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1. Introduction ..................................... 5
1.1 Purpose................................................... 5
1.2. Regulatory Information........................... 5
1.3 Abbreviations .......................................... 7
2. General Performance...................... 8
2.1 Product Name ......................................... 8
2.2 Supporting Standard ................................8
2.3 Main Parts: GSM Solution....................... 8
2.4 HW Feature............................................. 9
2.5 S/W Features .........................................11
3. HW Circuit Description................. 14
3.1 General Description .............................. 14
3.2 RF Part.................................................. 14
3.3 Digital Baseband................................... 20
3.4 Multimedia IC ........................................ 27
3.5 Analog Baseband.................................. 30
3.6 Bluetooth Interface.................................36
3.7 Function difference ................................40
3.8 BOM difference ......................................41
4. Trouble Shooting .......................... 42
4.1 RF Part Technical Brief......................... 43
4.2 RF Part Trouble shooting...................... 46
4.3 Bluetooth Trouble Shooting .................. 54
4.4 Baseband Part Troubleshooting ........... 57
4.5 LCD Display Trouble shooting .............. 65
4.6 Camera Trouble Shooting..................... 72
4.7 Flash LED Trouble Shooting................. 76
4.8 SIM Detect Trouble Shooting................ 79
4.9 Slide Up/Down Trouble Shooting.......... 82
4.10 Speaker/Receiver Trouble Shooting
(Common Path)................................... 84
4.11 MIC Trouble Shooting ......................... 86
4.12 Ear-Mic Jack Detection
Trouble Shooting................................. 88
4.13 Ear-Mic Hook Detection
Trouble Shooting................................. 89
4.14 Ear-Mic Headset MIC
Trouble Shooting................................. 90
4.15 Ear-Mic Headset MIC
Trouble Shooting................................. 91
4.16 FM-Radio Trouble Shooting................ 92
4.17 Transflash Trouble Shooting............... 93
4.18 Main Key Backlight LED
Trouble Shooting................................. 95
4.19 Slide Key Backlight LED
Trouble Shooting................................. 97
4.20 Vibrator Trouble Shooting ................... 98
5. Download..................................... 100
5.1 Download Software............................. 100
5.2 The Environment of Downloading
Software.............................................. 100
5.3 Download Procedure ...........................102
6. Block Diagram............................. 109
7. CIRCUIT DIAGRAM...................... 111
8. BGA IC Pin Check ........................123
9. PCB LAYOUT............................... 129
10. Calibration
.......................................
139
10.1 What’s the Rx Calibration?
..............
139
10.2 What’s the Tx Calibration?
..............
139
10.3 Calibration program-HOT_KIMCHI ..140
11. HW Test program
..........................
145
11.1 Laputa setup.....................................145
11.2 RX Test ............................................146
11.3 TX Test.............................................147
12. Engineering Mode......................148
13. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 153
13.1 EXPLODED VIEW ............................ 153
13.2 Replacement Parts
<Mechanic component>.................... 155
<Main component> ........................... 157
13.3 Accessory ......................................... 175
Table of Contents
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