LG KM900 Service Manual

Service Manual Model : KM900

Internal Use Only

Service Manual

KM900

Date: February, 2009 / Issue 1.0

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3 ABBREVIATION ............................................................7

2. PERFORMANCE ...............................................9

2.1 Supporting Standard ....................................................9

2.2 Main Parts : Solution ....................................................9

2.3 H/W features .............................................................10

2.4 HW Spec. ..................................................................11

3. TECHNICAL BRIEF .........................................16

3.1 Functional Block Diagram ..........................................16

3.2 Baseband Processor Introduction ...............................17

3.3 Power management IC...............................................30

3.4 Power ON/OFF ..........................................................38

3.5 SIM Interface .............................................................39

3.6 T - Flash connector ....................................................40

3.7 Memory ....................................................................41

3.8 LCD Display ..............................................................42

3.9 keypad back-light illumination ....................................43

3.10 LCD back-light illumination ......................................44

3.11 Battery voltage monitor ............................................45

3.12 Audio ......................................................................46

3.13 WLAN/Bluetooth/FM (LBEH19UNBC) .........................48

3.14 18PIN Interface connector ........................................50

3.15 General Description .................................................51

3.16 GSM Part ................................................................54

3.17 WCDMA Part ...........................................................58

3.18 GSM Power Ampliﬁ er Module ..................................60

3.19 WCDMA Band1/8 Power Ampliﬁ er Module ...............61

3.20 WCDMA Band1/8 Low Noise Ampliﬁ er .....................63

3.21 WCDMA Band1/2 Duplexer ......................................64

3.22 WCDMA Band5/8 Duplexer ......................................65

3.23 KM900 Disassembly & Assembly manual

(Disassembly) ...................................................... 66

3.24 KM900 Disassembly & Assembly manual

(Assembly) .......................................................... 70

4.3 Charging Trouble .......................................................78

4.4 USB Trouble ..............................................................81

4.5 SIM Detect Trouble ....................................................84

4.6 Three-KEY backlight Trouble .......................................87

4.7 Micro SD Trouble .......................................................90

4.8 Audio Trouble ............................................................92

4.9 Microphone Trouble ...................................................96

4.10 Camera Trouble .....................................................100

4.11 Main LCD Trouble ..................................................104

4.12 Trouble Shooting of WiFi /Bluetooth part ..................107

4.13 Trouble Shooting of A-GPS part ..............................113

4.14 FM Transmitter trouble ...........................................117

4.15 MIC FPCB .............................................................119

4.16 Speaker Module ....................................................112

4.17 Ambient Sensor .....................................................124

4.18 Touch Sensor ........................................................125

5. Download & S/W upgrade .........................127

6. BLOCK DIAGRAM ........................................ 140

7. CIRCUIT DIAGRAM ...................................... 141

8. BGA Pin Map ..............................................157

9. PCB LAYOUT ...............................................161

10. RF Calibration .......................................... 175

10.1 Test Equipment Setup ............................................175

10.2 Calibration Step .....................................................175

12. EXPLODED VIEW & REPLACEMENT

PART LIST .................................................181

12.1 EXPLODED VIEW ...................................................181

12.2 Replacement Parts ................................................183

12.3 Accessory .............................................................219

4. TROUBLE SHOOTING ..................................... 74

4.1 Trouble shooting test setup ........................................74

4.2 Power on trouble .......................................................75

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LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features

of the KM900.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services. System

users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not

warrant that this product is immune from the above case but will prevent unauthorized use of common

carrier telecommunication service of facilities accessed through or connected to it. LGE will not be

responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing

harm or interruption in service to the telephone network, it should disconnect telephone service until repair

can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the KM900 or compatibility with the net work, the

telephone company is required to give advanced written notice to the user, allowing the user to take

appropriate steps to maintain telephone service.

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LGE Internal Use Only

1. INTRODUCTION

KM900 service manual

D. Maintenance Limitations

Maintenance limitations on the KM900 must be performed only by the LGE or its authorized agent. The user

may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that

unauthorized alternations or repair may affect the regulatory status of the system and may void any

remaining warranty.

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information such as

the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

KM900 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also

grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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Only for training and service purposes

KM900 service manual

◆

1.3. ABBREVIATION

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER

Bit Error Ratio

CC

-CV Constant Current – Constant Voltage

CLA

Cigar Lighter Adapter

DAC

Digital to Analog Converter

DCS

Digital Communication System

dBm

dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI

International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB

Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

Enhanced General Packet Radio Service

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

KM900 service manual

◆

◆RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR

TA

TDD

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO

VCTCXO

WAP

◆ 8PSK 8 Phase Shift Keying

Side Tone Masking Rating

Travel Adapter

Time Division Duplex

Voltage Controlled Oscillator

Voltage Control Temperature Compensated Crystal

Oscillator

Wireless Application Protocol

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Only for training and service purposes

2. PERFORMANCE

KM900 service manual

2.1 Supporting Standard

Item Feature Comment

2. PERFORMANCE

Supporting Standard WCDMA 900 / WCDMA 2100/HSDPA

GSM850/EGSM/DCS/PCS1 with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 3

Frequency Range GSM850 TX : 824 - 849MHz

GSM850 RX : 869 - 894MHz EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS TX : 1710 - 1785 MHz DCS RX : 1805 - 1880 MHz PCS TX : 1850 - 1910 MHz PCS RX : 1930 - 1990 MHz WCDMA900 TX : 880 - 915 MHz WCDMA900 RX : 925 - 960 MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz HSDPA TX : 880 - 915 MHz 1920 - 1980 MHz HSDPA RX : 925 - 960 MHz 2110 - 2170 MHz WLAN 802.11g : 2400 – 2483.5 MHz

Application Standard WAP 2.0, JAVA 2.1

2.2 Main Parts : Solution

Item Part name Comment

Digital Baseband PMB8878 (Infineon)

Analog Baseband PMB8878 (Infineon)

RF chip TQ7M5005 (TriQuent))

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LGE Internal Use Only

2. PERFORMANCE

KM900 service manual

2.3 H/W features

Item Feature Comment

Form Factor Color LCD – Bar Type

Battery

Item Feature Comment

Size 105.9 × 55.3 × 11.97mm

Weight 105g With Battery

time

Charging time 3 hours 20min @power OFF/1000mAh

1)Capacity Standard : Li-Ion, 10000mAh

2) Packaging Type : Soft Pack

GSM 227 hours @paging period 5 Stand-by

WCDMA 227hours @DRX=7

GSM 170min @ Power Level 5 Talk time

WCDMA 170min @Tx=12dBm

Rx sensitivity EGSM900 : -105 dBm

DCS1800 : -105 dBm PCS1900 : -105 dBm WCDMA2100 : -106.7 dBm

TX output

power

GPRS compatibility GPRS Class 12 EDGE compatibility EDGE Class 12

Display Main LCD(3”, 480 x 800)/TFT

Built-in Camera 5 Mega pixel

System connector 18 Pin

Ear Phone Jack 18pin, 4 Pole, Stereo

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V1.2, A2DP

Voice Recording Yes

GSM/ GPRS

EDGE EGSM900 : 27 dBm

ANT Main : Internal Fixed Type

EGSM900 : 33 dBm DCS1800 : 30 dBm PCS1900 : 30 dBm

DCS1800 : 26 dBm PCS1900 : 26 dBm

Class4 (EGSM900) Class1(DCS) Class1(PCS) E2 (EGSM900) E2 (DCS) E2 (PCS)

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Only for training and service purposes

2. PERFORMANCE

KM900 service manual

Speaker Phone mode

Yes

Support

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable No

T-Flash Yes Not Equipped

2.4 HW Spec.

2.4.1 GSM Transmitter/Receiver spec.

Item Specification

GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz

Frequency

EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz

DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Phase Error

Frequency Error

EMC(Radiated Spurious Emission

Disturbance)

Transmitter Output power and Burst

Timing

Burst Timing <3.69us

Spectrum due to modulation out to

less than 1800kHz offset

Spectrum due to modulation out to

larger than 1800kHz offset to the

edge of the transmit band

Spectrum due to switching transient

Rms : 5°

Peak : 20 °

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

GSM/DCS : < -28dBm

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

200kHz : -36dBm

600kHz : -51dBm/-56dBm

GSM : 1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

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LGE Internal Use Only

2. PERFORMANCE

KM900 service manual

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection – Speech

channels

AM Suppression

- GSM : -31dBm - DCS : -

29dBm

Timing Advance ± 0.5T

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

-98dBm/-96dBm (2.439%)

2.4.2 WCDMA Transmitter spec.

Item Specification

Transmit Frequency WCDMA900 : 880 – 915MHz

WCDMA2100 : 1920 MHz ~ 1980 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage

Power Ratio (ACLR)

Spurious Emissions

|f-fc| > 12.5 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

when Interference CW Signal Level = -40 dBc

< -15 dB at Pout  -20 dBm

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Only for training and service purposes

2. PERFORMANCE

KM900 service manual

2.4.3 WCDMA Receiver spec.

Item Specification

Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz

WCDMA2100 : 2110 ~2170 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity (ACS) ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84 MHz

& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control In Uplink Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

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LGE Internal Use Only

2. PERFORMANCE

KM900 service manual

2.4.4 HSDPA Transmitter Spec.

Specification Item

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz Transmit Frequency

Maximum Output Power

HS-DPCCH

Spectrum Emission Mask

Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Sub-

test in

table

C.10.1.

5

Frequency offset from

Power

step

carrier △f

Power step slot

boundary

Minimum requirement

Power

step

size, P

[dB]

Transmitter power step

tolerance

[dB]

+/- 2.3 6Start of Ack/Nack 1 +/- 0.6 1Start of CQI 2 +/- 0.6 0Middle of CQI 3 +/- 2.3 5End of CQI 4

Measurement

Bandwidth

2.5 ~ 3.5 MHz

3.5 ~ 7.5 MHz

7.5 ~ 8.5 MHz

Adjacent Channel Leakage Power Ratio (ACLR)

Error Vector Magnitude

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 > 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

3GPP Not Complete

- 14 -

-35-15×(△f-2.5)dBc

-35-1×(△f-3.5)dBc

-35-10×(△f-7.5)dBc

Only for training and service purposes

30 kHz

1 MHz 1 MHz 1 MHz -49dBc 8.5 ~ 12.5 MHz

KM900 service manual

2.4.5 HSDPA Receiver Spec.

p

(

p

y

S

Receive Frequency

Maximum Input Level (BLER or R), 16QAM Only

ecificationItem

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 BLER < 10% or R >= 700kbps

2.4.6 WLAN 802.11g Transmitter and Receiver Spec.

Tx Power Level

Frequency Tolerance

Tolerance Spectrum Mask

(rms EVM) Spurious Emissions

Rx Min input Sensitivity

Rx Max in Rx Adjacent Channel

Rejection

ut Sensitivit

Specification Item

2400 MHz ~ 2483.5 MHz ( CH1~CH13 ) Transmit Frequency

≤ 20dBm under (Europe), ≤ 30dBm under (USA)

within ±25 PPM

within ±25 PPM Chip clock Frequency

≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz) ≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)

≤ -5dB Transmitter constellation error

< -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz

PER ≤ 10%

-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@1 2Mbps

-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@ 36Mbps

-66dBm@48Mbps, -65dBm@54Mbps

≥ -20dBm

PER ≤ 10%,

ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps

※ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity

6,9,12,18,24,36,48,54Mbps)@ PER ≤ 10%

2. PERFORMANCE

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.1 Functional Block Diagram

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Only for training and service purposes

KM900 service manual

3.2 Baseband Processor Introduction

3. TECHNICAL BRIEF

[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)

3.2.1 General description

S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal

baseband IC combined with a 3G coprocessor IC, providing all analog and digital functionality for a dual

mode mobile phone in a single chip.

Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm CMOS

technology to meet the ever increasing demands of the market for feature rich and high performance

terminals at low costs.

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.

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LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

3.2.2. Block Description

z Processing core

- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the

Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate Motion Estimation

algorithms with based video encoding schemes..

- TEAKLite DSP core

z ARM9-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory (I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z TEAKLite®-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal

and external memories and with the peripheral buses.

- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

- A controller FPI bus for connecting the low performance controller peripherals such as keypad

etc. called hereafter fPI2 bus.

- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with 8channels

offloads the controller from data transfers.

- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called AHB_PER1 and

AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer AHB ‘backbone’ by

asynchronous, burst capable AHB2AHB bridges which are shared between accessing masters.

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Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and AHB_PER2 by

its second master interface.

z TEAKLite® Bus System

- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals. Also the

data bus is connected into the controller system via shared RAMs to the FPI3 bus.

- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD®3H. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with four additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

· GMSK Modulator: gauss-filter with B*T=0.3

· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- f8 and f9 Cipher unit

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low-power mode and enhanced CPU modes(idle and sleep modes)

- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly

coupled to the display interface. The resulting building block consisting of 2D engine and Display

interface is called Display Content Controller (DCC)

- Security crypto box supporting

· AES, DES, 3 DES

· Hash function

· RSA acceleration

· Secret Root Key (e-fuse) and Key Management

· True Random Number Generator

- Sample Rate Converter (SRC) for audio up-sampling

- Comprehensive static and dynamic Power Management

· Various frequency options during operation mode

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LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

· 32 kHz clock in standby mode

· Sleep control in standby mode

· RAMs and ROMs in power save mode during standby mode

· Additional leakage current reduction in standby mode possible by switching off for the TEAKLitre®

subsystem.

- Extensive debug support for the controller and the DSP system

· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow trace) for ARM

· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®

· Multi-core debug support

· 4 Monitor pins for important internal signals and most pad signals

· Cerberus debugging unit

- 2 General Purpose Timers with 3 32-bit timers

- Serial number

- A real time clock with alarm functions

- 2 capture/compare units with 16 channels. One channel active during sleep mode.

z 3G Coprocessor Subsystem

- ARM7 TRMI-S

· 240 kByte Instruction RAM

· 64 kByte Data RAM

· 8 kByte Boot ROM

- 20kByte Communication RAM

- HW accelerators for

· Transmit Path

· Inner and Outer Receiver for Release5 incl. HSDPA

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Only for training and service purposes

KM900 service manual

3.2.3 RF Interface(T_OUT)

S-Gold® 3H uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

3. TECHNICAL BRIEF

T_OUT

Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 -

T_OUT2 ANT_SEL1

T_OUT3 2G_ANT_SELECT

T_OUT4 CHG_EOC

T_OUT5 GPS_IRQ

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2

ANT_SEL3

T_OUT8

T_OUT9

DSR

T_OUT10

T_IN0 WLAN_RESET_N

T_IN1 WLAN_REG_ON

JACK_DETECT

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LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

3.2.4 ADC channel

ADC block is composed of 11 external ADC channel. This block operates charging process and other related

process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 JACK_TYPE Accessory type detect

M4 SENSOR_ADC

M5

N.C

M6 N.C

M7 N.C

M8 VBAT Battery supply voltage measure

M9 N.C

M10 N.C

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Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

3.2.5 GPIO map

Over a hundred allowable resources, KM900 is using as follows except dedicated to SIM and Memory. KM900

GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in

below table

[Table 3.2.5-1] S-Gold®3H GPIO pin Map

Port Function Net Name Description

KEY MATRIX

KP_IN0

KP_IN1

KP_IN2

KP_IN3

KP_IN4

KP_IN5

KP_IN6

KP_OUT0

KP_OUT1

KP_OUT2

KP_OUT3

USIF1

USIF1_RXD_MRST

USIF1_TXD_MTSR

USIF1_RTS_N

USIF1_CTS_N

USIF2

USIF2 _RXD_MRST

USIF2 _TXD_MTSR

USIF2_RTS_N

USIF2_CTS_N

USIF3

USIF3 _RXD_MRST

USIF3 _TXD_MTSR

USIF3_SCLK

CLK

CLK32K

GPIO_22

CAMERA I/F

KEYIN0

KEYIN1

KEYIN2

GPS_ON

GPS_RST

MAIN_VOICE_REC_SW

LED_ON

KEYOUT0

KEYOUT1

N.C

MAIN_VOICE_MIDI_SW

UART_RX UART Data

UART_TX UART Data

USB_ DAT_VP USB Data

USB_SE0_VM USB Data

MMP_WAIT

RPWRON

BT_UART_RTS Bluetooth RTS

BT_UART_CTS Bluetooth CTS

BT_UART_RX

BT_UART_TX

LIN_INVERTER

CLK32k For FM Radio, BT CLK32K

Not used

- 23 -

LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

CIF_D0

CIF_D1

CIF_D2

CIF_D3

CIF_D4

CIF_D5

CIF_D6

CIF_D7

CIF_PCLK

CIF_HSYNC

CIF_VSYNC

CLKOUT2

CIF_PD

CIF_RESET

LCD I/F

DIF_D0

DIF_D1

DIF_D2

DIF_D3

DIF_D4

DIF_D5

DIF_D6

DIF_D7

DIF_D8

DIF_DS1

DIF_DS2

DIF_CD

DIF_WR

DIF_RD

DIF_HD

DIF_VD

DIF_RESET1

DIF_RESET2

I2C

I2C1_SCL

I2C1_SDA

PM_INT (EINT)

I2C2_SCL

MM_AD0 Camera DATA[0]

MM_AD1 Camera DATA[1]

MM_AD2 Camera DATA[2]

MM_AD3 Camera DATA[3]

MM_AD4 Camera DATA[4]

MM_AD5 Camera DATA[5]

MM_AD6 Camera DATA[6]

MM_AD7 Camera DATA[7]

HP_AMP_SHDN Camera pixel clock

USB_SELECT Camera H sync

WLAN_WAKEUP Camera V sync

26M_GPS Camera main clock

_CHG_EN Camera power down(active high)

LIN_PWM_FREQ Camera reset

MM_AD8 LCD data[0]

MM_AD9 LCD data[1]

MM_AD10 LCD data[2]

MM_AD11 LCD data[3]

MM_AD12 LCD data[4]

MM_AD13 LCD data[5]

MM_AD14 LCD data[6]

MM_AD15 LCD data[7]

TA_DETECT LCD data[8]

MMP_CS1_N MAIN LCD chip select

WLAN_HOST_WAKEUP FM radio interrupt

MM_A16 Command Data switch

MMP_WR_N LCD Write

MMP_RD VT camera reset

HOOK_DET LCD Reset

MMP_RESET_N LCD Vsync

MMP_INT LCD Reset

A_RESET 3G reset

SCL_PMIC For PMIC

SDA_PMIC For PMIC

PM_INT For PMIC

I2C_SCL

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

I2C2_SDA

SIM I/F

CC_IO

CC_CLK

CC_RST

I2S2

I2S2_CLK0

I2S2_CLK1

I2S2_RX

I2S2_TX

I2S2_WA0

I2S2_WA1

External Memory

MMCI1_CMD

MMCI1_DAT[0]

MMCI1_CLK

MMCI1_DAT[1] MMCI1_DAT[2] MMCI1_DAT[3]

MMCI2_CMD

MMCI2_DAT[0]

MMCI2_CLK

I2C_SDA

SIM_IO SIM CARD DATA

SIM_CLK SIM CARD CLOCK

SIM_RST SIM CARD RESET

FMT_RST

EN_BAR

LIN_PWM_MAG

BT_HOST_WAKEUP

TOUCH_INT

N.c

WLAN_CMD

WLAN_SDIO[0]

WLAN_CLK

WLAN_SDIO[1]

WLAN_SDIO[2]

WLAN_SDIO[3]

TOUCH_LDO_EN

LIN_MOTOR_EN Vibrator enable

IrDA

IRDA_TX

IRDA_RX

I2S1

I2S1_CLK0

I2S1_CLK1

I2S1_RX

I2S1_TX

I2S1_WA0

Audio I/F

EPN1

EPP1

EPPA1

EPREF

EPPA2

USB_OEn For USB

JACK_DETECT_3.5

BT_PCM_CLK For Bluetooth

BT_PCM_IN For Bluetooth

BT_PCM_OUT For Bluetooth

BT_PCM_SYNC For Bluetooth

REC_N For Receiver

REC_P For Receiver

EAR_SPK_P For Headset

Reference

EAR_SPK_N For Headset

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

MICN1

MICP1

MICN2

MICP2

VMICP

VMICN

ADC

M0

M1

M2 ,M6,M9,M10

M3

M4

M5

M7

M8

Reference

VREFP

IREF

JTAG I/F

JTAG0_TDO

JTAG0_TDI

JTAG0_TMS

JTAG0_TCK

JTAG0_TRST_N

JTAG0_RTCK

JTAG1_TDO

JTAG1_TDI

JTAG1_TMS

JTAG1_RTCK

RST_N

ETM I/F

TRIG_IN

MON1

MON2

TRACESYNC

TRACECLK

PIPESTAT[2]

PIPESTAT[1]

MAIN_MIC_N For Main Mic

MAIN_MIC_P For Main Mic

HS_MIC_N For Headset Mic

VMIC_P Power for MIC

GND Ground for MIC

BAT_ID Battery temperature measure

RF_TEMP RF block temperature measure

N.C

JACK_TYPE Accessory type detect

SENSOR_ADC H/W version detect

TA_DETECT Battery supply voltage measure

N.C

VBAT

VREFN

GND with resistor 22K(1%)

TDO

TDI

TMS

TCK

TRSTn

RTCK

A_TDO

A_TDI

A_TMS

A_RTCK

A_RESTET

TRIG_IN

2V62_VIO ETM

WITH RESISTOR ETM

TRACESYNC

TRACECLK

PIPESTAT2

PIPESTAT1

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

PIPESTAT[0]

TRACEPKT[0]

TRACEPKT[1]

TRACEPKT[2]

TRACEPKT[3]

TRACEPKT[4]

TRACEPKT[5]

TRACEPKT[6]

TRACEPKT[7]

Memory

MEM_AD[0]

MEM _AD[1]

MEM _AD[2]

MEM _AD[3]

MEM _AD[4]

MEM _AD[5]

MEM _AD[6]

MEM _AD[7]

MEM _AD[8]

MEM _AD[9]

MEM _AD[10]

MEM _AD[11]

MEM _AD[12]

MEM _AD[13]

MEM _AD[14]

MEM _AD[15]

MEM _WR_n

MEM _RD_n

MEM _BC0_n

MEM _BC1_n

MEM _BC2_n

MEM _BC3_n

MEM _A[0]

MEM _A[1]

MEM _A[2]

MEM _A[3]

MEM _A[4]

MEM _A[5]

PIPESTAT0

TRACEPKT0

TRACEPKT1

TRACEPKT2

TRACEPKT3

TRACEPKT4

TRACEPKT5

TRACEPKT6

TRACEPKT7

DATA(0)

DATA(1)

DATA(2)

DATA(3)

DATA(4)

DATA(5)

DATA(6)

DATA(7)

DATA(8)

DATA(9)

DATA(10)

DATA(11)

DATA(12)

DATA(13)

DATA(14)

DATA(15)

_WR

_RD

_BC0

_BC1

LDQS

UDQS

ADD(0)

ADD(1)

ADD(2)

ADD(3)

ADD(4)

ADD(5)

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

MEM _A[6]

MEM _A[7]

MEM _A[8]

MEM _A[9]

MEM _A[10]

MEM _A[11]

MEM _A[12]

MEM _A[13]

MEM _A[14]

MEM _A[15]

MEM _A[16]

MEM _A[17]

MEM _A[18]

MEM _A[19]

MEM _A[20]

MEM _A[21]

MEM _A[22]

MEM _A[23]

MEM _A[24]

MEM _A[25]

MEM _A[26]

MDM_CSA0_N

MDM_ CSA1_N

MDM_ CSA2_N

MDM_CSA3_N

MEM _CS0_n

MEM _CS1_n

MEM _CS2_n

MEM _CS3_n

MEM _ADV_n

MEM _RAS_n

MEM _CAS_n

MEM _WAIT_n

MEM _SDCLK0

MEM _BFCLK01

MEM _BFCLK02

MEM _CKE

Memory

ADD(6)

ADD(7)

ADD(8)

ADD(9)

ADD(10)

ADD(11)

ADD(12)

ADD(13)

ADD(14)

ADD(15)

ADD(16)

ADD(17)

ADD(18)

ADD(19)

ADD(20)

ADD(21)

ADD(22)

ADD(23)

ADD(24)

ADD(25)

ADD(26)

ADD(27)

ADD(28)

ADD(29)

BA0

_NAND_CS INTEL NOR (64MB)

_RAM_CS INTEL SDRAM (64MB)

_CS3

BA1

_RAS

_CAS

_WAIT

SDCLKO For Burst mode

BFCLKO For Burst mode

SDCLK1 For Burst mode

CKE

- 28 -

Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

FCDP_RBn

GPIO_60

TDMA I/F

T_OUT0

T_OUT1

T_OUT2

T_OUT3

T_OUT4

T_OUT5

T_OUT6

T_OUT7

T_OUT8

T_OUT9

T_OUT10

DIF_D8

CIF_PD

RF I/F

RF_STR0

RF_STR1

RF_DATA

RF_CLK

GPIO[7]

GPIO[10]

GPIO[15]

GPIO[16]

GPIO[17]

GPIO[18]]

System Port

AFC

CLKOUT0 [<=26MHz]

F26M

F32K

OSC32K

RESET_n

TRIG_OUT

RTC_OUT

SPUC_RQ_IN2

FCDP

RPWRON_DBB

TXON_PA PAM

ANT_SEL1

2G+ANT_SELECT

_EOC Charging terminate signal

GPS_IRQ

PA_MODE PAM

ANT_SEL2

ANT_SEL3

DSR

JACK_DETECT Jack detect

TA_DETECT Charger detect

CHG_EN Charging enable

2G_EN

_PPR Charger detect

2G_DATA

2G_CLK

3G_LD

3G_MASTER_ON

3G_PA_MODE1

ANT_SEL4

ANT_SEL5

ANT_SEL6

PIN 6 WITH NC7SZ4L8X

PIN 7

WITH NC7SZ4L8X

26MHZ 26M Main Clock

to 32k crystal

_RESET

TRIG_OUT

RTC_OUT

PM_VCXO_EN

Not used

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

KM900 service manual

DSP

DSPIN0

DSPOUT1

DSPIN1

CLK32K

WDOG Navi key LED Backlight Control

BT_WAKEUP

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon SGOLD

baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

- 30 -

Only for training and service purposes

3. TECHNICAL BRIEF

KM900 service manual

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized

functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear

regulators

- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone

functions (e.g. organizer functions, games, MP3 decoding) possible.

- SDBB has high efficiency up to 95% and also a power save mode.

- Memory Interface is directly supported by the SDBB

- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the

linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase

the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up

withpower being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of

8 Ohm for usage in hands-free phones and for ringing

- 450 mW maximum output power

- adjustable gain

- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer

batteries

- Precharge current source with two current levels

- Constant current / constant voltage charging with 3 different termination voltages

- Programable charge current limitation for use with different batteries

- 31 -

LGE Internal Use Only

LG KM900 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual