BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS”
IN THIS MANUAL.
0102,SEPTEMBER21827947NFA:ON/P
MDT505 (MDS505V/W)
Page 2
CONTENTS
SECTION 1 ........ GENERAL
SECTION 2 ........ CABINET & MAIN CHASSIS
SECTION 3 ........ ELECTRICAL
SECTION 4 ........ REPLACEMENT PARTS LIST
1-1
Page 3
SECTION 1. GENERAL
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
Storage in conductive bag
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
NEVER look directly at the laser beam, and don’t allow
contact with fingers or other exposed skin.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton
swab should be used, taking care not to distort lens.
Drop impact
Pressure
Magnet
How to hold the pick-up
Cotton swab
Conductive Sheet
6) Never attempt to disassemble the pick-up.
Spring has excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab.
(Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much
of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
1-2
Pressure
Page 4
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature or humidity is high, where strong magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1 MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Armband
Resistor
(1 MΩ)
Resistor
(1 MΩ)
Conductive
Sheet
1-3
Page 5
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate
static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
1. MAIN P.C.BOARD ................................................................................................................................ 3-61
DETAILS AND WAVEFORMS ON SYSTEM TEST AND DEBUGGING
4
1
2
3
1. SYSTEM 27 MHz CLOCK,RESET,FLASH R/W SIGNAL
1)
MT1389SE/GH
2)
MT1389SE/GH
Power Cord in
main clock is at 27 MHz(X500)
1
FIG 1-1
reset is high active.
P_CTL
DVD_RST
RESET_IN
2
3
4
FIG 1-2
3-16
Page 36
3) Flash R/W enable signal during download(Downloading)
5
6
7
5
SF_DI
SF_DO
2. SDRAM CLOCK
1)
MT1389SE/GH
DCLK = 93 MHz, Vp-p = 2.2, Vmax = 2.7 V
main clock is at 27 MHz(X500)
6
FIG 1-3
SDCLK
7
FIG 2-1
3-17
Page 37
3. VIDEO PART-1 (100% FULL COLOR-BAR)
89
11
8
10
9
10
CVBS_IY
11
PbPr
3-18
Page 38
4. VIDEO PART-2 (100% FULL COLOR-BAR)
1213
1415
12
14
13
CVBSCOMP_Y
15
COMP_PbCOMP_Pr
3-19
Page 39
5. SERVO OPEN/CLOSE SIGNAL
17
16
1918
1) Tray open/close waveform
OPENSW
CLOSESW
OPEN
CLOSE
FIG 5-1
3) Tray open waveform
OPENSW
2) Tray close waveform
OPENSW
16
CLOSESW
17
OPEN
18
19
16
CLOSE
FIG 5-2
16
17
18
19
CLOSESW
OPEN
CLOSE
17
18
19
FIG 5-3
3-20
Page 40
20
22
23
21
6. SLED CONTROL RELATED SIGNAL (NO DISC CONDITION)
SLD
M-STBY
SL+
SL-
FIG 6-1
20
21
22
23
3-21
Page 41
7. LENS CONTROL RELATED SIGNAL(NO DISC CONDITION)
24
26
25
28
27
29
FOD
F+
F-
24
25
26
FIG 7-1
8. LASER POWER CONTROL RELATED SIGNAL(NO DISC CONDITION)
MDI1
DVDLD
CDLD
FIG 8-1
27
28
29
3-22
Page 42
9. DISC TYPE JUDGEMENT WAVEFORMS
30
32
31
F+
PU_DET
RF
FIG 9-1 (DVD)
F+
PU_DET
30
31
32
31 : This signal can see using special debug program
30
31
RF
32
FIG 9-2 (DVD)
3-23
Page 43
F+
35
34
33
33
PU_DET
RF
F+
PU_DET
RF
34
35
FIG 9-3 (CD)
34 : This signal can see using special debug program
33
34
35
FIG 9-4 (CD)
3-24
Page 44
10. FOCUS ON WAVEFORMS
37
39
38
36
36 : This signal can see using special debug program
PU_DET
FOD
F+
F-
PU_DET
FOD
F+
F-
36
37
38
39
FIG 10-1 (DVD)
36
37
38
39
FIG 10-2 (CD)
3-25
Page 45
40
4241
11. SPINDLE CONTROL WAVEFORMS (NO DISC CONDITION)
FIG 11-1
SPinD
40
SP-
41
SP+
42
3-26
Page 46
4645
44
12. TRACKING CONTROL RELATED SIGNAL(System checking)
43
43 : This signal can see using special debug program
PU_DET
PU_DET
43
TRO
TRO
44
T-
T+
T-
T+
PU_DET
TRO
45
46
FIG 12-1(DVD)
PU_DET
43
TRO
44
T-
45
T+
46
FIG 12-2(CD)
3-27
Page 47
MEMO
3-28
Page 48
MIC/USB
PCB
JOG PCB
WIRING DIAGRAM
TUNER
MODULE
DC FAN
AUX
JACK
23P
CN400
2P
23P
15P
CN401
3 CD CHANGER MD
P7708
2P
5.1 CH SPK TERMINAL
SMPS PCB
MAIN
PCB
8P
PN102
CN301
8P
P1001
PN301
36P
9P
P8502
6P
DECK
MECHANISM
5P
36P
CN302
5P
8P
P8501
PN304
CN200
4P
15P
PN201
15P10P
CN102
2P
CN502
FRONT PCB
CN501
CN101
7P
PN101
IPOD PCB
CN202
CN952
CN951
3-293-30
2P
KARAOKE
PCB
Page 49
BLOCK DIAGRAMS
DECK S/W
PLAY/REC L/R
Deck
SOL/MOTOR
REC_BIAS
EXP_DATA,CLK
REC/PB_MUTE
HA12237F
Cassette
Deck ASP
TAPE
S-24CS16A01
REC_L/R
EEPROM
REMOCON
MODULE
HALL,LEAF
MCLK,BCLK
LRCLK,DATA
EEPROM
DATA,CLK
9.8304 MHz
LC87F5N
C8A
AUDIO
MICOM
(3.3V)
SPI(4P)DVD_RST
KIA7027
RESET
KIA7027
PWR_SENS
DSP_BSY
DSP_IBO
PWM_RST
DATA,CLK
PWM/DSP_CLK
PWM/DSP_DATA
PS9850
DSP/
PWM
Modulat
AMP_SD
AMP_OTW
AMP_PDN
Power Amp
FAN_AD
FAN
FAN_CTRL
FL
FR
S/W
TAS5614
RR
C/T
RL
Tuner
Aux-IN
Portable
IPOD
USB
MIC
H/PHONE
Composite
Component
D+, D-
IPOD VIDEO
/ CVBS
R/G/B
PR/Y/PB
NJM2505
VIDEO NOISE
ISOLATION
S4308
OP AMP
MC4580
OP AMP
THS7314
VIDIO FUNC
CS5346
ADC
H/P_ L/R
UART
NLASB
3157
DFT2G
VIDEO SW
LRCLK, BCLK
MCLK
5346_DATA
MIC L/R
IPOD VIDEO
CVBS
Y/G
Pb/B
Pr/R
27 MHz
MTK1389GH
MPEG
DATA
CP2.0
IPOD
RST,CLK
HY57V
64614
20HG
SDRAM
DMA[0-10]
DB[0-15]
SCL
W25Q
16BY
FLASH
SDA
KSC24
1021CS
EEPROM
SCL
SDA
6302_DO
6302_DI
OPEN/CLOSE
FOCUS/SLED
SPINDLE/TRACKING
6315_CLK
6315_STB
PT6302
VFD
DRIVER
GR[1-12]
SG[1-16]
VFD
MD_DVD, MD_CD
LD_DVD, LD_CD
VR_DVD, VR_CD
Motor
Driver
S3053
/S8082
A, B, C, D, E, F, RF
F+/-, T+/-
SLED+/SPINDLE+/LOAD+/OPEN/CLOSE
PICK-UP
Motor
MDS715:5.1ch
MDT505:2.1ch
MDD305 : 2ch
TJ3965D
3.3V LDO
TO
PWM/TUNE
R
KIA78R05
5V
TO USB
LM39102
5V LDO
TO IPOD
LM39102
5V LDO
TO MPEG
MO8706EN
DC/DC3.3V
TO MPEG
3-313-32
Page 50
CIRCUIT DIAGRAMS
1. SMPS - POWER CIRCUIT DIAGRAM
12
11
10
9
8
IMPORTANT SAFETY NOTICE
WHEN SERVICING THIS CHASSIS, UNDER NO
CIRCUMSTANCES SHOULD THE ORIGINAL DESIGN BE
MODIFIED OR ALTERED WITHOUT PERMISSION
FROM THE LG CORPORATION. ALL COMPONENTS
SHOULD BE REPLACED ONLY WITH TYPES IDENTICAL
TO THOSE IN THE ORIGINAL CIRCUIT. SPECIAL
COMPONENTS ARE SHADED ON THE SCHEMATIC
FOR EASY IDENTIFICATION.
THIS CIRCUIT DIAGRAM MAY OCCASIONALLY DIFFER
FROM THE ACTUAL CIRCUIT USED. THIS WAY,
IMPLEMENTATION OF THE LATEST SAFETY AND
PERFORMANCE IMPROVEMENT CHANGES INTO
THE SET IS NOT DELAYED UNTIL THE NEW SERVICE
LITERATURE IS PRINTED.
NOTE :
1. Shaded(
2. Voltages are DC-measured with a digital voltmeter
) parts are critical for safety.
Replace only with specified part number.
during Play mode.
7
6
5
4
3
2
CAUTION:
Danger if fuse is incorrectly replaced.
1
A
Replace only with the type identical to fuse rating
and(or) model name described in main label.
BCDEFGHIJKLMNOPQRST
Warning
Parts that are shaded are critical with
respect to risk of fire or electrical shock.