LG KM386C Service Manual

Service Manual

Model : KM386c

Service Manual

KM386c

Date: June, 2008 / Issue 1.0

Internal Use Only

LGE Internal Use Only

- 3 -

* The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the

KM386c Series.

REVISED HISTORY

Editor Date Issue Contents of Changes S/W Version

C.G.KANG Mar. 5 2007 0.1 - V08d

C.G.KANG Apr. 10 2007 0.2 - V10a

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1. INTRODUCTION ...............................7

1.1 Purpose .................................................. 7

1.2 Regulatory Information............................ 7

1.3 ABBREVIATION ..................................... 9

2. PERFORMANCE .............................11

2.1 H/W Features.........................................11

2.2 Technical specification...........................12

3. TECHNICAL BRIEF ........................19

3.1 KM386c series Component

Block diagram... ........................................19

3.2 Baseband Processor (BBP)

Introduction ............................................20

3.3 Power management IC ..........................30

3.4 Power ON/OFF ......................................34

3.5 SIM interface..........................................35

3.6 Micro SD external memory Interface .....36

3.7 Memory ..................................................37

3.8 LCD Display ...........................................38

3.9 Keypad Switching & Scanning ...............40

3.10 Keypad back-light illumination .............41

3.11 LCD back light illumination...................42

3.12 ISP(Image Signal Processor)...............43

3.13 Battery current consumption monitor ...44

3.14 JTAG & ETM interface connector ........45

3.15 Audio....................................................46

3.16 Charging circuit ....................................49

3.17 BLUETOOTH .......................................50

3.18 FM Radio .............................................52

3.19 18pin Multi Media Interface

connector .............................................53

4. RF circuit technical brief ...............55

4.1 General Description ...............................55

4.2 Receiver part..........................................57

4.3 Transmitter part......................................58

4.4 RF synthesizer .......................................59

4.5 DCXO.....................................................60

4.6 Front End Module control.......................60

4.7 Power Amplifier Module .........................61

5. PCB layout......................................62

5.1 Main PCB component placement ..........62

6. Trouble shooting............................64

6.1 Trouble shooting test setup....................64

6.2 Power on Trouble...................................65

6.3 Charging trouble ....................................68

6.4 LCD display trouble................................70

6.5 Camera Trouble .....................................72

6.6 Receiver & Speaker trouble ...................74

6.7 Microphone trouble ................................76

6.8 Ear-MIc Jack Detection trouble..............77

6.9 Vibrator trouble ......................................78

6.10 Keypad back light trouble.....................79

6.11 SIM & uSD trouble ...............................80

6.12 RF Troubleshooting .............................83

6.13 RF Receiver path Troubleshooting ......85

6.14 RF Transmitter path Troubleshooting ..90

6.15 PAM Circuit ..........................................92

7. Download & S/W upgrade.................95

7.1 Download program user guide...............95

7.2 Multi-Download Program Setting ...........96

8. CIRCUIT DIAGRAM ........................99

9. BGM PIN MAP...............................105

10. PCB LAYOUT ..............................111

11. RF Calibration.............................113

11.1 Test Equipment Setup .......................113

11.2 Calibration Step .................................113

12. Stand-alone Test ........................119

12.1 Test Program Setting .........................119

12.2 Tx Test ...............................................121

12.3 Rx Test...............................................122

13. ENGINEERING MODE ................123

14. EXPLODED VIEW &

REPLACEMENT PART LIST ......125

14.1 Exploded View ...................................125

14.2 Replacement Parts ............................127

14.3 Accessory ..........................................147

Table Of Contents

- 6 -

LGE Internal Use Only

Only for training and service purposes

- 7 -

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the KM386c Series.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges you’re your telecommunications

services. System users are responsible for the security of own system. There are may be risks of toll

fraud associated with your telecommunications system. System users are responsible for

programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that

this product is immune from the above case but will prevent unauthorized use of common-carrier

telecommunication service of facilities accessed through or connected to it. LGE will not be

responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the KM386c Series or compatibility with the

network, the telephone company is required to give advanced written notice to the user, allowing the

user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the KM386c Series must be performed only at the LGE or its authorized

agents. The user may not make any changes and/or repairs expect asspecifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

- 8 -

1. INTRODUCTION

E. Notice of Radiated Emissions

The KM386c Series complies with rules regarding radiation and radio frequency emission as defined

by local regulatory agencies. In accordance with these agencies, you may be required to provide

information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

An KM386c Series may interfere with sensitive laboratory equipment, medical equipment, etc.

Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.

Following information is ESD handling: Service personnel should ground themselves by using a wrist

strap when exchange system boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective

packages until these are used. When returning system boards or parts such as EEPROM to the

factory, use the protective package as described.

LGE Internal Use Only

Only for training and service purposes

- 9 -

1. INTRODUCTION

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

LGE Internal Use Only

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

- 10 -

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

- 11 -

2. GENERAL PERFORMANCE

2.1 H/W Feature

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Feature Comment

Standard Battery Li-ion, 800mAh

AVG TCVR Current tbd @PL5

Standby Current tbd @PP9

Talk time tbd

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓

TX output power EGSM : 32.5dBm (@PL 5)

DCS/PCS: 30/30dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 320 pixels, 2” ± QVGA, 265K color,

Status Indicator Navi, Send, Call End, Back and etc. Key are

implemented by touchpad.

CLEAR, SEND, END/PWR, MP3, AF/Camera double

action, Volume Up, Volume Down, Lock

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack (Call/Music)

3.5pi Stereo Jack. (Music Only)

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

- 12 -

2. GENERAL PERFORMANCE

2.2 Technical specification

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

GSM900

TX: 890 + 0.2 x n MHz

RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

1 Frequency Band

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)

RX: TX + 80MHz

2 Phase Error

RMS < 5 degrees

Peak < 20 degrees

3 Frequency Error < 0.1ppm

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

12 19 dBm 3dB

4 Power Level DCS1800/PCS1900

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

- 13 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

5

Output RF Spectrum 6,000 -71

(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19

6

(due to switching transient) 600 -21

1,200 -21

1,800 -24

- 14 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Only for training and service purposes

Item Description Specification

DCS1800/PCS1900

Offset from Carrier (kHz). Max. (dBm)

Output RF Spectrum 400 -22

6

(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

EGSM

8 Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-100dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 2 -7

500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5

3,400 2 -10

4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

- 15 -

2. GENERAL PERFORMANCE

LGE Internal Use Only

Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

16 Distortion

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

System frequency

2.5ppm

(26 MHz) tolerance

19 32.768KHz tolerance 30ppm

Standby

20 Power consumption

- Normal 3 mA(@PP9)

21 Talk Time

EGSM/Lvl 7 (Battery Capacity 800mA):180 min EGSM/Lvl12(Battery Capacity 800 mA):320min Under conditions, at least 300 hours:

1. Brand new and full 800mAh battery

22 Standby Time

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off. At least 65 dB under below conditions:

23 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Current

Fast Charge : < 400 mA Slow Charge: < 120 mA

Antenna Bar Number Power

7 >-92 dBm ~

5 -97dBm ~ -93dBm

25 Antenna Display

4 -100dBm ~ -98dBm

2 -103dBm ~ -101dBm

1 -105dBm ~ -104dBm

0< -106 dBm

Off No Service

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 16 -

Item Description Specification

Battery Bar Number Voltage( 0.05V)

3 3.69V ~ 4.2V

26 Battery Indicator 2 3.53V ~ 3.69V

1 3.43V ~ 3.53V

0 3.30V ~ 3.43V

27 Low Voltage Warning

3.53V↓ 0.05V (Call)

3.43V↓ 0.05V (Standby)

28 Forced shut down Voltage 3.3 0.05 V

Li-ion Battery or Li-Polymer Battery

29 Battery Type

Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 800mAh

Switching-mode charger

31 Travel Charger Input: 100 ~ 240 V, 50/60Hz

Out put: 4.8, 0.9A

LGE Internal Use Only

2. GENERAL PERFORMANCE

- 17 -

* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification

1 RMS EVM 9% 2 Peak EVM 30% 395thPercentile EVM 15% 4 Origin Offset Suppression ≥ 30dB

GSM900/EGSM

Level Power Toler. Level Power Toler.

5 27dBm 3dB 13 17dBm 3dB

6 27dBm 3dB 14 15dBm 3dB

7 27dBm 3dB 15 13dBm 3dB

8 27dBm 3dB 16 11dBm 5dB

9 25dBm 3dB 17 9dBm 5dB

10 23dBm 3dB 18 7dBm 5dB

11 21dBm 3dB 19 5dBm 5dB

5 Power Level 12 19dBm 3dB

DCS1800, PCS1900

Level Power Toler. Level Power Toler.

0 26/25dBm 3dB 8 14 dBm 3dB

1 26/25dBm 3dB 9 12 dBm 4dB

2 26/25dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

6 Output RF Spectrum GSM900/EGSM

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

LGE Internal Use Only

Only for training and service purposes

2. GENERAL PERFORMANCE

- 18 -

Item Description Specification

6 Output RF Spectrum DCS1800, PCS1900

(due to modulation) Offset from carrier(kHz) Max. dBc

100 +0.5

200 -30

250 -33

400 -54

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

6,000 -71

7 Output RF Spectrum GSM900/EGSM

(due to switching transient) Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 --30

DCS1800, PCS1900

Offset from carrier(kHz) Max. dBm

400 -23

600 -26

1,200 -27

1,800 -30

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.1 KM386c series Component Block diagram

3. TECHNICAL BRIEF

Figure 1. KM386c series Functional Block Diagram

- 20 -

3. TECHNICAL BRIEF

3.2 Baseband Processor (BBP) Introduction

3.2.1 General Description

extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution,

integrating the digital and mixed signal portions of the base band in 0.13um, 1.5V technology.

operation modes CSD/GPRS/EGPRS (up to class 12) without additional external hardware.

LGE Internal Use Only

Only for training and service purposes

Æ

A

S-GOLDradi o

Baseband

DAC DAC

AD

USB FS

FCDP

Keyp ad

GPIO

USI

IrDA

MMC/SD

I

IS /

and

SRAM

DMAC

ARMÆ 926

USIM

Speech

Deco din

Speech

Encod in

MOVE

I

GS

Cip her

TEAKLit

ICU

USARTs

Equal ize

Tim er

SCCU

GEA-1/2/3

CAPCOM

GPT

Camera

IR-Memor y

DigR

GS

RTC

Multimed ia I C

RF

Contr o

EBU

CGU

AUX

AD

IC

JTAG

Disp lay

I

R

Sigm a-Delta

MASH

Modula to

L

DA

PL

LD

I/

LD

ANA LD

D

LPF

D

AD

PA/ FE

Contro

GP

LD

SI

LD

USB

LD

VI LD

AUX

LD

RTC

LD

RF

LD

RF

LD

RF1

LD

FIR

DC

DigR

GMSK

8PSK

Offs et Comp

FIR

-

+

3-wir e Ctrl

C

Power

Hands-

free

Am p

Powe

Contro

Ramp

Gen

DCXO

LED

PWMís

Char ger

LDO

S

(BL

SD1

(1.5V)

SD2

(1.8V)

- 21 -

3. TECHNICAL BRIEF

3.2.2 Block Description

• Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration.

- TEAKLite DSP core

• ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal)

• DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

• Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.

• Controller Bus system The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses.

• Clock system The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3. Thus power consumption and performance can be optimized for each application.

• Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes)

LGE Internal Use Only

- 22 -

3. TECHNICAL BRIEF

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

-1 Serial Synchronous SPI compatible interfaces in the controller domain

- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain

- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller supporting IrDA’s SIR standard (up to 115.2Kbps)

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)

3.2.3 External Devices connected to memory interface

Table 1. Memory interface

3.2.4 RF Interface

on/off RF ICs Periodically each TDMA frame.

Table 2. RF Interface Spec

.

LGE Internal Use Only

Only for training and service purposes

Device Name Maker Remark

NAND FLASH K5D1G12ACE-D075 Samsung Synchronous / A synchronous

SDRAM K5D1G12ACE-D075 Samsung Synchronous 133MHz

LCD IM200DBN7A LGIT 8bit access 2times transmission

MP3 Decoder TCC8720 Telechips MP3 Decoder

Resource Interconnection Description

TX2 TXHB Output High band(DCS/PCS) Tx

TX1 TXLB Output Low band(850/900) Tx

RX1, RX1X GSM850_RXP, GSM850_RXN Input of GSM850 LNA

RX2, RX2X GSM900_RXP, GSM900_RXN Input of GSM900 LNA

RX3, RX3X DCS1800_RXP, DCS1800_RXN Input of DCS1800 LNA

RX4, RX4X PCS1900_RXP, PCS1900_RXN Input of PCS1900 LNA

PABS PA_BAND Select PAM operation band.

FE1, FE2 VC1, VC2 Control FEM operation band & mode

PAEN PA_EN PAM Enable

VRAMP TX_RAMP Tx Ramp signal

T_OUT6 PA_MODE_2 Select PAM operation mode (GSM/EDGE)

- 23 -

3. TECHNICAL BRIEF

3.2.5 USART Interface

KM386c have two UART Drivers as follow :

- USART0 : SW upgrade / Calibration

- USIF : BT Interface.

Table 3. USIF Interface Spec.

3.2.6 ADC channel

BBP ADC block is composed of 7 external ADC channel. This block operates charging process and

other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage

LGE Internal Use Only

Resource Name Remark

UART0

UART0_TXD UART_TX Transmit Data

UART0_RXD UART_RX Receive Data

USIF

USIF_TXD UART_BT_TX Transmit Data

USIF_RXD UART_BT_RX Receive Data

T_OUT3 UART_BT_RTS Flow Control Signal

T_OUT4 UART_BT_CTS Flow Control Signal

ADC channel

Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 N.C

M4 N.C

M5 N.C

M6 N.C

M7 N.C

M8 VBAT Battery supply voltage measure

M9 LOAD Current consumption measure

M10 N.C

3.2.7 GPIO map

Over a hundred allowable resources, KM386c series is using as follows except dedicated to SIM and

Memory. KM386c series GPIO(General Purpose Input/Output) Map, describing application, I/O state,

and enable level, is shown in below table.

- 24 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Port Function Net Name Description

KEY MATRIX

KP_IN2 KP_IN(2)

KP_IN3 KP_IN(3)

KP_IN4 KP_IN(4)

KP_IN5 KP_IN(5)

KP_IN6 KP_IN(6)

KP_OUT0 KP_OUT(0)

KP_OUT1 KP_OUT(1)

KP_OUT2 KP_OUT(2)

KP_OUT3 KP_OUT(3)

DSPIN1 KP_OUT(4)

UART0

UART0_RXD UART_RX UART, RS232 Data

UART0_TXD UART_TX UART, RS232 Data

UART0_RTS_N uSD_DET Micro SD Card Detect

UART0_CTS_N MM_RESET MP3 Decoder Reset

USIF

USIF_TXD_MTSR UART_BT_TX

USIF_RXD_MRST UART_BT_RX

TOUT_3 UART_BT_RTS Bluetooth RTS

TOUT_4 UART_BT_CTS Bluetooth CTS

USB

USB_DPLUS USB_BB_DP USB +

USB_DMINUS USB_BB_DM USB -

CLK

DSPIN0 CLK32K For FM Radio, BT CLK32K

- 25 -

3. TECHNICAL BRIEF

LGE Internal Use Only

CAMERA I/F

CIF_D0 CAM_D(0) Camera DATA[0]

CIF_D1 CAM_D(1) Camera DATA[1]

CIF_D2 CAM_D(2) Camera DATA[2]

CIF_D3 CAM_D(3) Camera DATA[3]

CIF_D4 CAM_D(4) Camera DATA[4]

CIF_D5 CAM_D(5) Camera DATA[5]

CIF_D6 CAM_D(6) Camera DATA[6]

CIF_D7 CAM_D(7) Camera DATA[7]

CIF_PCLK CAM_PCLK Camera pixel clock

CIF_HSYNC CAM_HS Camera H sync

CIF_VSYNC CAM_VS Camera V sync

CLKOUT CAM_MCLK Camera main clock

CIF_PD CAM_PD Camera power down(active high)

CIF_RESET CAM_RESET Camera reset

LCD I/F

DIF_D0 DIF_D(0) LCD data[0]

DIF_D1 DIF_D(1) LCD data[1]

DIF_D2 DIF_D(2) LCD data[2]

DIF_D3 DIF_D(3) LCD data[3]

DIF_D4 DIF_D(4) LCD data[4]

DIF_D5 DIF_D(5) LCD data[5]

DIF_D6 DIF_D(6) LCD data[6]

DIF_D7 DIF_D(7) LCD data[7]

DIF_D8 DIF_D(8) LCD data[8]

DIF_CS1 DIF_CS LCD chip select

DIF_CS2 EHI_INT MP3 Decoder Interrupt

DIF_CD DIF_RS Command Data switch

DIF_WR DIF_WR LCD Write

DIF_HD EOC Indicating End of Charging.

DIF_VD LCD_VSYNC VSYNC

DIF_RESET2 JACK_DET_3.5 Detect plug-in of 3.5pi Ear-Phone

I2C

I2C_SCL I2C_SCL For Sub-PMIC/Audio DAC/Camera

I2C_SDA I2C_SDA For Sub-PMIC/Audio DAC/Camera

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

SIM I/F

CC_IO SIM_IO SIM CARD I/O

CC_CLK SIM_CLK SIM CARD CLOCK

CC_RST SIM_RST SIM CARD RESET

I2S1

I2S1_CLK0 Not used

I2S1_RX Not used

I2S1_TX Not used

I2S1_WA0 Not used

External Memory

MMCI_CMD RPWRON Remote Power On

MMCI_DAT[0] uSD_DET_CTRL uSD Card Detect

MMCI_CLK TF_CLK T-flash

MMCI_DAT[1] BT_INT BT Interrupt

MMCI_DAT[2] FLIP_OPEN Flip Open/Close Detect

MMCI_DAT[3] HOLD HOLD Key

Audio I/F

EP_N, EP_P SPK_N, SPK_P For Speaker

HS_N, HS_P RCV_N, RCV_P For Receiver

EPPA1 BBP_SND_L For Speaker

EPREF Reference

EPPA2 BBP_SND_R For Speaker

MICN1 MIC_N For Mic

MICP1 MIC_P For Mic

MICN2 HS_MIC_N For Headset Mic

MICP2 HS_MIC_P For Headset Mic

VMIC MICBIAS Power for MIC

ADC

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2

M3

M8 VSUPPLY Battery supply voltage measure

M9 LOAD Current consumption measure

M10 N.C

Reference

VREF

IREF

JTAG I/F

TDO TDO JTAG

TDI TDI JTAG

TMS TMS JTAG

TCK TCK JTAG

TRST_n _TRST JTAG

RTCK RTCK J TAG

Memory

EBU_AD[0] DATA(0)

EBU _AD[1] DATA (1)

EBU _AD[2] DATA (2)

EBU _AD[3] DATA (3)

EBU _AD[4] DATA (4)

EBU _AD[5] DATA (5)

EBU _AD[6] DATA (6)

EBU _AD[7] DATA (7)

EBU _AD[8] DATA (8)

EBU _AD[9] DATA (9)

EBU _AD[10] DATA (10)

EBU _AD[11] DATA (11)

EBU _AD[12] DATA (12)

EBU _AD[13] DATA (13)

EBU _AD[14] DATA (14)

EBU _AD[15] DATA (15)

EBU _WR_N _WR

EBU _RD_N _RD

EBU _BC0_N _BC0

EBU _BC1_N _BC1

EBU _A[0] ADD(0)

EBU _A[1] ADD (1)

EBU _A[2] ADD (2)

EBU _A[3] ADD (3)

EBU _A[4] ADD (4)

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

- 28 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

EBU _A[5] ADD (5)

EBU _A[6] ADD (6)

EBU _A[7] ADD (7)

EBU _A[8] ADD (8)

EBU _A[9] ADD (9)

EBU _A[10] ADD (10)

EBU _A[11] ADD (11)

EBU _A[12] ADD (12)

EBU _A[13] ADD (13)

EBU _A[14] ADD (14)

EBU _A[15] ADD (15)

EBU _A[16] ADD (16)

EBU _A[17] ADD (17)

EBU _A[18] ADD (18)

EBU _A[19] ADD (19)

EBU _A[20] ADD (20)

EBU _A[21] ADD (21)

EBU _A[22] ADD (22)

EBU _A[23] ADD (23)

EBU _A[24] ADD (24)

EBU _CS0_n _FLASH1_CS

EBU _CS1_n SDRAM_CS

EBU _CS2_n nCS1

EBU _CS3_n

EBU _ADV_n

EBU _RAS_n _RAS

EBU _CAS_n _CAS

EBU _WAIT_n

EBU _SDCLKO SDCLKO

EBU _SDCLKI SDCLKI

EBU _BFCLKO

EBU _BFCLKI

EBU _CKE CKE

Memory

FCDP_RBn FCDP

- 29 -

3. TECHNICAL BRIEF

LGE Internal Use Only

TDMA I/F

T_OUT3 UART_BT_RTS

T_OUT4 UART_BT_CTS

T_OUT5 CHG_EN

T_OUT6 PA_MODE_2 PAM

T_OUT7 HOOK_DETECT

T_OUT8 VBUS_OVP USB DETECT

System Port

CLKOUT0 [<=26MHz] Not used

F26M 26MHZ_MCLK 26M Main Clock

F32K to 32k crystal

OSC32K to 32k crystal

RESET_n _RESET

TRIG_OUT TRIG_OUT

RTC_OUT RTC_OUT

- 30 -

3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C - Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

LGE Internal Use Only

Only for training and service purposes

- 31 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Figure 4. Top level block diagram of the PMU Block of PMB8888

LG KM386C Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual