISM SECTION ...................................................................................................... 2-5
3. DVD DECK MECHANISM SECTION (DVM-H1723) ................................................................................ 2-7
4. SPEAKER SECTION .............................................................................................................................. 2-11
5. PACKING ACCESSORY SECTION .......................................................................................................2-13
2-1
MEMO
2-2
EXPLODED VIEWS
1. CABINET AND MAIN FRAME SECTION (MDT505)
272
iPod
464
A45
251
260
259
254
255
256
261
257
252
262
A42
263L
464
261
464
258
250
270L
FRONT
271
464
269
464
464
265
264
J
E
270R
CABLE1
263R
A43
USB
P
A26
A26
A
276
A26
274
464
B
463
A
B
463
O
464
MAIN
C
D
F
464
463
273
E
G
H
P
I
275
A46
J
464
279
455
VOLUME
253
CABLE2
464
A00
278
CABLE3
SMPS
N
463
464
451
A44
277
L
L
C
D
464
F
A47
464
O
464
CABLE4
464
G
I
H
268
N
300
464
CABLE5
M
M
267A
267A
464
266
464
464
267
267
2-3 2-4
2. TAPE DECK MECHANISM SECTION (A/R & A/S : RIGHT A/R DECK)
A00
009
003
001
007
037
015
006
017
020
019
022
018
A01
023
025
011
A02
009
2-5 2-6
3. DVD DECK MECHANISM SECTION (DVM-H1723)
151
A26
153A
159
156
153
177
167
172
166
170
162
163
175
164
181
165
155
173
180
169A
169B
169C
430
012
A02
012
010
137
A01
430
012
430
035
2-7 2-8
MEMOMEMO
2-9 2-10
4. SPEAKER SECTION
4-1. FRONT SPEAKER (MDS505V)
A60
2-11
4-2. PASSIVE SUBWOOFER (MDS505W)
A90
2-12
5. PACKING ACCESSORY SECTION
808 Battery
811 RCA Cable, 1 Pin(Black)
900 Remote Control
803 Packing, Casing
824 AM Loop Antenna
825 FM Wire Antenna
801 Owner’s Manual
804 Bag
802 Box
2-13
MEMO
2-14
SECTION 3
ELECTRICAL
CONTENTS
ELECTRICAL TROUBLESHOOTING GUIDE .................................................................................... 3-2
DETAILS AND WAVEFORMS ON SYSTEM TEST AND DEBUGGING ................................ 3-16
WIRING DIAGRAM ................................................................................................................................... 3-29
BLOCK DIAGRAM .................................................................................................................................... 3-31
CIRCUIT DIAGRAMS ............................................................................................................................... 3-33
1. SMPS - POWER CIRCUIT DIAGRAM ................................................................................................. 3-33
2. MAIN - MICOM CIRCUIT DIAGRAM .................................................................................................... 3-35
3. MAIN - PWM CIRCUIT DIAGRAM ....................................................................................................... 3-37
4. MAIN - AMP CIRCUIT DIAGRAM ........................................................................................................ 3-39
5. MAIN - DECK CIRCUIT DIAGRAM ...................................................................................................... 3-41
6. MAIN - MPEG CIRCUIT DIAGRAM ..................................................................................................... 3-43
7. MAIN - SERVO CIRCUIT DIAGRAM ................................................................................................... 3-45
8. MAIN - I/O CIRCUIT DIAGRAM ........................................................................................................... 3-47
9. VFD CIRCUIT DIAGRAM ..................................................................................................................... 3-49
10. MIC & USB CIRCUIT DIAGRAM .......................................................................................................... 3-51
11. VOLUME CIRCUIT DIAGRAM ............................................................................................................. 3-53
12. IPOD CIRCUIT DIAGRAM (OPTIONAL PART) ................................................................................... 3-55
13. KARAOKE CIRCUIT DIAGRAM (OPTIONAL PART) ........................................................................... 3-57
CIRCUIT VOLTAGE CHART ................................................................................................................. 3-59
PRINTED CIRCUIT BOARD DIAGRAMS ......................................................................................... 3-61
1. MAIN P.C.BOARD ................................................................................................................................ 3-61
2. SMPS P.C.BOARD ............................................................................................................................... 3-65
3. FRONT(VFD / USB & MIC / VOLUME) P.C.BOARD ........................................................................... 3-67
4. IPOD P.C.BOARD (OPTIONAL PART) ................................................................................................ 3-69
5. KARAOKE P.C.BOARD (OPTIONAL PART) ....................................................................................... 3-69
3-1
ELECTRICAL TROUBLESHOOTING GUIDE
1. SMPS BOARD
No power.
Check the AC
line pattern.
YES
Check fuse F901.
YES
Check C978
voltage (3.9 V).
YES
Check C963
voltage (5.6 V).
YES
NO
NO
NO
NO
Connect the open line.
Replace F901.
Check BD901 “+”
to “
-
” Pin impedance .
Check 3.7 V lines short.
Replace PC972, IC902’s components.
Check SMPS second part lines short.
Check MAIN or AMP board short.
Low impedance:
Replace IC901, BD901.
Check IC901
Vcc voltage (10 V ~ 30 V).
YES
Replace SMPS board.
NO
Replace PC951, PC972, IC901.
Check around IC901’s components
(Short, Open).
3-2
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