LG M227WDP, M237WDP Schematic

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Internal Use Only

LCD MONITOR TV

SERVICE MANUAL

CHASSIS : LD93C

MODEL : M227WDP

M237WDP

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

M227WDP-PZL

M237WDP-PZL

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................18

TROUBLE SHOOTING ............................................................................22

BLOCK DIAGRAM...................................................................................30

EXPLODED VIEW .................................................................................. 31

SVC. SHEET ...............................................................................................

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Only for training and service purposes

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PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety.

These parts are

marked on the schematic diagram and the Exploded View It is essential that these critical parts

should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

• Replaceable batteries

* CAUTION RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

Ω

0.15uF

AC Volt-meter

Good Earth Ground such as WATER PIPE,

To Instrument's exposed METALLIC PARTS

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

1.5 Kohm/10W

CONDUIT etc.

Only for training and service purposes

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or re-connecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 21.53 inches diagonal

3 Active Display area 476.64(H) 268.11(V) mm

4 Outline Dimension 495.6(H) x 292.2(V) x16.5(D) mm Typ. (Without Inverter)

5 Aspect Ratio 16:9

6 Pixel Number 1920 x RGB x 1080 pixel

7 Pixel Pitch 0.248(H) x 0.248(V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16.7M color (6bit with A-FRC)

10 Electrical Interface LVDS 2Port

11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

12 Operating Mode Normally White

13 Backlight Unit 4 CCFL (4 lamps)

14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.

15 Color Gamut 72%

Only for training and service purposes

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. Module Specification

4.1 M227WDP-PZL : LGD,LM215WF-TLA1( P/N : EAJ60156901 / P6)

1. Application Range.

This spec sheet is applied to the 22”/ 23” LCD Monitor TV used LD93C chassis.

2. Specification

Each part is tested as below without special appointment

2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C

2.2 Relative Humidity : 65±10%

2.3 Power Voltage : Standard input voltage (100~240V@ 50/60Hz)

• Standard Voltage of each products is marked by models

2.4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM .

2.5 The receiver must be operated for about 5 minutes prior to the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification Safety : CE, IEC specification EMC : CE, IEC

Safety : IEC/EN60065 EMI : EN55013 EMS : EN55020

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Only for training and service purposes

4.2 M227WDP-PZL : AUO / M215HW01-V0( P/N : EAJ55729601)

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 21.53 inches(546.86mm) diagonal

3 Active Display area 476.64(H) 268.11(V) mm

4 Outline Dimension 495.6(H) x 292.2(V) x16.35(D) mm Typ. (Without Inverter)

5 Aspect Ratio 16:9

6 Pixel Number 1920 x RGB x 1080 pixel

7 Pixel Pitch 0.248(H) x 0.248(V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16.7M color (6bit with Hi-FRC)

10 Electrical Interface LVDS 2Port

11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

12 Operating Mode Normally White

13 Backlight Unit 4 CCFL (4 lamps)

14 Response Time Rising Time : 3.8 + Falling Time : 1.2 ms Typ.

15 Color Gamut 72%

4.3 M237WDP-PZL : LGD / LM230WF1-TLA3( P/N : EAJ60682701 / P7, ZBD) REPLACEMENT MODULE : LGD / LM230WF1-TLA6( P/N: EAJ60682703 / P7, ZBD / Magna Drive IC)

No Item Specification Unit Remark

1 Type TFT Color LCD Module

2 Diagonal Size 23 inches(584.2mm) diagonal

3 Active Display area 509.184(H) 286.416(V) mm

4 Outline Dimension 533.2(H) x 312(V) x16.5(D) mm Typ. (Without Inverter)

5 Aspect Ratio 16:9

6 Pixel Number 1920 x RGB x 1080 pixel

7 Pixel Pitch 0.265(H) x 0.265(V) mm

8 Color arrangement RGB vertical Stripe

9 Color Depth 16.7M color

10 Electrical Interface LVDS 2Port

11 Surface Treatment Hard coating(3H) & Anti-glare(Haze 25)

12 Operating Mode Normally White

13 Backlight Unit 4 CCFL (4 lamps)

14 Response Time Rising Time : 1.3 + Falling Time : 3.7 ms Typ.

15 Color Gamut 72%

No Item Specification Remarks

1 Market EU(PAL Market-26Countries) DTV & Analog

UK, France, Germany, Spain, Sweden, Finland,

Italy, Netherland, Belgium, Czech

Luxemburg, Greece, Denmark, Austria, Hungary,

Switzerland, Croatia, Turkey

Analog Only -

Poland, Portugal, Norway, Bulgaria,

Serbia,Slovenia, Russia, Romania

2 Broadcasting system 1) PAL-BG

2) PAL-DK

3) PAL-I/I’

4) SECAM L/L’

5) DVB-T

3 Receiving system Analog : Upper Heterodyne

Digital : COFDM

4 Scart Jack (2EA) PAL, SECAM Scart 1 Jack is Full scart and support RF-OUT(ATV)

Scart 2 jack is Half scart and support MNT/DTV-OUT.

5 Component Input (1EA) Y/Cb/Cr

Y/Pb/Pr

6 RGB Input RGB-PC Analog(D-SUB 15Pin)

7 DVI Input DVI-D Digital

8 HDMI Input (1EA) HDMI-DTV HDMI version 1.3 Support HDCP / Not support PC

9 Audio Input (2EA) RGB/DVI Audio

Component L/R Input

10 SPDIF out (1EA) SPDIF out

11 Earphone out (1EA) Antenna, AV1, AV2, Component,

RGB, DVI, HDMI

12 USB (1EA) Picture, Music Software Update + Picture + Music

13 RS-232C (1EA) Commercial Mode

5. General Specification

5.1 TV

- 8 -

Only for training and service purposes

No Item Specification Remarks

1 Supported Sync. Type Separate Sync., Digital

2 Operating Frequency Analog Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

Digital Horizontal 30 ~ 83kHz

Vertical 56 ~ 75 Hz

3 Resolution Analog Max. 1920x1080 @ 60Hz

Recommend 1920x1080 @ 60Hz

Digital Max. 1920x1080 @ 60Hz

Recommend 1920x1080 @ 60Hz

4 Input Voltage Voltage :100 – 240 Vac, 50 or 60Hz

5 Inrush Current Cold Start : 50 A Hot : 120 A

6 Operating Condition Sync (H/V) Video LED Wattage

Power S/W On On Typ. On/On Active Blue 53W

mode Max On/On Active Blue 60W M227WDP-PZL

Typ. On/On Active Blue 55W

Max On/On Active Blue 60W M237WDP-PZL

Sleep mode Off/On

Off Amber 1W RGB/

On/Off

Power S/W Off Off mode - Off Off 0.5W

7 MTBF 50,000 HRS with 90% Confidence leve

22”AUO:40,000 Hours(min)

Lamp Life 22”LGD:50,000 Hours(min)

23”LGD:50,000 Hours(min)

8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)

9 Operating Environment Temp : 10°C ~ 35°C

Humidity : 20 % ~ 80 %

10 Storage Environment Temp : -10°C~60°C non condensing

Humidity : 5 % ~ 90 % non condensing

Only for training and service purposes

- 9 -

5.2 RGB / DVI

No. Item Specification Min. Typ. Max. Remark

1 Viewing Angle[CR>10] Horizontal 150 170 - CR >10

Vertical 140 160

2 Luminance Luminance (cd/m2) 240 300 -

Variation(%) 75 80

3 Contrst Ratio CR 600 1000

Full white/Full black

4 Color Coordinates [CIE1931] White W

0.313

Typ. 0.329 Typ.

RED R

-0.03 0.648 +0.03 DVI or RGB

0.339 Standard, 6500K

Green G

0.282

Full white(100IRE)

0.603 Backlight 100

Blue B

0.143

0.070

5 Response Time(ms) Rise Time TrR 3.8 5.5

Condition : DVI

Decay Time TrD 1.2 2.5

Standard, Backlight100

Only for training and service purposes

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6. Chroma & Brightness

6.1 M227WDP – AUO Module (for more details, refer to the module spec.)

No. Item Specification Min. Typ. Max. Remark

1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10

Up/Down 60/70 75/85

2 Luminance Luminance (cd/m2) 250 300 -

Variation(%) 75

3 Contrst Ratio CR 700 1000

Full white/Full black

4 Color Coordinates [CIE1931] White W

0.313

Typ. 0.329 Typ.

RED R

-0.03 0.646 +0.03 DVI or RGB

0.334 Standard, 6500K

Green G

0.303

Full white(100IRE)

0.616 Backlight 100

Blue B

0.147

0.067

5 Response Time(ms) Rise Time TrR 1.3 2.6

Condition : DVI

Decay Time TrD 3.7 7.4 Standard, Backlight100

6.2 M227WDP – LGD Module (for more details, refer to the module spec.)

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Only for training and service purposes

* Optical Test Condition

- Surrounding Brightness Level : dark

- Surrounding Temperature : 25±5°C

- warm-up Time : 30 Min

- Contrast, Brightness : Outgoing condition

- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

* Active area

1. Active area of LCD PANEL is in bezel of cabinet.

2. Interval between active area and bezel |A-B|<1.0 mm , |C-D|<1.0 mm A: Interval between left of active area and bezel B: Interval between right of active area and bezel C: Interval between top of active area and bezel D: Interval between bottom of active area and bezel

Active Area

Bezel

No. Item Specification Min. Typ. Max. Remark

1 Viewing Angle[CR>10] Right/Left 70/70 85/85 - CR >10

Up/Down 60/70 75/85

2 Luminance Luminance (cd/m2) 250 300 -

Variation(%) 75

3 Contrst Ratio CR 700 1000

Full white/Full black

4 Color Coordinates [CIE1931] White W

0.313

Typ. 0.329 Typ.

RED R

-0.03 0.644 +0.03 DVI or RGB

0.336 Standard, 6500K

Green G

0.301

Full white(100IRE)

0.611 Backlight 100

Blue B

0.146

0.070

5 Response Time(ms) Rise Time TrR 1.3 2.6

Condition : DVI

Decay Time TrD 3.7 7.4

Standard, Backlight100

6.3 M237WDP – LGD Module (for more details, refer to the module spec.)

No Item module Min Typ Max Remark

1 22/23 inch 40000:1 50000:1 PC Mode(D-sub, DVI) , Mode : Outgoing condition

Input signal : 100 IRE Full white pattern

No Item module

Luminance (cd/m

) C/R(min)

Remark

Min Typ Max RF,AV,

COMPONENT,HDMI

1 22/23 inch - 170 200 - 500

RF,AV,COMPONENT,HDMI

Test condition

Only for training and service purposes

- 12 -

8. Component Video Input (Y, PB

, PR)

7. SET Optical Feature

7.1 PC Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))

*If input signal is 100 IRE full white pattern, the luminance and color coordinate will depend on the panel. When testing DFC, please wait for at least 1 minutes after checking luminance at black pattern.

No Item module

Luminance (cd/m

) C/R(min)

Remark

Min Typ Max Min Typ

1 22/23 inch - 240 230 - 600 700

RGB & DVI

DFC 50000:1

No.

Specification

Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz)

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 33.72 59.94 74.176 HDTV 1080I

11. 1920*1080 33.75 60.00 74.250 HDTV 1080I

12. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

7.2 Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))

7.3

-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub & DVI

Only for training and service purposes

- 13 -

9. RGB Input ( PC )

10. RGB EDID Data

10.1 M227WDP(Product ID : 22388)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.175

3. 640*480 37.5 75 31.5

4. 800*600 37.879 60.317 40.0

5. 800*600 46.875 75.0 49.5

6. 1024*768 48.363 60.0 65.0

7. 1024*768 60.123 75.029 78.75

8. 1152*864 67.500 75.000 108.0

9. 1280*1024 63.981 60.02 108.0

10. 1280*1024 79.976 75.035 135.0

11. 1680*1050 64.674 59.883 119.0

12. 1680*1050 65.290 59.954 146.25

13. 1600*1200 75.0 60.0 162.0

14. 1920*1080 66.587 59.934 138.5

10.2 M237WDP(Product ID : 22391)

Only for training and service purposes

- 14 -

11. DVI Input ( PC )

12. DVI EDID Data

12.1 M227WDP(Product ID : 22389)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1. 720*400 31.468 70.08 28.321

2. 640*480 31.469 59.94 25.175

3. 640*480 37.5 75 31.5

4. 800*600 37.879 60.317 40.0

5. 800*600 46.875 75.0 49.5

6. 1024*768 48.363 60.0 65.0

7. 1024*768 60.123 75.029 78.75

8. 1152*864 67.500 75.000 108.0

9. 1280*1024 63.981 60.02 108.0

10. 1280*1024 79.976 75.035 135.0

11. 1680*1050 64.674 59.883 119.0

12. 1680*1050 65.290 59.954 146.25

13. 1600*1200 75.0 60.0 162.0

14. 1920*1080 66.587 59.934 138.5

12.2 M237WDP(Product ID : 22392)

Only for training and service purposes

- 15 -

13. HDMI input (DTV) (Not Support PC)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 27.864 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 27 24 74.25 HDTV 1080P

8. 1920*1080 33.75 30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

14. HDMI1/2 EDID Data

14.1 M227WDP (Product ID : 22390)

Only for training and service purposes

- 16 -

14.2 M237WDP (Product ID : 22393)

- 17 -

Only for training and service purposes

15. Mechanical specification

15.1 M227WDP-PZL

No. Item Content Unit Remark

1. Product Width(W) Length(D) Height(H) mm

Dimension Before Packing 519.8 193.2 400.5 mm

After Packing 592 446 135 mm

2. Product Only SET 4.7 Kg

Weight With BOX 6.3 Kg

3. Container Individual or 20ft 40ft

Loading Palletizing Indi. Wooden Indi. Wooden

Quantity 816 600 1700 1380

4. Stand

Type Detachable ( Base detachable)

Assy

Size(W x D x H) 271.2x 193.2x 108.4

Tilt Degree -5~15 degree

Tilt force 0.8~3.5kgf

Swivel Degree

none

Swivel Force

5. Appearance General Refer to Standard of LG(55)G1-1020

*Appearance Gap spec

Front: 0.5 mm

Back & Bottom : 1.0 m

15.2 M237WDP-PZL

No. Item Content Unit Remark

1. Product Width(W) Length(D) Height(H) mm

Dimension Before Packing 560.8 193.2 427 mm

After Packing 651 456 161 mm

2. Product Only SET 5.6 Kg

Weight With BOX 7.4 Kg

3. Container Individual or 20ft 40ft

Loading Palletizing Indi. Wooden Indi. Wooden

Quantity 630 560 1290 1176

4. Stand

Type Detachable ( Base detachable)

Assy

Size(W x D x H) 271.2x 193.2x 108.4

Tilt Degree -5~15 degree

Tilt force 0.8~3.5kgf

Swivel Degree

none

Swivel Force

5. Appearance General Refer to Standard of LG(55)G1-1020

*Appearance Gap spec

Front: 0.5 mm

Back & Bottom : 1.0 m

Only for training and service purposes

- 18 -

ADJUSTMENT INSTRUCTION

1. Application

This document is applied to LD84G chassis 22” LCD Monitor TV which is manufactured in Monitor Factory or is produced on the basis of this data.

2. Designation

2.1 The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing.

2.2. Power Adjustment: Free Voltage

2.3. Magnetic Field Condition: Nil.

2.4. Input signal Unit: Product Specification Standard

2.5. Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25°C±5°C Relative humidity : 65 ±10% Input voltage : 220V, 60Hz

2.6. Adjustment equipment: Color Analyzer (CA-210 or CA-

110), Pattern Generator (MSPG-925L or Equivalent), DDC Adjustment Jig equipment, SVC remote controller

2.7. Don’t push The “IN STOP KEY” after completing the

function inspection.

3. Main PCB check process

• APC - After Manual-Insult, executing APC

• Download

1. Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

2. Set as below, and then click "Auto Detect" and check

"OK" message. If display "Error", Check connect computer, jig, and set.

3. Click "Connect" tab.

If display "Can’t ", Check connect computer, jig, and set.

4. Click "Read" tab, and then load download file(XXXX.bin) by clicking "Read"

5. Click "Auto" tab and set as below

6. Click "Run".

7. After downloading, check "OK" message.

(1) (3)

Please Check the Speed :

To use speed between

from 200KHz to 400KHz

(4)

filexxx.bin

Only for training and service purposes

- 19 -

• USB DOWNLOAD

1. Put the USB Stick to the USB socket

2. Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting

3. Show the message "Copying files from memory"

4. Updating is staring.

5. Updating Completed, The TV will restart automatically.

6. If your TV is turned on, check your updated version and Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

• After downloading, have to adjust TOOL OPTION again.

1. Push "ADJ " key in service remote controller

2. Select "Tool Option 1" and Push "OK" button

3. Punch in the number. (Each model has their number.)

4. Completed selecting Tool option

3.1 ADC Process

3.1.1 PC input ADC

3.1.1.1 Auto RGB Gain/Offset Adjustment

- Convert to PC in Input-source

- Signal equipment displays Output Voltage: 700 m Vp-p

Impress Resolution XGA (1024 x 768 @ 60Hz) Model : 60 in Pattern Generator Pattern : 29 in Pattern Generator (MSPG-925 SERIES)

Adjustment pattern (PC )

- Adjust by commanding AUTO_COLOR_ADJUST.

3.1.1.2 Confirmation

- We confirm whether "0xAA (RGB)" address of EEPROM "0xA2" is "0xAA" or not.

- If "0xAA (RGB)" address of EEPROM "0xA2" isn’t "0xAA", we adjust once more

- We can confirm the ADC values from "0xA4~0XA9 (RGB)" addresses in a page "0xA2"

*Manual ADC process using Service Remocon. After enter Service Mode by pushing "ADJ" key,

execute "ADC Adjust" by pushing " " key at "ADC CALIBRATION: RGB".

i TV Software Upgrade

Copying files from memory

Do not remove the memory card from the pc

Do not plug off!

i TV Software Upgrade

Upgrading...

Do not plug off!

63%

i TV Software Upgrade

Upgrading COMPLETED

The TV will restart after seconds.

100%

3.1.2 COMPONENT input ADC

3.1.2.1 Component Gain/Offset Adjustment

- Convert to Component in Input-source

- Signal equipment displays Impress Resolution 1080i Model: 223 in Pattern Generator(1080i Mode) Pattern : 65 in Pattern Generator( MSPG-925 SERIES)

Adjustment pattern (COMPONENT )

- Adjust by commanding AUTO_COLOR_ADJUST.

3.1.2.2 Confirmation

- We confirm whether "0xB3 (480i)/0xBC (1080i)" address of

EEPROM "0xA2" is "0xAA" or not.

- If "0xB3 (480i)/0xBC(1080i)" address of EEPROM "0xA2"

isn’t "0xAA", we adjust once more

- We can confirm the ADC values from "0xAD~0XB2

(480i)/0XB6~BB (1080i)" addresses in a page "0xA2"

*Manual ADC process using Service Remocon. After enter

Service Mode by pushing "ADJ" key,

execute "ADC Adjust" by pushing " " key at "ADC CALIBRATION :COMPONENT".

Impress Resolution 1080i

3.2 Function Check

3.2.1 Check display and sound

-Check Input and Signal items. (cf. work instructions)

1. TV

2. AV (SCART1/SCART2/CVBS/S-Video)

3. COMPONENT (1080i)

4. RGB (PC : 1920x1080 @ 60Hz)

5. DVI (PC : 1920x1080 @ 60Hz)

6. HDMI

6. PC Audio In

* Display and Sound check is executed by Remote controller.

4. Total Assembly line process

4.1 Adjustment Preparation

- W/B Equipment condition CA210: CH 9, Test signal: Inner pattern (85IRE)

- Above 5 minutes H/run in the inner pattern. ("power on" key of adjust remote control)

- 15 Pin D-Sub Jack is connected to the AUTO W/B EQUIPMENT.

- Adjust Process will start by execute I2C Command (Inner pattern (0xF3, 0xFF).

- Adjust Process will finish by execute I2C Command (Inner pattern (Inner pattern (0xF3,0x00)).

** Caution ** Color Temperature: COOL, Medium, Warm One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

* W/B condition

- Surrounding Temperature : 20 % ~ 80 %

- Surrounding Temperature : 25±5 °C

- warm-up Time : Under 5 Min.

*Manual W/B process using adjusts Remote control.

- After enter Service Mode by pushing "ADJ" key,

- Enter White Pattern off of service mode, and change off -> on.

- Enter "W/B ADJUST" by pushing " " key at "5. W/B ADJUST".

- 20 -

Only for training and service purposes

EZ ADJUST

MODE : Component

TEMPERATURE : Cool R-GAIN : 192 G-GAIN : 192 B-GAIN : 192

R-OFFSET : 128 G-OFFSET : 128 B-OFFSET : 128 COPY ALL

1. Tool Option : 2249

2. ADC CALIBRATION External : DTV

3. ADC CALIBRATION Internal

4. ADC ADJUST

5. W/B ADJUST

6. WHITE PATTERN : Off

7. EDID D/L

X=0.283 (

0.015

)

M197WDP

Y=0.298 (

0.015

)

M227WDP

Inner pattern

X=0.295 (

0.015

)

M237WDP

(216gray,85IRE)

Y=0.305 (

0.015

)

X=0.313 (

0.015

)

Y=0.329 (

0.015

)

Luminance Cool

Min : 120 Typ : 170

(cd/ )

Medium

Min : 120 Typ : 170

Inner pattern

Warm

Min : 120 Typ : 170

(216gray,85IRE)

Cool

Min : 170 Typ : 220 M 227WDP

Medium

Min : 170 Typ : 220 M 237WDP

Warm

Min : 170 Typ : 220

M197WDP

Medium

8,000k

Color Temperature

Cool

9,300k

Warm

6,500k

* After done all adjustments, Press “In-start” button and compare

Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Don’t push The “IN STOP KEY” after completing the function

inspection.

* When doing Adjustment, Please make circumstance as below.

4.2 DPM operation confirmation (Only Apply for MNT Model)

• Check if Power LED Color and Power Consumption operate as standard.

- Set Input to RGB and connect D-sub cable to set

- Measurement Condition: (100~240V@ 50/60Hz)

- Confirm DPM operation at the state of screen without Signal

4.3 DDC EDID Write (RGB 128Byte)

- Connect D-sub Signal Cable to D-Sub Jack.

- Write EDID DATA to EEPROM (24C02) by using DDC2B protocol.

- Check whether written EDID data is correct or not.

4.4. DDC EDID Write (DVI 128Byte)

- Connect DVI-D Signal Cable to DVI Jack.

- Write EDID DATA to EEPROM (240C02) by using DDC2B protocol.

- Check whether written EDID data is correct or not.

4.5. DDC EDID Write (HDMI 256Byte)

- Connect HDMI Signal Cable to HDMI Jack.

- Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

- Check whether written EDID data is correct or not

4.6. Serial number (RS-232C)

- Press "Power on" key of service remocon.(Baud rate : 115200 bps)

- Connect RS232 Signal Cable to RS-232 Jack.

- Write Serial number by use RS-232.

- Must check the serial number at the Diagnostics of SET UP menu. (Refer to below).

- 21 -

Only for training and service purposes

- 22 -

TROUBLESHOOTING

1. Power- Up Boot Fail Trouble Shooting

Check P1101 All

Voltage Level (5V, 15V)

Check Power connctor

OK ?

Replace Power board

Check IC1107 Output

Voltage Level (5V)

Replace IC 1107 &

Recheck

Check X101 Clock

12MHz

Replace X101

Replace IC 105 Flash

Memory

Check IC1104 Output

Voltage Level (1.8V)

Replace IC1104 &

Check IC1105 Output

Voltage Level (12V)

Replace IC1105

Check IC1102 Output

Voltage Level (3.3V)

Replace IC1102

Wave form of X101

Only for training and service purposes

- 23 -

2. No OSD Trouble Shooting

Check P1103

#13, #14, #25, #26

IC100 has problem

Check LVDS Cable for damage or open

conductors.

Check LCD Module

Control board

(Refer to Module CAS)

Replace Cable

1. Check Power Board, 15V

2. Check IC1107 Output voltage(5V)

3. Check P304(#1,2,3) 5V

1. Replace Power Board

2. Replace IC1107

Check P1101(#9)

INV_ON high?

Check GPIO Path

(Refer to Appendix 1.)

Only for training and service purposes

- 24 -

Check RF Cable

Check TP Clock, Data, Sync

R521, R532, R533

Mabe Tuner(IC500) has problems

Check P1103

#13, #14, #25, #26

Check Tuner 5V Power &

Q1105 5V

Replace Q1105

Place IC100 has problems

Check LD500 color

Bad Tuner. Replace Tuner.

None

Yellow ->-> none

Check Demodulator Input Clock

X500 (31.875MHz),X501 (20.48MHz)

Replace X500 Replace X501

Check LCD Module

Control board

Refer to Module CAS

Wave form of X500e

3. Digital TV Video Trouble Shooting

Only for training and service purposes

- 25 -

4. Component Video Trouble Shooting

Check input signal format

Is it supported?

Check signal

C1121,C122,C123

Check R164, R144, R145

C1121, C122, C123

Check JK700

Replace JK602 or Check Divice

IC100 has problem

Check Component Cable

Wave form of C121

Wave form of C122

Wave form of C123

Wave form of Comp Y

Wave form of Comp Pb

Wave form of Comp Pr

The Waveforms depend on input signal

Only for training and service purposes

- 26 -

5. RGB Video Trouble Shooting

Check input signa format

Is it supported?

Check signal, Hsync, Vsync

(R729, R730)

Replace R729, R730

Check signal RGB (R158, R160, R162)

C115, C117, C119)

Check JK703

Replace JK703

Replace R158, R160, R162,

C115, C117, C119

IC100 has problem

Check RGB Cable connector

for damage

Wave form of R730(Vsync)

Wave form of R729(Hsync)

Wave form of R160/ C117

Wave form of R158/ C115

Wave form of R162/ C119

Only for training and service purposes

- 27 -

6. AV Video Trouble Shooting

Check inpu t signal for mat

Is it supported?

Check signal RGB

R116, R113, R114 C137, C134, C135

Replace R1 16, R113, R114

C137, C134, C135

Check signal R611(AV_CVBS),

R625, R626(S_Video)

Replace R6 11, R625, R626

IC101 has problem

Check AV Ca ble / S-Video Cable f or

damage or open conn ector

Wave form of R626(S-video)

Wave form of R611(CVBS)

Wave form of R625(S-video)

- 28 -

Only for training and service purposes

7.HDMI Video Trouble Shooting

Check input signal format

Is it supported?

Check JK900 / JK901 for proper connectio n or

damage

Replace connector

Check HD MI Cable for damage o r open

connnector

Check EDID NVRAM(IC902, IC903)

Redownload EDID data or

Replace IC901/ IC902

Check HDCP Key NVRAM(IC102)

Power 12C Signal(#5, #6)

Replace IC102

Replace Mstar(IC100)

- 29 -

Only for training and service purposes

8. All Source Audio Trouble Shooting

Only for training and service purposes

- 30 -

BLOCK DIAGRAM

LVDS

SC2_L/R_IN

MSD237HFG

(Saturn4)

(IC100)

TAS5709

(IC1000)

SP (R)

SP (L)

CI Slot

(P800)

24C02

KIA7427

(IC105)

24C512

(IC101)

I2C_D_TU

IR / H.P JACK

TV_CVBS+

DDR Memory

512Mbx2 (IC300/1)

DSUB_R/G/B/H/V

PC_L/R_IN

COMP_Y/Pb/Pr

COMP_L/R_IN

MAX3232

(IC700)

RS232C_TX/RX

HDMI_I2C

HDMI_TMDS

USB_DM/DP

PCM_ADD

PCM_DATA

TS_Parallel

TU_TS_DATA/TU_ERROR

74LVC541A

(IC800)

PCM_CD_ON

CI_CD_1/2

SPK_L/R_OUT

P401

KEY1/2

LED_RED/Light SENSE

Flash Memory

16MB (IC104)

SC1_CVBS_IN

SC2_CVBS_IN

SC1_TV_VOUT

DTV/MNT_V_OUT

SC1_L/R_IN

TV_L/R_OUT

DTV/MNT_L/R_OPOUT

LCD Panel

(P402)

19î : 1366x768

20î : 1600x900

22î : 1920x1080

23î : 1920x1080

27î : 1920x1080

RESET SYSTEM_I2C

TS_Serial

TPA6132

(IC1002)

H/phone_L/R_OUT

Tuner

24C02

SPI

DDR

DDC_I2C/UART

J1000

SPDIF_OUT

OPTIC

SCART

Component

USB

DVI

HDMI1_Rear

HDMI2_Side

MSG1040

(IC103)

I/O Expander (for Input Detection)

COMP_DET

HEADPHONE_DET

CVBS_DET

S-VIDEO_DET

USB_OCD

SCART1_DET

SCART2_DET

I2C_EXPANDER

Composite

CVBS_V/L/R_IN

LM324D

(IC600)

DTV/MNT_L/R_OUT

TV_L/R_OPOUT

XC5000

(IC500)

SC1_R/G/B

DRX3913K-XK

(IC501)

DTV_IF_P/N

SIF+

I2C_D_TU

24C02

DVI_TMDS

HDCP Key

HDMI_I2C

HDMI_TMDS

P402

Only for training and service purposes

- 31 -

EXPLODED VIEW

300

810

120

121

510

200

800

310

540

400

530

500

900

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

LGE Internal Use Only

Printed in KoreaP/NO : MFL49414532

Sep., 2009

LG M227WDP, M237WDP Schematic

Specifications and Main Features

Frequently Asked Questions

User Manual