LG M2794D Diagram

LCD MONITOR TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LA97A

MODEL : M2794D

M2794D-PMJ

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

P/NO : MFL49414529 (0906-REV00) Printed in Korea

LGE Internal Use Only

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTIONS .........................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................12

TROUBLE SHOOTING ............................................................................15

BLOCK DIAGRAM...................................................................................24

DESCRIPION OF BLOCK DIAGRAM .....................................................25

EXPLODED VIEW .................................................................................. 26

SVC. SHEET ...............................................................................................

LGE Internal Use Only

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF

Ω

LGE Internal Use Only

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

LGE Internal Use Only

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

LGE Internal Use Only

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application Range.

1) This spec sheet is applied all of the LCD TV with LA97A chassis.

2) Not included spec and each product spec in this spec sheet apply correspondingly to the following each country standard and requirement of Buyer

2. Specification

Each part is tested as below without special appointment

1) Temperature : 20±5°C

2) Relative Humidity : 65±10%

3)

Power Voltage : Standard input voltage (100~240V@50/60Hz)

*Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3.Test method

1) Performance : LGE TV test method followed

2) Demanded other specification

- Safety : UL,CSA,IEC specification

- EMC : FCC,ICES,IEC specification

4. General Specification

4.1 PC

No Item Specification Remarks

1 Supported Sync. Type Separate Sync., Digital

2 Operating Frequency Analog Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

Digital Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

3 Resolution Analog Max. 1920x1080 @ 60Hz

Recommand 1920x1080 @ 60Hz

Digital Max. 1920x1080 @ 60Hz

Recommand 1920x1080 @ 60Hz

4 Inrush Current Cold Start : 50 A Hot : 120 A

5 Operating Condition Sync (H/V) Video LED Wattage

Power S/W On

On mode On/On Active Blue 135W(Max)

1. SOUND: 1/8W non-clipped max.

audio signal

On/On Active Blue 120W(Typ)

2. VIDEO: Color Bar pattern

(Contrast: MAX, Brightness: MAX)

Sleep mode Off/On

Off Amber 1W For RGB

On/Off

Power S/W Off Off mode - Off Off 1W

6 MTBF 50,000 HRS with 90% Confidence level

Lamp Life

40,000 Hours (Min)

7 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

- 7 -

LGE Internal Use Only

No Item Specification Remarks

1. Receiving System ATSC/NTSC-M

2. Available Channel 1)VHF :02~13

2)UHF :14~69

3)DTV :02~69

4)CATV :01~135

5)CADTV :01~135

3. Input Voltage 1)AC 100 ~ 240V 50/60Hz Mark: 110V, 60Hz

4. Market North America

5. Screen Size 27inch FHD

6. Aspect Ratio 16:9

7. LCD Module LM270WF1-TLB1 LGD

8. Operating Environment 1)Temp : 0 ~40 deg

2)Humidity : ~80 %

9. Storage Environment 1)Temp : -20 ~60 deg

2)Humidity : ~85 %

4.2 TV

No Item Content Unit Remark

1 Product Width(W) Length(L) Height(H)

Dimension Before Packing 654.1 210 494.6 mm

After Packing 725 535 185 mm

2 Product Only SET 8.92 Kg

With BOX 11.1 Kg

3 Cintaniner 20ft 40ft

Loding

Individual or

Indi. Wooden Indi. Wooden

Quantity

Palletizing

420 330 840 726

4 Stand Assy Type Detachable (Base detachable)

Size (W x D x H) 330.0 x 210.0 x 51.8

Tilt Degree -5~10degree

Tilt force 1.0~3.7kgf

Swivel Degree 358 degree

Swivel Force 0.5 ~2.kgf

5 Appearance General Refer to Standard of LG(55)G1-1020

5. Mechanical specification

- 8 -

LGE Internal Use Only

6. Optical characteristic specification

6.1 Chroma &Brightness.

No. Item

Specification

Remark

Min typ Max

1. Viewing Angle<CR>10> Right/Left 70/70 85/85

Up/Down 60/70 75/85

2. Luminance Luminance

DVI or RGB

(cd/m2) 320 400 - Stnadard, 6500K

- Full White (100IRE)

Variance(%) 75 Min / Max

3. Contrast Ratio CR 700 1000 Full White/ Full black

4. Color Coordinates White Wx 0.313

[CIE 1931] Wy 0.329

RED Rx Typ 0.661 Typ DVI or RGB

Ry -0.03 0.318

+0.03

- Stnadard, 6500K

Green Gx 0.207 - Full White (100IRE)

Gy 0.668

Blue Bx 0.144

By 0.068

* Optical Test Condition

- Surrounding Brightness Level : dark

- Surrounding Temperature : 25 ± 5°C

- warm-up Time : 30 Min

- Contrast, Brightness : Outgoing condition

- *Incase of Vivid Mode, high level saturation may be occurred.Check gray linearity at standard mode.

* Active area

- Active area of LCD PANEL is in bezel of cabinet.

- Interval between active area and bezel | A-B|<1.0 mm , | C-D|<1.0 mm

A: Interval between left of active area and bezel B: Interval between right of active area and bezel C: Interval between top of active area and bezel D: Interval between bottom of active area and bezel

C

B

D

A

Active Area

Bezel

No Item Min Typ Max Remark

1. Cool Wx 0.283 0.285 0.287 AV Mode

(9300K) Wy 0.291 0.293 0.295 - RF/ AV1,2,3/ Component/ HDMI

2. Medium Wx 0.293 0.295 0.297 - Vivid

(8000K) Wy 0.203 0.305 0.307 - Cool/ Medium/ Warm: 85IRE

3. Warm Wx 0.311 0.313 0.315 - DTV Signal(16~235): Black Level ; Low

(6500K) Wy 0.327 0.329 0.331 - PC Signal(0~255): Black Level ; High

4. 6500k Wx 0.283 0.313 0.343 PC Mode

Wy 0.299 0.329 0.259 - RGB/ DVI

5. 9300k Wx 0.253 0.283 0.313 - Stnadard

Wy 0.268 0.298 0.328 - 6500K/ 9300K :Full White 100IRE

*Use channel 13 of CA-210,because this model is WCG Panel.

6.2 Chroma (PSM :PC Mode-Standard, AV Mode-Vivid)

** The W/B Tolerance is ±0.002 for Adjustment

- 9 -

LGE Internal Use Only

7. SET Optical Feature

7.1 PC Mode (Measurement Condition:Full white/Standard/6500k)-> Measure the black luminance after 30 seconds.

No Item Luminance(cd/m2) C/R Remark

Min Typ Max Min Typ

1 27 inch 320 400 - 700:1 1000:1 DFC 20,000:1

No Item Luminance(cd/m2) C/R(Min) Remark

Min Typ Max RF,AV,COMPONENT,HDMI

1 27 inch 200 270 - 400:1 RF, AV, COMPONENT, HDMI

7.2 AV Mode (Measurement Condition:Full white(100IRE)/Vivid)-> Measure the black luminance after 30 seconds.

No Item Min Typ Max Remark

1 M2794D-PMJ 16000: 1 20000: 1 - For Checking Black Luminance, wait for over 1 minute.

7.3 Dynamic CR

- Dynamic CR Working Condition : Full Black Pattern( All Black, No pattern( MSPG Pattern# 2)) signal in D- sub & DVI

No.

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz)

1. 720* 480 15.73 59.94 SDTV ,DVD 480I

2. 720* 480 15.73 60.00 SDTV ,DVD 480I

3. 720* 480 31.47 59.94 SDTV 480P

4. 720* 480 31.50 60.00 SDTV 480P

5. 1280* 720 44.96 59.94 HDTV 720P

6. 1280* 720 45.00 60.00 HDTV 720P

7. 1920* 1080 33.72 59.94 HDTV 1080I

8. 1920* 1080 33.75 60.00 HDTV 1080I

9. 1920* 1080 23.0 24.0 HDTV 1080P

10. 1920* 1080 33.75 30 HDTV 1080P

11. 1920* 1080 67.43 59.94 HDTV 1080P

12. 1920* 1080 67.5 60 HDTV 1080P

8. Component Video Input (Y, CB /PB , CR /PR)

LGE Internal Use Only

- 10 -

9. RGB/DVI

9.1 Input ( PC )

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720*400 31.468 70.08 28.321

2 640*480 31.469 59.94 25.175 Input 848x480 60Hz, 852x480 60Hz

-> 640x480 60Hz Display

3 640*480 37.5 75 31.5

4 800*600 37.879 60.317 40.0

5 800*600 46.875 75.0 49.5

6 1024*768 48.363 60.0 65.0

7 1024*768 60.123 75.029 78.75

8 1152*864 67.500 75.000 108.0

9 1280*1024 63.981 60.02 108.0

10 1280*1024 79.976 75.035 135.0

11 1680*1050 64.674 59.883 119.0

12 1680*1050 65.290 59.954 1 46.25

13 1600*1200 75.0 60.0 162.0

14 1920*1080 66.587 59.934 138.5

3)Adjustable Data

*: Serial No. .( Input the S/ N at Total Assembly line) **: week ***: year ex) when year 2006 : input “10” **** : CHECK SUM (deferent along Serial No, week, year)

2) DVI( Digital) EDID - Product ID : 22204

9.2 RGB EDID Data

1) D- SUB( Analog) EDID - Product ID : 22203

LGE Internal Use Only

- 11 -

10. HDMI1,2

10.1 Input ( DTV: For Video, PC is not Supported)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720* 480 31.469 / 31.5 59.94 / 60 23.00/ 23.03 SDTV 480P

2 720* 576 31.25 50 54 SDTV 576P

3 1280* 720 37.500 50 74.25 HDTV 720P

4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P

5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I

6 1920* 1080 28.125 50.00 74.25 HDTV 1080I

7 1920* 1080 26.97 / 23 23.97 / 24 74.17/ 74.25 HDTV 1080P

8 1920* 1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P

9 1920* 1080 56.250 50 148.5 HDTV 1080P

10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P

10.2 EDID Data

HDMI EDID - Product ID : 22205( HDMI1 and HDMI2 have the Same EDID)

1) HDMI 1

- 12 -

LGE Internal Use Only

2) HDMI2

Adjustable Datas( Serial No, week, Year and Check sum) in HDMI EDID are same with RGB/ DVI

LGE Internal Use Only

- 13 -

ADJUSTMENT INSTRUCTION

1. Application

1) This spec sheet is applied all of the LCD TV with LA97A chassis.

2)Not included spec and each product spec in this spec sheet

apply correspondingly to the following each country standard and requirement of Buyer.

2. Designation

1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing.

2) Power Adjustment: Free Voltage

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specification Standard

5) Reserve after operation: Above 30 Minutes

6) Adjustment equipments: Color Analyzer(CA- 210 or CA- 110), Pattern Generator (MSPG- 925L or Equivalent ), DDC Adjustment Jig equipment, SVC remote controller

3. Main PCB check process

# APC - After Manual-Insult, executing APC

# Download

1. Execute ISP program "Mstar ISP Utility" and then click "Config" tab.

2. Set as below, and then click "Auto Detect" and check "OK" message.

If display "Error", Check connect computer, jig, and set.

3. Click "Connect" tab.

If display "Can’t ", Check connect computer, jig, and set.

4. Click "Read" tab, and then load download file(XXXX.bin) by clicking "Read"

5. Click "Auto" tab and set as below

6. Click "Run".

7. After downloading, check "OK" message.

3.1 ADC Process

3.1.1 PC input ADC

3.1.1.1 Auto RGB Gain/Offset Adjustment

• Convert to PC in Input-source I2C COMMAND: 0xF4(SELECT_INPUT)0x00 0x60 (RGB)

cf 0x10(TV),0x20(AV),0x40(COMPONENT),0x60(RGB),

0x90(HDMI)

• Signal equipment displays

Output Voltage : 700 mVp-p Impress Resolution XGA (1024 x 768 @ 60Hz) Model: 60 in Pattern Generator Pattern: 29 in Pattern Generator (MSPG-925 SERISE) [gray pattern that left & right is black and center is white signal (Refer below picture)].

Adjustment pattern (PC )

• Adjust by commanding AUTO_COLOR_ADJUST(0xF1) 0x00 0x02 instruction.

3.1.1.2 Confirmation

• We confirm whether “0xB6(RGB)” address of EEPROM “0xA2” is “0xAA”or not.

• If “0xB6(RGB)” address of EEPROM “0xB2” isn’t “0xAA”, we adjust once more

• We can confirm the ADC values from “0xB0~ 0xB5(RGB)” addresses in a page “0xA2”

*Manual ADC process using Service Remocon. After enter

Service Mode by pushing “INSTART” key, execute “AutoRGB” by pushing “ ” key at “Auto-RGB”.

(2) OK

(1)

(3)

(4)

filexxx.bin

(6)

filexxx.bin

(5)

(7) ……….OK

LGE Internal Use Only

- 14 -

3.2.1COMPONENT input ADC

3.2.1.1Component Gain/Offset Adjustment

• Convert to Component in Input-source I2C COMMAND :0xF4(SELECT_INPUT)0x00 0x40 (COMPONENT) cf.0x10(TV),0x20(AV),0x40(COMPONENT), 0x60(RGB),0x90(HDMI)

• Signal equipment displays at SD Mode Impress Resolution: 480i MODEL :209in Pattern Generator(SD Mode) PATTERN :08in Pattern Generator(MSPG-925 SERISE)

• Signal equipment displays at HD Mode Impress Resolution:1080i MODEL :223in Pattern Generator(HD Mode) PATTERN :08in Pattern Generator(MSPG-925 SERISE)

Adjustment pattern (COMPONENT )

• Adjust by commanding AUTO_COLOR_ADJUST(0xF1)

0x00 0x02 instruction

3.2.1.2 Confirmation

• We confirm whether “0xC8(1080i)”address of EEPROM “0xA2” is “0xAA” or not.

• If “0xC8(1080i)” address of EEPROM “0xA2” isn’t “0xAA”, we adjust once more

• We can confirm the ADC values from “0xC2~(1080i)” addresses in a page “0xA2”

3.2 Function Check

3.2.1 Check display and sound

• Check Input and Signal items. ( cf. work instructions)

1.TV

2.AV (CVBS/ S-Video)

3.COMPONENT (1080i)

4.RGB (PC: 1680X1050 @60Hz)

5.HDMI

6.PC Audio In and H/P Out

* Display and Sound check is executed by Remote controller.

4. Total Assembly line process

4.1 Adjustment Preparation

• Above 30 minutes H/run in RF no signal

• 15 Pin D-Sub Connector, for IIIC communication not including VGA signal,is connected to AUTO W/B EQUIPMENT..

* Color Temperature

4.2 Check coordinate of 9300K

•Set Input mode to RGB.

• Set Temperature : 9300K

• Adjust x: 0.285±0.005, y: 0.293±0.005(9300°K ) (Full white MSPG series Pattern 4)

4.3 Check color coordinate of 6500K

• Set Input mode to RGB.

• Set Temperature : 6500K

• Adjust x:0.313±0.005, y:0.329±0.005(6500°K )

(Full white MSPG series Pattern 4)

4.4 DPM operation confirmation (Only Apply for MNT Model) Check if Power LED Color and Power Consumption operate as standard.

• Set Input to RGB and connect D-sub cable to set

• Measurement Condition : (100~240V@50/60Hz)

• Confirm DPM operation at the state of screen without Signal

4.5 DDC EDID Write Model Name(M2394D-PMJ)

• Connect D- sub Signal Cable to D-Sub Jack.

• Connect DVI Signal Cable to DVI Jack.

• Connect HDMI1,2 Signal Cable to HDMI1,2 Jack.

• Write EDID DATA to EEPROM(24C02) by using DDC2B

protocol.

• Check whether written EDID data is correct or not. (refer to Product spec).

4.6 HDCP (High-Bandwidth Digital Contents Protection)SETTING

• Connect D-sub Signal Cable to D-Sub Jack

• Input HDCP key with HDCP-key-in-program

• HDCP Key value is stored on EEPROM(AT24C512) which

is 80~A1 addresses of 0xA0~0xA2 page

• AC off/on and on HDCP button of MSPG925 and confirm

whether picture is displayed or not of using MSPG925

• HDCP Key value is different among the sets.

4.7 Outgoing condition Configuration

• After all function test., press IN-STOP Key by SVC Remote

controller. And Make Ship Condition.

• When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then Automatically turn off. (Must not AC power OFF during blinking)

4.8 Internal pressure

• Confirm whether is normal or not when between power

board's ac block and GND is impacked on 1.5kV(dc) or

2.2kV(dc) for one second

Cool

9,300 K

X=0.285 Y=0.293

Inner pattern

(216 Gray level, 85 IRE)

MSPG Series Pattern 78

Medium

8,000 K

X=0.295 Y=0.305

(216 Gray level, 85 IRE) MSPG Series Pattern 78

Warm

6,500 K

X=0.313 Y=0.329

(216 Gray level, 85 IRE) MSPG Series Pattern 78

o

- 15 -

LGE Internal Use Only

5. Adjustment Command

5.1 Adjustment Commands(LEMGTH=84)

5.2 EEPROM DATA READ

5.2.1 Signal Table

5.2.2 Command Set

*use: To read the appointment Address of E

5.3 E2PROM Data Write

5.3.1 Signal Table

LEN : 84h + Byte CMD : 8Eh ADH : E2PROM Slave Address (A0, A2, A4, A8), Not 00h

(Reserved by Buffer to E2PROM ) ADL : E2PROM Sub Address ( 00~ FF) Data : Write data

5.3.2 Command Set

- use

• EDID write : 16-byte by 16-byte, 8 order (128-byte)

write(TO “00 – 7F” of “EEPROM Page A4”)

• FOS Default write : 16-mode data

(HFh,HFl,VF,STD,HP,VP,Clk,ClkPh,PhFine) write

• Random Data write : write the appointment Address of

E2PROM

5.4 VRAM Read

• Send CMD(70h) to read Video RAM value from MICOM

And save its value to 128-Bytes Buffer(Common Buffer for the use of EDID)

• Delay 500ms ( Time to Wait and Read Video RAM from

MICOM)

• Be transmitted the contents of MICOM’s 128-bytes

Buffer to PC.

(128th Data is the CheckSum of 127-bytes data : That’s

OK if the value of adding 128-bytes Data is Zero)

No. Adjustment Contents CMD ADR VAL Description

1 FACTORY ON E0 00 00

Factory mode on

2 FACTORY OFF E2 00 00 Factory mode off

3 EEPROM ALL INIT. E4 00 00 EEPROM All cl ear

4 EEPROM Read E7 00 00 EEPROM Read

5 EEPROM Write E8 00 Data EEPROM Write by some values

6

COLOR SAVE

(R/G/B cutoff)

Drive, Contrast,

Bright)

EB

00 Save

7 20 00

00~100

8 V POSITION 30 00 00~100

9 CLOCK 90 00

00~100

10 PHASE 92 00 00~100

They have different range

mode, FOS Adjustment

11 R DRIVE 16 00 00~FF

12 G DRIVE 18 00 00~FF

13 DRIVE 1A 00 00~FF

Drive adjustment

14 R CUTOFF 80 00 00~7F

15 G CUTOFF 82 00 00~7F

16 B CUTOFF 84 00 00~7F

Offset adjustment

17 BRIGHT 10 00 00~3F

19 CONTRAST 12 00 00~64

Bright adjustment Luminance adjustment

20

AUTO_COLOR_

ADJU ST

F1 00 02 Auto COLOR Adjustment

21 CHANGE_COLOR_TEMP 00 0,1,2,3

0: COOL 1: NORMAL 2: WARM 3: USER

22 FACTORY_DEFAULT F3 00 00

Factory mode off

& II_SW is “1” & Input change to “ TV”

23

AUTO_INPUTCHANGE

00

0 : TV 1 : AV1

2 : AV2

3 : Component

4 : RGB

5 : DVI

6 : HDMI

00

Color

F4

0,1,2,4

POSITION H

B

F2

----------------------------------------------------------------------

128 Bytes

STOP

A A D1 6F

STOP

START

A

A ADn

A A A 50 6E 03 CMD ADH84 START A A ADL A CS

No. contents CMD A DH ADL Details

1 EEPROM READ E7 A0 0 0-Page 0~7F Read

2 80 0-Page 80~FF Read

3 A2 0 1-Page 0~7F Read

4 80 1-Page 80~FF Read

5 A4 0 2-Page 0~7F Read

6 80 2-Page 80~FF Read

7 A6 0 3-Page 0~7F Read

8 80 3-Page 80~FF Read

Adjustment

STOP

AAA AA 50 6E 03 CMD ADH84+n START ADL

A

CSAAData_1 A . . . Data_n A

No. Adjustment contents CMD(hex) LEN Details

1 EEPROM WRITE E8 94 16-Byte Write

2 84+n n-byte Write

AAAA A 506E 03 70 0084 START A A 00 A CS

STOP

A CSA Data1 6F START . . . Data128

NA

STOP

LGE Internal Use Only

- 16 -

TROUBLESHOOTING

1. Power- Up Boot Fail Trouble Shooting

Check P700 All

Voltage Level (5V, 15V)

Check Pow er con nector

OK ?

Replace Po wer board

Y

N

Check IC705 #2 Pin

Voltage Level 3.3V

Replace IC 705 &

Recheck

Y

N

Check X101 Clock

12MHz

Replace X 101

Y

N

Replace IC 106 Flash

Memory

Check Q702 Outp ut

Voltage Level (5V)

Replace Q702

N

Y

Wave form of X101

N

Wave form of X101

LGE Internal Use Only

- 17 -

2. No OSD Trouble Shooting

Check P30 2

#8(TXEC+) , #9(TXEC-) ,

#20(TXOC+) , #21(TXOC-)

IC101 has problem

Check L VDS Cable for damage or ope n

con ductors .

Check L CD Module

Control board

(Refer to Module CAS)

Y

N

Y

Replace Ca ble

N

Y

1. Check Po wer Board , 15V

2. Check Q702 Output voltage(5V)

3. Check P302(#1, 2, 3) 5V

1. Replace Pow er Board

2. Replace Q702

N

Check P70 0(#9)

INV_ON high

Check GPIO Path

(Refer to Appe ndix 1 .)

N

Y

Check RF Ca ble

Check T P Clock, Data, Sync

R440, R441, R442

Maybe Tun er(TU400) has problems

Check IC10 1 LVDS output

#8(TXEC+) , #9(TXEC-) ,

#20(TXOC+) , #21(TXOC-)

Y

N

Check Tu ner 5V Po wer &

Q707 5V

Replace Q7 07

Y

N

Y

Replace IC101 has problems

N

Y

Check L D400 color

Bad Tun er. Replace Tuner.

None

Yello w ->-> none

Check Demod ulator Input Clock

X400 (25MHz)

Replace X400

N

Y

Check L CD Module

Control board

Refer to Mo dule CAS

Wave form of X400

LGE Internal Use Only

- 18 -

3. Digital TV Video Trouble Shooting

Wave form of X400

LGE Internal Use Only

- 19 -

4. Component Video Trouble Shooting

Check inpu t signal format

Is it supported?

Check signal

C124, C126, C129

Check R10 7, R109, R112,

C124, C126, C129

Y

N

Check J K602

Replace JK602 or Che ck Divice

Y

N

Y

IC101 has problem

Y

Check Compo nent Cab le

Wave form of C124

Wave form of C126

Wave form of C129

Wave form of Comp Y

Wave form of Comp Pb

Wave form of Comp Pr

LGE Internal Use Only

- 20 -

5. RGB Video Trouble Shooting

Check inpu t signal format

Is it supported?

Check signal , Hsync, Vsync

(R673, R674)

Replace R6 73, R674

Check signal RGB (R119, R104, R105

C121,C122,C119)

Y

N

Check JK607

Replace JK607

Y

N

Y

Replace R119, R104, R105,

C121,C122,C119

N

IC101 has problem

Y

Check RGB Cable connector

for damage

Y

Wave form of R673(Vsync)

Wave form of R104/C121

Wave form of R105/C122

Wave form of R119/C119

- 21 -

LGE Internal Use Only

6. AV Video Trouble Shooting

Check inpu t signal format

Is it supported?

Check signal RGB

R116, R113, R114 C137, C134, C135

Replace R1 16, R113, R114

C137, C134, C135

Y

N

Check signal R611(AV_CVBS),

R625, R626(S_Video)

Replace R6 11, R625, R626

Y

N

Y

IC101 has problem

Check AV Ca ble / S-Video Cable f or

damage or open conn ector

Y

Wave form of R626(S-video)

Wave form of R611(CVBS)

Wave form of R625(S-video)

LGE Internal Use Only

- 22 -

7.HDMI Video Trouble Shooting

Check input signal form at

Is it supported?

Y

Check JK801 / JK802 for proper connectio n or

damage

Replace c onn ector

Y

N

Y

Check HD MI Cable for damage o r open

conn ector

Check ED ID NVRAM

(IC801, IC802)

Pow er & I2 C Sig nal (#5, #6)

Redownloa d EDID data or

Rep lace IC801/IC802

Y

N

Check HD CP Key NVRAM (IC105)

Pow er & I2 C Sig nal (#5, #6)

Replace IC105

Y

N

Check IC803 Out Volta ge Level

3.3V(Pin 6)

Replace IC803

Y

N

Replace Ms tar(IC101)

- 23 -

LGE Internal Use Only

8. All Source Audio Trouble Shooting

Make sure yo u can’t hear any audi o

and Device sup port the au di o sig nal

norm ally .

Check Speaker and it s w ire

con nectio n (P500)

And the resistance

Check Sig nal from IC501

L502, L503, L504, L505

Y

Replace IC 500

N

Check 15V From Po wer board

(P700, Pin#1,2)

And Check Aud io Amp Pow er 12V

(IC501, Pin#2, 3, 34, 35, 40, 41, 44, 45)

Y

Replace P ower Board or Check

L511

N

Y

Check Sig nal from IC101

(R130, R131, R1021, R1022)

Y

Replace IC 101

N

Replace co nnector or Speaker

N

LGE Internal Use Only

- 24 -

BLOCK DIAGRAM

AV(V, L/R)

S-Video

CABLEAIR

ATSC/NTSC Tuner

(TDVF-H051F)

LG Innotek

M-STAR

(LGE1854C)

VSB

Receiver

(LGDT3304)

Audio AMP

(NTP3000A)

HY5DU561622

256M(DDR)

HY5DU561622

256M(DDR)

HY5DU561622

256M(DDR)

HY5DU561622

256M(DDR)

CLK_25MHz

IF-P

IF-N

LVDS(8Bit)

CLK_12MHz

CVBS(ATV)

TP DATA[0-7]

SIF

2

Component

(YPbPr/LR)

R OUT

L OUT

HP_L/R_Out

PC Audio_In

RGB(PC)

PC IN

L

C

D

1.0Vp-p

96dBuV

5V

SIFM0

SIFP0

Buffer

1.2V 3.3V

[3]

[16]

[15]

[N:11]

[P:10]

2

IF_AGC

MSCL

MSDA

2

3.3V1.2V

15V_AMP

EEPROM

EEPROM(512K)

24C512

EEPROM(512K)

24C512

3.3V

Flash(8M)

3.3V

KEY_CTL[1,2]

5V

P

O

W

E

R

P

O

W

E

R

15V

5V_ST

INV_ON

PWM_DIM

A_DIM

[12]

SDA[7]

SCL[8]

TUNER_CVBS

VCOM0

HDMI1(VIDEO)

USB(SW Upgrade)

HPDCTRL[12]

DDCDA_SDA[14]

DDCDA_SCL[15]

POWER_HDMI[110]

3.3V

AVDD_DVI

2.6V

VDD_DDR

27”

TMDS351

DVI/HDMI

SW

DVI(PC)

HDMI2(VIDEO)

EEPROM

TX_Clock, Data

K

E

Y

K

E

Y

H

P

/

L

E

D

/

I

R

H

P

/

L

E

D

/

I

R

HP_DET

KEY_1,2

R

L

HP_L_OUT

HP_R_OUT

LED_BLUE

LED_AMBER

IR

5V

TPA6110

HEADPHONE

AMP

HP_RHP_L

Data

LRCLK

SCLK

MSDA/MSCL

3W

Memory CLK 210Mhz

TMDS CLK

- 138.5Mhz

LVDS CLK

-138.5MHz

- 25 -

LGE Internal Use Only

DESCRIPTION OF BLOCK DIAGRAM

1.Input Interface.

1-1.PC Input

- RGB Input is directly transmitted to LGE1854C(scaler,Clock 12Mhz) and display up to 1920*1080 resolution

- DVI Signal input go to scaler through TMSD351(DVI/HDMI Switch)

- PC Audio is connected PC-Audio input by Stereo Cable

1-2 Video Input

- Component :YPbPr/YCbCr signal input, Up to 1080P Resolution.

- CVBS/S-Video : CVBS/S-Video signal input, supporting 480P

- HDMI 1,2 :Digital signal input(Included Audio)

1-3 RF(ATSC/NTSC)Input :ATSC/NTSC Input.

1-4 Audio Input :Component L/R,Audio L/R,Stereo(For PC) input.

2.Output Interface

- Video :The video signal goes to LGE1854C(Scaler)-> Frame Memory(210MHz:converted LVDS signal)->Module

- Audio :The audio is divided Digital signal at Scaler go through NTP3000A(Audio Amp IC) and generate to Speaker

Head-phone signal is divided to stereo signal at Scaler, then generate Headphone Amp(IC TPA6110)

- Optical Output :Generate audio output from Scaler(SPDIF(Optical)

3.Power Interface

- Input 5V,12V from Power Board is converted to 3.3V,2.6V,1.8V,1.25V,1.2V by Regulator and DC/DC Converter

Supply power to Module,Audio Amp and IC

LGE Internal Use Only

- 26 -

EXPLODED VIEW

300

510

500

120

200

535

810

530

540

800

400

900

550

121

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

LGE Internal Use Only