LG LEO3 BAND13 Users manual
FCC ID : BEJLEO3-BAND13
ATTACHMENT E.
- User Manual -
HCT CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI, KYOUNGKI-DO, 467-701, KOREA
TEL:+82 31 639 8517 FAX:+82 31 639 8525 www.hct.co.kr
Report No. : HCT-RF09-0512 1/1
Updated
File
BAND13 RF board manual
Rev.
Written by
Title
Reviewed by
Granted by
Managed by
Type
LEO3 RF (Band13) Hardware Manual
ABSTRACT 1
This document is a hardware RF board manual for LTE user equipment platform. Contents of 2
this document are the description of each blocks and usage directions. It is recommended to 3
peruse this manual before operating RF Board. 4
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HISTORY 6
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KEY WORDS 8
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Manual
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Mobile Communication Technology Research Lab.
533 Hogye-dong, Dongan-gu, Anyang-shi,
Kyongki-do, KOREA
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©Copyright, 2009 By LG Electronics Inc. All rights reserved.
No part of this document may be reproduced in any way, or by any means, without
the express written permission of LG Electronics Inc.
LGE Proprietary i MCTR Lab.
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[Notice] 44
1. The product described in this manual may be modified without prior notice for reliability, 45
functionality or design improvement. 46
2. Information contained in this manual is correct and reliable, but LG shall not be held 47
responsible for damage due to the use of information, product or circuit or infringement of 48
property rights or other rights. 49
3. This manual does not grant users the property rights and other rights of the third party or LG 50
Electronics Inc. 51
4. No part of this manual may be transcribed or duplicated without the written permission of LG 52
Electronics Inc. 53
5. The appearance of the product shown in this manual may slightly differ from that of the actual 54
product. 55
LGE Proprietary ii MCTR Lab.
Updated
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BAND13 RF board manual
Rev.
CONTENTS 1
1 Introduction................................................................................................................................ １ 2
1.1 Scope ..................................................................................................................................... １ 3
1.2 Terminology............................................................................................................................ １ 4
2 Features and Photograph........................................................................................................... ２ 5
2.1 Features ................................................................................................................................. ２ 6
2.2 Photograph of the LEO3 RF board .......................................................................................... ２ 7
3 Block Diagram and Description.................................................................................................. ４ 8
3.1 Block Diagram ........................................................................................................................ ４ 9
3.2 Block Description .................................................................................................................... ４ 10
3.2.1 RX Blocks................................................................................................................... ４ 11
3.2.2 TX Blocks ................................................................................................................... ５ 12
3.2.3 Common Blocks ......................................................................................................... ５ 13
4 Interface .................................................................................................................................... ７ 14
4.1 Power supply .......................................................................................................................... ７ 15
4.2 Digital I/Q Data & Sampling Cock ........................................................................................... ８ 16
4.3 SPI ......................................................................................................................................... ８ 17
4.4 Control signals (GPIO’s).......................................................................................................... ９ 18
4.5 LEDs....................................................................................................................................... ９ 19
5 Placement Map....................................................................................................................... １０ 20
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BAND13 RF board manual
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FIGURES 2
Figure 1: Photograph of LEO3 RF ................................................................................................... ３ 3
Figure 2: RF Block Diagram (For RX/TX) ........................................................................................ ４ 4
Figure 3: Diagrams of Power supply................................................................................................ ７ 5
Figure 4: Diagrams of Data & Clock Signal Interface....................................................................... ８ 6
Figure 5: Diagram of SPI interface .................................................................................................. ９ 7
Figure 7: Top placement map of LEO3 RF (Band13).................................................................... １０ 8
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TABLES 13
Table 1: List of SPI programmable devices ..................................................................................... ８ 14
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BAND13 RF board manual
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1 Introduction 1
2
1.1 Scope 3
4
This RF board is intended for radio frequency part of LTE user equipment platform to develop 5
and verify LTE user equipment modem. This RF board is connected to 3rd version of LTE user 6
equipment platform (LEO3) as the form of daughter board. This document intends to describe the 7
brief architecture and usages of the board designed as RF part of LEO3 platform. 8
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1.2 Terminology 11
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ADC Analog to Digital Converter 13
AFC Automatic Frequency Compensation 14
DAC Digital to Analog Converter 15
LO Local Oscillator 16
LTE Long Term Evolution 17
LVDS Low-Voltage Differential Signaling 18
MISO Multi-In Single-Out 19
PA Power Amplifier 20
RF Radio Frequency 21
SAW Surface Acoustic Wave 22
UE User Equipment 23
VGA Variable Gain Amplifier 24
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BAND13 RF board manual
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2 Features and Photograph 2
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2.1 Features 4
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Supporting RF band: BAND-13 6
Transmitting Frequency band: 777 ~ 787 MHz (10MHz) 7
Receiving Frequency band: 746 ~ 756 MHz (10MHz) 8
2-Receive path and 1-Transmit path (MISO) 9
+6V dc main power supply 10
19.2 MHz reference clock 11
Transceiver 12
Two chips transceiver solution by Infineon SMARTiLTE ICs(PMB_LTE_v093) 13
Triple-band operation 14
Three programmable LTE RF bandwidths: 5,10,20MHz 15
Supply voltage rage from 2.7 ~ 3.0V 16
Optional 2nd supply voltage from 1.71 ~ 3.0V 17
On-chip LDO 18
Different power-down modes 19
3-wire bus programmable 20
10-bit ADC and DAC support 21
61.44 MHz for AD conversion 22
122.88 MHz for DA conversion 23
Additional 16-bit HKDAC for Tx VGC and AFC 24
2.2 Photograph of the LEO3 RF board 25
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BAND13 RF board manual
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Figure 1: Photograph of LEO3 RF 3
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- Mechanical size of board is 170 (W) X 170 (H) mm5
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BAND13 RF board manual
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3 Block Diagram and Description 2
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3.1 Block Diagram 4
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2.7-3.0V
2.7-3.0V
1.4-1.6V
1.71-3.0V
2.7-3.0V
2.7-3.0V
1.4-1.6V
1.71-3.0V
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Figure 2: RF Block Diagram (For RX/TX) 9
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3.2 Block Description 11
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3.2.1 RX Blocks 13
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Two receive paths, RX0 path and RX1 path, are designed for MISO technology to increase the 15
receiving data throughput. Both of receiving paths have the same structure and consist of the 16
following transceivers and anything else analog devices. 17
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LNA 19
- This LNA is used for each receiving path 20
- LNA has the fixed 14dB gain at range of Band13 21
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Transceiver (RX section) 23
- LNA2 with three programmable gain steps 24
- Complete analog baseband path without external components 25
- Three programmable baseband channel filter bandwidths 26
- Separate RX PGC 3-wire bus operation possible 27
- Performance 28
RX Total Gain : 2~80dB 29
Gain step: 1dB 30
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