LG M2762D Diagram

LCD MONITOR TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LD93A

MODEL : M2762D

M2762D-P(W)ZL

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

P/NO : MFL62477305(0908-REV00) Printed in Korea

LGE Internal Use Only

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CONTENTS

CONTENTS .............................................................................................. 2

PRECAUTIONS .........................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................13

TROUBLE SHOOTING ............................................................................17

BLOCK DIAGRAM...................................................................................25

EXPLODED VIEW .................................................................................. 26

SVC. SHEET ...............................................................................................

LGE Internal Use Only

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF

Ω

LGE Internal Use Only

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

LGE Internal Use Only

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

LGE Internal Use Only

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application Range.

1) This spec sheet is applied all of the LCD TV with LD93A chassis.

2) Not included spec and each product spec in this spec sheet apply correspondingly to the following each country standard and requirement of Buyer

2. Specification

Each part is tested as below without special appointment

1) Temperature : 25±5°C(77±9°F) , CST: 40±5°C

2) Relative Humidity : 65±10%

Power Voltage : Standard input voltage (100~240V@50/60Hz)

*Standard Voltage of each product is marked by models

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3.Test method

1) Performance : LGE TV test method followed

2) Demanded other specification

- Safety : CE,IEC specification

- EMC : CE,IEC specification

4. Electrical Specification

4.1 Module Specification

Model Market Appliance

Safety : IEC/ EN60065

Mx62D

EMI :EN55013

(PAL Market)

EMS : EN55020

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 27 inches( 686.0mm) diagonal

3 Active Display area 597.89( H) 236.31( V) mm

4 Outline Dimension 630( H) x 368.2( V) x 21.6( D) mm Typ. (Without Inverter)

5 Aspect Ratio 16: 9

6 Pixel Number 1920 x RGB x 1080 pixel

7 Pixel Pitch 0.3114( H) x 0.3114 (V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16.7M color

10 Electrical Interface LVDS 2Port

11 Surface Treatment Hard coating( 3H) & Anti- glare( Haze 25)

12 Operating Mode Normally White

13 Backlight Unit 4 CCFL (4 lamps)

14 Response Time Rising Time : 1 + Falling Time : 4 ms Typ.

15 Color Gamut 72%

- M2762D- P(W)ZL : LGD / LM270WF1- TLD1 ( P/ N : EAJ60703601)

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LGE Internal Use Only

No Item Specification Remarks

DTV &Analog- UK,France,Germany,Spain,Sweden,Finland,

Italy,Netherland,Belgium,Czech,Luxemburg,Greece,

1 Market EU(PAL Market-26Countries) Denmark,Austria,Hungary,Switzerland,Croatia,Turkey

Analog Only -Poland,Portugal,Norway,Bulgaria,Serbia,

Slovenia,Russia,Romania

1) PAL-BG

2) PAL-DK

2 Broadcasting system 3) PAL-I/I’

4) SECAM L/L’

5) DVB-T

3 Receiving system

Analog : Upper Heterodyne

Digital : COFDM

4 Scart Jack (2EA) PAL,SECAM

Scart 1 Jack is Full scart and support RF-OUT(ATV)

Scart 2 jack is Half scart and support MNT/DTV-OUT.

5 Component Input (1EA) Y/Cb/CrY/Pb/Pr

6 CVBS Input (1EA) PAL,SECAM,NTSC 4 System(Rear):PAL50,SECAM,NTSC,PAL60

7 RGB Input RGB-PC Analog(D-SUB 15Pin)

8 DVI Input DVI-D Digital

9 HDMI Input (2EA)

HDMI1-DTV 1ea(Rear),1ea(Side)

HDMI2-DTV HDMI version 1.3 Support HDCP / Not support PC

10 Audio Input (3EA) RGB/DVI Audio, Component, CVBS L/R Input

11 SPDIF out (1EA) SPDIF out

12 Earphone out (1EA)

Antenna,AV1,AV2,AV3,Component,

RGB,DVI,HDMI1,HDMI2

13 USB (1EA) Picture,Music Software Update +Picture +Music

14 RS-232C (1EA) Commercial Mode

5. General specification

5.1 TV

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LGE Internal Use Only

5.2 RGB

No Item Specification Remark

1 Supported Sync.Type Separate Sync.,Digital

Horizontal 30~83kHz

Analog

Vertical 56~75 Hz

2 Operating Frequency

Horizontal 30~83kHz

Digital

Vertical 56~75 Hz

Max. 1360 x 768 @60Hz

Analog

Recommend 1360 x 768 @60Hz

Max. 1360 x 768 @60Hz

M1962D

Digital

Recommend 1360 x 768 @60Hz

Max. 1600 x 900 @60Hz

3 Resolution

Analog

Recommend 1600 x 900 @60Hz

Max. 1600 x 900 @60Hz

M2062D

Digital

Recommend 1600 x 900 @60Hz

Max. 1920 x 1080 @60Hz

Analog

Recommend 1920 x 1080 @60Hz

M2262D/M2362D/M2762D

Max. 1920 x1080 @60Hz

Digital

Recommend 1920 x1080 @60Hz

4 Input Voltage Voltage :100 ~240 Vac,50 or 60Hz

5 Inrush Current Cold Start :50 A/ Hot :120 A

Operating Condition Sync (H/V) Video LED Wattage

On/On Active Blue 40 Max.

M1962D

On/On Active Blue 35 Typ.

On/On Active Blue 60 Max.

M2062D

On/On Active Blue 50 Typ.

6 Power On On/On Active Blue 60 Max.

S/W Mode

M2262D

On/On Active Blue 53 Typ.

On/On Active Blue 65 Max.

M2362D

On/On Active Blue 55 Typ.

On/On Active Blue 70 Max.

M2762D

On/On Active Blue 63 Typ.

Off/On

Sleep mode

On/Off

Off Amber 1W RGB / DVI

Off mode - Off Off 0.5W

19”LGD :50,000 Hours(min)

19”AUO :50,000 Hours(min)

20”LGD :50,000 Hours(min)

Lamp 20”CMO :40,000 Hours(min)

7 MTBF 50,000 HRS with 90%Confidence level Life 22”LGD :50,000 Hours(min)

22”AUO :40,000 Hours(min)

23”LGD :50,000 Hours(min)

27”LGD :50,000 Hours(min)

8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

9 Operating Environment

Temp :10°C ~35°C

Humidity :20 %~80 %

10 Storage Environment

Temp :-10°C ~60°C non condensing

Humidity :5 %~90 %non condensing

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LGE Internal Use Only

6. Chroma & Brightness

6.1 M2362D – LGD Module

No. Item

Specification

Remark

Min typ Max

1. Viewing Angle[CR>10]

Right/Left 70/70 85/85 -

Up/Down 60/70 75/85 -

2. Luminance

Luminance (cd/m

) 250 300 -

Variation(%) 75 - -

3. Contrast Ratio CR 700 1000 - Full white/ Full black

White Wx 0.313

Wy 0.329

RED Rx Typ 0.644 Typ DVI or RGB

4. Color Coordinates Ry -0.03 0.336

+0.03

- Standard, 6500K

[CIE 1931] Green Gx 0.301 - Full White (100IRE)

Gy 0.611 - Backlight 100

Blue Bx 0.146

By 0.070

Rise Time Tr

R 1.3 2.6 Condition : DVI or RGB

5. Response Time Decay Time Tr

D 3.7 7.4 Standard, Backlight100

6.3 Optical Test Condition

- Surrounding Brightness Level : dark

- Surrounding Temperature : 25±5°C

- warm-up Time :30 Min

- Contrast,Brightness : Outgoing condition

-.*Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

6.2 M2762D –LGD Module

No. Item

Specification

Remark

Min typ Max

1. Viewing Angle[CR>10]

Right/Left 70/70 85/85 -

Up/Down 60/70 75/85 -

2. Luminance

Luminance (cd/m2) 250 300 -

Variation(%) 75 - -

3. Contrast Ratio CR 700 1000 - Full White/ Full black

White Wx 0.313

Wy 0.329

RED Rx Typ 0.637 Typ DVI or RGB

4. Color Coordinates Ry -0.03 0.337

+0.03

- Standard, 6500K

[CIE 1931] Green Gx 0.298 - Full White (100IRE)

Gy 0.613 - Backlight 100

Blue Bx 0.147

By 0.057

Rise Time Tr

R 1 4 Condition : DVI or RGB

5. Response Time Decay Time Tr

D 4 8 Standard, Backlight100

Gray to Gray T

GrD_AVR

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LGE Internal Use Only

No Item Min Typ Max Remark

1. Cool

White Balance,X axis 0.268 0.283 0.298 DQA :±0.015

White Balance,Y axis 0.283 0.298 0.313 DQA :±0.015

2. Medium

White Balance,X axis 0.280 0.295 0.310 DQA :±0.015

White Balance,Y axis 0.290 0.305 0.320 DQA :±0.015 Measurement Condition

3. Warm

White Balance,X axis 0.298 0.313 0.328 DQA :±0.015 PSM :Outgoing condition

White Balance,Y axis 0.314 0.329 0.344 DQA :±0.015 Input signal :White pattern(85IRE)

4. 6500k

White Balance,X axis 0.298 0.313 0.328 DQA :±0.015 Pattern number :78 (MSPG series)

White Balance,Y axis 0.314 0.329 0.344 DQA :±0.015

5. 9300k

White Balance,X axis 0.268 0.283 0.298 DQA :±0.015

White Balance,Y axis 0.283 0.298 0.313 DQA :±0.015

7. Chroma (PSM : PC Mode-Standard, AV Mode-Vivid)

No Item

Luminance(cd/m

) C/R(min)

Remark

Typ Max RF,AV,COMPONENT,HDMI

1 M1962D 120 150 500 RF, AV, COMPONENT, HDMI

2 M2062D 170 200 500 Test Condition

3 M2262D 170 200 500 Mode :Outgoing condition

4 M2362D 170 200 500 Input signal : 100IRE White pattern

5 M2762D 170 200 500 (Pattern #4 : MSPG series)

- AV Mode

8.2 Special feature(DFC)

- DFC Working Condition : Full Black Pattern( All Black, No pattern( MSPG Pattern# 2)) signal in D- sub & DVI

No Item Min Typ Max Remark

M1962D/ M2062D/ M2262D/

PC Mode( D- sub, DVI), Mode : Outgoing condition

M2362D/ M2762D

40000: 1 50000: 1 -

Input signal : 100 IRE Full white pattern

8. SET Optical Feature

8.1 General feature

- PC Mode

No Item

Luminance(cd/m

) C/R

Remark

Min Typ Max Min Typ

1 M1962D 150 180 500 700 RGB &DVI

2 M2062D 200 230 500 700 DFC 50000:1(Typ)

3 M2262D 200 230 500 700 -Mode :Outgoing condition

4 M2362D 200 230 500 700 Input signal :100IRE White pattern

5 M2762D 200 230 500 700 (Pattern #4 :MSPG series)

6.4 Active area

1. Active area of LCD PANEL is in bezel of cabinet.

2. Interval between active area and bezel |A-B| ≤ 1.0 mm , |C-D| ≤ 1.0 mm

A: Interval between left of active area and bezel B: Interval between right of active area and bezel C: Interval between top of active area and bezel D: Interval between bottom of active area and bezel

Active Area

Bezel

- 11 -

LGE Internal Use Only

No.

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel clock( MHz)

1. 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)

2. 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)

3. 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz

4. 720* 480 31.47 59.94 27.000 SDTV 480P

5. 720* 480 31.50 60.00 27.027 SDTV 480P

6. 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280* 720 44.96 59.94 74.176 HDTV 720P

8. 1280* 720 45.00 60.00 74.250 HDTV 720P

9. 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920* 1080 33.72 59.94 74.176 HDTV 1080I

11. 1920* 1080 33.75 60.00 74.250 HDTV 1080I

12. 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

13. 1920* 1080 56.25 50 148.5 HDTV 1080P

14. 1920* 1080 67.432 59.94 148.350 HDTV 1080P

15. 1920* 1080 67.5 60.00 148.5 HDTV 1080P

9. Component Video Input (Y, PB , PR)

10. RGB/DVI INPUT (PC)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.175

3. 640*480 37.5 75 31.5

4. 800*600 37.879 60.317 40.0

5. 800*600 46.875 75.0 49.5

6. 1024*768 48.363 60.0 65.0

7. 1024*768 60.123 75.029 78.75

8. 1152*864 67.500 75.000 108.0

9. 1280*1024 63.981 60.02 108.0

10. 1280*1024 79.976 75.035 135.0

11. 1680*1050 64.674 59.883 119.0

12. 1680*1050 65.290 59.954 146.25

13. 1600*1200 75.0 60.0 162.0

14. 1920*1080 66.587 59.934 138.5

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LGE Internal Use Only

11. HDMI INPUT(DTV)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P

2 720* 576 31.25 50 27.864 SDTV 576P

3 1280* 720 37.500 50 74.25 HDTV 720P

4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P

5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I

6 1920* 1080 28.125 50.00 74.25 HDTV 1080I

7 1920* 1080 27 24 74.25 HDTV 1080P

8 1920* 1080 33.75 30.00 74.25 HDTV 1080P

9 1920* 1080 56.250 50 148.5 HDTV 1080P

10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P

10.2 EDID Data (Product ID : 22382)

10.1 EDID Data (Product ID : 22381)

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