LG LEO3 Users manual
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LEO3 RF (AWS) Hardware Manual |
Manual |
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1ABSTRACT
2This document is a hardware RF board manual for LTE user equipment platform. Contents of
3this document are the description of each blocks and usage directions. It is recommended to
4peruse this manual before operating RF Board.
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8 KEY WORDS
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Mobile Communication Technology Research Lab.
533 Hogye-dong, Dongan-gu, Anyang-shi,
Kyongki-do, KOREA
©Copyright, 2009 By LG Electronics Inc. All rights reserved.
No part of this document may be reproduced in any way, or by any means, without the express written permission of LG Electronics Inc.
LGE Proprietary |
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MCTR Lab. |
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UE RF Band4 HW Manual
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44[Notice]
451. The product described in this manual may be modified without prior notice for reliability,
46functionality or design improvement.
472. Information contained in this manual is correct and reliable, but LG shall not be held
48responsible for damage due to the use of information, product or circuit or infringement of
49property rights or other rights.
503. This manual does not grant users the property rights and other rights of the third party or LG
51Electronics Inc.
524. No part of this manual may be transcribed or duplicated without the written permission of LG
53Electronics Inc.
545. The appearance of the product shown in this manual may slightly differ from that of the actual
55product.
LGE Proprietary |
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1 |
Introduction |
CONTENTS |
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1.1 |
Scope ..................................................................................................................................... |
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1.2 |
Terminology............................................................................................................................ |
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Features and Photograph........................................................................................................... |
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2.1 |
Features ................................................................................................................................. |
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2.2 |
Photograph of the LEO3 RF board.......................................................................................... |
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Block Diagram and Description.................................................................................................. |
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3.1 |
Block Diagram ........................................................................................................................ |
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Block Description.................................................................................................................... |
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3.2.1 RX Blocks .............................................................................................................................. |
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3.2.2TX Blocks................................................................................................................................ |
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3.2.3 Common Blocks................................................................................................................. |
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Interface .................................................................................................................................... |
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4.1 |
Power supply .......................................................................................................................... |
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4.2 |
Digital I/Q Data & Sampling Cock ........................................................................................... |
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4.3 |
SPI ......................................................................................................................................... |
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4.4 |
Control signals (GPIO’s).......................................................................................................... |
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4.5 |
LEDs....................................................................................................................................... |
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4.6 |
Logic probing header .............................................................................................................. |
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Placement Map....................................................................................................................... |
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LGE Proprietary |
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MCTR Lab. |
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Rev. |
UE RF Band4 HW Manual
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FIGURES |
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Figure 1: Photograph of LEO3 RF................................................................................................... |
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Figure 2: RF Block Diagram (For RX/TX) ........................................................................................ |
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Figure 3: Diagrams of Power supply................................................................................................ |
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Figure 4: Diagrams of Data & Clock Signal Interface....................................................................... |
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Figure 5: Diagram of SPI interface.................................................................................................. |
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Figure 6: RX I/Q data probing Interface........................................................................................ |
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Figure 7: Top placement map of LEO3 RF (AWS) ....................................................................... |
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Table 1: List of SPI programmable devices |
TABLES |
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LGE Proprietary |
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MCTR Lab. |
Updated |
File |
Rev. |
UE RF Band4 HW Manual
1 1 Introduction
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3 1.1 Scope
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5This RF board is intended for radio frequency part of LTE user equipment platform to develop
6and verify LTE user equipment modem. This RF board is connected to 3rd version of LTE user
7equipment platform (LEO3) as the form of daughter board. This document intends to describe the
8brief architecture and usages of the board designed as RF part of LEO3 platform.
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1.2Terminology
ADC |
Analog to Digital Converter |
AFC |
Automatic Frequency Compensation |
DAC |
Digital to Analog Converter |
LO |
Local Oscillator |
LTE |
Long Term Evolution |
LVDS |
Low-Voltage Differential Signaling |
MISO |
Multi-In Single-Out |
PA |
Power Amplifier |
RF |
Radio Frequency |
SAW |
Surface Acoustic Wave |
UE |
User Equipment |
VGA |
Variable Gain Amplifier |
LGE Proprietary |
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MCTR Lab. |
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