1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
Storage in conductive bag
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
NEVER look directly at the laser beam, and don’t allow
contact with fingers or other exposed skin.
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton
swab should be used, taking care not to distort lens.
6) Never attempt to disassemble the pick-up.
Spring has excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab.
Drop impact
Pressure
Magnet
How to hold the pick-up
Cotton swab
Conductive Sheet
(Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much
of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
1-3
Pressure
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature or humidity is high, where strong magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1 MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Armband
Resistor
(1 MΩ)
Resistor
(1 MΩ)
Conductive
Sheet
1-4
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate
static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
Important Notice :
When ugrade the software running. Do not shunt down the power, it tmay damage the unit.
1. MICOM UPGRADE
1) Copy the software file into USB flash, as the file name is LG_MDT355__XXXXXXX.HE
2) Insert the USB flash into USB host.
3) Set Function to USB position.
Appear onto VFD
UPGRADE
4) After finish, Set will automatically power off.
2. FLASH MEMORY UPGRADE
1) Copy the software file into USB flash, As the file name is LG_MDT355__XXXXXXX.RO
2) Insert the USB flash into USB host.
3) Set Function to USB position.
Appear onto VFD
CODE 00
NO USB
4) Manual Power off and Power on is finish.
1-7
SPECIFICATIONS
• GENERAL
Power supply Refer to main label.
Power consumption Refer to main label.
Net Weight 5.27 kg
External dimensions (W x H x D) ( 272 x 334 x 381 ) mm
Operating conditions Temperature 5 °C to 35 °C, Operation status: Horizontal
Operating humidity 5 % to 85 %
Laser Semiconductor laser, wavelength, 760 to 800 nm
• TUNER FM/AM [MW]
FM Tuning Range 87.5 to 108.0 MHz or 87.50 to 108.00 MHz
FM Intermediate Frequency 128 kHz
AM Tuning Range 522 to 1 620 kHz, 520 to 1 710 kHz or 522 to 1 710 kHz
AM Intermediate Frequency 45 kHz
• AMPLIFIER
Output Power Front : 100 W x 2
SUB Woofer : 150 W
• USB
Bus Power Supply (USB) DC 5 V 500 mA
USB Version USB 2.0 or USB 1.1
• CD
Frequency Response 40 to 20 000 Hz
Signal-to-noise ratio More than 60 dB
Dynamic range More than 50 dB
• TAPE
F.F/REW Time 120 sec (C-60)
Frequency Response 250 to 8 000 Hz
Signal to Noise Ratio 40 dB
Channel Separation 45 dB (P/B) / 40 dB (R/P)
Erase Ratio 50 dB (MTT-5511)
• SPEAKERS
FRONTSUBWOOFER
Speaker nameMDS355VMDS355W
Type2 Way 2 Speaker1 Way 1 Speaker
Impedance4 Ω3 Ω
Rated Input Power100 W150 W
Max. Input Power200 W300 W
Net Dimensions (W x H x D)( 222 x 342 x 276 ) mm( 272 x 334 x 332 ) mm