LG M197WD-PZJ Schematic

		Internal Use Only
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Europe/Africa	http://eic.lgservice.com
Asia/Oceania	http://biz.lgservice.com

LCD MONITOR TV SERVICE MANUAL

CHASSIS : LD84G

MODEL : M197WD M197WD-PZJ

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS ..............................................................................................	2
PRODUCT SAFETY ..................................................................................	3
SPECIFICATION ........................................................................................	6
ADJUSTMENT INSTRUCTION ...............................................................	15
TROUBLE SHOOTING ............................................................................	19
BLOCK DIAGRAM...................................................................................	25
EXPLODED VIEW ..................................................................................	27
SVC. SHEET ...............................................................................................

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 2 -	LGE Internal Use Only
Only for training and service purposes

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

•There are some special components used in LCD

monitor that are important for safety. These parts are marked on the schematic diagram and the Exploded View. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

•Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

•Must mount the module using mounting holes arranged in four corners.

•Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

•Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

•Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

•Make certain that treatment person’s body are grounded through wrist band.

•Do not leave the module in high temperature and in areas of high humidity for a long time.

•The module not be exposed to the direct sunlight.

•Avoid contact with water as it may a short circuit within the module.

•If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

WARNING

BE CAREFUL ELECTRIC SHOCK !

•If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

•Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

AC Volt-meter

Good Earth Ground such as WATER PIPE, CONDUIT etc.

	To Instrument's	0.15uF
	exposed
	METALLIC PARTS

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Grond for 1 second, Resistance must be less than 0.1 Ω

*Base on Adjustment standard

•Replaceable batteries

* CAUTION

RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.

DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 3 -	LGE Internal Use Only
Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board module or any other receiver assembly.

b.Disconnecting or re-connecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature. (500ºF to 600ºF)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500ºF to 600ºF)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 4 -	LGE Internal Use Only
Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as possible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 5 -	LGE Internal Use Only
Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application Range.

3. Test method

This spec sheet is applied to the 19” LCD Monitor TV used LD84G chassis.

2. Specification

Each part is tested as below without special appointment

2.1Temperature : 25±5°C(77±9°F), CST : 40±5°C

2.2Relative Humidity : 65±10%

2.3Power Voltage : Standard input voltage (100~240V@ 50/60Hz)

• Standard Voltage of each products is marked by models

2.4Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM .

2.5The receiver must be operated for about 5 minutes prior to the adjustment.

3.1Performance : LGE TV test method followed.

3.2Demanded other specification

Safety : CE, IEC specification

EMC : CE, IEC

4.Module Specification

4.1 M197WD-PZJ : LGD LM185WH1TLA1( P/N : EAJ52964001)

No	Item	Specification	Unit	Remark
1	Type	TFT Color LCD Module
2	Diagonal Size	18.51 inches (470.1mm) diagonal
3	Active Display area	409.800 (H) x 230.400 (V)	mm
4	Outline Dimension	430.4(H) x254.6(V) x 13.0(D)	mm	Typ.
5	Aspect Ratio	16:9
6	Pixel Number	1366 x RGB x 768	pixel
7	Pixel Pitch	0.10(H) x 0.30(V)	mm
8	Color arrangement	RGB vertical Stripe
9	Color Depth	16.7M color (8bit with A-FRC)
10	Electrical Interface	LVDS
11	Surface Treatment	Hard coating(3H) & Anti-glare(Haze 25)
12	Operating Mode	Normally White
13	Backlight Unit	2 CCFL(2 lamps)
14	Response Time	Rising Time : 1.1 + Falling Time : 3.9	ms	Typ.
15	Color Gamut	Normal 72% Panel(CIE1931)

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 6 -	LGE Internal Use Only
Only for training and service purposes

5.General Specification

5.1 TV

No	Item	Specification	Remarks
1	Market	EU(PAL Market-26Countries)	DTV & Analog -
			UK, France, Germany, Spain, Sweden,
			Finland, Italy, Netherlands, Belgium,
			Luxemburg, Greece, Denmark, Czech,
			Austria, Hungary, Switzerland, Croatia, Turkey
			Analog Only -
			Poland, Portugal, Norway, Bulgaria,
			Serbia,Slovenia, Russia, Rumania
2	Broadcasting system	1) PAL-BG
		2) PAL-DK
		3) PAL-I/I’
		4) SECAM L/L’
		5) DVB-T (ID TV)
3	Receiving system	Analog : Upper Heterodyne
		Digital : COFDM
4	Scart Jack (2EA)	PAL, SECAM	Scart 1 Jack is Full scart and support RF-OUT(ATV)
			Scart 2 Jack is Half scart and support MNT/DTV-OUT
5	Component Input (1EA)	Y/Cb/Cr
		Y/Pb/Pr
6	CVBS Input (1EA)	PAL, SECAM, NTSC	4 System(Rear):PAL50, SECAM,NTSC,PAL60
7	S-Video Input (1EA)	PAL, SECAM, NTSC	4 System(Rear):PAL50, SECAM,NTSC,PAL60
8	RGB Input	RGB-PC	Analog(D-SUB 15 Pin)
9	DVI Input	DVI-D	Digital
10	HDMI Input (2EA)	HDMI1-DTV	HDMI version 1.3
		HDMI2-DTV	Support HDCP (Not Support PC)
11	Audio Input (3EA)	RGB/DVI Audio	L/R Input
		Component
		CVBS/S-Video
12	SDPIF out (1EA)	SPDIF out
13	Earphone (1EA)	Antenna, AV1, AV2, AV3, Component,
		RGB, DVI, HDMI1, HDMI2
14	USB (1EA)	ISP Download (Version 2.0)	For service only
15	RS-232C (1EA)	For TV Linkloader

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 7 -	LGE Internal Use Only
Only for training and service purposes

5.2 RGB / DVI

No	Item					Specification			Remarks
1	Supported Sync. Type			Separate Sync., Digital
2	Operating Frequency			Analog	Horizontal		30 ~ 61kHz
					Vertical		56 ~ 75 Hz
				Digital	Horizontal		30 ~ 61kHz
					Vertical		56 ~ 75 Hz
3	Resolution			Analog	Max.		1366x768 @ 60Hz
					Recommend		1360x768 @ 60Hz
				Digital	Max.		1366x768 @ 60Hz
					Recommend		1360x768 @ 60Hz
4	Input Voltage			Voltage :100 – 240 Vac, 50 or 60Hz
5	Inrush Current			Cold Start : 50 A		Hot : 120 A
6	Operating Condition			Sync (H/V)	Video		LED	Wattage
	Power S/W On		On mode	On/On	Active		Blue	45W	Max.
				On/On	Active		Blue	35W	Typ.
			Sleep mode	Off/On	Off		Amber	1W	RGB
				On/Off
	Power S/W Off		Off mode	-	Off		Off	1W
7	MTBF			50,000 HRS with 90% Confidence level					Lamp Life: 50,000 Hours(min)
8	Using Altitude			5,000 m (for Reliability) 3,000m(for FOS)
9	Operating Environment			Temp : 10°C ~ 35°C
				Humidity : 20 % ~ 80 %
10	Storage Environment			Temp : -10°C~60°C non condensing
				Humidity : 5 % ~ 90 % non condensing

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 8 -	LGE Internal Use Only
Only for training and service purposes

6.Chroma & Brightness

6.1 18.5” LCD Module (for more details, refer to the module spec.)

No.	Item	Specification			Min.	Typ.	Max.		Remark
1.	Viewing Angle<CR>10>	Right/Left			70/70	85/85			CR >10
		Up/Down			60/70	75/85
2.	Luminance	Luminance (cd/m2)			250	300			DVI or RGB
									-Standard, 6500K
									-Full White(100IRE)
		Variation(%)			75				MIN / MAX
3.	Contrast Ratio	CR			600	1000			Full white/Full black
4.	Color Coordinates[CIE1931]	White		WX	Typ	0.313	Typ		DVI or RGB
				WY	-0.03	0.329	+0.03		-Standard, 6500K
		RED		Xr		0.642			- Full White(100IRE)
				Yr		0.334
		Green		Xg		0.304
				Yg		0.608
		Blue		Xb		0.146
				Yb		0.073

*Optical Test Condition

-Surrounding Brightness Level : dark

- Surrounding Temperature	: 25±5°C
- warm-up Time	: 30 Min
- Contrast, Brightness	: Outgoing condition

- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

* Active area

1.Active area of LCD PANEL is in bezel of cabinet.

2.Interval between active area and bezel |A-B|<1.0 mm , |C-D|<1.0 mm

A:Interval between left of active area and bezel

B:Interval between right of active area and bezel

C:Interval between top of active area and bezel

D:Interval between bottom of active area and bezel

C

Active Area

A

B

D Bezel

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 9 -	LGE Internal Use Only
Only for training and service purposes

7.SET Optical Feature

7.1 PC Mode (Measurement Condition: Full white/ Standard/6500K) -> Measure the black luminance after 30 seconds.

No

Item

module

Luminance (cd/m2)

C/R(min)

Remark

Min

Typ

Max

Min

Typ

1

19 inch

LGD

250

300

-

600:1

1000:1

RGB & DVI

DFC 20000:1

7.2 AV Mode (Measurement Condition: Full white(100IRE)/ Vivid)

Measure the black luminance after 30 seconds.

No

Item

module

Luminance (cd/m2)

C/R(min)

Remark

Min

Typ

Max

RGB(Full White 100IRE)

1

19 inch

LGD

170

220

-

500:1

RF, AV, COMPONENT,HDMI

8. Component Video Input (Y, PB, PR)

No.		Specification		Remark
	Resolution	H-freq(kHz)	V-freq(Hz)
1.	720x480	15.73	60.00	SDTV, DVD 480i
2.	720x480	15.63	59.94	SDTV, DVD 480i
3.	720x480	31.47	59.94	480p
4.	720x480	31.50	60.00	480p
5.	720x576	15.625	50.00	SDTV, DVD 625 Line
6.	720x576	31.25	50.00	HDTV 576p
7.	1280x720	37.5	60.00	HDTV 720p
8.	1280x720	44.96	59.94	HDTV 720p
9.	1280x720	45.00	60.00	HDTV 720p
10.	1920x1080	28.125	50.00	HDTV 1080i
11.	1920x1080	33.75	60.00	HDTV 1080i
12.	1920x1080	33.72	59.94	HDTV 1080i
13.	1920x1080	26.97//27	23.97/24	HDTV 1080p
14.	1920x1080	33.716/33.75	29.976/30.00	HDTV 1080p
15.	1920x1080	56.250	50	HDTV 1080p
16.	1920x1080	67.43/67.5	59.94/60	HDTV 1080p

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 10 -	LGE Internal Use Only
Only for training and service purposes

9. RGB Input ( PC )

No.	Resolution	H-freq(kHz)	V-freq(Hz)	Pixel clock(MHz)	Remark
1	720x400	31.468	70.08	28.321
2	640x480	31.469	59.94	25.175	Input 848x480 60Hz, 852x480 60Hz
					=> 640x480 60Hz Display
3	640x480	37.5	75	31.5
4	800x600	37.879	60.317	40.0
5	800x600	46.875	75.0	49.5
6	1024x768	48.363	60.0	65.0
7	1024x768	60.123	75.029	78.75
8	1280x768	47.776	59.90	79.5
9	1360x768	47.712	60.015	85.5
10	1366x768	47.7	60	85.86

10.RGB EDID Data

10.1M197WD-PZJ

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 11 -	LGE Internal Use Only
Only for training and service purposes

11. DVI Input ( PC )

No.	Resolution	H-freq(kHz)	V-freq(Hz)	Pixel clock(MHz)	Remark
1	720x400	31.468	70.08	28.321
2	640x480	31.469	59.94	25.175	Input 848x480 60Hz, 852x480 60Hz
					=> 640x480 60Hz Display
3	640x480	37.5	75	31.5
4	800x600	37.879	60.317	40.0
5	800x600	46.875	75.0	49.5
6	1024x768	48.363	60.0	65.0
7	1024x768	60.123	75.029	78.75
8	1280x768	47.776	59.90	79.5
9	1360x768	47.712	60.015	85.5
10	1366x768	47.7	60	85.86

12.DVI EDID Data

12.1M197WD-PZJ

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 12 -	LGE Internal Use Only
Only for training and service purposes

13. HDMI input (DTV) (Not Support PC)

No.	Resolution		H-freq(kHz)		V-freq(Hz)	Pixel clock(MHz)	Proposed
1	720x480	31.469		/ 31.5	59.94 / 60	27.00/27.03	SDTV 480P
2	720x576	31.25			50	54	SDTV 576P
3	1280x720	37.500			50	74.25	HDTV 720P
4	1280x720	44.96	/	45	59.94 / 60	74.17/74.25	HDTV 720P
5	1920x1080	33.72	/	33.75	59.94 / 60	74.17/74.25	HDTV 1080I
6	1920x1080	28.125			50.00	74.25	HDTV 1080I
7	1920x1080	26.97	/	27	23.97 / 24	74.17/74.25	HDTV 1080P
8	1920x1080	33.716		/ 33.75	29.976 / 30.00	74.25	HDTV 1080P
9	1920x1080	56.250			50	148.5	HDTV 1080P
10	1920x1080	67.43	/	67.5	59.94 / 60	148.35/148.50	HDTV 1080P

14.HDMI EDID Data

14.1M197WD-PZJ (HDMI 1)

Copyright C 2008 LG Electronics. Inc. All right reserved.	- 13 -	LGE Internal Use Only
Only for training and service purposes