Page 1
Service Manual
Model : KS360
Service Manual
KS360
Date: August, 2008 / Issue 1.0
Internal Use Only
Page 2
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KS360
Series.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
J.P.Kim Jul. 18. 2008 0.1 -
Page 3
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 4
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................19
3.1 KS360 series Component
Block diagram... .....................................19
3.2 Baseband Processor (BBP)
Introduction ............................................20
3.3 Power management IC ..........................28
3.4 Power ON/OFF ......................................32
3.5 SIM interface..........................................33
3.6 Micro SD external memory Interface .....34
3.7 Memory ..................................................35
3.8 LCD Display ...........................................36
3.9 Keypad Switching & Scanning ...............39
3.10 Touch KEY...........................................41
3.11 Keypad back-light illumination .............43
3.12 LCD back light illumination...................44
3.13 ISP(Image Signal Processor)...............45
3.14 JTAG & ETM interface connector ........46
3.15 Audiot ...................................................47
3.16 Charging circuit ....................................49
3.17 BLUETOOTH .......................................50
3.18 FM Radio .............................................52
3.19 18pin Multi Media Interface
connector .............................................53
3.20 General Description .............................55
3.21 Receiver part........................................57
3.22 Transmitter part....................................58
3.23 RF synthesizer .....................................59
3.24 DCXO...................................................60
3.25 Front End Module control.....................60
3.26 Power Amplifier Module .......................61
4. PCB layout......................................62
4.1 Main PCB component placement ..........62
5. Trouble shooting............................66
5.1 Trouble shooting test setup....................66
5.2 Power on Trouble...................................67
5.3 Charging trouble ....................................70
5.4 LCD display trouble................................72
5.5 Camera Trouble .....................................74
5.6 Receiver & Speaker trouble ...................76
5.7 Microphone trouble ................................78
5.8 Ear-MIc Jack Detection trouble..............79
5.9 Vibrator trouble ......................................80
5.10 Keypad back light trouble.....................82
5.11 SIM & USD trouble...............................84
5.12 Touch trouble .......................................88
5.13 Qwerty Key trouble ..............................90
5.14 Trouble Shooting of Receiver Part.......92
5.15 Trouble Shooting of Transmitter Part...96
6. Download & S/W upgrade...............103
6.1 S/W download setup ............................103
6.2 Download program user guide.............104
6.3 Multi-Download Program Setting .........105
7. CIRCUIT DIAGRAM ......................107
8. BGM PIN MAP...............................117
9. PCB LAYOUT................................121
10. RF Calibration ............................127
10.1 Test Equipment Setup .......................127
10.2 Calibration Step .................................127
11. Stand-alone Test ........................133
11.1 Test Program Setting .........................133
11.2 Tx Test ...............................................135
11.3 Rx Test...............................................136
12. ENGINEERING MODE ................137
13. EXPLODED VIEW &
REPLACEMENT PART LIST ......139
13.1 Exploded View ...................................139
13.2 Replacement Parts ............................141
Table Of Contents
Page 5
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KS360 Series.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KS360 Series or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KS360 Series must be performed only at the LGE or its authorized
agents. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 7
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1. INTRODUCTION
E. Notice of Radiated Emissions
The KS360 Series complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KS360 Series may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 8
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1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
Page 9
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
- 10 -
LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
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2. GENERAL PERFORMANCE
2.1 H/W Feature
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Feature Comment
Standard Battery Li-Polymer, 800mAh
AVG TCVR Current 250mA typ @PL5
Standby Current 1.85 mA typ @PP9
Talk time 5.6 hours (GSM TX Level 10)
Standby time Over 430 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓
TX output power EGSM : 32.5dBm (@PL 5)
DCS/PCS: 29.5/29.5dBm (@PL 0)
GPRS compatibility Class 12
SIM card type 3V Small
Display Main 240x320 262K TFT 2.4”
Status Indicator Dial keys are implemented by touchpad.
Navi, Send, Call End, Back, Volume Up, Volume Down,
Camera, Touch hot Key and CLEAR
Number key, Alphabet, OK, space bar,
Function key are implemented by Qwertykey
ANT Built in antenna
EAR Phone Jack - 18pin multi port Headset jack (Call/Music)
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
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2. GENERAL PERFORMANCE
2.2 Technical specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
1Frequency Band
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 2 mA(@PP9)
21 Talk Time
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
22 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current
Fast Charge : < 450 mA
Slow Charge: < 200 mA
Antenna Bar Number Power
7 >-92 dBm ~
7 → 5 -97dBm ~ -93dBm
25 Antenna Display
5 → 4 -100dBm ~ -98dBm
4 → 2 -103dBm ~ -101dBm
2 → 1 -105dBm ~ -104dBm
1 → 0< -106 dBm
Off No Service
Page 15
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Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE
- 16 -
Item Description Specification
Battery Bar Number Voltage( 0.05V)
3 3.74V ~ 4.2V
26 Battery Indicator 2 3.64V~3.73V
1 3.45V ~ 3.63V
0 3.35V ~ 3.44V
27 Low Voltage Warning
3.45V ↓ 0.05V (Call)
3.45V ↓ 0.05V (Standby)
28 Forced shut down Voltage 3.35 0.05 V
Li-ion Battery or Li-Polymer Battery
29 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 5.6V, 0.4A
Page 16
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE
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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM 9%
2 Peak EVM 30%
395thPercentile EVM 15%
4Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
Page 17
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. GENERAL PERFORMANCE
- 18 -
Item Description Specification
6 Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
Page 18
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
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3.1 KS360 series Component Block diagram
3. TECHNICAL BRIEF
Figure 1. KS360 series Functional Block Diagram
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3. TECHNICAL BRIEF
3.2 Baseband Processor (BBP) Introduction
3.2.1 General Description
extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution,
integrating the digital and mixed signal portions of the base band in 0.13um, 1.5V technology.
The chip will fully support the FR/HR/EFR/NB-AMR speech codec.
additional external hardware.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Æ
K
r
Baseband
DAC
DAC
USB FS
FCDP
Keypad
GPIO
USI
IrDA
MMC/SD
I
AD
DMAC
ARMÆ 926
USIM
IS /
Speech
and
Decodin
Speech
and
Encodin
SRAM
MOVE
I
Cipher
TEAKLit
ICU
USARTs
GS
Equalize
GEA-1/2/3
CAPCOM
IR-Memory
GS
Timer
SCCU
GPT
RTC
Multimedia IC
Camera
I
DigR
RF
Contro
EBU
CGU
AUX
C
AD
IC
JTAG
Display
I
R
DigR
GMS
8PSK
3-wire
Ctrl
Power
Hands-
free
Amp
Powe
Contro
+
Ramp
Gen
DCXO
LED
PWMís
Charge
FIR
DC
Offset
Comp
FIR
Sigma-Delta
MASH
Modulato
-
L
DA
LDO
S
(BL
SD1
(1.5V)
SD2
(1.8V)
PL
LD
I/
LD
ANA
LD
AD
LPF
AD
AD
PA/FE
Contro
GP
LD
SI
LD
USB
LD
VI
LD
AUX
LD
RTC
LD
RF
LD
RF
LD
LD
RF1
Page 20
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3. TECHNICAL BRIEF
3.2.2 Block Description
• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S
includes an MMU, and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
LGE Internal Use Only
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Only for training and service purposes
Page 21
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3. TECHNICAL BRIEF
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)
3.2.3 External Devices connected to memory interface
Table 1. Memory interface
3.2.4 RF Interface
on/off RF ICs Periodically each TDMA frame.
Table 2. RF Interface Spec
.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Device Name Maker Remark
NAND FLASH K5D1G12ACD-D075 Samsung Synchronous / A synchronous
SDRAM K5D1G12ACD-D075 Samsung Synchronous 133MHz
LCD IM200DBN7A LGIT 8bit access 2times transmission
Resource Interconnection Description
TX2 TXHB Output High band(DCS/PCS) Tx
TX1 TXLB Output Low band(850/900) Tx
RX1, RX1X GSM850_RXP, GSM850_RXN Input of GSM850 LNA
RX2, RX2X GSM900_RXP, GSM900_RXN Input of GSM900 LNA
RX3, RX3X DCS1800_RXP, DCS1800_RXN Input of DCS1800 LNA
RX4, RX4X PCS1900_RXP, PCS1900_RXN Input of PCS1900 LNA
PABS PA_BAND Select PAM operation band.
FE1, FE2 VC1, VC2 Control FEM operation band & mode
PAEN PA_EN PAM Enable
VRAMP TX_RAMP Tx Ramp signal
T_OUT6 PA_MODE Select PAM operation mode (GSM/EDGE)
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3. TECHNICAL BRIEF
3.2.5 USART Interface
KS360 have two UART Drivers as follow :
- USART0 : SW upgrade / Calibration
- USIF : BT Interface.
Table 3. USIF Interface Spec.
3.2.6 ADC channel
BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Resource Name Remark
UART0
UART0_TXD UART_TX Transmit Data
UART0_RXD UART_RX Receive Data
USIF
USIF_TXD UART_BT_TX Transmit Data
USIF_RXD UART_BT_RX Receive Data
T_OUT3 UART_BT_RTS Flow Control Signal
T_OUT4 UART_BT_CTS Flow Control Signal
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery supply voltage measure
M9 N.C
M10 JACK_TYPE JACK type measure (Not used)
Page 23
3.2.7 GPIO map
Over a hundred allowable resources, KS360 is using as follows except dedicated to SIM and Memory.
KS360 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
- 24 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Port Function Net Name Description
#Keypad
KP_IN1 KEY_I2C_SCL Key coder IC control
KP_IN2 KEY_I2C_SDA Key coder IC control
KP_IN3 DIF_RESET LCD reset
KP_IN4 BT_RESET BT reset
KP_IN5 IF_MODE3 LCD interface mode (Hitachi LCD => High)
KP_IN6 VIB_PWR_EN Motor LDO enable
KP_OUT0 CAM_PWR_EN Camera LDO enable
KP_OUT1 LIN_INVERT Motor control
KP_OUT2 TOUCH_SCL Touch IC control
KP_OUT3 TOUCH_SDA Touch IC control
#USART0
USART0_RXD UART_RX UART, RS232 data
USART0_TXD UART_TX UART, RS232 data
USART0_RTS_N MMC_DET Micro SD card Detect
USART0_CTS_N HOOK_DETECT Earmic hook key Detect
DSPOUT0 JACK_DET Earmic Detect
#USB
USB_DPLUS USB_DP USB +
USB_DMINUS USB_DM USB -
#CIF:Camera Interface
CIF_D0 CAM_D(0) Camera DATA(0)
CIF_D1 CAM_D(1) Camera DATA(1)
CIF_D2 CAM_D(2) Camera DATA(2)
CIF_D3 CAM_D(3) Camera DATA(3)
CIF_D4 CAM_D(4) Camera DATA(4)
CIF_D5 CAM_D(5) Camera DATA(5)
CIF_D6 CAM_D(6) Camera DATA(6)
Page 24
- 25 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CIF_D7 CAM_D(7) Camera DATA(7)
CIF_PCLK CAM_PCLK Camera pixel clock
CIF_HSYNC CAM_HS Camera H sync
CIF_VSYNC CAM_VS Camera V sync
CLKOUT2 CAM_MCLK Camera main clock
CIF_PD_GPIO CAM_PWDN Camera sensor power down
CIF_RESET_GPIO CAM_RST Camera reset
#Display_Interface
DIF_D0 DIF_D(0) LCD DATA(0)
DIF_D1 DIF_D(1) LCD DATA(1)
DIF_D2 DIF_D(2) LCD DATA(2)
DIF_D3 DIF_D(3) LCD DATA(3)
DIF_D4 DIF_D(4) LCD DATA(4)
DIF_D5 DIF_D(5) LCD DATA(5)
DIF_D6 DIF_D(6) LCD DATA(6)
DIF_D7 DIF_D(7) LCD DATA(7)
DIF_CS1 DIF_CS LCD chip select
DIF_CS2 BT_INT BT interrupt
DIF_CD DIF_CD LCD command/data switch
DIF_WR DIF_WR LCD write
DIF_RD DIF_RD LCD read
DIF_HD EOC Indicating End of charging
DIF_VD DIF_VSYNC LCD V sync
DIF_RESET1_GPIO KEY_INT Key coder IC interrupt
#I2C
I2C_SCL I2C_SCL For Sub-PMIC/Audio DAC/Camera
I2C_SDA I2C_SDA For Sub-PMIC/Audio DAC/Camera
#Chip Card (USIM1)
CC_IO SIM_DATA SIM card I/O
CC_CLK SIM_CLK SIM card CLOCK
CC_RST SIM_RST SIM card RESET
#MMCI: Multimedia Card IF
MMCI_CMD MMC_CMD uSD Card command/response
MMCI_DAT0 MMC_D0 uSD Card Data (0)
MMCI_CLK MMC_CLK uSD Card Clock
Page 25
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
#USIF: Universal Serial IF
USIF_TXD_MTSR UART_BT_TX BT UART data output
USIF_RXD_MRST UART_BT_RX BT UART data input
USIF_SCLK BT_VCXO_EN BT vcxo (26MHz) enable
#I2S1: DAI-PCM
I2S1_CLK0 I2S1_CLK BT synchronous data clock
I2S1_RX I2S1_RX BT synchronous data input
I2S1_TX I2S1_TX BT synchronous data output
I2S1_WA0 I2S1_WA0 BT synchronous data sync
#MMCI: SD-Extension
MMCI_DAT1 MMC_D1 uSD Card Data (1)
MMCI_DAT2 MMC_D2 uSD Card Data (2)
MMCI_DAT3 MMC_D3 uSD Card Data (3)
#Voiceband: Analog Interface
EP_N BB_SND_L For Speaker
EP_P BB_SND_R For Speaker
HS_N RCV_N For Receiver
EP_CM NA
HS_P RCV_P For Receiver
MIC1_N MIC_N For Mic
MIC1_P MIC_P For Mic
MIC2_N HS_MIC_N For Headset Mic
MIC2_P HS_MIC_P For Headset Mic
VMIC MICBIAS Power for MIC
#Measurement
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 LCD_ID LCD ID measure (Hitachi LCD_ID = 0)
M7 GND
M8 VBAT Battery voltage measure
M9 NA
M10 JACK_TYPE JACK type measure (Not used)
#JTAG
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
Page 26
#FCDP:Flash Controller DMA Port
FCDP_RBN FCDP
#GSM TDMA Timer: GSM Control
T_OUT3 UART_BT_RTS BT UART request to send
T_OUT4 UART_BT_CTS BT UART clear to send
T_OUT5 TOUCH_INT Touch IC interrupt
T_OUT6 PA_MODE PAM
T_OUT7 RPWRON Remote Power On
T_OUT8 LIN_PWM_FRQ Motor control
#Other Functional Pins:
Clocks and control
CLKOUT0 CHG_EN Charging enable
F32K To 32KHz crystal
OSC32K To 32KHz crystal
RESET_N nRESET
#Extra I/Os & Interrupt Inputs
DSPIN0 CLK32K BT 32kHz sleep clock
DSPIN1 SLIDE_OPEN Slide open/close detect
#Baseband I/0
FSYS3 NA
FSYS2 26MHZ_BT BT Main clock
#Reference Oscillator / PLL
REFR NA
XOX 26MHz 26MHz Main clock
XO 26MHz 26MHz Main clock
#LED's
BL1_PWM / VSENSE1 DBB_BL_PWM Not used
BL2_PWM LIN_PWM_MAG Motor control
BL3_PWM SUB_KEY_BL Sub Key LED control
VSS_FLASH GND
FLASH_SINK QWERTY_KEY_BL Qwerty Key LED control
#Control Logic
LPBCL_ECHO GND
ON_OFF / SCAN_RESET PWRON
RESET2_N / VSENSE2 M_RESET Memory reset
PO_RESET_N / SCAN_OUT2 PO_RESET
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 27
- 28 -
3. TECHNICAL BRIEF
3.3 Power management IC
3.3.1 General Description
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 28
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3. Top level block diagram of the PMU Block of PMB8888
Page 29
Table 6. LDOs Output Table of PMU Block of PMB8888
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LDO Net name Output Voltage Output Current Usage
SD1 VSD1_1V5 1.5V 400mA Core & for LDO
SD2 1V8_VSD2 1.8V 300mA Memory
VAUX 2V9_VAUX 2.9V 150mA BT Power
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_VSIM 2.9V 22mA SIM card
VMME 2V9_VMMC 2.9V 150mA SD Card
VAUDIO 2V5_VAUDIO 2.5V 220mA Headset
VUSB 3V1_VUSB 3.1V 40mA USB Switch
VRF1 2V85_VRF1 2.85V 150mA
VRF2 1V5_VRF2 1.5V 80mA
VRF3 2V85_VRF3 2.85V 150mA
VRTC 2V0_VRTC 2.0V 4mA RTC
VVIB 2V8_VVIB 2.8V 140mA Touch
Figure 4. LDOs Circuit Diagram of KS360 series
1V5_VRF2
C103 120p
C102 0.01u
2V85_VRF3
1V8_VSD2
1V5_VSD1
0.1u
L10
M10
J8
VSS_MAIN_1
VSS_MAIN_2
VSS_MAIN_3
39p
C118
V19
VSS_MAIN_4L8VSS_MAIN_5
VDDP_EBU_1
L100 47nH
F3
VSS_MS
H2
VSS_EP
K1
K4
AGND_MS1
C114
0.1u
L11
M11
L9
VDD_MAIN_1
VDD_MAIN_2
C112
L12
M9
VDD_MAIN_3
VDD_MAIN_4
C113
0.1u
2V85_VRF3
47nHL102
C128 100p
W4
VDDTX
AGND_MS2
C104 0.1u
W5
VDDVCO
T3
VDDTRX
2V85_VRF3
2V85_VRF1
T6
P4
VDDDIG
C119 0.01u
VDDMS
0.01uC105
V7
VDDXO
2V85_VRF3
W6
VDDPLL
2V8_VVIB
2V5_VAUDIO 3V1_VUSB
C101
2.2u
2V9_VAUX
L101 47nH
0.01uC120
0.01u
C122 1u
C121
E1
D11
E2
E3
VDDRX
VAUDIO
VSS_AUDIO
VBAT_AUDIO
C10
VLED
VAUX
L1
2V9_VMMC
E12
D12
VVIB
C100
2.2u
C115 2.2u
B7
E11
A7
VMMC
VSS_LDO1
VBAT_LDO1
1V5_VRF2
C107
C106
1u
1u
2V62_VIO
1V5_VPLL
1uC123
C124 1u
C6
B8
A8
C7
A3
VIO
VSIM
VUSB
VSS_LDO2D6VSS_LDO3
VBAT_LDO2
VBAT_BSW_USB_MMC
2V85_VRF12V85_VRF3
B4
B3
VRF2B1VRF3
VPLL
VDD_RF2PLL
220nC108
A2
VRF1
VBAT
1uC109
2V85_VRF3
C125 1u
B2
VBAT_RF13
220n
C110
VBAT 2V9_VSIM
2.2uC116
C3
M2
N2
VSSRF1
C111 1u
220n
C126
T2
VSSRF6
VSSRF2N3VSSRF3P2VSSRF4R2VSSRF5
VSSRF7U2VSSRF8U3VSSRF9
C127
1u
U6
V2
VSSRF10V4VSSRF11V5VSSRF12
VSSRF13V6VSSRF14
W1
VBAT
C5
A4
CH_GATE
CH_SOURCE
2V0_VRTC
C130
0.1u
D7
A5
C4
VDD_REF
SENSE_IN1D5SENSE_IN2
VDDCHARGE
KDR331V
2
3
1
D100
C117
0.1u
A1
A19
W19
C8
M4
NC1
NC2
NC3
VDD_FUSE_FS
CHARGE_UC_SCAN_IN1
R101 0
2V0_VRTC
E18
D18
VSS_RTC
VDD_RTC
0R100
VCHG_OVP
VBUS_OVP
C129
0.1u
Page 30
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.3.2 Charging
KS360 charge the battery using an external charging IC of Intersil ISL9221 for Li-Polymer battery in
4.2 Volts level.
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 400 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.15 V
9 Low battery alarm
a. Idle : 3.45 V ~ 3.35 V
b. Dedicated : 3.45 V ~ 3.35 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.35 V
12. Charging temperature adc range
a. ~ -5 : low charging voltage operation (3.6 V ~ 3.9 V)
b. -5 ~ 50 : standard charging (up to 4.2 V)
c. 50 ~ : low charging voltage operation (3.6V ~ 3.9V)
4.2V~3.74V 3.74V~3.64V
3.64V~3.45V 3.45V~3.35V
Figure 5. Battery Block Indication
Page 31
- 32 -
3. TECHNICAL BRIEF
3.4 Power ON/OFF
KS360 series Power State : Defined 3cases as follow
] Power-ON-charging : Charger or USB detect.
triggered by a push button. To detect if the push-button is pressed during system operation the logical
level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF
register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-
mentioned bit won’t be set.
To support Remote power on function for factory mass production, applied an BJT as following figure.
As monitoring the RPWRON and Key matrix KEY_COL7 & KEY_ROW6, KS360 series system
recognize whether remote power on or End-key pushed
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 6. Remote power on and End-key power on circuit.
Remote Power On
R222
10K
END
100K
R224
END_KEY_IN
KEY_COL7
KEY_ROW6
RPWRON_EN
RPWRON
R225
R223
2K
100K
END_KEY_IN
330K
R219
C226
10u
R221
3.3M
2V0_VRTC
2K
R220
EMX18
Q201
PWRON
25631
4
END_KEY
Page 32
- 33 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.5 SIM interface
KS360 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 7). SIM_DATA,
SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_DATA : SIM card bidirectional data
Figure 7. SIM Circuit
SIM CONNECTOR
2V9_VSIM
R522
DNI
15K
SIM_DATA SIM_CLK
C546
DNI
R523
4
5
6
10
9
C5
C6
C7
GND4
J500
GND1
GND2GND3
2V9_VSIM
1
C1
2
C2
3
C3
7
8
C543
220n
C547
22p
SIM_RST
C548
1000p
Page 33
- 34 -
3. TECHNICAL BRIEF
3.6 Micro SD external memory Interface
In KS360 series a Micro SD slot for external Memory is connected to PMB8888.
Micro SD memory pad assign.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 8. Micro SD Card Circuit
SD mode
Pin No. Name Type Description
DAT1_2 MMC_D1 I/O Data bit [1]
DUMMY1 NC
DAT0 MMC_D0 I/O Data bit [0]
VSS GND GND Ground
CLK MMC_CLK I Clock
VDD 2V9_VMMC Power Power
CMD MMC_CMD I/O Command response
CD_DAT3 MMC_D3 I/O Data bit [1]
DUMMY2 NC
DAT2 MMC_D2 I/O Data bit [2]
DETECT_A MMC_DET
DETECT_B GND GND Ground
DUMMY3 GND GND Ground
MICRO SD Connector
100KR501
2V9_VMMC
C532
27p
2V9_VMMC
C534
C533C531
27p27p
1u
S500
GND
AXA463062P
DAT1_2
DUMMY1
DAT0
VSS
CLK
VDD
CMD
CD_DAT3
DUMMY2
DAT2
DETECT_A
DETECT_B
DUMMY3
100KR502
100KR503
100K
R504
C530
C529
27p
27p
27p27p
MMC_D1
MMC_D0
MMC_CLK
MMC_CMD
MMC_D3
MMC_D2
MMC_DET
2V62_VIO
100KR500
27p
100KR508
C527 C528C526
Page 34
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.7 Memory
1Gbit NAND Flash & 512Mbit SDRAM employed on KS360 series with 8 bit bus for NAND and 16bit
bus for SDRAM thru ADD(0) ~ ADD(24). The 1Gbit NAND Flash memory with SDRAM stacked device
family offers multiple high-performance solutions.
0.1u
C138
1V8_VSD2
C134
0.1u
R110
3.3K
R109
3.3K
TP105
TP100
1V8_VSD2
TP104
R105 22
R106 22
TP102
1V8_VSD2
0.1u
C135C131
0.1u
1V8_VSD2
C137
0.1u
0.1u
C133C132
0.1u
0.1u
C136
R111
1
E2
VSSQ1
J2
VSSQ2
L2
VSSQ3
_CAS
F7
C6
_CE
_CS
E9
_RAS
E7
_RE
E5
D6
_WE
F8
_WED
_WP
F5
N7
VCC2
VCCQ
N6
VDD1
B4
VDD2
G9
H2
VDD3
M2
VDD4
D2
VDDQ1
F2
VDDQ2
K2
VDDQ3
C2
VSS1
VSS2
F9
G2
VSS3
VSS4
N4
B5
VSS5
N5
VSS6
VSS7
N8
M6
NC18
NC19
M7
B7
NC2
M8
NC20
NC21
N2
N9
NC22
B9
NC3E8NC4
NC5
F3
F6
NC6
G4
NC7
NC8
G5
G6
NC9
E6
R__B
UDQM
H3
VCC1
B6
J6
IO2
L6
IO3
IO4
J7
IO5
L7
J8
IO6
L8
IO7
LDQM
G3
NC1
B2
NC10
H5
H6
NC11
NC12J3NC13
K5
K6
NC14
NC15
K7
K8
NC16
NC17
M5
K4
DQ10
DQ11
L3
L4
DQ12
DQ13
M3
M4
DQ14
N3
DQ15
DQ2
C3
D4
DQ3
DQ4
D3
E4
DQ5
DQ6
E3
F4
DQ7
J4
DQ8
DQ9
K3
IO0
J5
IO1
L5
G8
CKE
CLE
C5
H4
CLK
DNU1
A2
P9
DNU10
DNU11
P10
A9
DNU2
DNU3
A10
B1
DNU4
DNU5
B10
N1
DNU6
DNU7
N10
P1
DNU8
DNU9
P2
B3
DQ0
C4
DQ1
A0
C7
C8
A1
A10
D9
A11
H9
A12
G7
A2
C9
A3
B8
A4
M9
A5
L9
A6
K9
A7
J9
A8
H7
H8
A9
ALE
D5
BA0
D7
D8
BA1
K5D1G12ACD-D075
U100
SDRAM_CS
M_RESET
DATA(0:15)
DATA(0:7)
DATA(15)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
DATA(8)
DATA(9)
DATA(10)
DATA(11)
DATA(12)
DATA(13)
DATA(14)
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
SDCLKI
FLASH1_CS
ADD(0:12)
ADD(12)
ADD(2)
ADD(3)
ADD(4)
ADD(5)
ADD(6)
ADD(7)
ADD(8)
ADD(9)
DATA(0)
DATA(1)
DATA(2)
ADD(0)
ADD(1)
ADD(10)
ADD(11)
_WR
FCDP
ADD(13)
ADD(14)
CKE
_CAS
_RAS
_WR
_BC0
_BC1
SDCLKO
ADD(16)
ADD(17)
_RD
Figure 9. Memory Circuit
Page 35
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.8 LCD Display
LCD module include:
- Main LCD: 240x320 262K TFT 2.4”
- Backlight : 5 piece of white LED
LCD Connector Interface Spec:
Table 7. LCD Connector Interface Spec.
3. TECHNICAL BRIEF
- 36 -
Pin No. Pin Name I/O Description
1 GND Ground
2 PWM O PWM signal output for backlight control
3 DTX3 I Interface Mode
4 DTX1 I Interface Mode
5 DTX1 I Interface Mode
6 VSYNC-O O Vsync Interface out
7 RD O Read
8 WR I/O Write
9 RS I/O Address/Data select
10 CS I/O Chip Select
11 D15 I/O Data[15] for LCD
12 D14 I/O Data[14] for LCD
13 D13 I/O Data[13] for LCD
14 D12 I/O Data[12] for LCD
15 D11 I/O Data[11] for LCD
16 D10 I/O Data[10] for LCD
17 D9 I/O Data[9] for LCD
18 D8 I/O Data[8] for LCD
19 D7 I/O Data[7] for LCD
20 D6 I/O Data[6] for LCD
21 D5 I/O Data[5] for LCD
22 D4 I/O Data[4] for LCD
23 D3 I/O Data[3] for LCD
Page 36
- 37 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Pin No. Pin Name I/O Description
24 D2 I/O Data[2] for LCD
25 D1 I/O Data[1] for LCD
26 D0 I/O Data[0] for LCD
27 LCD-ID I Menufacture ID
28 VCC1 I Logic
29 VCC1 I Analog
30 RESET I/O LCD reset
31 MLED5 O LED Cathode
32 MLED4 O LED Cathode
34 MLED3 O LED Cathode
34 MLED2 O LED Cathode
35 MLED1 O LED Cathode
36 MLED I LED Anode
37 GND - Ground
Page 37
- 38 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 10. 37pin LCD connector circuit
2V62_VIO
LCD_BL_PWM
IF_MODE3
DIF_VSYNC
DIF_RD
DIF_WR
DIF_CD
DIF_CS
DIF_D(7)
DIF_D(6)
DIF_D(5)
DIF_D(4)
DIF_D(3)
DIF_D(2)
DIF_D(1)
DIF_D(0)
LCD_ID
DIF_RESET
MLED5
MLED4
MLED3
MLED2
MLED1
MLED
R100
100K
R102 0
C100
0.1u
IFMODE(1)
IFMODE(0)
CN100
1
2
3
0R101
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
VA101
EVLC14S02050
Page 38
- 39 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.9 Keypad Switching & Scanning
The keypad is controlled by a Key coder IC (PP2106M2). It can be used for scanning keypads up to 8
rows and 8 columns (max 64 keys). PMB8888 control PP2106M2 by KEY_I2C_SCL, KEY_I2C_SDA
and KEY_INT.
Figure 11-1. Keypad Configuration Circuit
QWERTY KEY
2V62_VIO
2V62_VIO
R400
120K
XI
U400
P53
(1%)
25
XO
24
23
VDD
CLK_SEL
470R419
470R420
KEY_I2C_SDA
R401 0
22
P10
P40
P41
P42
P43
P44
P45
P46
P4713P5012P5111P52
14
R402
21
20
19
18
17
16
15
4.7K
R403 470
470R404
R406 470
470R408
R410 470
470R412R411 0
R414 470
C41727p
C416
C41427p
C41827p
27p C415
C41927p
27p
C41327p
C400
2V62_VIO
27pC402
C404 27p
C403 27p
KEY_COL7
KEY_COL6
KEY_COL5
KEY_INT KEY_ROW5
KEY_I2C_SCL
2V62_VIO
470R405
R407 470
470R409
R415
4.7K
0R413
0.1uF
C401 0.1uF
1
TEST
2
SEL_28P
3
P57
4
P56
5
P55
6
P17
7
P15
C420 27p
27pC421
27pC422
C423 27p
27pC424
29
28
GND2
PGND
GND1
8
27
26
RESETB
PP2106M2
P54
9
10
470R416
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_ROW6
R417 470
KEY_COL4
KEY_COL3
R418 470
KEY_COL2
KEY_COL1
KEY_COL0
Page 39
- 40 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 11-2. Keypad Configuration Circuit
KEY_ROW4
KEY_ROW5
KEY_ROW6
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
Soft1
KB400
END_KEY
W
KB401
KB402
E
100
104
107
150R112
VA100
EVL14S02200
101
105
108 109
END
KB100
SENDSOFT2SOFT1
RIGHTCLRHOT
DOWNUPLEFT
VBAT
UT
OK
KB405
103
Soft2OI
KB407KB403 KB406KB404
102
106
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
KB419KB418KB416 KB417
KB427
Y
GD
C425
KB408
27p
C426
KB424
27p
KB432
C427
27p
KB409
KB433
KB410
KB434
RAQ
FZSym
CXShift
KB412KB411
KB420
KB413
KB421
KB429
PJ
KB414
K
MNV
KB430
CLRH
KB415
MSGLSpaceSFn
KB423KB422
ENTERB
KB431KB428KB425 KB426
Page 40
- 41 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.10 Touch KEY
The Touch keypad is controlled by CY8C20434. PMB8888 control CY8C20434 by TOUCH_SCL,
TOUCH_SDA and TOUCH_INT.
Page 41
- 42 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 42
3.11 Keypad back-light illumination
There are 3 snow white color LEDs on Main PCB and 7 blue color LEDs on Sub PCB for keypad
- 43 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 12. Qwerty + Multi_Keypad Backlight Circuit
QWERTY_KEY BACKLIGHT
VBAT
R310
LEWWS44-E
LEWWS44-E
LEWWS44-E
LD300
LD301
LD302
47
R311
47
R312
47
QWERTY_KEY_BL
SUB_KEY_BL
VA301
ICVN0505X150FR
MULTI_KEY BACKLIGHT
VBAT
R110
1K
C101
1u
R111
100ohmR103
LD100
10K
R104 100ohm
LD101
LEBB-S14E
100ohmR105
LD102
LEBB-S14E
LEBB-S14E
Q100
2SC5585
R106 100ohm
LD103
100ohmR107
LD104
LEBB-S14E
LEBB-S14E
R108 100ohm
LD105
100ohmR109
LD106
LEBB-S14E
LEBB-S14E
C102
1u
Page 43
- 44 -
3. TECHNICAL BRIEF
3.12 LCD back light illumination
MAX8630W is a charge pump designed to support PWM control mode. And MAX8630W supports 5
white LEDs. The MAX8630W is capable of driving up to 5 LEDs at a total of 100mA(MAX8630W
100mA).
The current sinks may be operated individually or in parallel for driving higher current LEDs. To
maximize power efficiency, the charge pump operates in 1X, 1.5X, or 2X mode, where the mode of
operation is automatically selected by comparing the forward voltage of each LED with the input
voltage.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 13. Charge-Pump Circuit
LCD BACKLIGHT
DBB_BL_PWM
LCD_BL_PWM
C103 1u
VBAT
3
C104
1u
DNIR114
0R115
100K
R116
IN
1
GND
9
CPWM
8
PWM P_GND
C114
0.1u
2
6
C1P
U100
MAX8630W
C2P
4
5
C115 1u
C1N
C2N
OUT
LED1
LED2
LED3
LED4
LED5
7
14
13
12
11
10
15
C113
1u
9p
C108
C107 9p
9p
C109
9p
C112
C111 9p
C110 9p
MLED
MLED1
MLED2
MLED3
MLED4
MLED5
Page 44
3.13 ISP(Image Signal Processor)
KS360 Series support Camera resolution up to 2M pixel. Camera Sensor I/F is integrated in the S-
- 45 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 14. ISP & Camera Circuit
DNIR119
K11
DIF_CS1
DIF_CS2
K8
DIF_D0
E17
G15
DIF_D1
DIF_D2
G17
C19
DIF_D3
G16
DIF_D4
DIF_D5
C18
H15
DIF_D6
DIF_D7
F16
DIF_HD
F15
H10
DIF_RD
DIF_RESET2_GPIO
F17
DIF_VD
H16
DIF_WR
J9
V14
CIF_D0
CIF_D1
U13
T12
CIF_D2
CIF_D3
T13
R11
CIF_D4
CIF_D5
R12
V13
CIF_D6
T11
CIF_D7
V12
CIF_HSYNC
CIF_PCLK
W12
CIF_PD_GPIO
W11
W10
CIF_RESET_GPIO
CIF_VSYNC
V11
U11
CLKOUT2
C17
DIF_CDDIF_CD
EOC
CAM_MCLK
CAM_PWDN
CAM_RST
DIF_RD
DIF_VSYNC
KEY_INT
DSR
BT_INT
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
CAM_PCLK
CAM_HS
CAM_VS
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
DIF_CS
DIF_WR
CAMERA POWER
I2C_SCL
I2C_SDA
CAM_VS
CAM_HS
CAM_MCLK
C508 7.5p
C509 7.5p
C510 7.5p
C511 7.5p
C512 7.5p
R510 10
R511
1V8_VCAM
2V8_VCAMIO
8
7
6
5
C551
2.2u
C552
2.2u
CAM_PWR_EN
100K
R525
C550
1u
VBAT
RT9011-MGPQWU500
1
VIN VOUT1
2
EN1
3
EN2
4
PGND
9
VOUT2
NC2
GNDNC1
EUSY0319001
CAMERA CONNECTOR
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
2V8_VCAMIO1V8_VCAM
R505 10
R506 10
10R507
7.5pC500
C501 7.5p
C518 7.5p
C502 7.5p
7.5pC519
R509 10
7.5pC503
R514 10
7.5pC520
C521 7.5p
R519 10
R520
R521
7.5pC506
C504 7.5p
C505 7.5p
C507 7.5p
10R516
10R517
10R518
7.5pC525
C524 7.5p
C522 7.5p
C523 7.5p
10
10
FB500
10
10R512
10R513
R51510
7.5pC517
7.5p
C535
C513 7.5p
C514 7.5p
C515 7.5p
C516
1u
CN500
24
23
22
21
20
19
18
17
16
15
14
ENBY0020401
AXK7L24227G
G1G2
1
2
3
4
5
6
7
8
9
10
11
1213
G3G4
CAM_D(7)
CAM_D(6)
CAM_D(5)
CAM_D(4)
CAM_D(3)
CAM_D(2)
CAM_D(1)
CAM_D(0)
CAM_PCLK
CAM_RST
CAM_PWDN
C536 7.5p
C537 7.5p
7.5pC538
7.5pC541
7.5p
C540 7.5p
C539
Page 45
- 46 -
3. TECHNICAL BRIEF
3.14 JTAG & ETM interface connector
In case of KS360 series mass production, the JTAG interface connector will not be mount on board.
That is only for developing and software debugging purpose.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
22
23
24
G1 G2
G3 G4
6
7
8
9
16
25
26
27
28
29
30
17
18
19
20
21
CN100
1
10
11
12
13
14
15
2
3
4
5
1V8_VSD2
TDI
_EXTRST
TDO
TMS
RTCK
TCK
TRST_N
ON BOARD ARM9 JTAG & ETM INTERFACE
Figure 15. JTAG & ETM Interface Circuit
Page 46
- 47 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.15 Audio
KS360 series Audio signal flow diagram as following diagram.
Figure 16. Audio Signal Flow Diagram
Page 47
- 48 -
3. TECHNICAL BRIEF
3.15.1 Audio amplifier
We use MAX9877 Audio AMP, which have speaker & headphone amplifiers. An audio signal path can
be selected by I2C command.
3.15.2 Microphone circuit
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 17. Audio AMP Circuit Diagram
Figure 18. Microphone Circuit Diagram
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
0R300
BB_SND_R
BB_SND_L
FM_SND_R
FM_SND_L
i2C_SDA
I2C_SCL
C308 1u
C309
C311 1u
C312 1u
C305 1u
1u
C315
1u
C304 1u
A4
A5
D1
D2
C1
C2
B2
B3
C3
D4
B4
C1N
C1P
INA2
INA1
INB2
INB1
BIAS
SDA
SCL
RXIN+
RXIN-
MICMIC
C301
1u
B1
A3
VSS
VDD
U303
MAX9877AEWP_TG45
GND
C4
D3
PGND
C5
PVDD
OUT+
OUT-
HPR
HPL
C302
1u
A1
A2
D5
B5
MICBIAS
0R313
0R314
HSO_R
HSO_L
SPK_P
SPK_N
C321
39p
MIC_N
MIC_P
C320
22n
C318
22n
C319
39p
C317
39p
L304
100nH
L303
100nH
VA300
EVLC14S02050
L302
C322
10u
100nH
MIC300
1
P
2
G1
3
G2
4
O
SPU0409HE5H-PB
Page 48
- 49 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.16 Charging circuit
ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other
from a desktop cradle.
The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.
Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used
safely.
An over voltage protection functions are integrated in ISL9221 for USB & Charge
Figure 19. Charging Circuit Diagram
CHARGING IC OVP
VBAT
VCHG_OVP VBUS_OVP
EOC
CHG_EN
2V0_VRTC
R226
DNI
2V62_VIO
R209
100K
VBUS_USB
VCHG
ISL9221U201
13
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
PGND
VDC_BYP
BAT
USB_BYP
IVDC
GND
IUSB
12
11
10
9
8
7
C209
C210
R215
100K
(1608,25V,K,X5R)
1u
10K
1u
(1608,25V,K,X5R)
(1%)
R213
(1%)
R216
33K
(1%)
16K
C211
1u
R214
(1005,10V,K,X5R)
C212
1u
(1005,10V,K,X5R)
(1005,10V,K,X5R)
C213
1u
Page 49
- 50 -
3. TECHNICAL BRIEF
3.17 BLUETOOTH
General Features
The BlueCore 5-FM BGA is a single chip radio and baseband IC for Bluetooth 2.4 GHz systems
including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with stereo
audio output stage and an RDS demodulator.
With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to
v2.0+EDR of the specification for data and voice communications.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 20. Bluetooth / FM Radio Circuit Diagram
VBALUN_BT
BLUETOOTH_CSR
R600
0
L600
NA
FM_SND_R
FM_SND_L
26MHZ_BT
LFB212G45BA1A220
L603 18nH
CLK32K
FM_ANT
C600
DNI
C613 1000p
C616
C618
FL600
3
2
1
C621
1.5p
1000pC615
820p
15p
UB
NC_DC
NC
ANT600
FEED
AMAN802015LG14
C609
C610
15p
15p
4
G1
B1
G2
B2
G3
8
C619
GND1
GND2
33nHL601
5
6
7
C612 220n
15p
C606
15p
C611 47n
C607
0.1u
560R604
C614
L602 470nH
820p
C617
0.01u
C608
2.2u
C601
0.1u
A3
A4
A5
B3
C9
K3
J2
K2
B1
A1
B5
D1
E1
F1
G1
2V62_VIO
2V62_VIO
C602
1u
AU_REF
SPKR_R
SPKR_L
FILT_EXT
CLK_32K
LO_REF
XTAL_OUT
XTAL_IN
FM_P
FM_N
AUX_DAC
RX_N
RX_P
RF_P
RF_N
R606 470K
R607 47K
A2
B10
VDD_PIO
PIO_11
A8
C6
FB600
C2
G2
VDD_FM
VDD_RADIO_1
PIO_9
PIO_10
C5
B7
1R602
J6
A7
G10
VDD_USB
VDD_PADS
VDD_CORE_1
VDD_RADIO_2
PIO_5
PIO_6
PIO_7
PIO_8
F9
E8
F10
1
R601
1R603
A6
H10
H1
VDD_LO
VDD_CORE_2
PIO_3
PIO_4
E9
B8
B9
TP606
VBALUN_BT
C603
C10
B2
C1
K1
VSS_PIO
VDD_ANA
VSS_FM1_1
VDD_AUDIO
BLUECORE5-FM
M600
PIO_0
PIO_1
PIO_2
AIO_0
AIO_1
J4
K4
A9
A10
C620
DNI
C604
DNI22n
B4
G9
VSS_DIG
VSS_FM2
VSS_FM1_2
_RST
SPI__CS
J9
F8
C605
15p
D2
E2
F2
VSS_ANA_1C3VSS_ANA_2D3VSS_ANA_3E3VSS_ANA_4F3VSS_ANA_5G3VSS_ANA_6
VSS_RADIO_2
VSS_RADIO_3
VSS_RADIO_1
SPI_CLK
SPI_MISO
SPI_MOSI
TEST_EN
H8
K9
C4
K10
C625
DNI
J3
VREGENABLE_H
VREGENABLE_L
VREGIN_LJ1VREGOUT_H
H4
H3
R605
2.2
C626
2.2u
G8
B6
VSS_PADS
VSS_CORE
PCM2_CLK
PCM2_SYNC
PCM2_OUT
PCM_SYNC
VREGIN_H
J5
K5
H2
VSS_LO
I2C_DATA
I2C_CLK
USB_DN
USB_DP
UART_CTS
UART_RTS
UART_RX
UART_TX
PCM2_IN
PCM_CLK
PCM_IN
PCM_OUT
C8
C7
K6
J7
H6
H5
K7
J8
D9
D10
E10
D8
H9
J10
K8
H7
2V9_VAUX
2.2u
TP600
TP601
TP602
TP603
TP604
TP605
FB601
UART_BT_RTS
UART_BT_CTS
UART_BT_TX
UART_BT_RX
I2S1_CLK
I2S1_WA0
I2S1_TX
I2S1_RX
C624C623
0.1u
BT_INT
BT_VCXO_EN
BT_RESET
Page 50
- 51 -
3. TECHNICAL BRIEF
Bluetooth Radio
- Common TX/RX teminal simplifies external matching, eliminates external antenna switch
- No external trimming is required In production
- Bluetooth v2.0 + EDR Specification compliant
Bluetooth Transmitter
- +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB
- Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
Bluetooth Receiver
- Integrated channel filters
- Digital demodulator for improved sensitivity and co-channel rejection
- Real time digitized RSSI available on HCI interface
- Fast AGC for enhanced dynamic range
- Channel classification for AFH
Synthesiser
- Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter
- Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock
Audio
- Single-ended stereo analogue output
- 16-bit 48 kHz digital audio bit stream output
Baseband and Software
- Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types
- Logic for forward error correction, header error control, access code correlation. CRC, demodulation,
encryption bit stream generation, whitening and transmit pulse shaping. Supports all Bluetooth
v 2.0 + EDR features incl. ESCO and AFH
- Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air
Physical Interfaces
- Synchronous serial interface up to 4Mbits/s for system debugging
- UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode
- USB v1.1 interface
- I2C slave for FM
- Two audio PCM interfaces (input and output)
- Analogue stereo (output only)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 51
- 52 -
3. TECHNICAL BRIEF
3.18 FM Radio
• Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 21. Bluetooth / FM Radio Block Diagram
Bluetoot
Antenn
BlueCor -5 F
RF
R
IN / OU
2.4 GH
F
Radi
RA
2.4
RO
Radi
MM
Processo
AUDIO
Driver
I/O
UAR
PI
I2S(PCM
VBT_2V
Stereo
Analog
u
Main
8888
PMB
Page 52
- 53 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.19 18pin Multi Media Interface connector
Table 11. Multi media interface pin assign
KM380 series MMI
Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Not used
4 HS_OUT_L Headset left sound
5 HS_OUT_R Headset Right sound
6 USB_DP USB_DP
7 UDB_DM USB_DM
8 JACK_DET Headset detect (active low)
9 VBAT Battery voltage
10 VBAT Battery voltage
11 RPWRON_EN Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR Not used
15 VBUS_USB USB VBUS
16 UART_Tx UART Tx
17 UART_Rx UART Rx
18 GND Power GND
Page 53
- 54 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 22. 18 Pin Multi port Circuit Diagram
2V62_VIO
HOOK_DETECT
HS_MIC_N
HS_MIC_P
NCS2200SQ2T2G
C202
C206 0.1u
JACK_TYPE
USB_DP
USB_DM
JACK_DET
RPWRON_EN
DSR
UART_TX
UART_RX
HSO_L
HSO_R
C200
0.1u
C201
100p
U200
0.1u
R200
1M
5
VIN-
4
VCC
1
VIN+
OUT
3
GND
C207
2
27p
C217
27p
R201
330K
RPWRON_EN
DSR
TX
RX
2V5_VAUDIO
R202
1.5K
R203
2.2K
C208
27p
C218
27p
10uC203
R208 DNI
39pC204
18PIN IO CONNECTOR
VBUS_USB
1uC216
(1608,25V,K,X5R)
DNI
R207
10KR204
100KR205
2V5_VAUDIO2V62_VIO
VBUS_USB
DNIR206
R227
DNI
VCHG
GND1 GND2
ICVFP10181E301FR
47R210
47R211
47R212
VBAT
100nH
FM_ANT
C205
24p
FL200
IN OUT
CN200
FB200 1800
1800FB201
1800FB202
FB203 1800
1R228
R229
1
FB206 1800
R230
0
C214 39p
C215 1u
(1005,10V,K,X5R)
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
20
22
L200
2 : Headset MIC
3 : Jack type
4 : CTS/HSO_L
5 : RTS/HSO_R
6 : USB+/Remote_INT/TXD
7 : USB-/Remote_ADC/RXD
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG
14 : DSR
15 : VUSB
16 : D/ TX
17 : D/ RX
Page 54
- 55 -
3. TECHNICAL BRIEF
3.20 General Description
voice and data transfer applications. The whole transceiver function is integrated in main IC, PMB8888
provides 4 LNA inputs for RF receiving and two outputs for PAM input for High/Low band. A direct
conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA
functionality.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 23. PMB 8888 Function Block Diagram
Page 55
- 56 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
R104
390K
VBAT
R107
100K
XO
W8
W7
XOX
T5
VDET
P3
VRAMP
K9
T_OUT8
TX1
V3
W3
TX2
T_OUT3
A18
J10
T_OUT4
T_OUT5
H11
E13
T_OUT6
T_OUT7
B19
W2
RX1
RX1X
V1
U1
RX2
T1
RX2X
RX3
R1
P1
RX3X
RX4
N1
RX4X
M1
PABIAS
R3
R4
PABS
PAEN
M3
PAMODE
U5
REFR
U4
M8
G3
J4
M9
M0
H3
J3
M1
M10
F4
M2
G4
H4
M7
FE1
N4
P5
FE2
G19
CLKOUT0
CC_CLK
U9
V10
CC_IO
V9
CC_RST
R108
4.7K
26MHz
X100
NX3225SA
GND1
2
4
GND2
HOT1
1
3
HOT2
R102
0
DNI
R103
LIN_PWM_FRQ
RPWRON
LCD_ID
CHG_EN
JACK_TYPE
DCS1800_RXN
BAT_ID
TX_RAMP
PA_EN
VC2
VC1
PA_BAND
PCS1900_RXN
PCS1900_RXP
DCS1800_RXP
UART_BT_RTS
UART_BT_CTS
TOUCH_INT
SIM_DATA
SIM_CLK
SIM_RST
PA_MODE
RF_TEMP
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
TXHB
TXLB
Figure 24. S-GOLD Radio Circuit Diagram
Page 56
- 57 -
3. TECHNICAL BRIEF
3.21 Receiver part
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 25). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 57
- 58 -
3. TECHNICAL BRIEF
3.22 Transmitter part
The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure26). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information.
The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The
divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining
amplitude and phase information. The output of the amplitude modulator is connected to a single
ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM
supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power
control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK
mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the
baseband ramping DAC.
In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping
functionality is assured by an on-chip ramping generator, whereas output power is controlled by the
PGA’s as described above.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 58
- 59 -
3. TECHNICAL BRIEF
3.23 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup.
The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz)
and operates at double or four times transmit or receive frequency. To cover the wide frequency range
the VCO is automatically aligned by a binary automatic band selection (BABS) before each
synthesizer startup.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 26. Transmitter Architecture Block Diagram
Page 59
- 60 -
3. TECHNICAL BRIEF
3.24 DCXO
The transceiver contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the crystal itself. The
overall pulling range of the DCXO consists of eight subranges. The subrange closest to the ‘0ppm’ at
the middle AFC-value is selected during the calibration process in the mobile’s production and is used
for the rest of the lifetime. The frequency tuning is performed along the selected subrange by
programming the frequency control word (XO_TUNE) via the three wire bus (“3Wbus”).
3.25 Front End Module control
Implemented in the Transceiver are two outputs for direct control of front end modules with two logic
input pins to select RX- and TX-mode as well as low- and high band operation.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 27. FEM Circuit Diagram
PAD600
PAD602
PAD601
R608 C631
0
C633
0.75p
VC1
PIN 14
GSM850_EGSM TX
DCS_PCS TX
GSM850 RX
EGSM900 RX
DCS1800 RX
PCS1900 RX L
H
L
L
L
L
L
L605
12nH
20
NC119NC2
GSM850_900TX
13
C649
5.6p
5.6nH
PCS1900
VC1
VC2
U601
LMSP43NA-782
C650
5.6p
L610
0.5p
C634
C641
DNI
RF
CN600
MM8430-2600RB3
4
6
GND2
GND4
1
IN
5p
GND1
GND3
3
5
VC2
PIN 13
L
H
L
L
L
OUT
2
C643 C644
2.5p
L604
NA
C632
22p
GSM850
L607
22nH
ANT
17
1
C645
2.5p
3.9p
L608
18nH
GSM900
16
10
VC1
VC2
GSM850RX1
GSM850RX2
GSM900RX1
2
3
4
C646
3.9p
C622
33p
C627
33p
12
14
GND19GND2
GSM1800RX1
GSM1800RX2
GSM900RX2
7
5
6
C647
3.3p
5.1nH
DCS1800
15
18
GND3
GND4
GND5
GSM1900RX1
GSM1900RX2
GSM1800_1900TX
8
11
C648
3.3p
L609
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
DCS1800_RXP
DCS1800_RXN
PCS1900_RXP
PCS1900_RXN
Page 60
- 61 -
3. TECHNICAL BRIEF
3.26 Power Amplifier Module
Table 10 PAM pin description
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 28. Power Amplifier Circuit Diagram
Pin Mame Description
1 MODE GMSK/EDGE Power control mode. L=GMSK, H=EDGE
2 DCS/PCS_IN RF input(DCS/PCS) DC Blocked
3 BS Band Select
4 REVD1 Reserved
5 VBATT DC Supply
6 VRAMP Analog PA Bias Control(All Bands, EDGE Mode)
Analog Output Power Control(All Bands, GMSK Mode)
7 GSM_IN RF input(EGSM) DC Blocked
9 GSM_OUT RF Output(EGSM) DC Blocked
10,11 GND Ground
12 REVD2 Reserved
13,14,15 GND Ground
16 DCS/PCS_OUT RF Output(DCS/PCS) DC Blocked
Pad GND PAD GRID Ground pad grid is device underside.
C629
1u
C628
10u
C630
27p
VBAT
C634
0.5p
C641
1.2nH
R615
L606
1
C635
0.5p
C642
DNIDNI
C640C639
0.01u 0.01u
TQM7M5005 U600
15
PGND
8
GND3
11
GND2
14
GND1
9
BY_CAP2
BY_CAP1
10
GSM850_900_OUT2MODE_SELECT
12
DCS_PCS_OUT
GSM850_900_IN
DCS_PCS_IN
TX_EN
VRAMP
VBATT
7
6
5
4
313
BS
1
C638
C637
C636
DNI
47p
DNI
R609 1
R613
R614 1
1R610
10KR611
1R612
1
TXLB
PA_EN
TX_RAMP
PA_BAND
PA_MODE
TXHB
Page 61
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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. PCB layout
- 62 -
4. PCB layout
4.1 Main PCB component placement
Main PCB Top Main PCB Top placement
Page 62
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. PCB layout
- 63 -
Main PCB bottom Main PCB bottom placement
Page 63
- 64 -
4. PCB layout
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
p
y
Hall Effect S/W
Key Encoder
Main FPCB Con
Backu
batter
Vibrator PAD
Bluetooth Antenna
Speaker
MMI
Connecto
r
PAD
Vibrator
Bluetooth
& FM radio Chip
Camera
Battery Connector
SIM Connecto
Power Induct
Micro SD
n.
Socket
Connecto
r
or
Memory
PA
M
r
BBP
FEM
MIC
Mobile Switch
Page 64
- 65 -
4. PCB layout
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Tou ch FPCB Conn.
KEY PCB Top
Main FPCB Con
KEY PCB Bottom
n.
LCD Con
n.
Page 65
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 66 -
5. Trouble shooting
5.1 Trouble shooting test setup
Equipment setup
Power on all of test equipment
-Connect PIF-UNION JIG or dummy battery to the DUT for power up.
-Connect mobile switch cable between Communication test set and DUT when you need to make an
phone call.
-Follow trouble shooting procedure
Page 66
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 67 -
5.2 Power on Trouble
Check Points
-Battery Voltage( Need to over 3.35V)
-Power-On Key detection (PWRON signal)
END
VA100
EVL14S02200
VBAT
150R112
KB100
END_KEY
TP1
RPWRON_EN
RPWRON
Remote Power On
330K
R219
R225
R223
2K
100K
END_KEY_IN
C226
10u
END
R221
3.3M
25631
4
END_KEY_IN
KEY_COL7
2V0_VRTC
2K
EMX18
Q201
R220
PWRON
END_KEY
R222
10K
R224
100K
KEY_ROW6
Page 67
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 68 -
START
Check
ìPWRONî signal of
TP1
2.0V
Check R112 when
push the power key
Check
ìPWRONî signal of
TP1
0V
Check the
BACKUP Battery
Check solder R112
or
Replace Dome Switch
(PWR key)
Check solder
Q201
Yes
Yes
Yes
Yes
No
No
No
No
Connect power
supply to the DUT
Vbat = over 3.35V
Check the all LDOís
output
Is it correct?
Check solder whole LDO
parts or replace it
Q201
TP1
PWR key
Replace main PCB
Is the 26MHz
clock from TP2
X100 of U102 ?
Check solder
Replace X-TA
L
No
X100
TP2
Page 68
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 69 -
Page 69
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 70 -
5.3 Charging trouble
Check Points
-Connection of TA (check TA voltage 5.6V)
-Charging Current Path component voltage drop
-Battery voltage
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 420 mA
5 CV voltage : 4.2 V
6 Cutoff current : 100 mA
7 Full charge indication current (icon stop current) : 100 mA
8 Recharge voltage : 4.15 V
(1005,10V,K,X5R)
C214 39p
GND1 GND2
IN OUT
ICVFP10181E301FR
FL200
47
47
1
R229
1800FB201
FB206 1800
FB203 1800
47
R230
VBAT
0
1R228
6
7
8
9
VCHG
11
12
13
14
15
16
17
18
19
2
20
21
22
3
4
5
CN200
1
10
C215 1u
1800FB202
FB200 1800
4.2V~3.75V 3.75V~3.64V
3.64V~3.45V 3.45V~3.35V
TP1
TP2
2V0_VRTC
R226
2V62_VIO
DNI
EOC
CHG_EN
CHARGING IC OVP
VBUS_USB
VCHG
ISL9221U201
13
R209
100K
R215
100K
(1608,25V,K,X5R)
C209
1u
C210
10K
1u
(1608,25V,K,X5R)
1
2
3
4
5
6
R213
(1%)
VDC
VUSB
_PPR
_CHG
_EN
IMIN
PGND
VDC_BYP
USB_BYP
IVDC
IUSB
12
11
BAT
10
9
8
GND
7
(1%)
R216
VBAT
VCHG_OVP VBUS_OVP
C212
(1%)
16K
C211
1u
R214
(1005,10V,K,X5R)
33K
1u
(1005,10V,K,X5R)
C213
1u
(1005,10V,K,X5R)
Page 70
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 71 -
START
Yes
18pin IO(CN200)
Is soldered ?
Yes
Source pin
(TP1) of FL200
= 5.6V ?
Yes
Output pin
(TP2)
of C212=4.2V?
Yes
Battery voltage
is over 3.35V?
No
Resolder the
CN200
TP1
No
No
No
The TA can be
broken
Change other TA
then retest
Check solder
U201 or replace it
charging until
battery
Voltage goes up to
3.35V
TP2
Yes
Charge is operating properly
Page 71
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 72 -
5.4 LCD display trouble
Check Points
-LCD assembly status ( LCD FPCB, Connector on FPCB)
-EMI filter soldering
-Connector combination
MAIN To FPCB Connector
VBAT
END_KEY
SUB_KEY_BL
KEY_ROW4
KEY_ROW5
KEY_ROW6
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
C41227p
C40827p
C41027p
C40627p
C40527p
TOUCH_SCL
TOUCH_SDA
TOUCH_INT DIF_D(3)
DBB_BL_PWM
RCV_P
RCV_N
C41127p
27p C409
27p C407
FL403 ICVE10184E150R101FR
1
2
3
4
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
G15G2
10
9
8
7
6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Socket
CN400
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
2V62_VIO
2V8_VVIB
FL400 ICVE10054E250R201FR
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
FL404 ICVE10054E250R201FR
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
G15G2
G110G2
5
G110G2
5
G15G2
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
10
ICVE10054E250R201FRFL401
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
ICVE10054E250R201FRFL402
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
10
9
8
7
6
9
8
7
6
9
8
7
6
9
8
7
6
IF_MODE3
LCD_ID
DIF_RESET
DIF_VSYNC
DIF_RD
DIF_WR
DIF_CD
DIF_CS
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
Check the connection LCD FPCB connector
Check signal flow via EMI filter
The LCD backlight enable signal
(SUB PCB)
Page 72
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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 73 -
START
Check LCD connector
combination then LCD test
with New LCD
Is LCD FPCB
normal?
Yes
Signal is normal on
2.62V Signal
FL400, FL401,
FL402,FL403,FL404
Yes
Assemble
No
No
Replace LCD FPCB
Check solder and
repair
Damaged filter
FL400,401,402,403,404
Page 73
- 74 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.5 Camera Trouble
Check Points
-Connectors combination
-FPCB status
CAMERA POWER
I2C_SCL
I2C_SDA
CAM_VS
CAM_HS
CAM_MCLK
C508 7.5p
C509 7.5p
C510 7.5p
C511 7.5p
C512 7.5p
R510 10
R511
CAM_PWR_EN
10
10R512
10R513
R51510
C513 7.5p
C514 7.5p
C515 7.5p
7.5p
C516
7.5pC517
100K
R525
1V8_VCAM
8
7
6
5
C550
1u
VBAT
RT9011-MGPQWU500
1
VIN VOUT1
2
EN1
3
EN2
4
PGND
9
VOUT2
NC2
GNDNC1
EUSY0319001
CAMERA CONNECTOR
(ENBY0020401,24PIN,0.9T,SOCKET,AXK7L24227G)
2V8_VCAMIO1V8_VCAM
FB500
CN500
G1G2
C535
1u
24
23
22
21
20
19
18
17
16
15
14
ENBY0020401
AXK7L24227G
1
2
3
4
5
6
7
8
9
10
11
1213
G3G4
C551
2.2u
2V8_VCAMIO
C552
2.2u
7.5pC500
C501 7.5p
C518 7.5p
C502 7.5p
7.5pC519
R505 10
R506 10
R509 10
7.5pC503
R514 10
7.5pC520
C521 7.5p
R519 10
R520
R521
CAM_D(7)
10R507
7.5pC506
C505 7.5p
C507 7.5p
C504 7.5p
10R516
10R517
10R518
7.5pC525
C524 7.5p
C522 7.5p
C523 7.5p
10
10
CAM_D(6)
CAM_D(5)
CAM_D(4)
CAM_D(3)
CAM_D(2)
CAM_D(1)
CAM_D(0)
CAM_PCLK
CAM_RST
CAM_PWDN
Check the connector combination
7.5p
C536 7.5p
7.5pC538
C537 7.5p
C539
7.5pC541
C540 7.5p
Page 74
- 75 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Check camera connector,
24pin main connector
Combination then Camera test
With equipped camera module
Yes
Replace New
Camera module
Working properly?
Yes
Replace Camera module
Yes
Assemble
No
Replace
Main
PCB
Page 75
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.6 Receiver & Speaker trouble
Check Points
-Speaker pin contact
-Audio amp soldering
-SUB PMIC soldering
5. Trouble shooting
- 76 -
TP1
TP3
TP5
TP6
TP4
TP2
AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR
VBAT
SPK_P
SPK_N
C544
47p
BB_SND_R
BB_SND_L
FM_SND_R
FM_SND_L
i2C_SDA
SPK
L500
100nH
C542
100p
L501
100nH
C545
47p
I2C_SCL
VA500
C305 1u
C308 1u
C309
1u
C311 1u
C312 1u
VA501
EVLC18S02015
C304 1u
A4
A5
D1
D2
C1
C2
B2
B3
C3
D4
B4
C315
1u
CN501
1
2
EVLC18S02015
C1N
C1P
INA2
INA1
INB2
INB1
BIAS
SDA
SCL
RXIN+
RXIN-
0R300
C301
1u
B1
A3
VSS
VDD
U303
MAX9877AEWP_TG45
GND
C4
D3
C5
PGND
PVDD
C302
1u
HPR
HPL
OUT+
OUT-
A1
A2
D5
B5
0R313
0R314
MAIN RECEIVER
RCV_P
RCV_N
C101
R102 0
C102
47p47p
HSO_R
HSO_L
SPK_P
SPK_N
0R100
+
-
OUT100
OUT101
Page 76
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 77 -
START
Check Speaker tension and
Contacts are clear
Input Signal ( TP1,
TP2) is Low(0V)?
Check the soldering status
Of U303 of main -board
Output Signal( TP3,
TP4) is Low(0V)?
Receiver Signal( TP5,
TP6) High(1.6V)?
.
No
No
Yes
Y
Replace Main Board
es
Replace U303 of
main -board
Replace Receiver
TP4
TP3
TP4
TP3
Replace Main PCB
Assemble
TP5 TP6
Page 77
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 78 -
5.7 Microphone trouble
Check Points
-Microphone hole
-MICBIAS & Signal come from
-Audio signal level of the Microphone
-Soldering of components
TP1
TP3
TP2
MIC_N
MIC_P
START
Check microphone sound
hole
Yes
Mic bias ON
(2.5V)when
call?( TP3,L302)
C320
22n
C318
22n
No
MICMIC
C321
39p
L304
100nH
C319
39p
L303
100nH
C317
39p
Check mic. Bias
VA300
EVLC14S02050
line
MICBIAS
L302
100nH
C322
10u
MIC300
1
P
2
G1
3
G2
4
O
SPU0409HE5H-PB
TP1
TP2
TP3
Check the signal
level at ( TP1,2)each
side of MIC300.
Replace Main PCB
Yes
Yes
No
Replace
microphone
(MIC3
00)
Page 78
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 79 -
5.8 Ear-MIc Jack Detection trouble
03
START
Check the Ear-Jack detection.
Check the soldering
status of CN200
Yes
Is the status of
FB202, FB203(TP1,2)
Yes
The main board has a
problem
Replace Main PCB
Assemble
No
No
TP1
TP2
Resoldering or
Replace CN20
Resolder FB202,
FB2
CN200
0
Page 79
5.9 Vibrator trouble
Check Points
-Connectors combination
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 80 -
TP4
TP3
TP1
TP2
MOTOR CIRCUIT
3V0_VMOTVBAT
LIN_INVERT
LIN_PWM_FRQ
LIN_PWM_MAG
VIB_PWR_EN
C300
1u
R303 0
R305 0
R307 0
U300 R1114D301D-TR-F
13
VDD
4
NC
6
CE
R301
100K
U301 TC7SZ86FU
1
IN_B
2
IN_A
3
GND
U304 TC7SZ86FU
1
IN_B
2
IN_A
3
GND
TP3
VOUT
GND1
GND2
VCC
OUT_Y
VCC
OUT_Y
2
5
5
4
5
4
3V0_VMOT
TP4
C303 1u
R306
130K
R308
130K
0.01u
R304
VDDVIB_PWR_EN
VO+
GND
PGND
3V0_VMOT
C313
6
8
VO-
5
7
9
1u
L300
VIB-
100nH
L301
100nH
VIB+
OUT300
OUT301
2200pC307
R302 100K
TPA6205A1DRBRU302
1
0
_SHUTDOWN
2
BYPASS
3
IN+
4
IN-
R309 100KC314
C316 2200p
TP2
TP1
Page 80
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 81 -
START
p
Check Vibrator Connector
Combination
Check the signal of
OUT300,OUT301
(TP1,2)
176Hz 2V
-p PWM?
Yes
Check the signal of
C303 (TP4)
Vol tag e is 3 . 0 V?
Yes
Check the signal of
R304 (TP3)
Vol tag e is 2.6V?
Yes
Replace Vibrator
No
Check the soldering
of U302,L300,L3
No
Check the soldering
of U300
01
Resoldering of
Replace U102
Assemble
Page 81
- 82 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.10 Keypad back light trouble
Check Points
-Signal path is connected well
-TR is working properly
TP1
TP2
QWERTY_KEY BACKLIGHT
VBAT
LEWWS44-E
LEWWS44-E
LEWWS44-E
LD300
LD301
LD302
R310
R311
R312
47
47
47
VA301
QWERTY_KEY_BL
ICVN0505X150FR
SUB_KEY_BL
MULTI_KEY BACKLIGHT
VBAT
C101
R110
1K
1u
R111
100ohmR103
LD100
10K
R104 100ohm
LD101
LEBB-S14E
100ohmR105
LD102
LEBB-S14E
Q100
2SC5585
R106 100ohm
LD103
LEBB-S14E
100ohmR107
LD104
LEBB-S14E
TP1
R108 100ohm
LD105
LEBB-S14E
100ohmR109
LD106
LEBB-S14E
C102
1u
LEBB-S14E
TP2
Page 82
- 83 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Check All of LEDs solder
Check VBAT
Yes
check GPIO
signal(SUB_KEY_BL
,TP2) Voltage of
Q100 > 0.7v
check GPIO
signal(QWERTY_KE
Y_BL, TP1) Voltage
of VA301 < 1.0v
Yes
KEY_LED is operating
No
No
Check BATTERY
Replace TR(Q100)
o
N
Resolder or
Replace VA301 or U1
02
Page 83
5.11 SIM & USD trouble
SIM Check Points
-Power is working
-Socket soldering
-Proper SIM is used
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 84 -
TP1
TP2
TP3
SIM CONNECTOR
J500
GND1
GND2GND3
2V9_VSIM
1
C1
2
C2
3
C3
7
8
C543
220n
C547
22p
SIM_RST
C548
1000p
2V9_VSIM
R522
DNI
15K
R523
4
C5
5
SIM_DATA SIM_CLK
C546
DNI
C6
6
C7
10
GND4
9
TP1
SIM_CLK
TP2
2V9_VSIM
TP3
SIM_DATA
Page 84
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 85 -
START
Check All of SIM card voltage
KS360 Series support
1.8V & 2.9V SIM only
6 pins are
soldered well?
Yes
Check Proper
SIM Card
Assemble
No
Yes
Resolder pin
Replace Main
Board
Page 85
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 86 -
uSD Check Points
-Power is working
-Socket soldering
-Card detect is working
Card insert Card eject
2V62_VIO
27p27p
C533C531
27p
C530
100K
27p
C532
R504
100KR502
100KR503
C534
2V9_VMMC
1u
VDD
VSS
S500
CD_DAT3
CLK
CMD
DAT0
DAT1_2
DAT2
DETECT_A
DETECT_B
DUMMY1
DUMMY2
DUMMY3
GND
2V9_VMMC
AXA463062P
100KR508
100KR500
27p
C529
27p27p
C527 C528C526
27p
100KR501
MMC_CMD
MMC_CLK
MMC_D0
MMC_D1
MMC_DET
MMC_D2
MMC_D3
TP1
TP2
TP2
TP4
Page 86
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 87 -
START
Check Micro SD card voltage
(2V9_VMMC)
TF socket pins
are well soldered
Yes
Check proper
uSD?
Assemble
No
Yes
Resolder it
(check data line
uSD D0~D3
(TP1~4)is 2.9V
Replace Main Board
Page 87
- 88 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.12 Touch trouble
Touch Check Points
-Power is working
-Connector soldering
-Touch IC soldering
(* After press the touch hot key, Touch key will works )
MAIN To FPCB Connector
VBAT
END_KEY
SUB_KEY_BL
KEY_ROW4
KEY_ROW5
KEY_ROW6
KEY_COL4
KEY_COL5
KEY_COL6
KEY_COL7
C41227p
C40827p
C41027p
C40627p
C40527p
TOUCH_SCL
TOUCH_SDA
TOUCH_INT DIF_D(3)
DBB_BL_PWM
RCV_P
RCV_N
C41127p
27p C409
27p C407
FL403 ICVE10184E150R101FR
1
INOUT_A1
INOUT_B1
2
INOUT_A2
INOUT_B2
3
INOUT_A3
INOUT_B3
4
INOUT_A4
INOUT_B4
G15G2
10
9
8
7
6
CN400
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Socket
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
2V62_VIO
2V8_VVIB
FL400 ICVE10054E250R201FR
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
FL404 ICVE10054E250R201FR
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
5
5
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
G15G2
10
ICVE10054E250R201FRFL401
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
G110G2
ICVE10054E250R201FRFL402
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
G110G2
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
G15G2
10
9
8
7
6
9
8
7
6
9
8
7
6
9
8
7
6
IF_MODE3
LCD_ID
DIF_RESET
DIF_VSYNC
DIF_RD
DIF_WR
DIF_CD
DIF_CS
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_D(7)
TP8
TP5
TP6
TP7
Page 88
- 89 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Check Touch Connector
Combination
Check the voltage
of TP1~4. Voltage is
Check the voltage
of TP5~8. Voltage is
Touch I C is well
soldered?
Yes
Yes
Yes
No
No
Resolder FL403 or
Replace Main Board
Replace Main or
Rosolder Touch IC
SUB FPCB
TP8
TP6
TP7
TP5
Change the Touch window
Yes
Assemble
TP4
TP1~ 3
Page 89
- 90 -
5. Trouble shooting
5.13 Qwerty Key trouble
Key Check Points
-Dome switch contacts
-Key coder IC soldering
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TP2
TP1
TP4
TP3
QWERTY KEY
2V62_VIO
C400
2V62_VIO
27pC402
C404 27p
C403 27p
KEY_COL7
KEY_COL6
KEY_COL5
KEY_INT KEY_ROW5
KEY_I2C_SCL
470R405
R407 470
470R409
0R413
0.1uF
C401 0.1uF
1
TEST
2
SEL_28P
3
P57
4
P56
5
P55
6
P17
7
P15
29
28
PGND
26
27
GND2
RESETB
PP2106M2
R400
120K
XI
U400
(1%)
25
24
XO
GND1
P53
P54
8
9
10
470R416
470R419
2V62_VIO
R415
4.7K
C420 27p
C423 27p
27pC421
27pC422
27pC424
KEY_I2C_SDA
R401 0
23
22
P10
VDD
CLK_SEL
P4713P5012P5111P52
14
470R420
P40
P41
P42
P43
P44
P45
P46
2V62_VIO
R402
21
20
19
18
17
16
15
4.7K
R403 470
470R404
R406 470
470R408
R410 470
470R412R411 0
R414 470
C41727p
C416
C41427p
C41827p
27p C415
C41927p
27p
C41327p
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_ROW6
R417 470
KEY_COL4
KEY_COL3
R418 470
KEY_COL2
KEY_COL1
KEY_COL0
Page 90
- 91 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Fig 6 Waveform of DCXO
START
g
Check the Dome switch
contacts are
clear
Check the voltage
of TP1~4.
e is 2.6V?
Volta
Yes
Check soldering
of components of
U400
Assemble
TP3
No
No
Resolder or Replace
U400
Resolder the
com
ponent
TP2
TP1
TP4
Page 91
- 92 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.14 Trouble Shooting of Receiver Part
Main PCB Bottom
START
Setup Test Equipment
Cell Power : ñ74dBm
EGSM CH30
DCS CH699
VCTC XO
Check point
VCTCXO
Check point
PLL Control
Check point
Mobile SW & FEM
Re-Download S/W & CAL
MobileSW&FEM
PLL
Page 92
5.14.1 Checking DCXO Circuit
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 93 -
DCXO
DCXO Cicuit DCXO Waveform
XO
W8
W7
XOX
REFR
U4
G19
CLKOUT0
CC_CLK
U9
V10
CC_IO
V9
CC_RST
26MHz
X100
NX3225SA
GND1
2
4
GND2
HOT1
1
3
HOT2
CHG_EN
SIM_DATA
SIM_CLK
SIM_RST
1pin
X100
1pin : 26MHz
Is the waveform
Yes
DCXO Circuit is OK.
See next page to check
PLL Circuit.
No
of 1pin Similar to Fig.6?
Replace X100
1pin
Page 93
5.14.2 Checking Mobile SW & FEM
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 94 -
FEM RX Control Logic
RF
PAD601
PAD600
C622
33p
0.5p
C634
0
R608 C631
5p
33p
C627
12nH
L605
13
GSM850_900TX
GSM900RX1
3
4
GSM900RX2
NC119NC2
20
16
VC1
VC2
10
17
ANT
GND19GND2
12
14
GND3
GND4
15
18
GND5
GSM1800RX1
5
6
GSM1800RX2
GSM1800_1900TX
11
7
GSM1900RX1
GSM1900RX2
8
GSM850RX1
1
2
GSM850RX2
NA
L604
LMSP43NA-782
U601
PAD602
22p
C632
CN600
MM8430-2600RB3
3
GND1
4
GND2
GND3
5
GND4
6
1
IN
OUT
2
0.75p
C633
VC1
VC2
Mobile SW & FEM Circuit
Mobile SW & FEM Check Points
RX Mode EGSM DCS PCS
ANT_SW1 Off Off Off
ANT_SW2 Off Off Off
TP10
TP9
TP1
TP2
TP5,6,7,8
TP10
TP9
CN600
TP2_C625 (ANT_SW2)
TP1_C621 (ANT_SW1)
U600
TP5~8
Page 94
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 95 -
Check TP10 of CN600
Mobile SW FEM Control Signals
with RF Cable and TP9 of C631
TP10 Signal
same as TP9?
Yes
Check TP1, TP2 of U600 ?
Yes
o
N
Replace Mobile SW
(SW401)
Control Signal is
Yes
TP5~8 Signal is
Yes
Mobile SW & FEM is OK.
Check Antenna.
No
No
Check PMB8888
Replace FEM (U600)
ANT SW1
ANT SW2
Page 95
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 96 -
5.15 Trouble Shooting of Transmitter Part
5.15.1 Checking DCXO Circuit
See RX Part “1. Checking DCXO Circuit”
Main PCB Bottom
Setup Test Equipment
Cell Power : ñ74dBm
EGSM CH30
DCS CH699
Check point
DCXO
Check point
Tran sceiver
Check point
PA Control
Signal
Check
FEM & Mobile
Re-Download S/W & RF
CAL
DCXO
FEM & M
S
Transceiver
PowerAmp
Page 96
5.15.2 Checking Transceiver Output Signals
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 97 -
Transceiver Output Circuit
Transceiver Output Operation
MODE Transceiver Output
GSMK Fixed
8PSK Ramp Burst Control
TXHB
TXLB
15
PGND
8
GND3
11
GND2
14
GND1
9
BY_CAP2
BY_CAP1
10
GSM850_900_OUT2MODE_SELECT
12
DCS_PCS_OUT
GSM850_900_IN
DCS_PCS_IN
TQM7M5005 U600
7
6
TX_EN
5
VRAMP
4
VBATT
313
BS
1
C636
DNI
C637
DNI
C638
47p
R609 1
R614 1
TXLB
1R610
10KR611
1R612
1R613
PA_EN
TX_RAMP
PA_BAND
PA_MODE
TXHB
Page 97
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 98 -
Transceiver Output (GMSK) Transceiver Output (8PSK)
TXLB (MODE: GMSK) : TP1 TXLB (MODE: 8PSK) : TP1
Check Output Signal
(TP1, TP2)
Signals are
Normal ?
Yes
Tra nsceiver is OK.
See next page to check
PAM Con trol Circuit.
N0
Replace
PMB8888(U102)
Page 98
5.15.3 Checking PAM Control Signals
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting
- 99 -
MODE MODE PA_LEVEL TXON_PA
GMSK LOW Ramp Burst Control HIGH
8PSK HIGH Control Amp bias HIGH
Transceiver Output
PAM Mode Operation
1R612
1R610
C636
DNI
1R613
10KR611
C638
47p
R614 1
DCS_PCS_IN
1
DCS_PCS_OUT
12
GND1
14
GND2
11
GND3
8
7
GSM850_900_IN
10
GSM850_900_OUT2MODE_SELECT
15
PGND
TX_EN
6
4
VBATT
VRAMP
5
TQM7M5005 U600
BS
313
BY_CAP1
BY_CAP2
9
DNI
C637
R609 1
PA_MODE
TXLB
TXHB
PA_BAND
PA_EN
TX_RAMP
PA_EN
TX_RAMP
PA_MODE
PAM Control Signals
PA_MODE
PA_EN
Page 99
- 100 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
(
)
)
)
)
)
)
)
)
)
GSMK Control Signal 8PSK Control Signal
Check Control Signals
TP1, TP2, TP3)
Signals are
Normal ?
Yes
PAM Con trol Signal is
OK.
See next page to check
FEM & Mobile SW Circuit.
No
TP1(TX RAMP
Check
PMB8888(U10
2)
TP2(PA E N
TP1(TX RAMP
TP2(PA E N
TP3(PA M O DE
TP3(PA M ODE
TP1(TX RAMP
TP3(PA MODE) : R616
TP1(TX_RAMP) : R612
TP2(PA_EN) : R614
TP2(PA E N
TP3(PA M ODE
Page 100
- 101 -
5. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.15.4 Checking FEM & Mobile SW
FEM TX Control Logic
Mobile SW & FEM Checking Points
TX Mode EGSM DCS PCS
ANT_SW1 On Off Off
ANT_SW2 Off On On
Mobile SW & FEM Circuit
TP10
TP9
TP2
TP1
TP5,6,7,8
PAD600
PAD602
PAD601
R608 C631
0
C633
0.75p
CN600
MM8430-2600RB3
4
6
2
GND2
GND4
1
IN
OUT
GND1
GND3
3
5
L605
12nH
5p
RF
C632
L604
NA
22p
TP10
17
ANT
1
16
10
VC1
VC2
GSM850RX1
GSM850RX2
GSM900RX1
GSM900RX2
2
3
4
C622
33p
C627
33p
12
14
15
GND19GND2
GND3
GSM1900RX1
GSM1800RX1
GSM1800RX2
7
8
5
6
18
NC119NC2
GND4
GND5
GSM1900RX2
GSM1800_1900TX
GSM850_900TX
11
13
20
U601
LMSP43NA-782
VC1
VC2
C634
0.5p
TP2_C625 (ANT_SW2)
TP1_C621 (ANT_SW1)
CN600
TP9
U600
TP5~8
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