LG KS20 Service Manual

Table Of Contents

1. INTRODUCTION.................................. 5

1.1 Purpose ...................................................... 5

1.2 Regulatory Information ............................... 5

2. PERFORMANCE ..................................7

2.1 System Overview.........................................7

2.2 Usable environment.....................................8

2.3 Radio Performance......................................8

2.4 Current Consumption.................................14

2.5 RSSI BAR ..................................................14

2.6 Battery BAR ...............................................15

2.7 Sound Pressure Level ...............................16

2.8 Charging ....................................................16

3. TECHNICAL BRIEF............................17

3.1 General Description ...................................17

3.2 GSM Mode.................................................19

3.3 UMTS Mode...............................................23

3.4 LO generation and distribution circuits ......25

3.5 Off-chip RF Components ...........................25

3.6 Digital Baseband(DBB/MSM7200) ............35

3.7 Hardware Architecture ...............................37

3.8. Subsystem(MSM7200) .............................39

3.9. Power Block..............................................42

3.10. External memory interface......................47

3.11. H/W Sub System ....................................49

3.12. Main Features.........................................76

4. TROUBLE SHOOTING.......................82

4.1 RF Component ..........................................82

4.2 SIGNAL PATH_UMTS RF .........................85

4.3 SIGNAL PATH_GSM RF ...........................86

4.4 Checking VCTCXO Block ..........................87

4.5 Checking Front-End Module Block ............89

4.6 Checking UMTS Block...............................91

4.7 Checking GSM Block.................................96

4.8 Checking Bluetooth Block........................102

4.9 Checking WLAN Block.............................104

4.10 Power ON Troubleshooting ...................108

4.11 Charger Troubleshooting .......................110

4.12 USB Troubleshooting.............................113

4.13 SIM Detect Troubleshooting ..................115

4.14 Camera Troubleshooting .......................117

4.15 Keypad Backlight Troubleshooting ........120

4.16 Main LCD Troubleshooting ....................121

4.17 Receiver Path ........................................122

4.18 Headset path .........................................124

4.19 Speaker phone path ..............................126

4.20 Main microphone ...................................128

4.21 Headset microphone..............................130

4.22 Vibrator ..................................................132

5. DOWNLOAD.....................................133

5.1 KS20 DOWNLOAD..................................133

6. BLOCK DIAGRAM ...........................146

6.1 GSM & UMTS RF Block ..........................146

6.2 Interface Diagram ....................................148

7. Circuit Diagram................................153

8. BGA IC PIN MAP..............................163

8. PCB LAYOUT ...................................169

9. Calibration & RF Auto Test

Program (Hot Kimchi) .....................177

9.1 Configuration of HOT KIMCHI .................177

9.2 How to use HOT KIMCHI.........................180

10. Phone Test Mode _ 3G smart

Phone KS20 ...................................182

11. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 189

11.1 EXPLODED VIEW ................................ 189

11.2 Replacement Parts

<Mechanic component> ....................... 191

<Main component> ............................... 193

11.3 Accessory ............................................. 209

- 3 -

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION

- 6 -

LGE Internal Use Only

2. PERFORMANCE

- 7 -

2.1 System Overview

2. PERFORMANCE

Item Specification

Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset

Size 99.8 X 58 X 12.9 mm

Weight Under 92.5g (with 1050mAh Battery)

Power 3.7 V normal, 1050 mAh Li-Polymer

Talk Time Over 100 min (WCDMA, Tx=-23 dBm, Voice)

(with 800mAh) Over 150 min (GSM, Tx=Level 5, Voice)

Standby Time Over 300 Hrs (WCDMA, DRX=1.28)

(with 800mAh) Over 400 Hrs (GSM, Paging period=9)

Antenna Internal type

LCD Main 2.8” 262K 240 X 320 pixel (TFT)

LCD Backlight White LED Back Light

Camera Auto Focus - 2.0 Mega pixel (CMOS) + VGA Video Call Camera

Vibrator Yes (Coin Type)

LED Indicator Yes

MIC Yes

Receiver Yes

Earphone Jack Yes (18 pin)

Connectivity Bluetooth, USB

Volume Key Push Type(+, -)

External Memory Yes

I/O Connect 18 Pin

LGE Internal Use Only

Only for training and service purposes

2.2 Usable environment

1) Environment

2) Environment (Accessory)

* CLA : 12 ~ 24 V(DC)

2.3 Radio Performance

1) Transmitter - GSM Mode

* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

2. PERFORMANCE

- 8 -

Item Specification

Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

Operation Temp -20 ~ +60°C

Storage Temp -20 ~ +70°C

Humidity 85 % (Max)

Reference Spec. Min Typ. Max Unit

TA Power Available power 100 220 240 Vac

No Item GSM DCS & PCS

100k~1GHz -39dBm

9k ~ 1GHz -39dBm

MS allocated 1G~[A]MHz -33dBm

Channel

1G~12.75GHz -33dBm

[A]M~[B]MHz -39dBm

Conducted [B]M~12.75GHz -33dBm

1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm

Emission 880M~915MHz -62dBm 880M~915MHz -62dBm

Idle Mode

915M~1GHz -60dBm 915M~1GHz -60dBm

1G~[A]MHz -50dBm 1G~[A]MHz -50dBm

[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm

[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm

LGE Internal Use Only

2. PERFORMANCE

- 9 -

* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

No Item GSM DCS & PCS

30M ~ 1GHz -36dBm

30M~1GHz -36dBm

MS allocated 1G~[A]MHz -30dBm

Channel

1G ~ 4GHz -30dBm

[A]M~[B]MHz -36dBm

Radiated [B]M~4GHz -30dBm

2Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm

Idle Mode

915M~1GHz -57dBm 915M~1GHz -57dBm

1G~[A]MHz -47dBm 1G~[A]MHz -47dBm

[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm

[B]M~4GHz -47dBm [B]M~4GHz -47dBm

3 Frequency Error ±0.1ppm ±0.1ppm

4 Phase Error

±5(RMS) ±5(RMS)

±20(PEAK) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error RA250 : ±200Hz RA250: ±250Hz

5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz

Interference Condition TU50 : ±100Hz TU50: ±150Hz

TU3 : ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB

250kHz -33dB 250kHz -33dB

Due to 400kHz -60dB 400kHz -60dB

Output RF

modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB

Spectrum

3000 ~ 6000kHz -71dB ≥6000kHz -73dB

≥6000kHz -77dB

Due to

400kHz -19dB 400kHz -22dB

Switching

600kHz -21dB 600kHz -24dB

transient

1200kHz -21dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 10 -

No Item GSM DCS & PCS

Frequency offset 800kHz

7 Intermodulation attenuation –

Intermodulation product should

be Less than 55dB below the

level of Wanted signal

Power control

Power Tolerance

Power control

Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

533±3 030±3

631±3 128±3

729±3 226±3

827±3 324±3

925±3 422±3

10 23 ±3 5 20 ±3

8 Transmitter Output Power 11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

9 Burst timing Mask IN Mask IN

LGE Internal Use Only

2. PERFORMANCE

- 11 -

2) Transmitter - WCDMA Mode

No Item Specification

1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)

2 Frequency Error ±0.1ppm

3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50dBm(3.84MHz)

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7 Transmit OFF Power -56dBm(3.84MHz)

8 Transmit ON/OFF Time Mask

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

9 Change of TFC

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

12 Spectrum emission Mask

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

LGE Internal Use Only

Only for training and service purposes

3)Receiver - GSM Mode

2. PERFORMANCE

- 12 -

No Item Specification

13 Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

14

Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW

(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

15 Transmit Intermodulation

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

16 Error Vector Magnitude (EVM)

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

17 Transmit OFF Power

-15dB@SF=4.768Kbps, Multi-code

transmission

No Item GSM DCS & PCS

1

Sensitivity (TCH/FS Class II) -105dBm -105dBm

2

Co-Channel Rejection

C/Ic=7dB Storage -30 ~ +85

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st

4

Intermodulation Rejection interferer:-44dBm 2nd interferer:-44dBm 2nd

interferer:-45dBm interferer:-44dBm

5

Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm

(TCH/FS Class II, RBER)

Unwanted : Depend on Frequency Unwanted : Depend on Frequency

LGE Internal Use Only

2. PERFORMANCE

- 13 -

4) Receiver - WCDMA Mode

No Item Specification

1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

3 Adjacent Channel Selectivity (ACS)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

4In-band Blocking UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

5 Out-band Blocking 2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

6 Spurious Response

-44dBm CW

UE@+20dBm output power(Class3)

-46dBm CW@10MHz

7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 14 -

2.4 Current Consumption

1) KS20 Current Consumption

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On)

2) KS20 Current Consumption

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Stand by Voice Call VT

WCDMA

Under 4.00 mA Under 600 mA Under 800mA

(DRX=1.28) (Tx=23dBm) (Tx=23dBm)

Under 3.00 mA Under 350 mA

GSM Paging=9 period (PCL=5)

Level Change WCDMA GSM

BAR 4 → 3 -82 ± 2 dBm -91 ± 2 dBm

BAR 3 → 2 -92 ± 2 dBm -96 ± 2 dBm

BAR 2 → 1 -102 ± 2 dBm -101 ± 2 dBm

BAR 1 → 0 -112 ± 2 dBm -106 ± 2 dBm

Stand by Voice Call VT

WCDMA

Under 2.5 mA Under 330 mA Under 500mA

(DRX=2.56) (Tx=10dBm) (Tx=10dBm)

Under 2.7 mA Under 270 mA

GSM

Paging=5 period (PCL=7)

LGE Internal Use Only

2.6 Battery BAR

2. PERFORMANCE

- 15 -

Indication Standby

Bar 4 100% ~ 76%

Bar 4 → 3 75%

Bar 3 → 2 50%

Bar 2 → 1 25%

Bar 1 → Empty 5%

Low Voltage, 10%

Warning message+ Blinking 5%

Power Off 3.20 ± 0.05V / 0%

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 16 -

2.7 Sound Pressure Level

2.8 Charging

• Charging Method : CC & CV (Constant Current and Constant Voltage)

• Maximum Charging Voltage : 4.2 V

• Maximum Charging Current : 900 mA

• Normal Battery Capacity : 1050 mAh

• Charging Time : Max 2.5 hours (except for trickle charging time)

• Full charging indication current (charging icon stop current) : 60 mA

• Cut-off voltage : 3.20 V

No Test Item Specification

1 Sending Loudness Rating (SLR) 8 ±3 dB

2 Receiving Loudness Rating (RLR)

Nor 2 ± 3 dB

Max -13 dB

3 Side Tone Masking Rating (STMR) Min 23 dB

4 Echo Loss (EL) Min 46 dB

5 Idle Noise-Sending (INS) Max -64 dBm0p

6 Idle Noise-Receiving (INR)

Nor

Under -54 dBPA

Max

7 Sending Loudness Rating (SLR) 8±3dB

8 Receiving Loudness Rating (RLR)

Nor -1 ±3 dB

Max -12 ±3 dB

9 Side Tone Masking Rating (STMR) Min 25 dB

10 Echo Loss (EL) Min 40 dB

11 Idle Noise-Sending (INS) Max -55 dBm0p

12 Idle Noise-Receiving (INR)

Nor Under -45 dBPA

Max Under -40 dBPA

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

13

-. Acoustic (Max Vol.)

MS/Headset SLR : 8 ±3dB

MS/Headset RLR : -15 ± 3dB/-12

dB

(SLR/RLR : Mid-value setting)

MS

Headset

MS and

Headset

Max

Under -62 dBm

LGE Internal Use Only

3. TECHNICAL BRIEF

- 17 -

3.1 General Description

The KS20 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

1

QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

3. TECHNICAL BRIEF

[Fig 1.1] Block diagram of RF part

LGE Internal Use Only

Only for training and service purposes

A generic, high-level functional block diagram of KS20 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver.

In the GSM receive path, the received RF signals are applied through their bandpass filters and downconverted directly to baseband in the RTR6275 transceiver IC.

These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing.

The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated

signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power

amplifier from a DAC within the MSM

KS20 power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

3. TECHNICAL BRIEF

- 18 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KS20’s receiver functions are split between the three RFICs as follows:

• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes bot use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.

RF Front end consists of antenna, antenna switch module(LSHS-M090U) which includes 3 RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In KS20, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

2

The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details.

ANT_SEL0 ANT_SEL1 ANT_SEL2

GSM 850/GSM 900 TX HIGH HIGH LOW

GSM 1800/GSM 1900 TX HIGH LOW LOW

GSM 850 RX - - -

GSM 900 RX LOW LOW LOW

GSM 1800 RX LOW LOW LOW

GSM 1900 RX LOW LOW HIGH

WCDMA HIGH LOW HIGH

[Table 1.1] Antenna Switch Module Control logic

LGE Internal Use Only

Only for training and service purposes

The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins

Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module.

The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7200 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs

3. TECHNICAL BRIEF

- 20 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 21 -

[Fig 1.2] RTR6275 RX feature

LGE Internal Use Only

Only for training and service purposes

3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band

3. TECHNICAL BRIEF

- 22 -

[Fig 1.3] GSM Transmitter matching

18Ω

300Ω300Ω

18Ω

300Ω300Ω

LGE Internal Use Only

3. TECHNICAL BRIEF

- 23 -

3.3 UMTS Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFto-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature upconverter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.

The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 24 -

[Figure 1.4] RTR6275 IC functional block diagram

WCDMA_2100_TX

WCDMA_2100_RX

LGE Internal Use Only

3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS 2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS 2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U503: ACPM-7381)

The UMTS PA output power is monitored by l power detector circuits(U500 : RTR6275). This detector voltage can be used for transmitter calibration and monitor to meet RF system specification.

3. TECHNICAL BRIEF

- 25 -

[Figure 1.5] WCDMA PAM, Duplexer, Coupler

(1608)

10dB

SMPY0015501

As close as possible

20dB

C565 100p

1nH

L520

3p

C554

33p

C561

C560

33p

FL503

3

ANT

4

PGNDRX

1 2

TX

SDMY0001301

ACMD-7602

NA

C564

L522

4.7nH

100p

C557

C566 100p

L523

10nH

220p

C556

2.7nH

L521

L524

10nH

C559

33p

91

C553

33p

R520

VPWR

33p

C558

R521 91

C563

51

1.5p

R518

VMODE0

3

VMODE1

U503ACPM-7381

6

GND1

GND2

7

GND3

9

PGND

11

RFIN

2

8

RFOUT

VCC1

110

VCC2

VEN

5

4

10u

C555

EFCH1950TDF1

G12G2

3

G3

5

IN

1

O1

4

75

R519

FL504

U502

SCDY0003402

50OHM

4

3

COUP IN

2

OUT

1

PWR_DET

RX_WCDMA_2100

WCDMA_PA_ON

WCDMA_PA_R0

WCDMA_2100_TX_OUT

LGE Internal Use Only

Only for training and service purposes

3.5.2 VCTCXO (X500 : TG-5010LH (19.2M))

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM7200 IC. The oscillator frequency is controlled by the MSM7200 IC.s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7200 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM6275 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (FL500 : LSHS-M090UE)

switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[75], GPIO[74], and GPIO[731]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and ANT_SEL2) respectively.

3. TECHNICAL BRIEF

- 26 -

[Table 1.2] Front End Module control logic

ANT_SEL0 ANT_SEL1 ANT_SEL2

GSM 850/GSM 900 TX HIGH HIGH LOW

GSM 1800/GSM 1900 TX HIGH LOW LOW

GSM 850 RX - - -

GSM 900 RX LOW LOW LOW

GSM 1800 RX LOW LOW LOW

GSM 1900 RX LOW LOW HIGH

WCDMA HIGH LOW HIGH

LGE Internal Use Only

3. TECHNICAL BRIEF

- 27 -

3.5.4 PMIC Functional Block Diagram (U304 : PM7540)

• Complete power management, housekeeping, and user interface functions for wireless devices (CDMA, non-CDMA handsets, and PDAs)

• Input power management

- Valid external supply attachment and removal detection

- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources

- Supports lithium-ion main batteries

- Trickle, constant current, constant voltage, and pulsed charging of the main battery

- Supports coin cell backup battery (including charging)

- Battery voltage detectors with programmable thresholds

- VDD collapse protection

- Charger current regulation and real-time monitoring for over-current protection

- Charger transistor protection by power limit control

- Control drivers for two external pass transistors and one external battery MOSFET (MOSFET is optional)

- Voltage, current, and power control loops

- Automated recovery from sudden momentary power loss

• Output voltage regulation

- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USB-OTG

- Four buck (step-down), switched-mode power supplies for efficiently generating MSMC1, MSMC2, MSME, and PA supply voltages

- Supports dynamic voltage scaling (DVS) for MSMC1, MSMC2, and PA outputs

- 18 low-dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (four), 150 mA (ten), and 50 mA (four). These can be used to power MSMA, MSMP, MSME2, MMC, RFRX1, RFRX2, RFTX, TCXO, SYNT, RUIM1, RUIM2, USB, WLAN, MDDI, CAM, BT, AUX1, and AUX2 circuits.

- One MIC bias regulator circuit

- All regulators can be individually enabled/disabled for power savings

- Low power mode available on most regulators

- All regulated outputs are derived from a common bandgap reference (close tracking)

• Integrated handset-level housekeeping functions reduces external parts count, size, and cost

- Analog multiplexer selects from five internal and up to 28 external inputs

- Multiplexer output's offset and gain are adjusted, increasing the effective ADC resolution

- Adjusted multiplexer output is buffered and routed to an MSM device ADC

- Dual oscillators: a 32.768 kHz off-chip crystal and an on-chip RC assure MSM device sleep clock

- Crystal oscillator detector and automated switch-over upon lost oscillation

- Real-time clock for tracking time and generating associated alarms

- On-chip adjustments minimize crystal oscillator frequency errors

- Control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal

- TCXO buffer control for optimal QPH/catnap timing

- Multistage over temperature protection (smart thermal control)

• Integrated handset-level user interfaces

- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers

LGE Internal Use Only

Only for training and service purposes

- Vibration motor driver programmable from 1.2 to 3.1 V in 100 mV increments

- Two-channel speaker driver with programmable gain, turn-on time, and muting; configurable inputs and outputs capable of stereo or mono operation (drives external 8-Ω speakers with volume controlled 500 mW, each channel)

- Video (TV) amplifier allows use as a camcorder or for slide presentations

• IC-level interfaces

- Configurable SBI (three-wire or single-wire) for efficient initialization, status, and control

- Supports MSM interrupt processing with an internal interrupt manager

- Many functions monitored and reported through real-time and interrupt status signals

- Dedicated circuits for controlled poweron sequencing, including the MSM device's reset signal

- Several events continuously monitored for triggering poweron/poweroff sequences

- Supports and orchestrates soft resets

- USB-OTG transceiver for full-speed (12 Mb/s) and low-speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals

- Two sets of RUIM level translators enable MSM device interfacing with external modules

• 22 multipurpose pins that can be configured as digital or analog I/Os, bidirectional I/Os, or current sinks; default functions support the two sets of RUIM level translators, poweron circuits, analog multiplexer inputs, an LED driver, and a selectable reference voltage output.

• Highly integrated functionality in a small package - 137-pin CSP with a several center ground pins for electrical ground, mechanical stability, and thermal relief

3. TECHNICAL BRIEF

- 28 -

[Figure 1.6] MSM7200 Interface

LGE Internal Use Only

3. TECHNICAL BRIEF

- 29 -

[Figure1.7] PM7540 Block Diagram

LGE Internal Use Only

Only for training and service purposes

3.5.5. GSM PAM (U501:TQM7M5003)

The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability 3rdgeneration InGaP HBT technology. With 50Ω and output, no external matching or bias components are required. The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the AM/AM path in EDGE operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a low-profile overmolded landgrid array on laminate.

3. TECHNICAL BRIEF

- 30 -

[Figure 1. 8] GSM PAM Schematic

(1608)

MODE

SFSY0030201

TQM7M5008

LOW

3 dB

GSM_PA_BAND

GSM

3 dB

DCS/PCS

HIGH

14

GND6

16

GND7

GND8

17

GSM_IN

7

GSM_OUT

9

3

TX_EN

VBATT

4

VCC

12

6

VRAMP

TQM7M5008

U501

BS

2

DCS_PCS_IN

1

15

DCS_PCS_OUT

GND1

5

8

GND2

GND3

10

11

GND4

13

GND5

33p

C540

R513

300

2.2K

R510

18

R511

4.7p

C539

L514

12nH

6.8nH

L513

C534 22u

VBAT

100p

C533

15p

C541

R512

300

FL501

EFCH897MTDB1

G12G2

3

G3

5

IN

1

O1

4

L512

2.2nH

300

R516

R514

18

300

R515

68p

C538

GSM_PA_BAND

GSM_PA_EN

DCS_PCS_TX

GSM_PA_RAMP

GSM_TX

LGE Internal Use Only

3. TECHNICAL BRIEF

- 31 -

3.5.6 UMTS Duplexer(FL503:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include;

• Insertion loss . this component is also in the receive and transmit paths ; In the KS20 typical losses : UMTS2100_ Tx = 1.28 dB, UMTS2100_ Rx = 1.46 dB

• Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:

• Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7 dB.

• Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 51.7dB.

• Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.

• Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

• Power handling . high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

LGE Internal Use Only

Only for training and service purposes

3.5.7 UMTS Rx RF filter (FL502 : EFCH2140TDE1)

• Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

- Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

3. TECHNICAL BRIEF

- 32 -

[Table 1.3] WCDMA Rx SAW Filter Specification

LGE Internal Use Only

3. TECHNICAL BRIEF

- 33 -

3.5.8 Bluetooth (U403 : BCM2048SKUFBG)

The bluetooth components are an bluetooth module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the KS20.

[Figure1.9] Bluetooth system architecture

- 34 -

3. TECHNICAL BRIEF

3.5.9 WLAN (SWL-2700S)

The MSM7200 supports SDIO interface which can be used for WLAN baseband data communication with a WLAN module. Because WLAN module includes RF components, the RF parts for KS20 WLAN include only WLAN module and an antenna. Figure 1.10 shows KS20 WLAN system architecture.

LGE Internal Use Only

Only for training and service purposes

[Figure1.10] WLAN system architecture

- 35 -

3. TECHNICAL BRIEF

3.6 Digital Baseband(DBB/MSM7200)

3.6.1 General Description

A. Features(MSM7200)

• Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE, HSDPA

• The ARM1136-J microprocessor can operate at up to 400 MHz.

• The ARM926EJ-S microprocessor can operate up to 256 MHz.

• Internal 256 MBits stacked DDR memory.

• Java hardware acceleration for faster Java-based games and other applets.

• Supports low-power, low-frequency crystal to enable TCXO shutoff.

• Integrated USIM Controller for direct interface to USIM card

• Software-controlled power management feature

• Integrated Bluetooth 2.0 baseband processor for wireless connectivity to peripherals

• High-speed, serial mobile-display, digital interface that optimizes the interconnection cost between the MSM device and the LCD panel

• Receive chain diversity support for WCDMA, providing improved capacity and data throughput

• USB OTG core supports both slave and limited host functionality

• Integrated wideband stereo CODEC for digital audio applications

• Direct interface to digital camera module with video front end (VFE) image processing

• Vocoder support (GSM-HR, FR, EFR, AMR, W-AMR, and 4GV)

• Advanced 15 x 15 x 1.4 mm, 0.5 mm pitch, 543-pin lead-free CSP packaging technology

• HSDPA Features

- supports release 5, December 2004 standard for HSDPA

- HSDPA enables PS data speeds up to 7.2 Mbps on the downlink

• WCDMA Features

- supports release 99 June 2004 of the W-CDMA FDD standard

- PS data rates supporting 384kbps DL / 384kbps UL

- CS data rates supporting 64kbps DL / 64kbps UL

- AMR (all rates)

LGE Internal Use Only

Only for training and service purposes

• GSM Features

- Voice features (FR,EFR,AMR,HR)

- Circuit-switched data features(9.6K,14.4K,Fax)

• GPRS Features

- Simple Class A operation

- Multi-slot class 12 data services

- CS schemes CS1,CS2,CS3,CS4

• EDGE Features

- EDGE E2 power class for 8PSK

- Simple Class A, multi-slot class 12

- Downlink/Uplink coding schemes (CS1-4, MCS1-9)

• Operation and Services

- LCD & Camera Interface

- USIM Interface

- Dual Memory Buses(EBI1-SDRAM & EBI2-NAND Flash)

- External Memory Interface (Micro SD)

• Data Communication

- BlueTooth

- Slave USB

3. TECHNICAL BRIEF

- 36 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 37 -

3.7 Hardware Architecture

MSM7200

MCP

DDR 1G

NAND 2G

2M AF

VGA

2.8î QVGA LCD

Speaker

Receiver

T Flash

- Touch Controller

- Joy Stick

- Send, End, Hot, Power

-Vol. Up/Down

- Camera Shutter

SIM Card

Int. Mic.

Bluetooth

WLAN

SWL-2700S

WLAN

SWL-2700S

BCM2048

FM Radio

18Pin Cradle

Connector

18Pin Cradle

Connector

PM7540

Battery

USB

Serial Port

RTC Battery

1050mAh

RTR6275

XCVR

RTR6275

XCVR

WCDMA

PAM

WCDMA

PAM

Switch-

plexer

Switch-

plexer

WCDMA/HSDPA RF Block

GSM PAM

Duplexer

UART1

SDIO1

GPIO

MIC1

SDIO2

UART2

CAMERA

LOUT/

RCV

EBI1/

EBI2

MDDI

RF

UART3

USB1.1

SBI

[Figure1.11] Simplified Block Diagram of System

- 38 -

3. TECHNICAL BRIEF

3.7.1. Block Diagram(MSM7200)

LGE Internal Use Only

Only for training and service purposes

MSM7200

CONNECTIVITY

CAMERA

PROCESSING

(Default 8bit

Interface)

GRAPHICS

VIDEO

AUDIO

DUAL MEMORY BUS

ARM1136-J APPS

PLL

APPS QDSP 4

ARM 926ejs

With Jazelle

UMTS, WCDMA,

processor

BT 1.2

processor

Rx ADC

Tx DAC

MP3, AAC,

EVRC, QCELP

AMR, CMX, MIDI

EBI 1 EBI 2

Open GL ES

3D, 2D

MPEG-4

H.263, H.264

Keypad I/F

SD/SDIO1

USB

UART1

UART2 / RUIM1

UART3 / PMIC SBI

Mono

Speaker

Stereo

Headset

MIC

MicroSD

Camera 2M

KEY

PAD

18 PIN

M M I

USB

NAND Flash

2G

SDRAM

1G

LCD

(2.8 inch)

PM7540

GSM/GPRS/EDGE

processor

USIM

4 Bit

JTAG

RF SBI

GPIO

Camera 0.3M

1

8

P

I

N

M

I

MDDI

Modem QDSP4

SD/SDIO2

WLAN

[Figure1.12] Simplified Block Diagram of MSM7200

LGE Internal Use Only

3. TECHNICAL BRIEF

- 39 -

3.8. Subsystem(MSM7200)

3.8.1. ARM Microprocessor Subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275 and PM7540 devices..

3.8.2. UMTS Subsystem

The UMTS Subsystem performs the digital UMTS signal processing. Its components include:

• Searcher engine

• Demodulating fingers

• Combining block

• Frame deinterleaver

• Viterbi decoder

• Up-link subsystem

• Turbo decoder

On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH).

3.8.3. GSM Subsystem

The GSM/GPRS/EGPRS subsystem reuses the MSM6280 GSM core. It performs the digital GSM signal processing and PA gain controls for GPRS support. The PA output level is controlled by an analog signal generated on the MSM. In GSM mode, the power profile ramps up before the burst and ramps down after the burst. In GPRS mode, at the beginning of each burst (up to four active transmit slots), PA must be smoothly ramped up to some desired output power level, held at that level for the current slot, smoothly ramped down/up during the transition period and held to the new level for the next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275 support differential GSM PA power control output. The RF interface communicates with the mobile station external RF circuits. Signals to these circuits control signal gain in the Rx and Tx signal path, control DC offset errors, and maintain the system frequency reference.

3.8.4. RF Interface

The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 40 -

3.8.5. Serial Bus Interface(SBI)

The MSM7200 device’s SBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6275 and PM7540 ASICs. Using the SBI, the RTR6275 and PM7540 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.

3.8.6. Wideband CODEC

The MSM7200 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6280 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.8.7. Vocoder Subsystem

The MSM7200 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7200 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.8.8. ARM Microprocessor subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275 and PM7540 devices.

LGE Internal Use Only

3. TECHNICAL BRIEF

- 41 -

3.8.9. Mode Select and JTAG Interfaces

The mode pins to the MSM7200 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7200 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

3.8.10. General-Purpose Input/Output Interface

The MSM7200 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.8.11. UART

The MSM7200 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

• UART1 for Bluetooth

• UART2 for USIM interface

• UART3 for data

3.8.12. USB

The MSM7200 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.

- 42 -

3. TECHNICAL BRIEF

3.9. Power Block

3.9.1. General

MSM7200, included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover the power of MSM7200, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

PM7540(U304) : Phone power supply MAX8645Y(U702) : LCD Backlight/Flash charge pump

3.9.2. PM7540

The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM7540 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

LGE Internal Use Only

Only for training and service purposes

- 43 -

3. TECHNICAL BRIEF

LGE Internal Use Only

[Figure1.13] PM7540 Functional Block Diagram

- 44 -

3. TECHNICAL BRIEF

3.9.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

LGE Internal Use Only

Only for training and service purposes

100~76 (%) 75~51 (%)

50~26 (%) 25~6 (%)

5~0 (%)

PM7540 Input Power Management

KS20 Battery Bar Display(Stand By Condition)

- 45 -

3. TECHNICAL BRIEF

Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from V

DD,

is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDDto pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

LGE Internal Use Only

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

PM7540 Input Power Managemen

t

- 46 -

3. TECHNICAL BRIEF

Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.

• Charging Method : CC & CV (Constant Current & Constant Voltage) ¶U Maximum Charging Voltage : 4.2V ¶U Maximum Charging Current : 900mA ¶U Nominal Battery Capacity : 1050mAh ¶U Charging time : Max 2.5h (Except time trickle charging) ¶U Full charge indication current (icon stop current) : 60mA ¶U Cut-off voltage : 3.20V

LGE Internal Use Only

Only for training and service purposes

- 47 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.10. External memory interface

A. MSM7200

The MSM7200 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the highbandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the MSM7200 IC has two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple commands for the external memory device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge provides the arbitration logic for all of the bus masters.

•

EBI1 Features

- Support for only low-power memories at 1.8-V I/O power supply voltage

- AXI bus frequencies up to 133 MHz

- A 16-bit/32-bit static and dynamic memory interface

•

DDR SDRAM interface features include:

- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed

- Supports auto precharge and manual precharge

- Supports partial refresh

- Separate CKE pin per chip-select to support partial operation mode

- Idle powerdown to save idling power consumption

•

EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).

- 2Mbytes of memory per chip select.

- Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

•

Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package

•

2Gb NAND(8bit) flash memory + 1Gb DDR SDRAM (32bit)

Interface Spec

Device Part Name Maker Read Access Time Write Access Time

NAND SS 45 ns 200 us

SDRAM 7.5 ns 7.5 ns

[Table 1.4] External memory interface for KS20

KAL009001M-D1YY SS

- 48 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure1.14] Simplified Block Diagram of Memory Interface

MSM7200

DDR

SDRAM

1Gb

(128MB)

NAND

2Gb

(256MB)

DATA[31:0]

ADDRESS[15:

0]

WE*

CS*

CAS*

RAS*

CLK_EN

CLK[0:1]

DQM[3:0]

DQS[3:0]

NAND_CS*

NAND_RE*

NAND_WE*

NAND_CLE

NAND_WP*

NAND_ALE

NAND_READY

DATA[7:0]

EBI1

EBI2

- 49 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.11. H/W Sub System

3.11.1. RF Interface

A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)

MSM7200 controls RF part(RTR6275) using these signals.

• SSBDT : SSBI I/F signals for control Sub-chipset

• TX_ON : Power AMP on RF part

• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

• DAC_REF : Reference input to the MSM Tx data DACs

[Figure1.15] Block Diagram of RF Interface

- 50 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

B. the others

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable

• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)

• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp

• GSM_PA_RAMP : Power Amp Gain Control of APC_IC

• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

- 51 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.11.2. MSM Sub System

3.11.2.1. USIM Interface

SIM interface scheme is shown in Figure. And, there control signals are followed

• USIM_CLK : USIM Clock

• USIM_Reset : USIM Reset

• USIM_Data : USIM Data T/Rx

3.11.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

MSM7200

PM7540

USIM

USIM CLK

USIM Reset

USIM Data

USIM Reset

USIM CLK

VREG_UIM 2.85V

[Figure1.16] SIM Interface

GPIO_Map Name Note

GPIO_86 UART3_RX Data_Rx

GPIO_87 UART3_TX Data_Tx

[Table 1.5] UART Interface

- 52 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.11.2.3. USB

The MSM7200 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM7200 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM7200.

Name Note

MSM_USB1_VM Data to/from MSM

MSM_USB1_VP Data to/from MSM

nUSB_OE1 Out-Put Enable of Transceiver

VUSB_5.0V USB_Power From Host(PC)

CRADLE_USB_DP USB Data+ to Host

CRADLE_USB_DN USB Data- to Host

[Table 1.6] USB Signal Interface

[Figure1.17] USB block(MSM7200 Side & PM7540 Side)

MSM7200

PM7540

nUSB_OE1

MSM_USB1_VM

MSM_USB1_VP

CRADLE_USB_DN

CRADLE_USB_DP

VUSB_5.0V

MMI

Conn.

(18p)

- 53 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.11.3. Key Pad

There are 13 main key buttons that are controlled by MSM7200. Refer to the Keypad circuit. ‘Power Button’ Key is connected to PMIC(PM7540:GPIO83).

Power Button

KB105

D119

PRSB6.8C

INSTPAR

KPDPWR_ON

[Table 1.7] Key Matrix Mapping Table

[Figure1.18] Power Button Keypad circuit

- 54 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

[Figure1.19] Main Keypad Circuit

[Figure1.20] Camera Keypad Circuit

Function Key

Button

SEND

Volume Up

Volume Down

KB104

D111

PRSB6.8C

D102

PRSB6.8C

INSTPAR

KB101

KB100

D112

PRSB6.8C

KB102

PRSB6.8C

D108

INSTPAR

D109

PRSB6.8C

INSTPAR

PRSB6.8C

D101

INSTPAR

KPD_ROW3

KPD_ROW2

KPD_ROW1KPD_COLUMN1

KPD_ROW4

Camera Button

SW100

LS50D23

ESCY0004201

1

23

4

KPD_ROW2

KPD_ROW1

KPD_COLUMN2

- 55 -

3. TECHNICAL BRIEF

LGE Internal Use Only

END Button

KB103

PRSB6.8C

D110

VA100 EVLC14S02050

EVLC14S02050VA101

KPD_COLUMN2

KPD_ROW0

5-Way Key

INSTPAR

D114

PRSB6.8C

D117

INSTPAR

D116

PRSB6.8C

INSTPAR

D118

PRSB6.8C

D113

INSTPAR

A

B

C COM1

COM2COM3

D

E

G1

G2

ESCY0004001

EVQQ7GA50

SW102

PRSB6.8C

D115

INSTPAR

KPD_ROW2 KPD_ROW3 KPD_ROW4

KPD_ROW1KPD_COLUMN0

KPD_ROW0

[Figure1.21] END Keypad Circuit

[Figure1.22] 5-Way Keypad Circuit

- 56 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.11.4. Touch Interface

In KS20, 4-wire touch screen panel is used for user input method. Two resistive layers make up a 4wire touch screen panel and are separated by insulating dots. The inside surface of each layer is coated with a transparent metal oxide coating that generates a gradient across each layer when voltage is applied.

[Table 1.8] MSM7200 Touch screen connections

[Table 1.9] Recommeded operation conditions

[Figure1.23] Touch screen circuit

TOUCH SCREEN CONNECTOR

PRSB6.8CD104

PRSB6.8CD106

D105 PRSB6.8C

D103 PRSB6.8C

6

CN101

G1

G2

1

2

3

4

5

04-6298-006-000-883

ENQY0008602

TOUCH_X1XR

TOUCH_Y1YD

TOUCH_X2XL

TOUCH_Y2YU

- 57 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.11.5. Camera Interface

KS20 Installed a 2M Pixel with auto focus and 0.3M Pixel Camera. The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its interface is dedicated camera interface port in MSM7200. The following figure is KS20 camera block diagram.

FLASH_PWR_ON

CAMERA I/F:

CIF_DATA[7:0]

CIF_LV CIF_FV

CIF_PCLK

CIF_MCLK

CIF_RESET#

CAM_I2C_SCL

CAM_I2C_SDA

CAM_2M_PWDN

CAM_VGA_PWDN

GPIO I/F:

CAM_PWR_ON

FLASH_PWR_ON

2M CAM

MSM7200

8

CAM_DATA[7:0] CAM_HSYNC CAM_VSYNC CAM_PCLK CAM_MCLK CAM_RST#

CAM_I2C_SCL CAM_I2C_SDA

CAM_2M_PWDN

VGA CAM

CAM_DATA[7:0] CAM_HSYNC CAM_VSYNC CAM_PCLK CAM_MCLK CAM_RST#

CAM_I2C_SCL CAM_I2C_SDA

CAM_VGA_PWDN

CAMERA

POWER

CAMERA

POWER

CAM_PWR_ON

ENF

MAX8631

CAM_PWR_ON

DVDD

IOVDD

LVDD AVDD

VDD

FLASH LED

FLASH_PWR_ON

CAM_PWR_ON

[Table 1.10] Interface between 2M/VGA Camera Module and MSM7200

- 58 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

The following figures show the flow of camera I/F signals between MSM7200 and camera modules. The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its interface is dedicated camera interface port in MSM7200.

[Figure1.24] Camera FPCB circuit

2M CAM CONNECTOR (T=0.9. SOCKET)

VCAM2_2.6V

VCAM_1.8V

VCAM3_2.6V

7 8 9

22

23

24

25

26

27

28

29

3

30

31

32

33

34

4 5 6

G4

1

10 11 12 13 14 15 16 17 18

19

2

20

21

CN102

AXK7L34227G

ENBY0015601

G1 G2

G3

VCAM1_2.6V

CAM_DATA7 CAM_DATA6 CAM_DATA5 CAM_DATA4 CAM_DATA3 CAM_DATA2 CAM_DATA1 CAM_DATA0

I2C_SDA I2C_SCL

CAM_PCLK

nCAM_RST

CAM_MCLK

CAM_VSYNC CAM_HSYNC

CAM_2M_PWDN

FPCB to SUB Connector

VCAM2_2.6V

VCAM1_2.6V

7 8 9

23

24

25

26

27

28

29

3

30

31

32

33

34

4 5 6

G2

1

10 11 12 13 14 15 16 17 18

19

2

20

21

22

VCAM_1.8V

CN103

G1

VCAM3_2.6V

CAM_DATA7 CAM_DATA6 CAM_DATA5 CAM_DATA4 CAM_DATA3 CAM_DATA2 CAM_DATA1 CAM_DATA0

CAM_MCLK

CAM_2M_PWDN

CAM_VSYNC CAM_HSYNC

I2C_SCL

I2C_SDA

CAM_VGA_PWDN

nCAM_RST

CAM_PCLK

VGA CAM CONNECTOR

9

VCAM3_2.6V

13

14

15

16

17

18

192

20

3 4 5 6 7 8

ENBY0039601

GB042-20S-H10-E3000

CN101

1

10 11

12

VCAM1_2.6V

CAM_DATA3

CAM_DATA2

CAM_DATA1

CAM_DATA0

CAM_VGA_PWDN

nCAM_RST I2C_SCL I2C_SDA

CAM_HSYNC CAM_VSYNC

CAM_PCLK

CAM_MCLK

CAM_DATA4 CAM_DATA5 CAM_DATA6

CAM_DATA7

- 59 -

3. TECHNICAL BRIEF

LGE Internal Use Only

SUB TO FPCB_CAM CONNECTOR (T=0.9. SOCKET)

NA

TP601

C726

R601 2.2K

FB600

FL600 ICVE21184E150R500FR

G15G2

10

INOUT_A1

1

2

INOUT_A2

INOUT_A3

3

4

INOUT_A4

9

INOUT_B1

INOUT_B2

8

7

INOUT_B3

INOUT_B4

6

VCAM_1.8V

2

INOUT_A2

INOUT_A3

3

4

INOUT_A4

9

INOUT_B1

INOUT_B2

8

7

INOUT_B3

INOUT_B4

6

FL603 ICVE21184E150R500FR

G15G2

10

INOUT_A1

1

R621 0

R719

2.2K

FB601

INOUT_B4

VCAM_2.6V

2.2K

R718

5

G110G2

1

INOUT_A1

INOUT_A2

2

3

INOUT_A3

INOUT_A4

4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

ICVE21184E150R500FRFL602

32

33

34

4 5 6 7 8 9

18

19

2

20

21

22

23

24

25

26

27

28

29

3

30

31

CN601

AXK7L34227G

ENBY0015601

G1 G2

G3 G4

1

10 11 12 13 14 15 16 17

FB602

2.2KR602

NA

C725

VCAM_2.6V

1

INOUT_A1

INOUT_A2

2

3

INOUT_A3

INOUT_A4

4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

ICVE21184E150R500FRFL604

5

G110G2

VCAM_2.6V

TP600

VCAM_2.6V

0R603

DEFAULT_NET_TYPE

CAM_2M_PWDN

I2C_SCL

I2C_SDA

CAM_VGA_PWDN

CAM_PCLK nCAM_RST

CAM_MCLK

CAM_DATA7 CAM_DATA6 CAM_DATA5 CAM_DATA4

CAM_DATA3 CAM_DATA2 CAM_DATA1 CAM_DATA0

CAM_VSYNC CAM_HSYNC

LCD BL/FLASH LED/CAMERA LDOs

C715

10u

C716 1u

10u

C717

5

LDO2

16

M1 M2

15

M3

14 13

M4

OUT

25

28

P1 P2

17

24

PGND

1

6

REFBP

7

SETF

8

SETM

BGND

29

22

C1N

C1P

23

C2N

27

26

C2P

ENF

21 18

ENLDO

20

ENM1 ENM2

19

F1

12 11

F2

10

F3

9

F4

GND

3

IN

2

LDO1

4

EUSY0263101

MAX8631XETIU702

2.2u

C722

C714 1u

R712 100K

R720

DNI

6.8KR730

R710 100K

VCAM_2.6V

VPWR

R717 13K

2.2u

C721

0.01u

C720

VCAM_1.8V

100KR711

BL_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON

VOUT

BLED4

BLED1 BLED2 BLED3

FLED

[Figure1.25] Camera module I/F and Camera LDO circuit

- 60 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

The 2 MEGA Camera module is connected to CAM-FPCB with 34pin Board to Board connector (AXK7L34227G). Its interface is dedicated camera interface port in MSM7200. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM7200.

[Table 1.11] Interface of 2 MEGA AF Camera Module

GNDGNDGND20

Vertical SynchOVSYNC19

Horizontal SynchOHSYNC18

AVDD2I2M_CAM_AVDD_2.6V17

LVDD2I2M_CAM_LVDD_2.6V15

AVDD1I2M_CAM_AVDD_2.6V16

Master Clock(24.576M)ICLKIN21

GNDGNDGND3

GNDGNDGND4

Camera reset signalIM_CAM_RESET_N5

GNDGNDGND6

NC7

I2C DataOI2C_SDA8

I2C ClockOI2C_SCL9

NC10

LVDD1I2M_CAM_LVDD_2.6V14

Camera power downIM_CAM_PWDN13

GNDGNDGND12

NC11

Master Clock(45.152M)ICAM_PCLK2

GNDGNDGND1

NotePortNameNo

AVDD2O2M_CAM_AVDD_2.6V34

AVDD1O2M_CAM_AVDD_2.6V33

CVDD2O2M_CAM_CVDD_1.8V32

DataOCAM_DATA(7)30

CVDD1O2M_CAM_CVDD_1.8V31

GNDGNDGND22

DataOCAM_DATA(0)23

DataOCAM_DATA(1)24

DataOCAM_DATA(2)25

DataOCAM_DATA(6)29

DataOCAM_DATA(5)28

DataOCAM_DATA(4)27

DataOCAM_DATA(3)26

- 61 -

3. TECHNICAL BRIEF

LGE Internal Use Only

The VGA Camera module is connected to LCD FPCB with 20pin Board to Board connector. Its interface is dedicated camera interface port in MSM7200. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM7200.

Camera I/O PowerIVREG_CAM_2.6V20

Camera I/O PowerIVREG_MSMP_2.6V19

Camera reset signalICAM_RESET_N18

I2C ClockII2C_SCL17

GNDGNDGND15

I2C ClockII2C_SCD16

GNDGNDGND3

Clock for Camera Data Out(12M)OCAM_PCLK4

DataOCAM_DATA(0)5

DataOCAM_DATA(1)6

DataOCAM_DATA(2)7

DataOCAM_DATA(3)8

DataOCAM_DATA(4)9

DataOCAM_DATA(5)10

Horizontal SyncOCAM_HSYNC14

Vertical SynchOCAM_VSYNC13

DataOCAM_DATA(7)12

DataOCAM_DATA(6)11

Master Clock(24M)ICAM_MCLK2

Camera power downiCAM_PWDN1

NotePortNameNo

[Table 1.12] Interface of VGA Camera Module

- 62 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.11.6. LED(KEY/Indicator) Light

There are 4 White LEDs in Main key backlight circuit, which are driven by KPD_DR_N line from PM7540.

In addition, there is 1 RGB LED in LED Notification-RGB backlight circuit, which are driven by KEBY_BACKLIGHT line from MSM7200 GPIO78/84/85.

[Figure1.26] Schematic of Power Keypad back light circuit

[Figure1.27] Schematic of KEY back light circuit

Power Keypad LED

PRSB6.8C

D107

SSC-TWH104-HLS

LD104

VPWR

SSC-TWH104-HLS

LD101

LD102

SSC-TWH104-HLS

R101100ohm

SSC-TWH104-HLS

LD103

R103100ohm

R102100ohm

100ohm

KPD_DRV_N

R100

BLUE

RED

GREEN

LED Notification-RGB

LD100LEMC-S11G

1

2

3

4

VPWR

LEDCB1

LEDCR1

LEDCG1

- 63 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.11.7. LCD Module Interface

- The LCD module is a Color TFT supplied by EPSON Imaging Devices. This LCD Module has a 2.8 inch diagonally measured active display area with 240(RGB)X320 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.

* Features

- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors

- LCD Driver IC: S6D0165(SS)

- Driving Method : A-Si TFT Active Matrix

- 4 bit MDDI(Mobile Display Digital interface) I/F

BL_PWR_ON

Charge Pump

BL PWR

LCD_PWR_ON

LDO

LCD PWR

MDDI I/F

MDDI_P_STB_P

MDDI_P_STB_M

MDDI_P_DATA_P

MDDI_P_DATA_M

GPIO

LCD_RESET

FLM(VSYNC)

LCD_PWR_ON

BL_PWR_ON

MSM7200

MDDI I/F MDDI_STB+ MDDI_STBMDDI_DT+ MDDI_DT-

RESET FLM(VSYNC)

LCD

POWER

Vci(2.6)

VccIO(1.8)

LCD

BLIGHT

LED(AN) LED(CA)

2.8 QVGA MDDI LCD

[Figure1.28] LCD Module Block Diagram

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 64 -

[Figure1.29] Display/ LCD FPCB I/F and LCD BL circuit

LCD Connector

7

8

9

16

17

18

19

2

20

21

22

23

24

25

26

27

3

4

5

6

ENQY0014201

04-6293-027-001-829

CN702

1

10

11

12

13

14

15

VLCD_2.6V

C713

0.01u

VLCD_1.8V

TP700

0.01u

C711

2

A

GND

3

NC

5

VCC

61

VCC1

Y

4

FXLP34L6X U700

TP703

C712

2.2u

TP702

VLCD_1.8V

TP701

0

R706

PG05DBTFC

D707

C705

2.2u

C710

FLM

BLED2 BLED3 BLED4

MDDI_P_STB_M

MDDI_P_STB_P

MDDI_P_DATA_M

MDDI_P_DATA_P

VOUT

LCD_RESET

BLED1

LCD BL/FLASH LED/CAMERA LDOs

C715

10u

C716 1u

10u

C717

5

LDO2

16

M1 M2

15

M3

14 13

M4

OUT

25

28

P1 P2

17

24

PGND

1

6

REFBP

7

SETF

8

SETM

BGND

29

22

C1N

C1P

23

C2N

27

26

C2P

ENF

21 18

ENLDO

20

ENM1 ENM2

19

F1

12 11

F2

10

F3

9

F4

GND

3

IN

2

LDO1

4

EUSY0263101

MAX8631XETIU702

2.2u

C722

C714 1u

R712 100K

R720

DNI

6.8KR730

R710 100K

VCAM_2.6V

VPWR

R717 13K

2.2u

C721

0.01u

C720

VCAM_1.8V

100KR711

BL_PWR_ON

FLASH_PWR_ON

CAM_PWR_ON

VOUT

BLED4

BLED1 BLED2 BLED3

FLED

3.11.8. Audio and Sound

3.11.8.1. Overview of Audio & Sound path

LGE Internal Use Only

3. TECHNICAL BRIEF

- 65 -

[Figure1.30] Audio Path Block Diagram

MSM7200

(U100-1)

SPK AMP

(U401)

Head_Set

Loud Speaker

MIC

Head_set MIC

Receiver and

Analog switch

(U400)

Headset

AMP

(U402)

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 66 -

3.11.8.2. Audio Signal Processing & Interface

The MSM7200 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software, the Rx path can be configured as either a mono or stereo output.

The integrated CODEC contains all of the required conversion and amplification stages for the audio front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is provided to generate the precise voltages and currents required by the CODEC. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 Volts DC while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection are included.

The CODEC interface includes the amplification stages for both the microphone and earphone. The interface supports two differential microphone inputs and a differential auxiliary input, each of which can be configured as single-ended if desired. In addition, the interface supports one differential earphone output, one single-ended earphone output, and one differential auxiliary output or two singleended line outputs. The CODEC is configured through the QDSP4000 command types and is not directly controlled by the microprocessor. The CODEC configuration command is sent to the QDSP4000 and then the QDSP4000 executes the command and configures the CODEC. Data is exchanged between the codec interface and the QDSP4000 through its DMA interface. The QDSP4000 uses the Ex_DMA_4 channel for reading data from the codec and uses the Ex_DMA_5 channel to transfer data to the codec. The CODEC interface is shown in more detail in Figure below.

[Figure1.31] Audio Interface Detailed Diagram(MSM7200)

LGE Internal Use Only

3. TECHNICAL BRIEF

- 67 -

MSM7200 BLK

C310 22p

390pC308

33p

SD12T1G

D306

C307

D305PG05DBTFC

FB301

C306

1u

DNIR307

C311 22p

390pC309

D307

1

2

34

5

6

PLR0504F

VUSB_5.0V

VBAT

EVLC14S02050VA301

PG05DBTFC D304

C312 1000p

0 R305

FB300

9

14 15 16 17 18

19

2

20

21

22

3 4 5 6 7 8

CN300

ENRY0006001

HSEJ-18S04-25

1

10 11 12 13

R3060

CRADLE_UART_TX CRADLE_UART_RX

CVBS

nEAR_DET

HS_MIC

VADP_5.0V

FM_ANT

REMOTE_PWR_ON

HSL HSR USC2 USC1

Head Set Jack BLK

MIC_Feedback

VMIC_BIAS

R102 2200

NAC104

C106 0.1u

FM_L

FM_R

2200R106

1uC109

H5

B6

Q_IP_CH1

C108 1u

B5

LINE_L_IN

A6

LINE_L_IP

LINE_R_IN

C1

A5

WIPER

LINE_R_IP

E7

D7

AUXIN

C107 0.1u

B7

AUXIP

A7

MIC1N

INTERNAL_MIC_P

HS_MIC

D102

PG05DBTFC

C105 3300p

4.87K/1%

AMUX_OUT

REM_ADC

0.1uC110

U4

D6

E6

F2

F1

B4

MIC2P

MIC1P

MIC2N

HKAIN0

HKAIN1

HKAIN2

RTR_DAC_REF

GSM_PA_DAC_REF

R105 4.7K

TV_OUT

T8

H9

G7

T4

R4

TVOUT

DAC_IREF

HPH_VREF

TVDAC_R_SET

_PWR_CTL_REF

MODEM_RCV_P

MODEM_RCV_N

R103 33

R104 33

HPH_L

HPH_R

RTR_TXIM

G9

P4

B9

A9

HPH_L

HPH_R

I_OUT_N

EAR1_OP

EAR1_ON

C100 27p

RTR_TXIP

RTR_TXQM

P2

P1

N4

I_OUT_P

Q_OUT_P

Q_OUT_N

27pC101

RTR_TXQP

VDD_RX

WLNA_OUT

WCDMA LNA Circuit

C543

L516

22p

1nH

C547

33p

C550

0.75p

FL502

EFCH2140TDE1

L518

3.3nH

5

4

G2

O2

1

IN

G1

O1

2

3

L517

C546

0.5p

WCDMA_MIX_IN_P

1nH

L519

WCDMA_MIX_IN_M

1nH

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 68 -

Handset main MIC BLK

Speaker Amp

IN+

A1

IN-

C1

SD_MODE

B2C2

SD_SEL

B1

VDD

A3

VO1

C3

VO2

U401 LM4898ITLX-NOPB

A2

BYPASS

B3

GND

C400

1u

TP400

0.1uC402

1uC403

47KR401

R403 20K

47KR400

C401 0.1u

R402 20K

VPWR

nSPEAKER_SHDN

LINE_ON

LINE_OP

AMP_OUT_N

AMP_OUT_P

GND

5

VCC

10

9

1A1B0

1 2

1B181S

2A

6

3

2B0 2B1

4

7

2S

U400 FSA2267AL10X

VPWR

nRECEIVER_SW

SPKR_P

SPKR_N

MODEM_RCV_N

MODEM_RCV_P

AMP_OUT_P

AMP_OUT_N

Audio Amp for loud Speaker

CN100

OSF213-42DC

SUMY0010508

MIC Connector

1 2

NA

capacitor

D100

INTERNAL_MIC_P

LGE Internal Use Only

3. TECHNICAL BRIEF

- 69 -

3.11.8.3. Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).

Headset MP3Headset

Headset MIDI BellHeadset

Speaker MP3Loud Mode

MP3

Speaker MIDI BellLoud Mode

MIDI

Speaker PhoneLoud Mode

Headset Voice CallHeadset

Speaker PhoneLoud Mode

Speaker phone

Receiver Voice Call

Description

Receiver Mode

Voice Call

DeviceMODE

[Table 1.13] Audio Mode

LGE Internal Use Only

Only for training and service purposes

Voice Call Receiver Mode Path

3. TECHNICAL BRIEF

- 70 -

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

AMP

(U401)

MIC

Head_set MIC

Voice

Voice + MP3 + MIDI

Voice Call Receiver Mode is routed as below

MSM7200 EAR1ON,EAR1OP -> Analog Switch( U400) -> Receiver

LGE Internal Use Only

3. TECHNICAL BRIEF

- 71 -

Voice Call Headset Mode Path & Head video Telephony Mode

Voice Call Headset Mode is routed as below

MSM7200 HPH_L, HPH_R -> 18Pin MMI -> Headset

Voice

Voice + MP3 + MIDI

MSM7200

(U100-1)

AMP

(U401)

Loud Speaker

MIC

Head_set MIC

Receiver and

Analog switch

(U400)

Head_Set

Headset

AMP

(U402)

LGE Internal Use Only

Only for training and service purposes

Voice Call Speaker Phone Mode

3. TECHNICAL BRIEF

- 72 -

MSM7200

(U100-1)

Headset

AMP

(U402)

Head_Set

Receiver and

Loud Speaker

Analog switch

(U400)

AMP

(U401)

MIC

Head_set MIC

Voice

Voice + MP3 + MIDI

Voice Call Speaker Phone Mode is routed as below

MSM7200 LINE_ON, LINE_OP -> AMP(U401) ->Analog Switch( U400 ) -> Loud speaker

LGE Internal Use Only

3. TECHNICAL BRIEF

- 73 -

MIDI Ring Tone/MP3 (Speaker)

Voice

Voice + MP3 + MIDI

MIDI Ring Tone/MP3 Mode is routed as below

MSM7200 HPH_L -> AMP(U401) -> Loud speaker

MSM7200

(U100-1)

AMP

(U401)

Loud Speaker

MIC

Head_set MIC

Receiver and

Analog switch

(U400)

Head_Set

Headset

AMP

(U402)

LGE Internal Use Only

Only for training and service purposes

MIDI Ring Tone/MP3 (Headset)

3. TECHNICAL BRIEF

- 74 -

MSM7200

(U100-1)

Headset

AMP

(U402)

AMP

(U401)

Head_Set

Analog switch

(U400)

Receiver and

Loud Speaker

Voice

Voice + MP3 + MIDI

MIDI Ring Tone/MP3 Headset Mode is routed as below

MSM7200 HPH_L, HPH_R -> 18PIn MMI ->Headset

MIC

Head_set MIC

LGE Internal Use Only

3. TECHNICAL BRIEF

- 75 -

Audio & Sound Main Component

There are 6 main components in CU320.

[Table 1.14] Audio main component list

8 ohm receiver & Load Speaker

EMS1810TPB1PCN701Receiver &

Load Speaker

4

-42 dB microphoneOSF213-42DCCN100MIC5

18Pin MMI ConnectorHSEJ-18S04-25RCN300MMI Conn6

1 Channel Analog SWFSA2267AL10XU400Analog Switch3

Class-AB Audio Amp

Base-Band Modem

Note

LM4898

MSM7200

Maker Part No.

U401

U100

Design No.

Audio amp

MSM7200

Component

2

1

- 76 -

3. TECHNICAL BRIEF

3.12. Main Features

1. LG KS20 Main Features

- Bar Type Simple & Stylish design

- UMTS 2100 + GSM 900 + DCS 1800 + PCS 1900 based GSM/GPRS/EDGE/UMTS

- HSDPA 3.6Mbps

- 2.8” QVGA LCD (262K TFT)

- Touch Sensitive User Interface

- Dual Camera (2M Pixel w AF + VGA(0.3M Pixel))

- Stereo Headset & Speaker phone

- 72 Poly Sound

- MP3/AAC/AMR/MIDI/3GP/SMAF decoder and play

- MPEG4 encoder/decoder and play/save

- JPEG en/decoder

- Supports Bluetooth and USB

- Supports WLAN

- Internal User Memory over 128MB

- 1050 mAh (Li-Ion Polymer)

- Windows MobileTM 6 Professional

- Microsoft Office Mobile

LGE Internal Use Only

Only for training and service purposes

- 77 -

3. TECHNICAL BRIEF

2. KS20 Main Component

LGE Internal Use Only

Main board, Top

Main board, Bottom

Sub board, Top

Sub board, Bottom

PMIC BB/MEM/LogicBluetoothRF

Logic

SD/SIM

Socket

WLANCAM

- 78 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

KEY-FPCB/Folder Assy, Top

Folder Assy, Bottom

CAM-FPCB

- 79 -

3. TECHNICAL BRIEF

RF

LGE Internal Use Only

FL503

U500

SW500

FL500

ANT501

L504

U403

FL502

U503

X500 U501

FL501

Reference Description Reference Description

U500 RTR6275 FL500 Switch

FL502 UMTS2100 RX SAW filter SW500 Test Connector

FL503 UMTS 2100 Duplexer X500 VCTCXO

U503 UMTS PA U403 Bluetooth RF Transceiver

FL504 UMTS 2100 TX SAW Filter FL501 UMTS2100 RX SAW filter

U501 TX Dual PAM

- 80 -

3. TECHNICAL BRIEF

Logic / BB / MEM / Audio

LGE Internal Use Only

Only for training and service purposes

U304

ANT400

U301

CN300

U303

U402

U100

CN301

U201

U300

U302

U400

U401

LD400

Reference Description Reference Description

LD400 Camera Flash U201 Memory, MCP

U304 PMIC, PM7540 U300 Charging/Power Switch

ANT400 Bluetooth ANT. U302 Over-voltage Protection

U301 Switch, UART CN300 MMI Connector(18p)

U303 Switch, USB U402 Audio, Headset Amp

U100 MCU, MSM7200 U400 Audio Sig. Switch

CN301 Battery Connector U401 Audio, Speaker Amp

- 81 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Logic

CN701

CN601

CN700

BAT700

CN600

U702

M600

CN702

CN602

CN603

F1_CN101

F1_CN103

F1_CN102

2M connector(34p)F1_CN102VGA connector(20p)F1_CN101

WLAN Cable connectorSW101

CAM FPCB to Sub

board connector(34p)

F1_CN103

WLAN Cable connectorCN603Backup BatteryBAT700

WLAN AntennaANT100

MICCN100Touch connector(6p)CN101

WLANM600LCD connector(27p)CN702

Sub board to Main

Board connector(90p)

CN602

Sub board to CAM

FPCB connector .

CN601

Vibrator ConnectorCN700Speaker Contact PADU701

Sub Board to KEY

FPCB connector(27p)

CN600

LCD BL/Flash Driver / 2

LDO

U702

DescriptionRef.DescriptionRef.

CN100

CN101

SW101

ANT100

- 82 -

4. TROUBLE SHOOTING

4.1 RF Component

TOP SIDE

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

BOTTOM SIDE

- 83 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 84 -

LGE Internal Use Only

4. TROUBLE SHOOTING

- 85 -

4.2 SIGNAL PATH_UMTS RF

➞ Common Tx/Rx

➞ UMTS 2100 Tx/Rx

➞ UMTS 2100 Tx

➞ UMTS 2100 Rx

➞ Tx I/Q

➞ LO

➞ Rx I/Q

LGE Internal Use Only

Only for training and service purposes

4.3 SIGNAL PATH_GSM RF

4. TROUBLE SHOOTING

- 86 -

➞ Common Tx/Rx

➞ GSM900 Tx

➞ DCS/PCS Tx

➞ DCS Rx

➞ PCS Rx

➞ EGSM900 Rx

➞ Tx I/Q

➞ LO

➞ Rx I/Q

LGE Internal Use Only

4. TROUBLE SHOOTING

- 87 -

4.4 Checking VCTCXO Block

The reference frequency (19.2MHz) from X100 (TCXO) is used in UMTS TX part, GSM part and BB part.

TCXO Circuit

0.1uF

C544

100p C548

VTCXO_2.85V

TG-5010LH_19_2M_75A

EXSK0007802

2

GND3OUT

VCC

4

VCONT

1

X500

19.2MHz 1000p C552

C542 1000p

R517

100ohm

0.01u

C551

TCXO_RTR_19.2MHz

TCXO_PM_19.2MHz

RTR_TRK_LO_ADJ

TP1

TP3

TP4 TP2

Schematic of the TCXO Block

Test Point of the TCXO Block

TP1

TP4

TP3

TP2

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 88 -

T

Check C355 of PMIC (U304)

Check R112 of MSM (U100)

T

LGE Internal Use Only

4. TROUBLE SHOOTING

- 89 -

4.5 Checking Front-End Module Block

Rev.F

SFAY0010001

33p

C516

ANT500

33p

C514

33p

C503L500

3.9nH

4.7p

C502

33p

C515

ANT501

VRF_SMPS

C509

0.1u

100nH

L502

13

4

GND4

5 8

GND5

10

GND6

12

GND7 GND8

17 18

GND9

7

NC

22

PCS_RX1

PCS_RX2

21

PGND1

25

PGND2

26

9

UMTS_TX_RX

14

VC1

15

VC2 VC3

16

VDD

ANT

11

DCS_PCS_TX

3

DCS_RX1

20

DCS_RX2

19

EGSM_RX1

24

23

EGSM_RX2

6

EGSM_TX

1

GND1

2

GND2 GND3

FL500

LSHS-M090UE

0

R500

15nH

L501

KMS-506

ENWY0002301

ANT

G1

G2

RF

SW500

NA

C506C505

1.5p

ANT_SEL2

ANT_SEL1

ANT_SEL0

ANT_SEL1

ANT_SEL2

TP1

Schematic of the Front-End Module Block

Test Point of the Front-End Module Block

TP1

- 90 -

4. TROUBLE SHOOTING

Logic Table of the FEM

LGE Internal Use Only

Only for training and service purposes

Check VCC

TP1 VRF_SMPS

ANT_SEL0 ANT_SEL1 ANT_SEL2

GSM 850/GSM 900 TX HIGH HIGH LOW

GSM 1800/GSM 1900 TX HIGH LOW LOW

GSM 850 RX - - -

GSM 900 RX LOW LOW LOW

GSM 1800 RX LOW LOW LOW

GSM 1900 RX LOW LOW HIGH

WCDMA HIGH LOW HIGH

- 91 -

4. TROUBLE SHOOTING

4.6 Checking UMTS Block

4.6.1 Checking Tx level

LGE Internal Use Only

ANT500

L500

3.9nH

4.7p

C502

ANT501

0

R500

KMS-506

ENWY0002301

ANT

G1

G2

RF

SW500

NA

C506C505

1.5p

(1608)

10dB

WCDMA LNA Circuit

SMPY0015501

As close as possible

20dB

C565 100p

3p

C554

33p

C561

C560

33p

0.5p

C546

FL503

3

ANT

4

PGNDRX

1 2

TX

SDMY0001301

ACMD-7602

NA

C564

100p

C557

1nH

L519

C566 100p

L516

1nH

C543

22p

L523

10nH

220p

C556

2.7nH

L521

VDD_RX

91

C553

33p

R520

VPWR

33p

C558

R521

91

33p

C549

C563

51

1.5p

R518

VMODE0

3

VMODE1

L518

3.3nH

U503ACPM-7381

6

GND1

GND2

7

GND3

9

PGND

11

RFIN

2

8

RFOUT

VCC1

110

VCC2

VEN

5

4

EFCH2140TDE1

G1

2

G2

5

IN

1

O1

3

O2

4

FL502

L517

1nH

0.75p

10u

C550

C555

EFCH

GG2

3

GO1

4

75

R519

FL5

L515

2.7nH

33p

C547

0.5p

C545

U502

SCDY0003402

50OHM

4

3

COUP IN

2

OUT

1

PWR_DET

WCDMA_PA_ON

WCDMA_PA_R0

WLNA_OUT

For testing, Max power of UMT 2100 is needed.

TP1

TP2

TP3

TP4

- 92 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

Run a FTM program set RF mode to IMT

set uplink freq. To

9750 click Tx on and

WCDMA set PA range

R1 on set Tx AGC to

410

Check Tx SAW

Filter

Check PAM block

Check coupler U103

Check Duplexer

FL104

Check FEM FL100

U502

FL503

FL500

- 93 -

4. TROUBLE SHOOTING

4.6.2 Checking UMTS PAM Control Block

• PAM control signal

1. PWR_DET : UMTS Tx Power Detected value (Check R519)

2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control

3. +VPWR: UMTS PAM Main Voltage (3V < +VPWR < 4.2V)

4. PA_ON : Turns the PA on and off

5. PA_R0 : Control signals that step the active PA mode and bias

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 94 -

4.6.3 Checking RF Rx Level

O

R

TP1

TP2

TP3

Vbias

TP4

WCDMA

RX_WCDMA_2100

L520

1nH

C554

3p

C553

33p

FL503 1 2

TX

ACMD-7602 SDMY0001301

ANT500

ANT501

R500

0

1.5p

L500

3.9nH

C502

4.7p C506C505 NA

SW500

KMS-506

G2

ANT

RF

G1

ENWY0002301

L515

2.7nH

C545

C549

0.5p 33p

4

PGNDRX

3

ANT

VPWR

U502

C560

SCDY0003402

33p

2

1

C563

OUT

50OHM

1.5p

4

R520

91

20dB

COUP IN

3

R518

51

VDD_RX

C543

L516

22p

1nH

WLNA_OUT

SMPY0015501

C557

C556

C555 10u

100p

220p

(1608)

33p

C561

C564 NA

R519

75

PWR_DET

R521

91

11

PGND VCC2

9

GND3

8

RFOUT

VMODE1

7

GND2

VMODE0

6

GND1

WCDMA LNA Circuit

L518

C547

3.3nH

33p

C550

0.75p

U503ACPM-7381

110

VCC1

2

RFIN

3 4 5

VEN

C566

As close as possible

100p

FL502

EFCH2140TDE1

C565 100p

5

4

G2

O2

1

IN

G1

O1

2

3

C558

33p

C546

0.5p

L521

2.7nH

10nH

L523

WCDMA_PA_

- 95 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Check Vbias over 2V?

Check the RF S/W

Check FEM

Check the Duplexer

FL104

Check the RTR6275

Check TP2

Signal exist?

Check TP3

Signal exist?

Check TP4

Signal exist?

FL503

- 96 -

4. TROUBLE SHOOTING

4.7 Checking GSM Block

LGE Internal Use Only

Only for training and service purposes

- 97 -

4. TROUBLE SHOOTING

4.7.1 Checking RF Tx level

4.7.2 Schematic of RF Tx level

LGE Internal Use Only

HIGH

(1608)

GSM 900 RX

MODE

WCDMA HIGH

GSM(925-960 MHz)

Rev.F

-

TQM7M5008

DCS(1805-1880 MHz)

ANT_SEL1 ANT_SEL2

HIGH

GSM 1800/GSM 1900 TX

ANTENNA SWITCH MODULE LOGIC

-

GSM 1900 RX

LOW

GSM

GSM 1800 RX

LOW

PCS(1930-1990 MHz)

HIGH

-

LOW

SFAY0010001

GSM_PA_BAND

GSM 850/GSM 900 TX

LOW

GSM 850 RX

GSMLOW

LOW

DCS/PCS

LOW

HIGH

ANT_SEL0

HIGH

LOW

14

GND6

16

GND7

GND8

17

GSM_IN

7

GSM_OUT

9

3

TX_EN

VBATT

4

VCC

12

6

VRAMP

33p

C516

TQM7M5008

U501

BS

2

DCS_PCS_IN

1

15

DCS_PCS_OUT

GND1

5

8

GND2

GND3

10

11

GND4

13

GND5

ANT500

33p

C540

4.7p

C539

33p

C514

33p

C503L500

3.9nH

4.7p

C502

L514

12nH

33p

C515

ANT501

6.8nH

L513

C534 22u

VRF_SMPS

C509

0.1u

VBAT

100nH

L502

100p

C533

15p

C541

L512

2.2nH

13

4

GND4

5 8

GND5

10

GND6

12

GND7 GND8

17 18

GND9

7

NC

22

PCS_RX1

PCS_RX2

21

PGND1

25

PGND2

26

9

UMTS_TX_RX

14

VC1

15

VC2 VC3

16

VDD

ANT

11

DCS_PCS_TX

3

DCS_RX1

20

DCS_RX2

19

EGSM_RX1

24

23

EGSM_RX2

6

EGSM_TX

1

GND1

2

GND2 GND3

FL500

LSHS-M090UE

0

R500

15nH

L501

KMS-506

ENWY0002301

ANT

G1

G2

RF

SW500

NA

C506

68p

C53

C505

1.5p

ANT_SEL2

ANT_SEL1

ANT_SEL0

TP1

TP2

TP3

LGE Internal Use Only

Only for training and service purposes

4.7.3 Checking RF Tx level

4. TROUBLE SHOOTING

- 98 -

LGE Internal Use Only

4. TROUBLE SHOOTING

- 99 -

4.7.4 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)

TP3. GSM_PA_BAND : Power Amp Band Selection Control

(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)

TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V

Schematic of GSM PAM Block

(1608)

SFSY0030201

TQM7M5008

14

GND6

16

GND7

GND8

17

GSM_IN

7

GSM_OUT

9

3

TX_EN

VBATT

4

VCC

12

6

VRAMP

TQM7M5008

U501

BS

2

DCS_PCS_IN

1

15

DCS_PCS_OUT

GND1

5

8

GND2

GND3

10

11

GND4

13

GND5

33p

C540

2.2K

R510

4.7p

C539

L514

12nH

6.8nH

L513

C534 22u

VBAT

100p

C533

15p

C541

FL501

EFCH897MTDB1

G12G2

3

G3

5

IN

1

O1

4

L512

2.2nH

68p

C538

GSM_PA_BAND

GSM_PA_EN

GSM_PA_RAMP

TP2

TP4

TP3

TP1

LGE Internal Use Only

Only for training and service purposes

4.7.5 Checking RF Rx Block

Schematic of `GSM900/DCS/PCS Rx Block

4. TROUBLE SHOOTING

- 100 -

TP1

TP2

TP3

TP1. DCS RX INPUT

TP2. PCS RX INPUT

TP3. GSM RX INPUT

C503

33p

L502

100nH

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

DCS_RX2 DCS_RX1

PCS_RX2

PCS_RX1 EGSM_RX2 EGSM_RX1

010001

11

ANT

13

VDD

7

NC

3 6 9 19 20 21 22 23 24

L501

15nH

C509

0.1u

VRF_SMPS

DCS(1805-1880 MHz)

PCS(1930-1990 MHz)

GSM(925-960 MHz)

5.6nHL503

L505 5.6nH

5.6nHL506

5.6nH

L508

27nHL509

L511 27nH

L504 15nH

L507 12nH

L510 33nH

LGE Internal Use Only

4. TROUBLE SHOOTING

- 101 -

LGE Internal Use Only

Only for training and service purposes

4.8 Checking Bluetooth Block

Test Point of the Bluetooth Block

Top

Bottom

4. TROUBLE SHOOTING

- 102 -

TP1. VBT_2.6V

TP2. VBT_CORE_2.6V

TP3. TCXO_BT

TP4. BT ANT Output

LG KS20 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual